阅读说明：本技术 一种大孔径孔铜pcb板的镀孔菲林制作方法 (Method for manufacturing plated hole film of large-aperture hole copper PCB ) 是由 程卫涛 武守坤 李纪生 刘敏 于 2019-10-12 设计创作，主要内容包括：本发明属于线路板加工技术领域，提供了一种大孔径孔铜PCB板的镀孔菲林制作方法，包括镀孔菲林设计，所述镀孔菲林设计的尺寸比钻孔中使用钻咀的尺寸小。针对现有技术中孔铜≥35um的精细线路PCB板制作流程较复杂、成本高的问题，本发明可以有效提高外观良率，节约生产成本。(The invention belongs to the technical field of circuit board processing, and provides a method for manufacturing a hole-plating film of a large-aperture copper PCB. Aiming at the problems of complex manufacturing process and high cost of the fine circuit PCB with the hole copper being more than or equal to 35um in the prior art, the invention can effectively improve the appearance yield and save the production cost.)

1. A method for manufacturing a plated hole film of a copper PCB with a large aperture hole is characterized by comprising the following steps: the method comprises the following steps of a former procedure, drilling, copper deposition, plate electroplating, pattern transfer, copper and tin electroplating, film stripping, pattern transfer, copper and tin electroplating, etching and a later procedure;

the drill bit comprises a plated hole film design, wherein the size of the plated hole film design is smaller than that of a drill bit used in drilling.

2. The method for manufacturing a plated hole film of a large-aperture copper PCB according to claim 1, wherein the method comprises a plated hole film design, and the plated hole film size of the metallized hole is 1.5-3.5mil smaller than the single side of the drill bit.

3. The method for manufacturing a film for plating a hole on a large-aperture copper PCB according to claim 1, wherein the thickness of the copper in the hole is 10-15um in the board electroplating process.

4. The method for manufacturing a hole-plating film of a large-aperture copper PCB according to claim 1, wherein in the copper electroplating process, a local addition mode is adopted, and only the hole copper with the thickness of 10um or more is processed.

5. The method for manufacturing a hole-plating film of a large-aperture copper PCB according to claim 4, wherein in the copper electroplating process, the thickness of the secondary hole copper is 20-50 um.

6. The method for manufacturing a hole-plated film of a large-aperture copper PCB according to claim 1, wherein the aperture of the drilled hole is 0.5-1.5 mm.

7. The method for manufacturing a hole-plating film of a large-aperture copper PCB according to claim 3, wherein in the hole copper processing, the current density is 1.5-3.5ASD, and the hole-plating time is 30-45 min.

8. The method for manufacturing a hole-plating film of a large-aperture copper PCB according to claim 1, wherein in the copper-nickel electroplating process, the current density is 2.5-4ASD, and the electroplating time is 8-15 min.

9. The method for manufacturing a hole-plating film of a large-aperture copper PCB according to claim 1, wherein a dry film protection copper surface is manufactured on the surface of the circuit board before the copper-nickel electroplating process.

Technical Field

The invention belongs to the technical field of circuit board processing, and particularly relates to a method for manufacturing a hole-plated film of a copper PCB with a large-aperture hole.

Background

For the manufacture of a fine circuit PCB with hole copper of more than or equal to 35um, a hole plating process is generally adopted in the industry after full-plate electroplating, the design of a hole plating film is more than or equal to 3mil (as shown in figure 2) compared with the single side of a drill bit, and the hole edge needs to be polished to be flat due to the protruding hole edge after hole plating.

According to the manufacturing method, after the hole is plated, one more polishing process is performed, and manpower and material resources are wasted. And if the polishing is not performed to the subsequent process, the appearance is poor, and particularly, the appearance of the plate with the surface treated by the nickel-gold is more obvious.

Disclosure of Invention

In view of the above, the invention provides a method for manufacturing a hole-plated film of a large-aperture copper PCB, which reduces the problem of board appearance caused by uneven polishing of an orifice after hole plating of the large-aperture copper PCB; the qualification rate of the products is improved. The invention has simple operation and is convenient for the field operation of the board.

The technical scheme of the invention is as follows:

a method for manufacturing a plated hole film of a copper PCB with a large aperture hole is characterized by comprising the following steps: the method comprises the following steps of a former procedure, drilling, copper deposition, plate electroplating, pattern transfer, copper and tin electroplating, film stripping, pattern transfer, copper and tin electroplating, etching and a later procedure;

the drill bit comprises a plated hole film design, wherein the size of the plated hole film design is smaller than that of a drill bit used in drilling.

In the invention, the polishing process after hole plating in the prior art is cancelled.

Furthermore, the invention comprises the design of a plated hole film, and the size of the plated hole film of the metallized hole is 1.5-3.5mil smaller than the single side of the drill bit.

Furthermore, in the plate electric technology, the thickness of the hole copper is 10-15 um.

Furthermore, in the copper electroplating process, a local addition mode is adopted, and only the hole copper with the thickness of 10um or more is processed.

Furthermore, in the copper electroplating process, the thickness of the secondary hole copper is 20-50 um.

Further, the aperture of the drill hole is 0.5-1.5 mm.

Furthermore, in the hole copper processing, the current density is 1.5-3.5ASD, and the hole plating time is 30-45 min.

Furthermore, in the copper-nickel electroplating process, the current density is 2.5-4ASD, and the electroplating time is 8-15 min.

Furthermore, before the copper-nickel electroplating process, a dry film protection copper surface is manufactured on the surface of the circuit board.

The invention provides a new manufacturing scheme for the PCB with the hole copper more than or equal to 35 um. Aiming at the problems of complex manufacturing process and high cost of the fine circuit PCB with the hole copper being more than or equal to 35um in the prior art, the invention can effectively improve the appearance yield and save the production cost.

According to the invention, through the design that the size of the plated hole film of the metallized hole is smaller than that of the single side of the drill bit, the convex plating condition outside the hole is prevented, so that the surface copper is smooth, the polishing process without the convex plating condition is avoided, the problem of uneven surface copper thickness caused by plate grinding is solved, the plated hole process is optimized, and the production cost is reduced. Meanwhile, the problems that the orifice is excessively ground due to the grinding of the plate and the copper surface has grinding marks after the plate is ground are solved.

Drawings

FIG. 1 is a schematic view of a processing method according to an embodiment of the present invention;

fig. 2 is a schematic view of a prior art processing method.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.