阅读说明：本技术 一种pcb板层偏检测反馈系统及其检测装置 (PCB (printed circuit board) layer deviation detection feedback system and detection device thereof ) 是由 李智 崔荣 缪桦 于 2018-07-06 设计创作，主要内容包括：本申请公开了一种PCB板层偏检测反馈系统及其检测装置。该PCB板层偏检测装置包括夹持件、换向机构、视觉检测装置和控制装置,夹持件用于紧固PCB板；换向机构用于驱动夹持件旋转,使得夹持件换向；视觉检测装置设于夹持件周侧,用于对PCB板周边上的多层层偏科邦进行图像采集；控制装置与视觉检测装置、换向机构通信连接,控制装置用于控制换向机构对夹持件进行换向,使得视觉检测装置对多层层偏科邦进行图像采集；控制装置还用于根据视觉检测装置采集的图像,确定PCB板的多个相邻层偏数据和整体层偏数据。通过上述方式,本申请能够自动在线检测PCB板的各相邻层偏数据和整体层偏数据,提高测量PCB板的各相邻层偏数据和整体层偏数据的效率和准确度。(The application discloses PCB plate layer deviation detection feedback system and detection device thereof. The PCB layer deviation detection device comprises a clamping piece, a reversing mechanism, a visual detection device and a control device, wherein the clamping piece is used for fastening a PCB; the reversing mechanism is used for driving the clamping piece to rotate so as to reverse the clamping piece; the visual detection device is arranged on the periphery of the clamping piece and used for acquiring images of the multilayer eccentric band on the periphery of the PCB; the control device is in communication connection with the visual detection device and the reversing mechanism, and is used for controlling the reversing mechanism to reverse the clamping piece, so that the visual detection device acquires images of the multilayer layer eccentric bond; the control device is also used for determining a plurality of adjacent layer deviation data and integral layer deviation data of the PCB according to the image collected by the visual detection device. Through the mode, the method and the device can automatically detect the deviation data of each adjacent layer and the deviation data of the whole layer of the PCB on line, and improve the efficiency and accuracy of measuring the deviation data of each adjacent layer and the deviation data of the whole layer of the PCB.)

1. The PCB layer deviation detecting device is characterized by comprising:

a clamping member for fastening the PCB;

the reversing mechanism is used for driving the clamping piece to rotate so as to reverse the clamping piece;

the visual detection device is arranged on the periphery of the clamping piece and used for acquiring images of the multilayer layer border on the periphery of the PCB;

the control device is in communication connection with the visual detection device and the reversing mechanism, and is used for controlling the reversing mechanism to reverse the clamping piece, so that the visual detection device acquires images of the multilayer Centraalbo; the control device is also used for determining a plurality of adjacent layer deviation data and integral layer deviation data of the PCB according to the image collected by the visual detection device.

2. The PCB board layer deviation detecting device according to claim 1, wherein the PCB board comprises a plurality of layers of core boards arranged in a stacked manner, a layer deviation Kebang is arranged on the periphery of each layer of core board, the layer deviation Kebang on each layer of core board is in the same position, and the layer deviation Kebang is a rectangular copper sheet.

3. The PCB plate deviation detecting device of claim 1, further comprising a stacking device, wherein the stacking device is in communication connection with the control device, the control device classifies the PCB plates according to the integral layer deviation data, and controls the stacking device to stack the PCB plates to corresponding positions according to the grades of the PCB plates.

4. The PCB plate deviation detecting device of claim 3, further comprising a conveying mechanism, wherein the conveying mechanism is used for conveying the clamping pieces, one end of the conveying mechanism is correspondingly provided with a plurality of PCB plate collecting mechanisms, the plurality of PCB plate collecting mechanisms correspond to the grades of the PCB plates in a one-to-one mode, and the stacking device stacks the PCB plates to the corresponding PCB plate collecting mechanisms.

5. The PCB plate deviation detecting device of claim 4, wherein the conveying mechanism comprises a frame and a power roller arranged on the frame, and the power roller drives the clamping piece to move; the visual detection device is arranged on the rack and used for collecting images of the layer deviation department of the PCB on the clamping piece.

6. The PCB board deviation detecting device of claim 5, wherein said visual detecting device comprises a plurality of cameras, a plurality of said cameras are arranged on said frame, and image acquisition is performed from two sides of said PCB board.

7. The PCB plate deviation detecting device of claim 4, wherein a PCB plate releasing mechanism is arranged at the other end of the conveying mechanism and used for releasing the PCB plate onto the clamping member.

8. A PCB board deviation detection feedback system comprising the PCB board deviation detection apparatus, the PCB board manufacturing apparatus and the PCB board drilling apparatus according to any one of claims 1 to 7;

the PCB deviation detection device feeds back the deviation data of the adjacent layers to the PCB manufacturing device, and feeds back the deviation data of the whole layer to the PCB drilling device.

9. The PCB layer deviation detection feedback system of claim 8, wherein the control device in the PCB layer deviation detection device is configured to determine a centerline position of each layer of Centraalbo according to the acquired image, and calculate an offset of a centerline of an adjacent layer of Centraalbo as the adjacent layer deviation data;

the control device is further configured to perform a difference between a maximum value and a minimum value in the adjacent layer deviation data to obtain the overall layer deviation data.

10. The PCB deviation detecting and feedback system of claim 9, wherein the control device is further configured to determine whether the PCB is qualified according to a result of comparing the adjacent layer deviation data with a preset layer deviation data and a result of comparing the integral layer deviation data with a preset integral layer deviation data;

and judging that the PCB is unqualified and providing a scrapping early warning if the numerical value of the adjacent layer deviation data is larger than the numerical value of the preset adjacent layer deviation data or the numerical value of the integral layer deviation data is larger than the numerical value of the preset integral layer deviation data.

11. The PCB board layer bias detection feedback system of claim 9, wherein the PCB manufacturing apparatus determines a pre-scaled ratio of the printed circuit of a corresponding core board relative to the printed circuits of its adjacent core boards based on the adjacent layer bias data.

12. The PCB panel deviation detection feedback device of claim 9, wherein the PCB panel drilling device determines the overall panel deviation ratio of the PCB panel according to the overall panel deviation data.

Technical Field

The application relates to the technical field of circuit board manufacturing, in particular to a PCB (printed circuit board) layer deviation detection feedback system and a detection device thereof.

Background

With the development of high-level and high-precision Printed Circuit Boards (PCBs), the requirement for interlayer alignment precision is more and more required, and the problem of layer deviation is more and more serious. At present, the method commonly adopted in the industry is to add a group of concentric circles at four corners of a production board respectively, set the distance between the concentric circles according to the requirement of layer deviation in production, and check the deviation degree of the concentric circles through an X-ray inspection machine or an X-target drilling machine in the production process to confirm the layer deviation condition.

For the layer deviation of the adjacent inner core plates, the testing can be generally carried out only by adopting an X-ray inspection machine, the measuring efficiency is low, and only the plate can be tested by drawing. The data obtained do not accurately support the optimization of the prevention ratio of the printed circuits on the inner core board. Meanwhile, products with the adjacent layers exceeding the standard can not be accurately identified and scrapped early warning is carried out on the products, and the defects of abnormal PCBs can be found only after the abnormal PCBs are tested, so that unnecessary process cost waste is caused. Meanwhile, adjacent layers cannot be accurately identified, and the requirement of product layer deviation technical management and control on the future higher signal transmission requirements cannot be met.

For the integral layer deviation, the efficiency is low by adopting an X-drilling target machine for identification at present and then manually judging and stacking, and the plate layer deviation is abnormally scrapped due to the frequent error of manual judgment. Unqualified PCB boards can not be scrapped in advance accurately, and abnormal PCB boards can not be tested to find defects, so that unnecessary process cost waste is caused.

Disclosure of Invention

The application provides a PCB (printed circuit board) layer deviation detection feedback system and a detection device thereof, which are used for solving the problems of low efficiency and low accuracy of manual detection of the layer deviation condition of the PCB.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a PCB plate deviation detecting device. The PCB layer deviation detection device comprises a clamping piece, a reversing mechanism, a visual detection device and a control device, wherein the clamping piece is used for fastening a PCB; the reversing mechanism is used for driving the clamping piece to rotate so as to reverse the clamping piece; the visual detection device is used for carrying out image acquisition on the multilayer layer Cedrubang on the periphery of the PCB; the control device is in communication connection with the visual detection device and the reversing mechanism, and is used for controlling the reversing mechanism to reverse the clamping piece, so that the visual detection device acquires images of the multilayer layer eccentric bond; the control device is also used for determining a plurality of adjacent layer deviation data and integral layer deviation data of the PCB according to the image collected by the visual detection device.

In order to solve the above technical problem, another technical solution adopted by the present application is: a PCB layer deviation detection feedback system is provided. The PCB deviation detecting and feeding back system comprises the PCB deviation detecting device, the PCB manufacturing device and the PCB drilling device, wherein the PCB deviation detecting device feeds back adjacent layer deviation data to the PCB manufacturing device, and feeds back integral layer deviation data to the PCB drilling device.

The beneficial effect of this application is: be different from prior art's condition, this application is through setting up holder fastening PCB board, it is rotatory to set up reversing mechanism drive holder, make vision detection device gather the image of the multilayer layer of PCB board week side branch ke bang, controlling means can automatic control centre gripping, switching-over, the completion of action such as collection, controlling means can also be according to the image of gathering, on line to every PCB board detection layer inclined to one side situation, including measuring each adjacent layer inclined to one side data and the inclined to one side data of whole layer between the core plate of layer on the PCB board, the efficiency and the degree of accuracy of each adjacent layer inclined to one side data and the inclined to one side data of whole layer of measuring the PCB board have been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic structural diagram of an embodiment of a PCB layer bias detection feedback system provided by the present application;

fig. 2 is a schematic structural view of a PCB board manufactured by the PCB board manufacturing apparatus 2 of fig. 1;

FIG. 3 is an idealized cross-sectional view of the upper linkage of the PCB of FIG. 2;

FIG. 4 is a schematic diagram of an actual cross-sectional structure of an upper layer of the PCB of FIG. 2;

FIG. 5 is a schematic structural diagram of an embodiment of the PCB layer deviation detecting apparatus in FIG. 1;

FIG. 6 is a schematic structural diagram of another embodiment of the PCB layer deviation detecting device in FIG. 1;

FIG. 7 is a schematic structural diagram of another embodiment of the PCB layer deviation detecting device in FIG. 1;

FIG. 8 is a schematic diagram of the transport mechanism, gripper, reversing mechanism, and visual inspection device of FIG. 7;

FIG. 9 is a schematic structural view of an embodiment of the reversing mechanism of FIG. 8;

fig. 10 is a schematic structural diagram of another embodiment of the PCB board deviation detecting apparatus in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, a schematic structural diagram of an embodiment of a PCB layer deviation detection feedback system provided in the present application is shown.

The PCB deviation detection feedback system comprises a PCB deviation detection device 1, a PCB manufacturing device 2 and a PCB drilling device 3.

The PCB manufacturing apparatus 2 is used for pre-placing, adjusting and printing the circuit route pattern on the core board 110, and the PCB manufacturing apparatus 2 further performs processes such as pressing and positioning on the multi-layer core board 110 to initially manufacture the PCB 11.

Referring to fig. 2 to 4, the PCB 11 includes a plurality of stacked core boards 110, a layer of askew bonding 112 is disposed on a periphery of each layer of core board 110, positions of the layer of askew bonding 112 on each layer of core board 110 are the same, and the layer of askew bonding 112 is a rectangular copper sheet as a whole. Specifically, the PCB 11 is generally rectangular, the core board 110 includes a circuit printing area 113, a process auxiliary area 114, and an edge milling area 115, which are nested, four sides of the process auxiliary area 114 are provided with two sets of layer partial bonds 112, each side is provided with two sets of layer partial bonds 112, and the positions of the layer partial bonds 112 correspond to the corner areas of the circuit printing area 113 to identify the length and width of the circuit printing area 113. The edge milling area 115 of the PCB 11 is removed by edge milling to expose the process auxiliary area 114 and the layer offset kebab 112 thereon, so that the PCB layer offset detection apparatus 1 can conveniently acquire images of the multilayer layer offset kebab 112. The layer-side groups 112 are square as a whole, the multiple layers of core boards 110 are stacked, and then the corresponding multiple groups of layer-side groups 112 are also stacked, and the adjacent layer-side groups 112 are used for assisting in detecting the interlayer offset (adjacent layer offset data) between the core boards 110. As shown in fig. 3, the multi-layer linkage 112 is ideally aligned. In fig. 4, the actually manufactured PCB 11 has a deviation between the multi-layer askew pads 112 due to the influences of the pre-placement ratio of the printed circuits on the core boards, the pressing and positioning manner between the core boards, and the like during the manufacturing process.

The PCB drilling device 3 is used for drilling the PCB 11, and a plurality of holes are formed in the PCB 11, for example, copper plating is performed on the inner sides of the holes to allow circuits on the core boards 110 to be conducted with each other, and the holes can also be used as mounting holes for other electronic components on the PCB 11.

The PCB layer deviation detecting device 1 is used for detecting adjacent layer deviation data and whole layer deviation data of a plurality of layers of core boards 110 on a PCB 11, wherein the adjacent layer deviation data is an interlayer offset between the adjacent core boards 110, and the whole layer deviation data is a difference value between a maximum value and a minimum value of the adjacent layer deviation data. The PCB deviation detecting device 1 feeds back adjacent layer deviation data to the PCB manufacturing device 2, and feeds back integral layer deviation data to the PCB drilling device 3.

The PCB manufacturing apparatus 2 determines a pre-set ratio of the printed circuit on the corresponding inner core board 110 to the printed circuit of the adjacent inner core board 110 according to the adjacent layer bias data. For example, the length and width data of the printed circuit on each layer of the core board 110 are both 100, and if the offset data of the layer offset kebang 112 on the second layer of the core board 110 relative to the layer offset kebang 112 on the first layer of the core board 110 is positive 5, it is determined that the second layer of the core board 110 is enlarged by five percent relative to the first layer of the core board 110 in the direction, and then the PCB manufacturing apparatus 2 needs to reduce the preset proportion by five percent to obtain the preset proportion of the actual printed circuit when printing the circuit route diagram, so as to correct the interlayer offset of the multilayer core board 110 caused by the processes such as stitching, and reduce the offset data of each adjacent layer of the PCB 11, so that the circuit printing areas 113 on the multilayer core board 110 are aligned.

The PCB drilling device 3 determines the integral layer deviation proportion of the PCB 11 according to the integral layer deviation data. The PCB drilling device 3 corrects the coordinate value of the drilled hole on the PCB 11 according to the integral layer deviation ratio, so that the distance from the drilled hole to the adjacent circuit line on each layer of the core board 110 is appropriate, and the influence of the drilled hole on the circuit line on the core board 110 close to the drilled hole is reduced. For example, copper is plated in the drill hole, which is too close to the circuit line, and can affect the signal transmission of the circuit line and increase the loss of the signal transmission; even due to the interlayer offset, the uncorrected drill hole position interferes with the circuit lines.

Referring to fig. 5, the PCB panel deviation detecting apparatus 1 includes a clamping member 10, a reversing mechanism 20, a visual detecting apparatus 30, and a control apparatus 40.

The clip 10 is used to fasten the PCB board 11. The reversing mechanism 20 is used for driving the clamping member 10 to rotate, so that the clamping member 10 is reversed. The visual inspection device 30 is disposed on the periphery of the clamping member 10, and is used for acquiring images of the multi-layer linkage 112 on the periphery of the PCB 11. The control device 40 is in communication connection with the visual detection device 30 and the reversing mechanism 20, and the control device 40 is used for controlling the reversing mechanism 30 to reverse the clamping piece 10, so that the visual detection device 30 performs image acquisition on the multilayer layer ascetic bond 112; the control device 40 is further configured to determine a plurality of adjacent layer deviation data and an overall layer deviation data of the PCB 11 according to the image collected by the visual inspection device 30.

For example, the vision inspection device 30 captures an image of the layer of the top tab 112 on one side of the PCB 11 from a single direction, and then the reversing mechanism 20 rotates the clamping member 10 to another orientation such that the layer of the top tab 112 on the other side of the PCB is aligned with the vision inspection device 30. Or, the visual inspection device 30 simultaneously acquires images of the layer upper corbels 112 on two opposite sides of the PCB 11, so that the time for the visual inspection device 30 to acquire images of the layer upper corbels 112 on the periphery of the PCB 11 can be reduced. Of course, if the vision inspection device 30 simultaneously acquires images of the layer eccentric bond 112 from four positions of the PCB 11, the reversing mechanism 20 does not need to be provided.

The holding member 10 includes, for example, a stage 12 and a holding block 14, the PCB 11 is placed on the stage 12, and the holding block 14 holds and fixes the PCB 11 on the stage 12 from the periphery side of the PCB 11. The clamping member 10 may also be a clamping device with other structures, which are only exemplary and not limiting in the present application. The reversing mechanism 20 is arranged below the clamping piece 10, and comprises a rotating shaft, wherein the rotating shaft is connected with the clamping piece 10 and drives the clamping piece to rotate through the rotating shaft; or the reversing mechanism 20 is a wheel train assembly and drives the clamping piece 10 to reverse through a gear.

The control device 40 is further configured to determine a centerline position of each layer of the linkage 112 according to the acquired image, and calculate an offset of a centerline of the adjacent layer of the linkage 112 as adjacent layer offset data; the control device 40 is further configured to make a difference between the maximum value and the minimum value in the adjacent layer deviation data to obtain the overall layer deviation data.

Specifically, the control device 40 prestores preset adjacent layer deviation data and preset overall layer deviation data. The control device 40 is further configured to determine whether the PCB 11 is qualified according to a comparison result between the adjacent layer deviation data and the preset adjacent layer deviation data and a comparison result between the overall layer deviation data and the preset overall layer deviation data. And if the numerical value of the adjacent layer deviation data is greater than the numerical value of the preset adjacent layer deviation data or the numerical value of the integral layer deviation data is greater than the numerical value of the preset integral layer deviation data, judging that the PCB 11 is unqualified, and giving a scrapping early warning.

For the PCB 11 with the adjacent layer deviation data and the whole layer deviation data within a reasonable range, the control device 40 further classifies the PCB 11 according to the whole layer deviation data, and then stacks the PCB 11 according to the grade of the PCB 11. For example, if the value of the integral layer deviation data is preset to be 15, the rejection early warning is provided for the PCB 11 with the integral layer deviation data larger than 15, and the PCB is classified as a rejection level; the PCB 11 with the integral layer deviation data value of 0-5 is classified as a first stage, the PCB 11 with the integral layer deviation data value of 6-10 is classified as a second stage, and the PCB 11 with the integral layer deviation data value of 11-15 is classified as a third stage. Here, the classification rule of the PCB 11 is only an illustrative example, and the classification of the PCB 11 can be flexibly divided according to actual situations.

Referring to fig. 6, the PCB panel deviation detecting apparatus 1 further includes a stacking apparatus 50, the stacking apparatus 50 is communicatively connected to the control apparatus 40, and the control apparatus 40 controls the stacking apparatus 50 to stack the PCB panel 11 to a corresponding position according to the grade of the PCB panel 11. The stacking device 50 is, for example, disposed on the periphery of the clamping member 10, and includes a mechanical arm and a suction cup disposed on the mechanical arm, the mechanical arm implements loading and unloading of the PCB 11, and the mechanical arm drives the suction cup to place the PCB 11 of the same grade to a corresponding position. The stacking device 50 is only an exemplary embodiment, and the stacking device 50 may have other structures, which is not limited in this application.

Referring to fig. 7, the PCB layer deviation detecting device 1 further includes a conveying mechanism 60, the conveying mechanism 60 is used for conveying the clamping member 10, one end of the conveying mechanism 60 is correspondingly provided with a plurality of PCB collecting mechanisms 70, the plurality of PCB collecting mechanisms 70 are in one-to-one correspondence with the grades of the PCBs 11, and the stacking device 50 is disposed on the periphery of the conveying mechanism 60 and close to each PCB collecting mechanism 70, and is used for stacking the PCBs 11 with the grades determined after detection to the corresponding PCB collecting mechanisms 70. For example, the vision inspection device 30 is fixedly connected to the conveying mechanism 60, the reversing mechanism 20 is disposed on the conveying mechanism 60, and the reversing mechanism 20 reverses the direction of the clamping member 10 while the conveying mechanism 60 conveys the clamping member 10, so that the vision inspection device 30 can perform image acquisition on the multilayer layer askew bang 112 on the periphery side of the PCB 11. Alternatively, the holding member 10 and the reversing mechanism 20 are integrated in the same device, which is disposed on the conveying mechanism 60. After the control device 40 determines the grade of the PCB 11, the clamping member 10 releases the PCB 11, the stacking device 50 stacks the PCB 11 to the PCB collecting mechanism 70 corresponding to the grade, and the PCB collecting mechanism 70 sequentially stacks the PCB 11 in order, so that the subsequent PCB drilling device 3 can process the PCB according to the corresponding integral layer deviation data.

Referring to fig. 8, in the present embodiment, the conveying mechanism 60 includes a frame 62 and a power roller 64 disposed on the frame 62, and the power roller 64 drives the clamping member 10 to move. For example, the power roller 64 moves the gripper 10 by driving the conveyor belt; the reversing mechanism 20 is arranged on the frame 62 and is kept still with the conveying mechanism 60, and when the power roller 64 conveys the clamping member 10 to pass through the reversing mechanism 20, the reversing mechanism 20 is matched with the clamping member 10, so that the clamping member 10 is reversed. Referring to fig. 9, for example, the reversing mechanism 20 includes a rectangular body 22 having a guiding slideway 24, a cylindrical guide block is disposed on the bottom wall of the holding member 10, and when the holding member 10 passes through the reversing mechanism 20, the cylindrical guide block cooperates with the guiding slideway 24 to deflect the holding member 10 by 90 degrees for reversing. The visual inspection device 30 is also provided on the frame 62, and collects an image of the layer upper 112 on the periphery of the PCB board 11 on the holder 10.

With continued reference to fig. 8, the vision inspection device 30 includes a plurality of cameras 32, and the plurality of cameras 32 are disposed on the frame 62 for capturing images from two sides of the PCB 11. For example, the vision inspection device 30 includes two sets of cameras 32, one set of camera 32 is used to inspect the multilayer layer askew bond 112 on the long side of the PCB 11, the other set of camera 32 is used to inspect the multilayer layer askew bond 112 on the wide side of the PCB 11, the reversing mechanism 20 is disposed between the two sets of cameras 32, and then the vision inspection device 30 can complete the image acquisition of the multilayer layer askew bond 112 on the peripheral side of the PCB 11 after the clamping member 10 is once reversed by the reversing mechanism 20.

For example, each group of cameras 32 is four in number, distributed on the frame 62, and arranged on two sides of the power roller 64, and the distance between the cameras 32 on each side is set corresponding to the distance between two groups of multi-layer banjo 112 on the wide side or the long side of the PCB 11. Or, two cameras 32 are arranged on two sides of the power roller 64, and image collection is sequentially performed on two sets of multi-layer banjo 112 on the wide side or the long side of the PCB 11 in the process of conveying the clamping member 10 by the conveying mechanism 60.

The control device 40 detects adjacent layer deviation data and overall layer deviation data of the PCB 11 in the length and width directions thereof according to the collected image. The PCB manufacturing apparatus 2 adjusts the pre-scaling ratio from the two directions of the length and width of the circuit route pattern, and then prints the adjusted circuit route pattern on the line board 110. The PCB drilling apparatus 3 correspondingly adjusts the drilling coordinate values in the length and width directions in the drilling program to determine the actual drilling coordinate values.

Referring to fig. 10, the other end of the transfer mechanism 60 is provided with a PCB drop mechanism 80, and the PCB drop mechanism 80 is used for dropping the PCB 11 onto the clamping member 10. The PCB 11 primarily manufactured by the PCB manufacturing device 2 is thrown onto the clamping part 10 through the PCB throwing mechanism 80, the clamping part 10 fastens the PCB 11, the conveying mechanism 60 conveys the clamping part 10, meanwhile, the visual detection device 30 collects images of two groups of multilayer layers of the partial Kobe 112 on the length side of the PCB 11 firstly, then the reversing mechanism 20 deflects the clamping part 10 for 90-degree reversing, the visual detection device 30 collects images of two groups of multilayer layers of the partial Kobe 112 on the width side of the PCB 11, after the control device 40 determines the grade of the PCB 11, the piling device 50 piles the PCB 11 to the PCB collecting mechanism 70 corresponding to the grade with the PCB 11, and the PCB collecting mechanism 70 piles the PCB 11 orderly so that the subsequent PCB drilling device 3 processes the PCB according to the corresponding integral layer deviation data. Further, the control device 40 provides a discard warning for the unqualified PCB 11, and further processes the unqualified PCB, such as destruction. And the control device 40 feeds back the adjacent layer deviation data to the PCB manufacturing device 2 and feeds back the whole layer deviation data to the PCB drilling device 3.

The PCB manufacturing apparatus 2 determines the pre-set ratio of the printed circuit on the corresponding inner core board 110 to the printed circuit of the adjacent inner core board 110 according to the offset data of the adjacent layers, so as to continuously correct the interlayer offset error of the multi-layer core board 110 caused by the lamination process, etc., reduce the offset data of the adjacent layers of the PCB 11, align the circuit printing areas 113 on the multi-layer core board 110, and further reduce the signal transmission loss. The PCB drilling device 3 determines the integral layer deviation proportion of the PCB 11 according to the integral layer deviation data. The PCB drilling device 3 correspondingly corrects the coordinate value of the drilled hole on the PCB 11 according to the integral layer deviation ratio, so that the distance from the drilled hole to the adjacent circuit line on each layer of the core board 110 is appropriate, and the influence of the drilled hole on the circuit line on the core board 110 close to the drilled hole is reduced.

Be different from prior art's condition, this application is through setting up holder fastening PCB board, it is rotatory to set up reversing mechanism drive holder, make vision detection device gather the image of the multilayer layer of PCB board week side branch ke bang, controlling means can automatic control centre gripping, switching-over, the completion of action such as collection, controlling means can also be according to the image of gathering, on line to every PCB board detection layer inclined to one side situation, including measuring each adjacent layer inclined to one side data and the inclined to one side data of whole layer between the core plate of layer on the PCB board, the efficiency and the degree of accuracy of each adjacent layer inclined to one side data and the inclined to one side data of whole layer of measuring the PCB board have been improved.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.