阅读说明：本技术 一种厚板压合台阶制作方法 (Method for manufacturing thick plate pressing step ) 是由 胡样平 樊廷慧 林映生 吴世亮 于 2019-10-10 设计创作，主要内容包括：本发明属于线路板加工技术领域，提供了一种厚板压合台阶制作方法，包括以下步骤：S1.开料时，包括内层板A、内层板B，分别制备内层板A、内层板B，使得内层板A的长度比内层板B的长度长18?23mm，保持两板的宽度相同；S2.分别在内层板A和内层板B上钻出定位孔；S3.使用定位孔将内层板A和内层板B压合在一起，形成台阶板。本发明通过不同内层板尺寸差在压合的时候就制作出台阶，减少了压合后控深铣台阶的额外流程，提高了生产效率，降低生产成本。(The invention belongs to the technical field of circuit board processing, and provides a method for manufacturing a thick plate pressing step, which comprises the following steps: s1, when cutting, preparing an inner layer plate A and an inner layer plate B respectively, wherein the length of the inner layer plate A is 18-23mm longer than that of the inner layer plate B, and the width of the two plates is kept the same; s2, respectively drilling positioning holes in the inner-layer plate A and the inner-layer plate B; and S3, pressing the inner-layer plate A and the inner-layer plate B together by using the positioning holes to form a step plate. According to the invention, the steps are manufactured during pressing through different size differences of the inner layer plates, so that the additional process of depth-controlled step milling after pressing is reduced, the production efficiency is improved, and the production cost is reduced.)

1. A thick plate pressing step manufacturing method is characterized by comprising the following steps:

s1, when cutting, preparing an inner layer plate A and an inner layer plate B respectively, wherein the length of the inner layer plate A is 18-23mm longer than that of the inner layer plate B, and the width of the two plates is kept the same;

s2, respectively drilling positioning holes in the inner-layer plate A and the inner-layer plate B;

and S3, pressing the inner-layer plate A and the inner-layer plate B together by using the positioning holes to form a step plate.

2. The method of claim 1, wherein the number of the positioning holes is 4-8.

3. The method of claim 2, wherein the positioning holes are symmetrically disposed on the long side of the inner layer plate A.

4. The method of claim 2, wherein the positioning holes are symmetrically disposed on the long side of the inner plate B.

5. The method for manufacturing a thick plate pressing step according to claim 4, wherein the positioning holes are symmetrically arranged on the long side of the inner layer plate B in the area close to the plate edge.

6. The method of manufacturing a thick plate press-fit step according to any one of claims 2 to 5, wherein the pitch of the positioning holes of the inner plate A is the same as the pitch of the positioning holes of the inner plate B.

7. The method of claim 6, wherein the positioning holes of the inner plate A and the positioning holes of the inner plate B are correspondingly disposed, and when the inner plates A and B are stacked, the positioning holes disposed therein are overlapped.

8. The method of claim 1, wherein in step S3, the inner plate B is placed on top of the inner plate A, the positioning holes formed in the two plates are overlapped and fixed by rivets, and the step plate is formed by the size difference after lamination.

9. The method of claim 8, wherein the inner plate B is placed in a middle region of the inner plate A.

Technical Field

The invention belongs to the technical field of circuit board processing, and particularly relates to a thick plate pressing step manufacturing method.

Background

The glue layer is arranged between two adjacent plates in the conventional multilayer circuit board, and when the multilayer circuit board is laminated, the plates are firstly laminated, the two adjacent plates are pre-bonded by the glue layer, and then the laminated plates are pressed by laminating equipment.

In the current printed circuit board industry, the thickness of a clamp plate in the electroplating process is 3.5mm, the plate with the thickness exceeding 3.5mm needs a depth-control step milling process after lamination, and the plate can be electroplated only after the plate edge thickness is milled to be below 3.5 mm. The method additionally increases a step depth control milling process, wastes production efficiency and increases production cost.

Disclosure of Invention

In view of the above, the invention provides a method for manufacturing a step for pressing a thick plate, which directly manufactures the step during pressing, reduces the additional production flow of milling the step after pressing, and is simple and easy to operate.

The technical scheme of the invention is as follows:

a thick plate pressing step manufacturing method is characterized by comprising the following steps:

s1, when cutting, preparing an inner layer plate A and an inner layer plate B respectively, wherein the length of the inner layer plate A is 18-23mm longer than that of the inner layer plate B, and the width of the two plates is kept the same;

s2, respectively drilling positioning holes in the inner-layer plate A and the inner-layer plate B;

and S3, pressing the inner-layer plate A and the inner-layer plate B together by using the positioning holes to form a step plate.

Furthermore, the number of the positioning holes is 4-8, and the stability of the connecting structure of the upper plate and the lower plate can be ensured in the pressing process through the number of the positioning holes.

Furthermore, the positioning holes are symmetrically arranged on the long edge of the inner-layer plate A.

Furthermore, the positioning holes are symmetrically arranged on the long edge of the inner-layer plate B.

Furthermore, the positioning holes are symmetrically arranged in the area, close to the plate edge, of the long edge of the inner-layer plate B.

Furthermore, the distance between the positioning holes of the inner-layer plate A is the same as that of the positioning holes of the inner-layer plate B, so that the positioning holes between the two plates can be coincident.

Furthermore, the positioning holes of the inner-layer plate A and the positioning holes of the inner-layer plate B are correspondingly arranged, and when the inner-layer plate A and the inner-layer plate B are stacked, the positioning holes arranged in the two plates are overlapped.

Further, in step S3, the inner layer board B is placed above the inner layer board a, the positioning holes formed in the two boards are overlapped, and the two boards are connected and fixed by rivets, and after being pressed, a step board is formed by the size difference.

Furthermore, the inner plate B is arranged in the middle area of the inner plate A, so that the stability in the pressing process and the structural stability of the pressing back step plate are ensured.

According to the invention, the steps are manufactured during pressing through different size differences of the inner layer plates, so that the additional process of depth-controlled step milling after pressing is reduced, the production efficiency is improved, and the production cost is reduced.

The invention does not need heating pre-bonding, has simple processing conditions and strong universality.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.