阅读说明：本技术 一种高频天线线路板阻焊发白的处理工艺 (Treatment process for solder mask whitening of high-frequency antenna circuit board ) 是由 梅浩 于 2019-03-25 设计创作，主要内容包括：本发明涉及一种高频天线线路板阻焊发白的处理工艺,在线路板阻焊工艺及表面处理之后,针对阻焊发白位置采用高温和强紫外线进行照射处理,其中温度控制在60-80℃。本发明可以有效释放阻焊表面的钠离子和氯离子污染,能有效的改善表面处理后阻焊发白问题。(The invention relates to a processing technology of high-frequency antenna circuit board solder mask whitening, which is characterized in that after the solder mask technology and the surface treatment of a circuit board, high-temperature and strong ultraviolet rays are adopted for irradiation treatment aiming at a solder mask whitening position, wherein the temperature is controlled at 60-80 ℃. The invention can effectively release sodium ion and chloride ion pollution on the surface of the solder mask and can effectively improve the problem of solder mask whitening after surface treatment.)

1. A processing technology for solder mask whitening of a high-frequency antenna circuit board is characterized in that after the solder mask technology and the surface processing of the circuit board, high temperature and strong ultraviolet rays are adopted for irradiation processing aiming at a solder mask whitening position, wherein the temperature is controlled to be 60-80 ℃.

2. The processing technology for the solder mask whitening of the high-frequency antenna circuit board according to claim 1, characterized in that: the ultraviolet intensity is 2500-.

3. The processing technology for the solder mask whitening of the high-frequency antenna circuit board according to claim 1, characterized in that: and a solder mask UV machine is utilized to synchronously realize the solder mask whitening treatment process, and an ultraviolet UV lamp and an LED lamp are arranged on the solder mask UV machine.

Technical Field

The invention belongs to the field of processing of circuit boards, and particularly relates to a processing technology for solder mask whitening of a high-frequency antenna circuit board.

Background

The manufacturing process of the high-frequency antenna circuit board comprises a PCB solder mask process and a surface treatment, and the traditional method for improving the solder mask whitening problem after the PCB surface treatment is realized by adopting a method of sending solder mask into an oven for baking, but the method cannot effectively improve the problem because the oven for baking only can further solidify ink but cannot release ions in the solder mask ink, and the whitening reason is mainly formed by the aggregation of ion pollution through research, so the whitening problem still exists after the surface treatment, and the high-quality production requirement cannot be met.

Disclosure of Invention

In order to overcome the defects, the invention provides a process for processing the solder mask whitening of the high-frequency antenna circuit board, which can effectively release sodium ions and chloride ions on the solder mask of the circuit board through processing, and effectively improve the problem of solder mask whitening after surface treatment.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a high-frequency antenna circuit board solder mask whitening treatment process is characterized in that after a circuit board solder mask process and surface treatment, high-temperature and strong ultraviolet rays are adopted for irradiation treatment of a solder mask whitening position, wherein the temperature is controlled to be 60-80 ℃.

As a further improvement of the invention: the ultraviolet intensity is 2500-. Thereby promoting the release of sodium ions and chloride ions on the surface of the solder mask and effectively improving the solder mask whitening problem after surface treatment.

As a preferred embodiment of the invention, the solder mask whitening treatment process is synchronously realized by using a solder mask UV machine, and an ultraviolet UV lamp and an LED lamp are arranged on the solder mask UV machine. Therefore, the solder resist process and the solder resist whitening treatment process can be completed on the same equipment, the processing process is simplified, and the production efficiency is improved.

The processing technology has the advantages that:

1. the surface treatment is carried out by adding high temperature and strong ultraviolet irradiation treatment, so that the pollution of sodium ions and chloride ions on the solder mask surface can be effectively released, and the solder mask whitening problem after the surface treatment can be effectively improved.

2. After the surface treatment, the high temperature and strong ultraviolet irradiation treatment are increased, so that the pollution of sodium ions and chloride ions on the copper surface can be effectively released, the activity of the copper surface is improved, and the tin soldering is convenient.

Detailed Description

In order to enhance the understanding of the present invention, the present invention will be described in further detail with reference to the following examples.