阅读说明：本技术 一种高性能增益芯片封装装置 (High-performance gain chip packaging device ) 是由 崔锦江 宁永强 张建伟 姜琛昱 于 2020-06-23 设计创作，主要内容包括：本发明公开了一种高性能增益芯片封装装置,包括热沉安装座,所述热沉安装座两端均固定有限位架,且热沉安装座内开有用于芯片安装的安装槽,两个所述限位架内均安装有方便导热材料安装在芯片外侧的辅助安装装置,本发明利用辅助安装装置,能够有效的将安装在芯片两侧的导热材料进行按压处理,使得导热材料能够更好地与芯片外侧贴合,提高导热能力,同时还能对贴合在芯片表面的透明导热材料进行轻微的角度调节,避免安装角度出现偏差。(The invention discloses a high-performance gain chip packaging device which comprises a heat sink mounting seat, wherein limiting frames are fixed at two ends of the heat sink mounting seat, mounting grooves for mounting a chip are formed in the heat sink mounting seat, and auxiliary mounting devices which are convenient for a heat conduction material to be mounted on the outer side of the chip are mounted in the two limiting frames.)

1. The utility model provides a high performance gain chip package device, includes heat sink mount pad (1), heat sink mount pad (1) both ends all are fixed with spacing (2), and offer mounting groove (3) that are used for the chip to install in heat sink mount pad (1), its characterized in that: two all install in spacing (2) and make things convenient for heat conduction material to install supplementary installation device (4) in the chip outside.

2. The high performance gain chip package arrangement of claim 1, wherein: supplementary installation device (4) are including adjusting pole (5), it has cup jointed mounting panel (6) all to slide at regulation pole (5) both ends, and mounting panel (6) fix respectively in spacing (2) inner wall both sides, it is equipped with according to clamp plate (7) to adjust pole (5) bottom, and adjusts pole (5) and is equipped with two linking arms (8) between clamp plate (7), it is equipped with U type frame (9) to adjust pole (5) top, and is equipped with two regulation arms (10) between regulation pole (5) and U type frame (9).

3. The high performance gain chip package arrangement of claim 2, wherein: linking arm (8) include spacing ring (11), spacing ring (11) are fixed in adjusting pole (5) one end outside, and are fixed with stop collar (12) outside spacing ring (11), stop collar (12) bottom and the corresponding stop collar (12) position department in pressing board (7) surface all are fixed with first link (13), two be equipped with first connecting plate (14) between first link (13), first connecting plate (14) both ends all rotate with two first links (13) through the pivot and are connected.

4. A high performance gain chip package according to claim 3, wherein: adjusting arm (10) is including adjusting cap (15), adjust cap (15) screw thread cup joint in adjusting pole (5) one end outside, and adjust cap (15) top and U type frame (9) bottom and all be fixed with second link (16), two be equipped with second connecting plate (17) between second link (16), second connecting plate (17) both ends all rotate with two second links (16) through the pivot and are connected.

5. The high performance gain chip package apparatus according to claim 4, wherein: adjust pole (5) including carriage release lever (18) and removal cover (19), carriage release lever (18) and removal cover (19) outer end are fixed with two spacing rings (11) respectively, and carriage release lever (18) and removal cover (19) outside respectively with two regulation caps (15) threaded connection, carriage release lever (18) one end slip grafting and removal cover (19) in, and carriage release lever (18) outer end has connect through bearing rotation cover (20) and has rotated cover (20), it has spacing groove (21) to open in removal cover (19), and carriage release lever (18) outside is fixed with spacing strip (22) with spacing groove (21) sliding connection, install adjusting spring (23) in removal cover (19), and adjusting spring (23) both ends are fixed with carriage release lever (18) and removal cover (19) inner wall respectively.

6. The high performance gain chip package arrangement of claim 5, wherein: remove cover (19) tail end and rotate cover (20) outside and all be fixed with two stopper (24), and mounting panel (6) outside all is fixed with connecting shell (25), it has two entry (26) with stopper (24) looks adaptation to open on connecting shell (25), it has cross groove (27) all to be carved with in removal cover (19) and carriage release lever (18) outer end.

7. The high performance gain chip package arrangement of claim 6, wherein: be equipped with in U type frame (9) and be used for centre gripping subassembly (28) of transparent heat conduction material installation, centre gripping subassembly (28) include grip block (29), grip block (29) both ends are all opened two shifting chutes (30), and all are fixed with slip post (31) in shifting chute (30), the movable block (32) has all been cup jointed in the slip post (31) outside the equal slip, movable block (32) top is rotated through the pivot and is connected with connecting strip (33), and the connecting strip (33) other end rotates through pivot and U type frame (9) top to be connected, slip post (31) outside cover has clamping spring (35), and clamping spring (35) both ends respectively with movable block (32) one side and shifting chute (30) inner wall contact.

8. The high performance gain chip package apparatus according to claim 7, wherein: the outer side of the clamping plate (29) is provided with a chamfer, and two ends of the pressing plate (7) are fixed with inclined plates (34).

Technical Field

The invention relates to the technical field of gain chip packaging, in particular to a high-performance gain chip packaging device.

Background

A Vertical Cavity Surface Emitting Laser (VCSEL) chip, which is a laser emitting chip based on gaas semiconductor material, has the advantages of small size, circular output spot, single longitudinal mode output, small threshold current, low cost, easy integration into large area array, and is widely applied to the fields of optical communication, optical interconnection, optical storage, and the like.

When the existing gain chip is used, due to the fact that an optical pumping working mode is adopted, the gain chip can generate more redundant heat during working, the temperature of the gain chip is increased due to the heat, gain spectrum drift is caused, serious and even the device cannot normally emit light, in order to solve the problem, the heat conduction material is attached to the outer side of the chip and used for dissipating heat of the chip generally, the transparent heat conduction material is attached to the front side of the chip and used for dissipating heat, the angle of the transparent heat conduction material attached to the front side has a deviation problem when the transparent heat conduction material is installed, the light emitting angle is influenced, and therefore the high-performance gain chip packaging device is provided.

Disclosure of Invention

The invention aims to provide a high-performance gain chip packaging device which facilitates the installation of a heat conduction material during the packaging of a gain chip, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a high performance gain chip packaging hardware, includes the heat sink mount pad, heat sink mount pad both ends all are fixed with spacing, and open the mounting groove that is used for the chip to install in the heat sink mount pad, two all install in the spacing and make things convenient for the heat conduction material to install the supplementary installation device in the chip outside.

Preferably, supplementary installation device is including adjusting the pole, it has cup jointed the mounting panel all to slide at regulation pole both ends, and the mounting panel is fixed respectively in spacing inner wall both sides, it is equipped with the press platen to adjust the pole bottom, and adjusts the pole and be equipped with two linking arms between the press platen to adjust the pole, it is equipped with U type frame to adjust the pole top, and adjusts and be equipped with two regulating arms between pole and the U type frame, through the installation of the effectual supplementary heat conduction material of supplementary installation device, is convenient for adjust the laminating of chip.

Preferably, the linking arm includes the spacing ring, the spacing ring is fixed in the regulation pole one end outside, and the spacing ring outside is fixed with the stop collar, the stop collar bottom all is fixed with first link, two with the corresponding stop collar position department in press platen surface be equipped with first connecting plate between the first link, first connecting plate both ends all rotate through pivot and two first links and are connected, realize pressing down the pressure of press platen through the linking arm to effectual heat conduction material with the installation is pressed down, makes its chip of laminating better under the condition of the pliability that its material itself possessed.

Preferably, the regulating arm is including adjusting the cap, adjust the cap screw-thread sleeve and connect in adjusting the pole one end outside, and adjust cap top and U type frame bottom and all be fixed with the second link, two be equipped with the second connecting plate between the second link, the second connecting plate both ends are all rotated through pivot and two second links and are connected, realize the regulation to distance between U type frame and the regulation pole through the regulating arm to satisfy the regulation to transparent heat conduction material angle.

Preferably, adjust the pole and include carriage release lever and removal cover, carriage release lever and removal cover outer end are fixed with two spacing rings respectively, and the carriage release lever and removal cover outside respectively with two regulation cap threaded connection, in carriage release lever one end slip grafting and the removal cover, and the carriage release lever outer end rotates through the bearing and has cup jointed the rotation cover, it has the spacing groove to open in the removal cover, and the carriage release lever outside is fixed with the spacing strip with spacing groove sliding connection, install adjusting spring in the removal cover, and the adjusting spring both ends are fixed with carriage release lever and removal cover inner wall respectively, through the adjusting spring in the adjustment cover, satisfy the carriage release lever and remove in the removal cover to sliding connection through spacing strip and spacing groove, thereby when satisfying the removal cover and rotating, drive the carriage release lever and rotate.

Preferably, remove the cover tail end and all be fixed with two stoppers with the rotation cover outside, and the mounting panel outside all is fixed with the connection shell, it has two entries with stopper looks adaptation to open on the connection shell, remove cover and carriage release lever outer end and all be carved with the cross recess, insert in the connection shell through the stopper to the realization is to the spacing of removal cover and carriage release lever, makes it install between two mounting panels.

Preferably, be equipped with the centre gripping subassembly that is used for transparent heat conduction material installation in the U type frame, the centre gripping subassembly includes the grip block, two shifting chutes have all been opened at the grip block both ends, and all be fixed with the slip post in the shifting chute, the movable block has all been slided in the slip post outside and has been cup jointed, the movable block top is rotated through the pivot and is connected with the connecting strip, and the connecting strip other end rotates through pivot and U type frame top to be connected, slip post outside cover has the centre gripping spring, and centre gripping spring both ends respectively with movable block one side and shifting chute inner wall contact, through the centre gripping group frame realize the centre gripping location to the transparent heat conduction material of chip front laminating.

Preferably, the clamping plate is provided with a chamfer at the outer side, inclined plates are fixed at two ends of the pressing plate, and the inclined plates facilitate pouring of heat conduction materials.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the auxiliary mounting device is utilized to effectively press the heat conduction materials arranged on the two sides of the chip, so that the heat conduction materials can be better attached to the outer side of the chip, the heat conduction capability is improved, and meanwhile, the slight angle adjustment can be carried out on the transparent heat conduction materials attached to the surface of the chip, and the deviation of the mounting angle is avoided.

Drawings

FIG. 1 is a schematic diagram of a gain chip according to the present invention after being mounted;

FIG. 2 is a schematic view of the overall configuration of the present invention;

FIG. 3 is a schematic view of an auxiliary mounting device according to the present invention;

FIG. 4 is a partial schematic view of the auxiliary mounting device of the present invention;

FIG. 5 is a partial cross-sectional structural schematic view of a linking arm of the present invention;

FIG. 6 is a front view of the auxiliary mounting device of the present invention;

FIG. 7 is a partial schematic view of a clamping assembly according to the present invention;

FIG. 8 is a schematic view of an adjusting lever according to the present invention;

FIG. 9 is a sectional view of the connection between the position-limiting groove and the position-limiting strip according to the present invention.

In the figure: 1-heat sink mount; 2-a limiting frame; 3-mounting grooves; 4-auxiliary mounting means; 5-adjusting the rod; 6, mounting a plate; 7-pressing plate; 8-a linker arm; 9-U-shaped frame; 10-an adjusting arm; 11-a spacing ring; 12-a stop collar; 13-a first connecting frame; 14-a first connection plate; 15-adjusting the cap; 16-a second link frame; 17-a second connecting plate; 18-a moving bar; 19-moving the sleeve; 20-rotating the sleeve; 21-a limiting groove; 22-a limit bar; 23-adjusting the spring; 24-a stopper; 25-a connecting shell; 26-an inlet; 27-a cross recess; 28-a clamping assembly; 29-a clamping plate; 30-a moving slot; 31-a sliding column; 32-moving block; 33-a connecting strip; 34-a sloping plate; 35-clamping spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-9, a high performance gain chip packaging apparatus shown in the figure includes a heat sink mounting base 1, limiting frames 2 are fixed at both ends of the heat sink mounting base 1, a mounting groove 3 for mounting a chip is formed in the heat sink mounting base 1, the limiting frames 2 and the mounting groove 3 are designed to facilitate mounting and limiting of the gain chip, and auxiliary mounting devices 4 for facilitating mounting of a heat conduction material on the outer side of the chip are mounted in both the limiting frames 2.

The auxiliary mounting device 4 comprises a regulating rod 5, mounting plates 6 are sleeved at two ends of the regulating rod 5 in a sliding mode, the mounting plates 6 are fixed to two sides of the inner wall of the limiting frame 2 respectively, a pressing plate 7 is arranged at the bottom of the regulating rod 5, inclined plates 34 are fixed to two ends of the pressing plate 7, the inclined plates 34 enable heat conduction materials to be more conveniently plugged, two connecting arms 8 are arranged between the regulating rod 5 and the pressing plate 7, a U-shaped frame 9 is arranged at the top of the regulating rod 5, and two regulating arms 10 are arranged between the regulating rod 5 and the U-shaped frame 9;

the connecting arm 8 comprises a limiting ring 11, the limiting ring 11 is fixed on the outer side of one end of the adjusting rod 5, a limiting sleeve 12 is fixed on the outer side of the limiting ring 11, first connecting frames 13 are fixed at the bottom of the limiting sleeve 12 and the position, corresponding to the limiting sleeve 12, of the surface of the pressing plate 7, a first connecting plate 14 is arranged between the two first connecting frames 13, and two ends of the first connecting plate 14 are rotatably connected with the two first connecting frames 13 through rotating shafts;

the adjusting arm 10 comprises an adjusting cap 15, the adjusting cap 15 is sleeved outside one end of the adjusting rod 5 in a threaded manner, second connecting frames 16 are fixed on the top of the adjusting cap 15 and the bottom of the U-shaped frame 9, a second connecting plate 17 is arranged between the two second connecting frames 16, two ends of the second connecting plate 17 are rotatably connected with the two second connecting frames 16 through rotating shafts, and the threads engraved in the two adjusting caps 15 are opposite, so that the adjusting caps can move in opposite directions when rotating in the same direction;

the adjusting rod 5 comprises a moving rod 18 and a moving sleeve 19, the outer ends of the moving rod 18 and the moving sleeve 19 are respectively fixed with two limiting rings 11, the outer sides of the moving rod 18 and the moving sleeve 19 are respectively in threaded connection with two adjusting caps 15, one end of the moving rod 18 is inserted into the moving sleeve 19 in a sliding mode, the outer end of the moving rod 18 is connected with a rotating sleeve 20 through a bearing rotating sleeve 20, a limiting groove 21 is formed in the moving sleeve 19, a limiting strip 22 in sliding connection with the limiting groove 21 is fixed on the outer side of the moving rod 18, an adjusting spring 23 is installed in the moving sleeve 19, and two ends of the adjusting spring 23 are respectively fixed with the inner walls of the moving rod 18 and the moving sleeve 19;

the installation principle of the heat conduction materials on the two sides of the auxiliary gain chip is as follows: fill in the chip both sides with the heat conduction material, because current heat conduction material adopts heat conduction electric gasket usually, the pliability that its material itself possessed, consequently, we are filling in the back, through pressing carriage release lever 18 and removal cover 19, make its move in opposite directions to make first connecting plate 14 in the linking arm 8 take place to rotate, and promote and press the clamp plate 7 and remove downwards, realize the extrusion to the heat conduction material, thereby make it have certain deformation, and laminate more with the chip.

In addition, two limiting blocks 24 are fixed on the outer sides of the tail end of the movable sleeve 19 and the rotating sleeve 20, a connecting shell 25 is fixed on the outer side of the mounting plate 6, two inlets 26 matched with the limiting blocks 24 are formed in the connecting shell 25, cross grooves 27 are carved in the outer ends of the movable sleeve 19 and the moving rod 18, and after the limiting blocks 24 are inserted into the connecting shell 25, personnel can rotate the movable sleeve 19 by means of a screwdriver, so that the adjustment of the adjusting arm 10 can be realized;

a clamping assembly 28 for mounting a transparent heat conduction material is arranged in the U-shaped frame 9, the clamping assembly 28 comprises a clamping plate 29, two moving grooves 30 are formed in two ends of the clamping plate 29, sliding columns 31 are fixed in the moving grooves 30, moving blocks 32 are sleeved on the outer sides of the sliding columns 31 in a sliding mode, the tops of the moving blocks 32 are rotatably connected with connecting strips 33 through rotating shafts, the other ends of the connecting strips 33 are rotatably connected with the tops of the U-shaped frame 9 through rotating shafts, clamping springs 35 are sleeved on the outer sides of the sliding columns 31, two ends of each clamping spring 35 are respectively in contact with one side of each moving block 32 and the inner wall of each moving groove 30, the moving blocks 32 are pushed through the clamping springs 35, so that the clamping plate 29 can clamp the transparent heat conduction material, and chamfers are formed in the outer sides of;

the angle adjustment and installation principle of the transparent heat conduction material on the front surface of the auxiliary gain chip is as follows: when the transparent heat conduction material on the front surface of the gain chip is installed, the two ends of the transparent heat conduction material are respectively plugged into the two U-shaped frames 9, and the moving block 32 is pushed to move under the elasticity of the clamping spring 35, so that the transparent heat conduction material is clamped and fixed;

pressing the movable rod 18 and the movable sleeve 19, moving the movable rod and the movable sleeve in opposite directions, penetrating the limit block 24 through the inlet 26 to be clamped with the connecting shell 25, aligning the cross groove 27 at the tail end of the movable sleeve 19 by means of an external tool screwdriver, screwing the movable sleeve 19, under the condition that the limit strip 22 and the limit groove 21 are mutually matched, enabling the movable rod 18 to be driven to rotate by rotation of the movable sleeve 19, enabling the movable rod 18 and the movable sleeve 19 to move on the two adjusting caps 15, enabling the second connecting plate 17 to be effectively adjusted in rotation, facilitating fine adjustment of the U-shaped frame 9, and achieving fine adjustment of angles of the transparent heat conduction materials on the front face of the gain chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.