Method for manufacturing multilayer flexible circuit board and product thereof
阅读说明：本技术 一种多层柔性线路板的制作方法及其制品 (Method for manufacturing multilayer flexible circuit board and product thereof ) 是由 李龙凯 于 2019-08-23 设计创作，主要内容包括：本发明公开了一种多层柔性线路板的制作方法,包括以下步骤：(1)制作双面FPC柔性板；(2)制作新型材料层结构；(3)在双面FPC柔性板上表面和/或下表面的线路上热压上至少一组新型材料层结构；在最外层新型材料层结构的线路上和/或双面FPC柔性板外露的线路上成型保护层,获得多层柔性线路板。本发明还公开了实施上述方法制作出的多层柔性线路板。本发明制作工序简化、方便,生产效率高；制作出的多层柔性线路板不但大幅简化了新型材料层结构,减薄了整体厚度,而且具有高速传输高频信号的功能,特别适用于新型5G科技产品；对线路与线路之间通电时的铜离子迁移现象具有防护及抵抗作用,保证线路安全正常工作。(The invention discloses a method for manufacturing a multilayer flexible circuit board, which comprises the following steps: (1) manufacturing a double-sided FPC flexible board; (2) manufacturing a novel material layer structure; (3) hot pressing at least one group of novel material layer structures on the circuit on the upper surface and/or the lower surface of the double-sided FPC flexible board; and forming a protective layer on the circuit of the outermost novel material layer structure and/or the exposed circuit of the double-sided FPC flexible board to obtain the multilayer flexible circuit board. The invention also discloses a multilayer flexible circuit board manufactured by implementing the method. The invention has the advantages of simplified and convenient manufacturing process and high production efficiency; the manufactured multilayer flexible circuit board not only greatly simplifies the structure of a novel material layer and reduces the whole thickness, but also has the function of transmitting high-frequency signals at high speed, and is particularly suitable for novel 5G scientific and technological products; the protective and resistant effects on the copper ion migration phenomenon when the circuit is electrified are achieved, and the safe and normal work of the circuit is guaranteed.)
1. A manufacturing method of a multilayer flexible circuit board is characterized by comprising the following steps:
(1) manufacturing a double-sided FPC flexible board: respectively coating a copper layer on the upper surface and the lower surface of the base film, and forming a circuit on the copper layer to obtain a double-sided FPC flexible board;
(2) making at least one group of novel material layer structure
(2.1) coating a copper layer on one surface of the film to form a single-sided board;
(2.2) coating a semi-cured high-frequency material layer on the other surface of the film of the single-sided board to obtain at least one group of novel material layer structures;
(3) hot-press molding: hot pressing at least one group of novel material layer structures on the circuit on the upper surface and/or the lower surface of the double-sided FPC flexible board, and in the hot pressing process, firstly, gradually raising the hot pressing temperature from 50-100 ℃ to 380-400 ℃ for 80-120 min; then, maintaining the hot pressing temperature of 380-400 ℃ for 60-90 min; finally, the hot pressing temperature is gradually reduced from 380 ℃ to 400 ℃ to 50 ℃ to 100 ℃, and the time for use is 30-60 min; in the whole process, the hot-pressing pressure is 400psi-500 psi; after hot pressing, the semi-cured high-frequency material layer on the novel material layer structure is combined with the circuit on the double-sided FPC flexible board into a whole; in the step, after each group of novel material layer structures are hot-pressed, a circuit is formed on a copper layer of the novel material layer structures; finally, forming a protective layer on the circuit of the outermost novel material layer structure and/or the exposed circuit of the double-sided FPC flexible board to obtain a multi-layer flexible circuit board;
wherein, the step (1) and the step (2) have no sequence.
2. The method of claim 1, wherein the step (2.2) comprises the following steps:
(2.2.1) putting the single-sided board on a coating machine, and coating a layer of synthetic liquid high-frequency material on the thin film of the single-sided board;
(2.2.2) sending the single-sided board coated with the synthetic liquid high-frequency material into a tunnel oven, and sequentially passing through a first heating baking area, a second heating baking area, a third heating baking area, a fourth heating baking area, a fifth heating baking area and a sixth heating baking area in the tunnel oven at a speed of 0.5-20m/s for segmented baking, so that the synthetic liquid high-frequency material on the single-sided board becomes a semi-solidified high-frequency material layer; wherein the temperature range of the first heating baking area is 60-100 ℃, the temperature range of the second heating baking area is 100-200 ℃, the temperature range of the third heating baking area is 200-300 ℃, the temperature range of the fourth heating baking area is 300-400 ℃, the temperature range of the fifth heating baking area is 400-500 ℃, the temperature range of the sixth heating baking area is 60-100 ℃, and the length of each heating baking area is 2-6 m.
3. The method of manufacturing a multilayer flexible wiring board according to claim 1, wherein in the step (1), the base film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film; in the step (2.1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film.
4. The method of manufacturing a multilayer flexible printed circuit board according to claim 1, wherein in the step (2.2), the semi-cured high frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high frequency functional adhesive, or a mixture of an LDK high frequency functional adhesive and a copper ion migration resistant adhesive.
5. The method for manufacturing the multilayer flexible circuit board according to claim 4, wherein the LDK high-frequency functional adhesive is obtained by adding Teflon or LCP material into AD adhesive, and the anti-copper ion migration adhesive is obtained by adding copper ion scavenger into AD adhesive and then highly purifying.
6. The method of manufacturing a multilayer flexible wiring board according to claim 1, wherein in the step (2.2), a color filler is added to at least one of the semi-cured high-frequency material layer and the thin film.
7. The multilayer flexible circuit board prepared by implementing the method of any one of claims 1 to 6, which comprises a double-sided FPC flexible board, a plurality of groups of upper novel material layer structures laminated on the upper surface of the double-sided FPC flexible board, and a plurality of groups of lower novel material layer structures laminated on the lower surface of the double-sided FPC flexible board, wherein the double-sided FPC flexible board comprises a base film, a first upper circuit layer arranged on the upper surface of the base film, and a first lower circuit layer arranged on the lower surface of the base film; the upper novel material layer structure comprises an upper semi-cured high-frequency material layer arranged on the upper surface of the first upper circuit layer, an upper film arranged on the upper surface of the upper semi-cured high-frequency material layer, and a second upper circuit layer arranged on the upper surface of the upper film; the lower novel material layer structure comprises a lower semi-solidified high-frequency material layer arranged on the lower surface of the first lower circuit layer, a lower thin film arranged on the lower surface of the lower semi-solidified high-frequency material layer, and a second lower circuit layer arranged on the lower surface of the lower thin film.
8. The multilayer flexible wiring board of claim 7, wherein the base film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film, the upper film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film, and the lower film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film.
9. The multilayer flexible circuit board of claim 7, wherein the upper semi-cured high frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high frequency functional adhesive, or a mixture of an LDK high frequency functional adhesive and an anti-copper ion migration adhesive, and the lower semi-cured high frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high frequency functional adhesive, or a mixture of an LDK high frequency functional adhesive and an anti-copper ion migration adhesive.
10. The multilayer flexible wiring board of claim 7, wherein at least one of the upper semi-cured high frequency material layer and the upper film is a colored layer, and at least one of the lower semi-cured high frequency material layer and the lower film is a colored layer.
11. The multilayer flexible circuit board of claim 7, wherein an upper protection layer is disposed on the upper surface of the second upper circuit layer of the novel material layer structure disposed on the outermost layer above the double-sided FPC flexible board, and a lower protection layer is disposed on the lower surface of the second lower circuit layer of the novel material layer structure disposed on the outermost layer below the double-sided FPC flexible board.
12. The multilayer flexible circuit board of claim 11, wherein the upper protective layer is a solder resist ink layer or a combination of a glue layer and a PI film, and the lower protective layer is a solder resist ink layer or a combination of a glue layer and a PI film.
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing method of a multilayer flexible circuit board and a product thereof.
Background
At present, from a communication network to a terminal application, the communication frequency is comprehensive and high-frequency, and high-speed and high-capacity applications emerge endlessly. In recent years, as wireless networks transition from 4G to 5G, network frequencies have increased. According to the 5G development route map displayed in the related data, the communication frequency will be promoted in two stages in the future. The first stage aims to boost the communication frequency to 6GHz before 2020, and the second stage aims to further boost to 30-60GHz after 2020. In the aspect of market application, the signal frequency of terminal antennas such as smart phones is continuously improved, high-frequency applications are more and more, and the requirements for high speed and large capacity are more and more. In order to adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, the flexible board is used as an antenna and a transmission line in terminal equipment, and the technology is also upgraded.
The conventional flexible printed circuit board has a multi-layer structure composed of a copper foil, an insulating substrate, a cover layer, etc., and is processed into a PI flexible printed circuit board by using the copper foil as a conductor circuit material, a PI film as a circuit insulating substrate, and the PI film and an epoxy resin adhesive as a cover layer for protecting and isolating a circuit through a certain process. Since the final physical and electrical properties of the flexible printed circuit board are determined by the properties of the insulating substrate, the flexible printed circuit board needs to adopt substrates with various performance characteristics in order to adapt to different application scenarios and different functions. At present, the soft board substrate which is applied more is mainly Polyimide (PI), but because the PI substrate has large dielectric constant and loss factor, large moisture absorption and poor reliability, the PI soft board has serious high-frequency transmission loss and poor structural characteristics, and cannot adapt to the current high-frequency high-speed trend. Therefore, with the emergence of new 5G technology products, the signal transmission frequency and speed of the existing circuit board have been difficult to meet the requirements of the 5G technology products.
Meanwhile, in the traditional multilayer flexible circuit board preparation process, the problems of more process flows, complex manufacturing, increased power consumption and signal transmission loss in the aspect of circuit board performance and the like generally exist.
Meanwhile, copper ion migration can appear between circuit and the circuit under the circular telegram condition of accurate circuit board usually, in the equipment use, can lead to the fact danger such as circuit burning explosion because of switching on the collision between circuit and the circuit, lead to the unable safe normal work of circuit on the circuit board.
Disclosure of Invention
Aiming at the defects, the invention aims to provide a method for manufacturing a multilayer flexible circuit board and a product thereof, wherein the circuit board is simplified in manufacturing procedure and more convenient to manufacture, and the production and processing efficiency is improved; the multilayer flexible line way board of producing has not only simplified novel material layer structure by a wide margin, has attenuate the whole thickness of circuit board, has the high frequency characteristic moreover, has the performance of high-speed transmission high frequency signal promptly, adaptable current high-frequency high-speed trend from wireless network to terminal application, and the copper ion migration phenomenon when circular telegram on circuit board and the circuit has fine protection and resistance simultaneously to novel 5G scientific and technological product, guarantees the safe normal work of circuit.
The technical scheme adopted by the invention to achieve the aim is as follows:
a manufacturing method of a multilayer flexible circuit board is characterized by comprising the following steps:
(1) manufacturing a double-sided FPC flexible board: respectively coating a copper layer on the upper surface and the lower surface of the base film, and forming a circuit on the copper layer to obtain a double-sided FPC flexible board;
(2) making at least one group of novel material layer structure
(2.1) coating a copper layer on one surface of the film to form a single-sided board;
(2.2) coating a semi-cured high-frequency material layer on the other surface of the film of the single-sided board to obtain at least one group of novel material layer structures;
(3) hot-press molding: hot pressing at least one group of novel material layer structures on the circuit on the upper surface and/or the lower surface of the double-sided FPC flexible board, and in the hot pressing process, firstly, gradually raising the hot pressing temperature from 50-100 ℃ to 380-400 ℃ for 80-120 min; then, maintaining the hot pressing temperature of 380-400 ℃ for 60-90 min; finally, the hot pressing temperature is gradually reduced from 380 ℃ to 400 ℃ to 50 ℃ to 100 ℃, and the time for use is 30-60 min; in the whole process, the hot-pressing pressure is 400psi-500 psi; after hot pressing, the semi-cured high-frequency material layer on the novel material layer structure is combined with the circuit on the double-sided FPC flexible board into a whole; in the step, after each group of novel material layer structures are hot-pressed, a circuit is formed on a copper layer of the novel material layer structures; finally, forming a protective layer on the circuit of the outermost novel material layer structure and/or the exposed circuit of the double-sided FPC flexible board to obtain a multi-layer flexible circuit board;
wherein, the step (1) and the step (2) have no sequence.
As a further improvement of the present invention, the step (2.2) specifically comprises the following steps:
(2.2.1) putting the single-sided board on a coating machine, and coating a layer of synthetic liquid high-frequency material on the thin film of the single-sided board;
(2.2.2) sending the single-sided board coated with the synthetic liquid high-frequency material into a tunnel oven, and sequentially passing through a first heating baking area, a second heating baking area, a third heating baking area, a fourth heating baking area, a fifth heating baking area and a sixth heating baking area in the tunnel oven at a speed of 0.5-20m/s for segmented baking, so that the synthetic liquid high-frequency material on the single-sided board becomes a semi-solidified high-frequency material layer; wherein the temperature range of the first heating baking area is 60-100 ℃, the temperature range of the second heating baking area is 100-200 ℃, the temperature range of the third heating baking area is 200-300 ℃, the temperature range of the fourth heating baking area is 300-400 ℃, the temperature range of the fifth heating baking area is 400-500 ℃, the temperature range of the sixth heating baking area is 60-100 ℃, and the length of each heating baking area is 2-6 m.
As a further improvement of the present invention, in the step (1), the base film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film; in the step (2.1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film.
As a further improvement of the invention, in the step (2.2), the semi-cured high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and an anti-copper ion migration adhesive.
As a further improvement of the invention, the LDK high-frequency functional adhesive is obtained by adding Teflon or LCP material into AD adhesive, and the anti-copper ion migration adhesive is obtained by adding copper ion scavenger into AD adhesive and then highly purifying.
As a further improvement of the present invention, in the step (2.2), at least one of the semi-cured high-frequency material layer and the thin film is added with a color filler.
The multilayer flexible circuit board prepared by implementing the method is characterized by comprising a double-sided FPC flexible board, a plurality of groups of upper novel material layer structures stacked on the upper surface of the double-sided FPC flexible board, and a plurality of groups of lower novel material layer structures stacked on the lower surface of the double-sided FPC flexible board, wherein the double-sided FPC flexible board comprises a base film, a first upper circuit layer arranged on the upper surface of the base film, and a first lower circuit layer arranged on the lower surface of the base film; the upper novel material layer structure comprises an upper semi-cured high-frequency material layer arranged on the upper surface of the first upper circuit layer, an upper film arranged on the upper surface of the upper semi-cured high-frequency material layer, and a second upper circuit layer arranged on the upper surface of the upper film; the lower novel material layer structure comprises a lower semi-solidified high-frequency material layer arranged on the lower surface of the first lower circuit layer, a lower thin film arranged on the lower surface of the lower semi-solidified high-frequency material layer, and a second lower circuit layer arranged on the lower surface of the lower thin film.
As a further improvement of the invention, the base film is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film, the upper film is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film, and the lower film is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film.
As a further improvement of the invention, the upper semi-cured high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive or a mixture of the LDK high-frequency functional adhesive and a copper ion migration resistant adhesive, and the lower semi-cured high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive.
As a further improvement of the present invention, at least one of the upper semi-cured high frequency material layer and the upper thin film is a colored layer, and at least one of the lower semi-cured high frequency material layer and the lower thin film is a colored layer.
As a further improvement of the invention, an upper protective layer is arranged on the upper surface of the second upper circuit layer of the novel material layer structure on the outermost layer above the double-sided FPC flexible board, and a lower protective layer is arranged on the lower surface of the second lower circuit layer of the novel material layer structure below the outermost layer below the double-sided FPC flexible board.
As a further improvement of the invention, the upper protective layer is a welding-proof ink layer or the combination of an adhesive layer and a PI film, and the lower protective layer is a welding-proof ink layer or the combination of an adhesive layer and a PI film.
The invention has the beneficial effects that:
(1) the double-sided FPC flexible board and the array of novel material layer structures are manufactured firstly, then the array of novel material layer structures are hot-pressed on the double-sided FPC flexible board to manufacture the multilayer flexible circuit board, the multilayer flexible circuit board with the required number of layers can be formed through hot pressing according to specific needs, the circuit board manufacturing procedure is simplified and is more convenient to manufacture, the circuit board manufacturing speed is increased, the production and processing efficiency is improved, and the production cost is reduced.
(2) Adopt MPI film, LCP film, TFP film or PTFE film, replace traditional PI film, as the structural substrate of shaping circuit in double-sided FPC flexbile plate and novel material layer, all be particularly suitable for the flexible line way board, not only can improve stability and dimensional stability of circuit board wholeness ability, and have the high frequency characteristic, transmissible high frequency signal, and accelerate the transmission rate of high frequency signal, realize the high-speed transmission of high frequency signal, power consumption and high frequency signal transmission loss are low, improve the signal transmission performance of circuit board, adaptable current high frequency high-speed trend from wireless network to terminal application, be particularly useful for novel 5G scientific and technological product.
(3) The semi-cured high-frequency material layer is adopted to replace the traditional semi-cured AD adhesive, and can be an MPI film, an LCP film, a TFP film, a PTFE film or an LDK high-frequency functional adhesive, so that the manufactured novel material layer structure has high-frequency characteristics, can transmit high-frequency signals at high speed, and has the functions of improving signal transmission frequency and resisting magnetic interference. The multilayer flexible circuit board prepared by hot-pressing the plurality of novel material layer structures on the double-sided FPC flexible board has high-frequency characteristics, can transmit high-frequency signals and accelerate the transmission speed of the high-frequency signals, high-speed transmission of the high-frequency signals is realized, the power consumption and the transmission loss of the high-frequency signals are low, the signal transmission performance of the circuit board is further improved, and the multilayer flexible circuit board is adaptable to the high-frequency high-speed trend from a wireless network to a terminal application at present and is particularly suitable for novel 5G technical products.
(4) The semi-cured high-frequency material layer is adopted to replace the traditional semi-cured AD adhesive, the semi-cured high-frequency material layer can be a mixture of LDK high-frequency functional adhesive and copper ion migration resistant adhesive, namely the semi-cured high-frequency material layer has the characteristic of transmitting high-frequency signals and also has the function of copper ion migration resistance, so that the manufactured novel material layer structure has the high-frequency characteristic, can transmit high-frequency signals at high speed and also has the function of copper ion migration resistance. Then with the multilayer flexible line way board that the preparation was out on the two-sided FPC flexible board of the hot pressing of several groups of novel material layer structures, can effectively guarantee that the circuit board can safe effective work in operating condition circuit, copper ion migration phenomenon can not appear between circuit and the circuit under the circular telegram condition, equipment is in the circular telegram use, copper ion migration phenomenon between circuit and the circuit prevents to appear, thereby prevent the circuit short circuit, the burning that the circuit switched on and arouses a fire, the battery explosion, and danger such as functional failure, thereby the circuit plays fine guard action.
(5) Structurally, an upper novel material layer structure and a lower novel material layer structure with special layer structures are combined to be respectively and sequentially superposed, so that the structural design of a multilayer flexible circuit board can be realized, the structural design of 4 layers, 6 layers, 8 layers or more layers can be achieved, and more requirements can be met; simultaneously, by the novel material layer structure of going up of modified and novel material layer structure, only to the two-sided flexible line way board of four layers, compare in the two-sided flexible line way board of traditional four layers, two-layer glue film and two-layer thin layer have been reduced, the novel material layer structure of product has been simplified by a wide margin to attenuate the whole thickness of multilayer flexible line way board, reduce whole product material cost, optimize the equipment space, promote product signal transmission speed, reduce power consumption, improve the moisture resistance and the heat resistance of product, make product wholeness can obtain improving.
The above is an overview of the technical solutions of the present invention, and the present invention is further described below with reference to the accompanying drawings and the detailed description thereof.
Drawings
FIG. 1 is an exploded view of a four-layer double-sided flexible circuit board of the present invention;
FIG. 2 is an overall cross-sectional view of a four-layer double-sided flexible circuit board of the present invention;
FIG. 3 is another overall cross-sectional view of a four-layer double-sided flexible wiring board of the present invention;
FIG. 4 is an overall cross-sectional view of a six-layer double-sided flexible circuit board of the present invention;
FIG. 5 is another overall cross-sectional view of a six-layer double-sided flexible wiring board of the present invention;
FIG. 6 is an overall cross-sectional view of a three-layer double-sided flexible circuit board of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined purposes, the following detailed description of the embodiments of the present invention is provided with the accompanying drawings and the preferred embodiments.
The embodiment of the invention provides a method for manufacturing a multilayer flexible circuit board, which comprises the following steps:
(1) manufacturing a double-sided FPC flexible board: respectively coating a copper layer on the upper surface and the lower surface of the base film, and forming a circuit on the copper layer to obtain a double-sided FPC flexible board;
(2) making at least one group of novel material layer structure
(2.1) coating a copper layer on one surface of the film to form a single-sided board;
(2.2) coating a semi-cured high-frequency material layer on the other surface of the film of the single-sided board to obtain at least one group of novel material layer structures;
(3) hot-press molding: hot pressing at least one group of novel material layer structures on the circuit on the upper surface and/or the lower surface of the double-sided FPC flexible board, and in the hot pressing process, firstly, gradually raising the hot pressing temperature from 50-100 ℃ to 380-400 ℃ for 80-120 min; then, maintaining the hot pressing temperature of 380-400 ℃ for 60-90 min; finally, the hot pressing temperature is gradually reduced from 380 ℃ to 400 ℃ to 50 ℃ to 100 ℃, and the time for use is 30-60 min; in the whole process, the hot-pressing pressure is 400psi-500 psi; after hot pressing, the semi-cured high-frequency material layer on the novel material layer structure is combined with the circuit on the double-sided FPC flexible board into a whole; in the step, after each group of novel material layer structures are hot-pressed, a circuit is formed on a copper layer of the novel material layer structures; finally, forming a protective layer on the circuit of the outermost novel material layer structure and/or the exposed circuit of the double-sided FPC flexible board to obtain a multi-layer flexible circuit board;
wherein, the step (1) and the step (2) have no sequence.
This embodiment adopts and prepares out two-sided FPC flexbile plate and the novel material layer structure of array earlier, makes multilayer flexible line way board with the mode preparation multilayer flexible line way board of the novel material layer structure hot pressing of array on two-sided FPC flexbile plate again, can be according to concrete needs, and the multilayer flexible line way board of the required number of piles of hot pressing formation, circuit board preparation process is simplified and is makeed more conveniently. As shown in fig. 1 to 3, a group of novel material layer structures are respectively hot-pressed on the upper and lower surfaces of a double-sided FPC flexible board to form a four-layer double-sided flexible circuit board; as shown in fig. 4 and 5, two sets of novel material layer structures are respectively hot-pressed on the upper and lower surfaces of the double-sided FPC flexible board to form a six-layer double-sided flexible circuit board. Of course, more groups of novel material layer structures can be respectively hot-pressed on the upper surface and the lower surface of the double-sided FPC flexible board to form a multi-layer flexible circuit board. The novel material layer structure can also be hot-pressed on one of the upper surface and the lower surface of the double-sided FPC flexible board, and the protective layer can be formed on the surface of the double-sided FPC flexible board which is not hot-pressed and has the novel material layer structure, as shown in FIG. 6, the double-sided FPC flexible board is a three-layer double-sided flexible circuit board.
The protective layer in this embodiment may be a solder mask ink layer or a combination of a glue layer and a PI film, and protects the circuit.
In this embodiment, the step (2.2) specifically includes the following steps:
(2.2.1) putting the single-sided board on a coating machine, and coating a layer of synthetic liquid high-frequency material on the thin film of the single-sided board;
(2.2.2) sending the single-sided board coated with the synthetic liquid high-frequency material into a tunnel oven, and sequentially passing through a first heating baking area, a second heating baking area, a third heating baking area, a fourth heating baking area, a fifth heating baking area and a sixth heating baking area in the tunnel oven at a speed of 0.5-20m/s for segmented baking, so that the synthetic liquid high-frequency material on the single-sided board becomes a semi-solidified high-frequency material layer; wherein the temperature range of the first heating baking area is 60-100 ℃, the temperature range of the second heating baking area is 100-200 ℃, the temperature range of the third heating baking area is 200-300 ℃, the temperature range of the fourth heating baking area is 300-400 ℃, the temperature range of the fifth heating baking area is 400-500 ℃, the temperature range of the sixth heating baking area is 60-100 ℃, and the length of each heating baking area is 2-6 m.
In the step (1), the base film is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film; in the step (2.1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film. Specifically, the characteristics and advantages of the PI film, the MPI film, the LCP film, the TFP film, and the PTFE film are respectively:
the PI film is a polyimide film (polyimide film), is a film type insulating material with good performance, and is formed by performing polycondensation and film-forming on pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent and then performing imidization. The PI film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and medium resistance, can be used for a long time in the temperature range of-269-280 ℃, and can reach the high temperature of 400 ℃ in a short time. The glass transition temperatures were 280 ℃ (Uplix R), 385 ℃ (Kapton) and 500 ℃ or higher (Uplix S), respectively. The tensile strength is 200MPa at 20 ℃ and is more than 100MPa at 200 ℃. Is particularly suitable for being used as a substrate of a flexible circuit board.
MPI (modified PI) is modified polyimide, namely the formula of the Polyimide (PI) is improved. MPI is a noncrystalline material, so that it has a wide working temperature, is easy to work with a copper foil pressed at a low temperature, can easily bond with copper on the surface, and is inexpensive. In particular, the fluoride formulation is improved, so that the MPI film can transmit high-frequency signals of 10-15 GHz. The MPI film is used as a substrate forming circuit, is particularly suitable for preparing a flexible circuit board, achieves the purposes of receiving and transmitting information stably at high speed, and is applied to terminals such as 5G mobile phones, high-frequency signal transmission fields, automatic driving, radars, cloud servers, smart homes and the like.
Through measuring the speed, the technical indexes of the MPI film are as follows:
from the above, the MPI film has the following characteristics:
(1) low Dk value, low Df value;
(2) excellent thermal aging resistance;
(3) excellent dimensional stability;
(4) excellent chemical resistance.
Therefore, the MPI film is adopted as the base material required by the forming circuit of the embodiment, so that the stability and the dimensional stability of the overall performance of the circuit board can be improved, high-frequency signals can be transmitted, the transmission speed of the high-frequency signals is increased, the signal transmission performance of the circuit board is improved, and the MPI film can adapt to the high-frequency and high-speed trend from a wireless network to a terminal application at present.
LCP is known as Liquid Crystal Polymer (Liquid Crystal Polymer), is a novel thermoplastic organic material, and generally exhibits Liquid crystallinity in a molten state. The LCP film is a liquid crystal polymer film, has the performances of high strength, high rigidity, high temperature resistance, thermal stability, bendability, dimensional stability, good electrical insulation and the like, and has better water resistance compared with a PI film, so that the LCP film is a film type material which is more excellent than the PI film. The LCP film can realize high-frequency high-speed soft boards on the premise of ensuring higher reliability. LCP films have the following excellent electrical characteristics:
(1) the dielectric constant can be kept constant almost in the whole radio frequency range up to 110GHz, the consistency is good, and the dielectric constant Dk value is specifically 2.9;
(2) the tangent loss is very small, only 0.002, and is only increased to 0.0045 even at 110GHz, so that the method is very suitable for millimeter wave application;
(3) has very small thermal expansion characteristic and can be used as an ideal high-frequency packaging material.
The LCP film is adopted as the base material required by the circuit forming of the embodiment, the stability and the dimensional stability of the overall performance of the circuit board can be improved, and the LCP film is smoother as a whole, so that the dielectric loss and the conductor loss of the LCP film material are smaller, and the LCP film has flexibility and sealing performance, can transmit high-frequency signals and accelerate the transmission speed of the high-frequency signals, improves the signal transmission performance of the circuit board, and is suitable for the high-frequency high-speed trend from a wireless network to a terminal application at present.
Specifically, the speed of the circuit board for transmitting the command to the central area (chip) in the working state can be effectively increased, the device (such as a mobile phone and communication base station device) can be quickly operated by quickly transmitting the command to each part, phenomena such as slowness, dead halt, jamming and the like do not exist, and the communication process is integrally smooth. Therefore, the LCP film has good application prospect in manufacturing high-frequency devices, and is particularly suitable for novel 5G technical products.
Meanwhile, the LCP soft board made of the LCP film as the base material has better flexibility, and can further improve the space utilization rate compared with the PI soft board. Flexible electronics can be further slimmed with smaller bend radii, and thus the pursuit for flexibility is also a manifestation of miniaturization. The resistance change is larger than 10% as a judgment basis, and under the same experimental condition, the LCP soft board can tolerate more bending times and smaller bending radius compared with the traditional PI soft board, so that the LCP soft board has better flexibility and product reliability. The LCP flexible board can be freely designed in shape due to the excellent flexibility, so that narrow space in the smart phone is fully utilized, and the space utilization efficiency is further improved.
Therefore, a miniaturized high-frequency high-speed LCP flexible board can be manufactured by using the LCP film as the base material.
TFP is a unique thermoplastic material with the following properties compared to conventional PI materials:
(1) low dielectric constant: low Dk value, specifically 2.55; whereas the Dk value of conventional PI is 3.2; therefore, the signal propagation speed is high, the thickness is thinner, the interval is tighter, and the power processing capability is higher;
(2) ultra-low material loss;
(3) ultra-high temperature performance, which can resist high temperature of 300 ℃;
(4) the moisture absorption rate is relatively low.
Therefore, the TFP film is adopted as the base material required by the forming circuit of the embodiment, so that the stability and the dimensional stability of the overall performance of the circuit board can be improved, high-frequency signals can be transmitted, the transmission speed of the high-frequency signals is increased, the signal transmission performance of the circuit board is improved, and the TFP film can adapt to the high-frequency and high-speed trend from a wireless network to a terminal application at present.
PTFE, chinese name: polytetrafluoroethylene, other name: teflon, taflon, teflon. Polytetrafluoroethylene (PTFE) has excellent dielectric properties, chemical resistance, heat resistance, flame retardance, low dielectric constant and dielectric loss and low variation over a high frequency range. The main properties are as follows:
1. electrical performance
(1) Dielectric constant: 2.1;
(2) dielectric loss: 5X 10-4；
(3) Volume resistance: 1018. omega. cm;
2. chemical properties: acid and alkali resistance, organic solvent resistance and oxidation resistance;
3. thermal stability: working for a long time at the temperature of-200-260 ℃;
4. flame retardancy: UL 94V-0;
5. weather resistance: there is no significant loss of mechanical properties over 20 years outdoors.
Therefore, the PTFE film is adopted as the base material required by the forming circuit of the embodiment, the stability and the dimensional stability of the overall performance of the circuit board can be improved, high-frequency signals can be transmitted, the transmission speed of the high-frequency signals is increased, the power consumption and the transmission loss of the high-frequency signals are reduced, the signal transmission performance of the circuit board is improved, the high-frequency high-speed trend from a wireless network to a terminal application can be adapted, and the high-frequency high-speed forming circuit is particularly suitable for novel 5G.
The demand of the high-frequency copper-clad plate is rapidly increased due to the integration of the 5G base station, and the polytetrafluoroethylene is taken as one of mainstream high-frequency base materials of the 5G high-frequency high-speed copper-clad plate, so that the 5G era can meet the great market growth.
Therefore, any one of the PI film, the MPI film, the LCP film, the TFP film and the PTFE film is adopted as a base material required by the forming circuit of the embodiment, and the base material is particularly suitable for a flexible circuit board, particularly the MPI film, the LCP film, the TFP film and the PTFE film, so that the overall performance of the flexible circuit board can be improved, the high-frequency characteristic is also realized, the transmission of high-frequency signals can be greatly accelerated, the high-speed transmission of the high-frequency signals is realized, and the novel 5G technology product is particularly suitable for.
Specifically, in the step (2.2), the semi-cured high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and an anti-copper ion migration adhesive. According to the high-frequency transmission device, the MPI film, the LCP film, the TFP film and the PTFE film are high-frequency film materials which can accelerate signal transmission frequency and speed, transmit high-frequency signals and improve signal transmission performance of a circuit board, the overall performance of the flexible circuit board can be improved, the high-frequency transmission device also has high-frequency characteristics, transmission of the high-frequency signals can be accelerated greatly, high-speed transmission of the high-frequency signals is achieved, and the high-frequency transmission device is particularly suitable for novel 5G scientific and technological products.
And to LDK high frequency function glue, obtain through adding teflon or LCP material in AD glues, this LDK high frequency function glue accessible is glued conventional AD and is added chemical material realization such as teflon or LCP, its inside molecular distribution is inseparabler, even, and not consume the energy, make LDK high frequency function glue have improvement signal transmission frequency, and the anti magnetic interference function, with the signal transmission performance who improves the circuit board, it is concrete, can effectively improve the circuit board and convey the speed that central zone (chip) assigned the instruction in operating condition, quick transmission is to each part, make equipment (such as cell-phone, communication base station equipment) operate fast, and phenomenon such as slow and dead machine card appears, make novel 5G science and technology product communication process whole smooth.
And for the anti-copper ion migration glue, the anti-copper ion migration glue is obtained by adding a reagent such as a copper ion capture agent into the AD glue and then highly purifying. Specifically, the liquid AD glue may be a conventional AD glue. The copper ion scavenger can be selected from inorganic ion exchangers (such as IXE-700F, IXE-750) which have the capability of trapping copper ions and can prevent the copper ions from migrating between circuits, and after the copper ion scavenger is added into the AD glue, the copper ion scavenger has no influence on the performance of the AD glue, but can improve the performance stability of the AD glue. The conventional AD glue contains epoxy resin, a tackifier, a plasticizer and various fillers, and after a high-purification process, the purity of the epoxy resin component in the AD glue can be improved, so that the possibility of copper ions between circuits migrating from the AD glue is obviously reduced, and the purpose of resisting copper ion migration is achieved. Specifically, a certain gap is formed between every two components in the conventional AD glue, copper ions can migrate through the gap, after the concentration of the epoxy resin for purifying the conventional AD glue is improved, the concentration of other components is obviously reduced, and the gap between the epoxy resin and the other components is greatly reduced, so that the gap for transferring the copper ions is reduced, and the purpose of resisting the transfer of the copper ions is achieved. Because the anti-copper ion migration glue has the anti-copper ion migration function of the low-particle material, the circuit can be effectively ensured to work safely and effectively in a working state, the ion migration phenomenon cannot occur between the circuit and the circuit, and the dangers of circuit short circuit, combustion, fire, explosion and the like caused by conduction collision between the circuit and the circuit in the use process of equipment are prevented, so that the circuit has good protection and protection effects.
When the semi-solidified high-frequency material layer is a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive, the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive are mixed, so that the semi-solidified high-frequency material layer has high-speed transmission high-frequency signals and copper ion migration resistant performance.
In the step (2.2), at least one of the semi-cured high-frequency material layer and the film is added with a colored filler. In particular, the colored filler may be a carbide or other colored filler. After the colored filler is added to the semi-cured high-frequency material layer (specifically, an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and a copper ion migration resistant adhesive) and the film (specifically, any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film), the film can exhibit corresponding colors, such as black, red, green, blue, and color. The colored semi-cured high-frequency material layer and the film have a shielding effect on the circuit, so that the internal circuit can be prevented from being exposed, and an outsider can be prevented from seeing the internal circuit from the outside, and the circuit on the circuit board is hidden and protected; meanwhile, the function of concealing the circuit board or the circuit with impurities or defects is achieved.
The embodiment of the invention also provides a multilayer flexible circuit board prepared by implementing the method, as shown in fig. 1 and fig. 2, the multilayer flexible circuit board comprises a double-sided FPC flexible board 1, a plurality of groups of upper novel material layer structures 2 stacked on the upper surface of the double-sided FPC flexible board 1, and a plurality of groups of lower novel material layer structures 3 stacked on the lower surface of the double-sided FPC flexible board 1, wherein the double-sided FPC flexible board 1 comprises a base film 11, a first upper circuit layer 12 arranged on the upper surface of the base film 11, and a first lower circuit layer 13 arranged on the lower surface of the base film 11; the upper novel material layer structure 2 comprises an upper semi-cured high-frequency material layer 21 arranged on the upper surface of the first upper circuit layer 12, an upper film 22 arranged on the upper surface of the upper semi-cured high-frequency material layer 21, and a second upper circuit layer 23 arranged on the upper surface of the upper film 22; the lower novel material layer structure 3 includes a lower semi-cured high-frequency material layer 31 disposed on the lower surface of the first lower circuit layer 13, a lower thin film 32 disposed on the lower surface of the lower semi-cured high-frequency material layer 31, and a second lower circuit layer 33 disposed on the lower surface of the lower thin film 32.
As shown in fig. 1 and 2, a set of upper novel
In this embodiment, the
In this embodiment, the upper semi-cured high-
In this embodiment, at least one of the upper semi-cured high
In this embodiment, an upper protection layer is disposed on the upper surface of the second
This embodiment is by the novel
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that other structures obtained by using the same or similar technical features as the above-described embodiments of the present invention are within the protection scope of the present invention.
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