Circuit board manufacturing method and circuit board
阅读说明:本技术 电路板的制作方法及电路板 (Circuit board manufacturing method and circuit board ) 是由 金立奎 车世民 陈德福 王细心 雷刚 于 2019-10-21 设计创作,主要内容包括:本发明提供一种电路板的制作方法及电路板,制作方法包括形成第一板体;在第二板体的底面上形成保护层,之后使第二板体的底面与第一板体的顶面贴合;第二板体上具有预设区域,预设区域在第一板体上的投影位于保护层在第一板体上的投影内;通过激光切割的方法沿预设区域的边缘形成切割缝,使保护层、预设区域内的第二板体与第一板体分离;通过在第一板体和第二板体之间形成保护层,并通过激光切割的方法沿预设区域的边缘形成切割缝,以使预设区域内的第二板体、保护层能够与第一板体分离,形成的阶梯槽与通过铣削的方式形成的阶梯槽相比,其侧壁更加光滑,进而使得形成的电路板的精度高。(The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body; forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer, the second plate body in the preset area and the first plate body are separated; through forming the protective layer between first plate body and second plate body to form the cutting seam through the edge in the method of laser cutting along presetting the region, so that second plate body, protective layer in the presetting region can separate with first plate body, and the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.)
1. A method for manufacturing a circuit board is characterized by comprising the following steps:
forming a first plate body;
forming a protective layer on the bottom surface of a second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body;
and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
2. The method for manufacturing a circuit board according to claim 1, wherein the forming a protective layer on the bottom surface of the second board body, and then attaching the bottom surface of the second board body to the top surface of the first board body further comprises: and connecting the first plate body and the second plate body.
3. The method of claim 2, wherein the connecting the first board body to the second board body comprises: the first plate body is provided with a first through hole, the second plate body is provided with a second through hole, the connecting piece is arranged in the first through hole and the second through hole in a penetrating mode, a first stopping portion abutting against the first plate body is formed at the first end of the connecting piece, and a second stopping portion abutting against the second plate body is formed at the second end of the connecting piece.
4. The method for manufacturing a circuit board according to claim 3, wherein the first stopper portion and/or the second stopper portion is formed by pressing the connecting member.
5. The method of claim 2, wherein the connecting the first board body to the second board body comprises: and heating the edges of the first plate body and the second plate body so as to melt part of the first plate body and part of the second plate body and form a connecting part at the junction position of the first plate body and the second plate body.
6. The method for manufacturing a circuit board according to claim 2, wherein the step of connecting the first board body and the second board body further comprises: a first metal layer is formed on a top surface of the second plate.
7. The method for manufacturing a circuit board according to claim 6, further comprising, after forming the first metal layer on the top surface of the second board body: and forming a third plate body on the bottom surface of the first plate body, wherein a second metal layer is arranged on the bottom surface of the third plate body.
8. The method for manufacturing a circuit board according to claim 7, wherein the forming a third board body on the bottom surface of the first board body, after the forming a second metal layer on the bottom surface of the third board body, further comprises: and forming a circuit pattern on the first metal layer and the second metal layer.
9. The method for manufacturing a circuit board according to any one of claims 1 to 8, wherein the forming of the first board body includes: the first plate body is formed by forming a third metal layer on the insulating plate.
10. A circuit board, comprising: a circuit board produced by the method for producing a circuit board according to any one of claims 1 to 9.
Technical Field
The invention relates to the field of electronic equipment manufacturing, in particular to a circuit board and a manufacturing method thereof.
Background
With the continuous development of electronic communication technology, the requirement for the space of the circuit board is higher and higher. In order to reduce the space occupied by the circuit board, a stepped groove (british name Cavity) is generally disposed on the circuit board, and at least part of the electronic device is mounted in the stepped groove, so as to prevent the electronic device from being exposed outside the circuit board, and the volume is too large, and the space is occupied, so how to form the stepped groove on the circuit board becomes a hot point of research.
Disclosure of Invention
The invention provides a manufacturing method of a circuit board and the circuit board, and aims to solve the technical problem that the precision of the circuit board is insufficient due to the fact that the side wall of a stepped groove formed by cutting through a milling cutter is rough.
The invention provides a manufacturing method of a circuit board, which comprises the following steps:
forming a first plate body; forming a protective layer on the bottom surface of a second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
Further, after the protective layer is formed on the bottom surface of the second board body and the bottom surface of the second board body is attached to the top surface of the first board body, the method further includes: and connecting the first plate body and the second plate body.
Further, the connecting the first board body and the second board body comprises: the first plate body is provided with a first through hole, the second plate body is provided with a second through hole, the connecting piece is arranged in the first through hole and the second through hole in a penetrating mode, a first stopping portion abutting against the first plate body is formed at the first end of the connecting piece, and a second stopping portion abutting against the second plate body is formed at the second end of the connecting piece.
Further, the first stopper portion and/or the second stopper portion is formed by pressing the connecting member.
Further, the connecting the first board body and the second board body comprises: and heating the edges of the first plate body and the second plate body so as to melt part of the first plate body and part of the second plate body and form a connecting part at the junction position of the first plate body and the second plate body.
Further, said connecting said first board body and said second board body further comprises: a first metal layer is formed on a top surface of the second plate.
Further, after forming the first metal layer on the top surface of the second plate body, the method further includes: and forming a third plate body on the bottom surface of the first plate body, wherein a second metal layer is arranged on the bottom surface of the third plate body.
Further, the forming a third board body on the bottom surface of the first board body, after having a second metal layer on the bottom surface of the third board body, further includes: and forming a circuit pattern on the first metal layer and the second metal layer.
Further, the forming a first plate body includes: the first plate body is formed by forming a third metal layer on the insulating plate.
The present invention also provides a circuit board, comprising: the circuit board is manufactured according to the manufacturing method of the circuit board.
The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body; forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer, the second plate body in the preset area and the first plate body are separated; through forming the protective layer between first plate body and second plate body to form the cutting seam through the edge in the method of laser cutting along presetting the region, so that second plate body, protective layer in the presetting region can separate with first plate body, and the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Fig. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a circuit pattern and a first through hole formed on a top surface of a first board in the method for manufacturing a circuit board according to the embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a second through hole formed in a second board in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 4 is a schematic view illustrating a first board and a second board connected by a connecting member in the method for manufacturing a circuit board according to the embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a first metal layer formed on a top surface of a second board body, and a third board body and a second metal layer formed on a bottom surface of the first board body in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 6 is a schematic diagram illustrating a circuit pattern formed on the first metal layer and the second metal layer in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 7 is a schematic diagram after a cutting seam is formed by a laser cutting method in the manufacturing method of the circuit board according to the embodiment of the invention;
fig. 8 is a schematic diagram of the circuit board after a step groove is formed in the manufacturing method of the circuit board according to the embodiment of the invention.
Description of reference numerals:
1: a first plate body;
11: a first through hole;
12: a third metal layer;
2: a second plate body;
21: presetting an area;
22: a second through hole;
23: a first metal layer;
3: a protective layer;
4: cutting a seam;
5: a connecting member;
51: a first stopper portion;
52: a second stopper portion;
6: a circuit pattern;
7: a third plate body;
71: a second metal layer.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Fig. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention; fig. 2 is a schematic diagram illustrating a circuit pattern and a first through hole formed on a top surface of a first board in the method for manufacturing a circuit board according to the embodiment of the present invention; fig. 3 is a schematic diagram illustrating a second through hole formed in a second board in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 4 is a schematic view illustrating a first board and a second board connected by a connecting member in the method for manufacturing a circuit board according to the embodiment of the present invention; fig. 5 is a schematic diagram illustrating a first metal layer formed on a top surface of a second board body, and a third board body and a second metal layer formed on a bottom surface of the first board body in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 6 is a schematic diagram illustrating a circuit pattern formed on the first metal layer and the second metal layer in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 7 is a schematic diagram after a cutting seam is formed by a laser cutting method in the manufacturing method of the circuit board according to the embodiment of the invention; fig. 8 is a schematic diagram of the circuit board after a step groove is formed in the manufacturing method of the circuit board according to the embodiment of the invention. Reference is now made to fig. 1-8. A method of fabricating a circuit board according to an embodiment of the present application is described. As shown in fig. 1, the present embodiment provides a method for manufacturing a circuit board, including: forming a
S101: forming a first plate body.
Referring to fig. 2, in particular, the
Alternatively, functional units such as
S102: forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body.
Referring to fig. 2 to 7, specifically, the
Alternatively, the
Alternatively, the material of the
Alternatively, the
S103: and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
Referring to fig. 7 and 8, specifically, a
Alternatively, the laser may be CO2Laser or UV laser.
Optionally, the
The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body 1; forming a protective layer 3 on the bottom surface of the second plate body 2, and then attaching the bottom surface of the second plate body 2 to the top surface of the first plate body 1; the second plate body 2 is provided with a preset area 21, and the projection of the preset area 21 on the first plate body 1 is positioned in the projection of the protective layer 3 on the first plate body 1; forming a cutting seam 4 along the edge of the preset area 21 by a laser cutting method, so that the protective layer 3 and the second plate body 2 in the preset area 21 are separated from the first plate body 1; through forming protective layer 3 between first plate body 1 and second plate body 2 to form cutting seam 4 along the edge of predetermineeing regional 21 through the method of laser cutting, so that predetermineeing second plate body 2 in regional 21, protective layer 3 and can separate with first plate body 1, the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.
As shown in fig. 4, the method further includes the steps of forming a
Specifically,
Optionally, there may be a plurality of ways to connect the
According to the manufacturing method of the circuit board, the
Referring to fig. 3-8, in one realisable form, connecting the
Specifically, a
Optionally, a special laser burning mode can be adopted to form the first through
Optionally, there may be a plurality of forming positions of the first through
Alternatively, the forming manner and the forming position of the second through
Alternatively, the material of the connecting
Optionally, a first sinking groove is formed at one end of the first through
According to the manufacturing method of the circuit board provided by the embodiment, the connecting
Referring to fig. 3-8, further, the
Specifically, the connecting
Alternatively, when the connecting
In the manufacturing method of the circuit board provided by this embodiment, the first blocking
In other implementations, connecting the
Specifically, through the edge of heating
As shown in fig. 5 to 8, further, after connecting the
Specifically, the
Optionally, the
In the manufacturing method of the circuit board provided by this embodiment, the
As shown in fig. 5 to 8, further, after forming the
Specifically, the
Referring to fig. 6, optionally, a
Optionally, a fourth board body may be formed on the bottom surface of the
Alternatively, the second metal layer 71 and the fourth metal layer may be copper layers.
In the manufacturing method of the circuit board provided in this embodiment, the
As shown in fig. 2, further, forming the
Specifically, the
Optionally, the
Alternatively, the
Alternatively, the
Alternatively, the
According to the manufacturing method of the circuit board, the
For example, when the method for manufacturing a circuit board provided by this embodiment is adopted, first, a third metal layer 12 is formed on the top surface of the insulating board to form a first board body 1; then, a cover film made of polyimide is used as a protective layer 3, the protective layer 3 is adhered to the bottom surface of the second plate body 2 through an adhesive, wherein the second plate body 2 is made of polypropylene (PP) resin, and then the bottom surface of the second plate body 2 is attached to the top surface of the first plate body 1 and is connected with the first plate body 1 and the second plate body; when the first plate body 1 and the second plate body are connected, firstly, a first through hole 11 is formed in the first plate body 1, a second through hole 22 is formed in the second plate body 2, the connecting piece 5 is arranged in the first through hole 11 and the second through hole 22 in a penetrating mode, then, in a mode of extruding the connecting piece 5, a first stopping part 51 which is abutted against the first plate body 1 is formed at the first end of the connecting piece 5, and a second stopping part 52 which is abutted against the second plate body 2 is formed at the second end of the connecting piece 5; thereafter, a first metal layer 23 is formed on the top surface of the second board body 2, a third board body 7 is formed on the bottom surface of the first board body 1, and a second metal layer 71 is provided on the bottom surface of the third board body 7; forming circuit patterns on the first metal layer 23 and the second metal layer 71 by etching; in addition, the second board body 2 is provided with a preset area 21, and the projection of the preset area 21 on the first board body 1 is positioned in the projection of the protective layer 3 on the first board body 1; finally, by CO2The protective layer 3 and the second plate body 2 are cut by laser along the edge of the preset area 21 to form a cutting seam 4, so that the protective layer 3 and the second plate body 2 in the preset area 21 are separated from the first plate body 1; the first plate body 1 positioned at the bottom of the stepped groove can be subjected to subsequent manufacturing processes such as welding prevention, electrical measurement and the like so as to finish the manufacturing of the stepped groove.
Referring to fig. 8, the present embodiment further provides a circuit board, including the circuit board manufactured by the above method for manufacturing a circuit board.
The circuit board that this embodiment provided, through forming
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "circumferential", and the like, are used to indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the invention and to simplify the description, and do not indicate or imply that the position or element referred to must have a particular orientation, be of particular construction and operation, and thus, are not to be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; may be mechanically coupled, may be electrically coupled or may be in communication with each other; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
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