阅读说明：本技术 一种多层多阶hdi板制作方法及装置 (Multilayer and multistage HDI plate manufacturing method and device ) 是由 孙启双 张佩珂 于 2019-09-17 设计创作，主要内容包括：本发明公开了一种多层多阶HDI板制作方法及装置,方法包括：设置有埋孔的层板为H/Hoz芯板；埋孔采取压合填胶方式塞孔,填胶层使用1080半固化胶片,树脂含量为RC68％；盲孔设置于球栅阵列的焊盘上,盲孔的孔内采用电镀镀铜填平。装置用于执行方法。本发明实施例通过设置有埋孔的层板为H/Hoz芯板,能够降低多层HDI板的厚度,埋孔采取压合填胶方式塞孔,填胶层使用1080半固化胶片,树脂含量为RC68％,能够满足硬度和加工效率的平衡,盲孔设置于球栅阵列的焊盘上,盲孔的孔内采用电镀镀铜填平,能够降低焊接对平整度的影响。(The invention discloses a method and a device for manufacturing a multilayer and multistage HDI plate, wherein the method comprises the following steps: the laminate provided with the buried holes is an H/Hoz core plate; the buried holes are plugged in a pressing glue filling mode, a 1080 semi-solidified glue film is used as a glue filling layer, and the resin content is RC 68%; the blind holes are arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled and leveled by adopting electroplating copper plating. The apparatus is for performing a method. According to the embodiment of the invention, the laminated board provided with the buried holes is the H/Hoz core board, the thickness of the multilayer HDI board can be reduced, the buried holes are plugged in a pressing glue filling mode, the glue filling layer uses 1080 semi-cured glue, the resin content is RC 68%, the balance of hardness and processing efficiency can be met, the blind holes are arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled by electroplating copper plating, so that the influence of welding on the flatness can be reduced.)

1. A manufacturing method of a multilayer multi-order HDI plate is characterized by comprising the following steps:

the laminate provided with the buried holes is an H/Hoz core plate;

plugging the buried holes in a pressing and glue filling mode, wherein the glue filling layer is 1080PP, and the resin content is RC 68%;

the blind holes are arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled and leveled by adopting electroplating copper plating.

2. The method for manufacturing the multilayer multi-order HDI board as claimed in claim 1, wherein the blind holes comprise stacked holes, and the corresponding lines of the layer board where the blind holes are located are provided with compensation coefficients.

3. The method for manufacturing the multilayer multi-stage HDI board as claimed in claim 1, wherein the specification of the inner layer circuit of the HDI board includes that the minimum line width/line distance is 3/3mil, the inner layer hole-to-line distance is 6mil, the aperture of the blind hole is 0.10mm, and the unilateral of the solder ring is 3 mil;

correspondingly, 1/3oz copper foil is pressed in an inner-layer pressing mode and an outer-layer pressing mode.

4. The method for manufacturing the multilayer multi-stage HDI plate as claimed in claim 1, wherein the HDI plate manufacturing step comprises:

cutting, drilling and burying holes, depositing copper, electroplating the whole board, transferring the pattern of a buried hole laminate, pressing, drilling blind holes by laser, depositing copper, electroplating and filling the blind holes, transferring the pattern of a non-buried hole laminate, pressing, electroplating the pattern, etching the outer layer circuit, welding resistance, characters, surface treatment, shape processing, electrical testing, and checking and packaging.

5. The method for manufacturing the multilayer multi-order HDI board as claimed in claim 2, wherein the circuit is provided with a compensation factor comprising:

IC compensation 1.2mil, ball grid array pad compensation 1.3mil, trace compensation 1.4 mil.

6. The utility model provides a multistage HDI board making devices of multilayer, its characterized in that includes:

the board unit is used for enabling the laminate provided with the buried holes to be an H/Hoz core board;

the buried hole unit is used for plugging the buried hole in a pressing and glue filling mode, a glue filling layer is made of 1080PP, and the resin content is RC 68%;

and the blind hole unit is used for enabling the blind holes to be arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled and leveled by adopting electroplating copper plating.

7. The device for manufacturing the multilayer multi-order HDI board as claimed in claim 6, wherein the blind holes comprise stacked holes, and the corresponding lines of the layer board where the blind holes are located are provided with compensation coefficients.

8. The device for manufacturing the multilayer multi-stage HDI board as claimed in claim 6, wherein the specifications of the inner layer circuit of the HDI board include a minimum line width/line distance of 3/3mil, an inner layer hole-to-line distance of 6mil, a blind hole aperture of 0.10mm, and a single edge of a solder ring of 3 mil;

correspondingly, 1/3oz copper foil is pressed in an inner-layer pressing mode and an outer-layer pressing mode.

9. The device for manufacturing the multilayer multi-stage HDI plate as claimed in claim 6, wherein the HDI plate manufacturing step comprises:

cutting, drilling and burying holes, depositing copper, electroplating the whole board, transferring the pattern of a buried hole laminate, pressing, drilling blind holes by laser, depositing copper, electroplating and filling the blind holes, transferring the pattern of a non-buried hole laminate, pressing, electroplating the pattern, etching the outer layer circuit, welding resistance, characters, surface treatment, shape processing, electrical testing, and checking and packaging.

10. The device for manufacturing the multilayer multi-order HDI board as claimed in claim 7, wherein the circuit is provided with a compensation factor comprising:

IC compensation 1.2mil, ball grid array pad compensation 1.3mil, trace compensation 1.4 mil.

Technical Field

The invention relates to the technical field of PCBs, in particular to a method and a device for manufacturing a multilayer multi-order HDI board.

Background

With the increasing market demand of electronic consumer products in the world, the functions of the electronic products are more and more complex, the performances of the electronic products are more and more excellent, and the electronic products are smaller and lighter. Therefore, the demand for the printed board is higher and higher. The HDI board is highlighted in wide application of the HDI board, and the HDI board is widely applied to the fields of navigation, medical treatment, transportation, remote communication and the like. The demand for such HDI-made boards is increasing with the widespread use of small-sized packaged portable electronic devices and with high-density interconnects.

The early processing is mainly focused on the first-order HDI board and the base board without the overlapped holes, and along with the requirement of product development, the processing requirement of the overlapped holes further increases the HDI processing difficulty, and the product yield and the lead cycle face severe challenges. Therefore, the processing technology of the multilayer multi-stage hole-overlapping HDI plate is urgently needed to be developed, the processing requirement of the multi-stage hole-overlapping HDI plate is met by improving the processing technology of the real multi-stage hole-overlapping, and the market competitiveness of the product is improved.

Disclosure of Invention

Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, an object of the embodiments of the present invention is to provide a method and an apparatus for manufacturing a multilayer multi-level HDI board.

The technical scheme adopted by the invention is as follows:

in a first aspect, an embodiment of the present invention provides a method for manufacturing a multilayer multi-stage HDI board, including: the laminate provided with the buried holes is an H/Hoz core plate; the buried holes are plugged in a pressing glue filling mode, a 1080 semi-solidified glue film is used as a glue filling layer, and the resin content is RC 68%; the blind holes are arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled and leveled by adopting electroplating copper plating.

Preferably, the blind holes comprise stacked holes, and correspondingly, the lines of the laminate where the blind holes are located are provided with compensation coefficients.

Preferably, the specification of the inner layer circuit of the HDI board comprises that the minimum line width/line distance is 3/3mil, the distance from an inner layer hole to a line is 6mil, the aperture of a blind hole is 0.10mm, and the single side of a welding ring is 3 mil; correspondingly, 1/3oz copper foil is pressed in an inner-layer pressing mode and an outer-layer pressing mode.

Preferably, the HDI plate manufacturing step includes: cutting, drilling and burying holes, depositing copper, electroplating the whole board, transferring the pattern of a buried hole laminate, pressing, drilling blind holes by laser, depositing copper, electroplating and filling the blind holes, transferring the pattern of a non-buried hole laminate, pressing, electroplating the pattern, etching the outer layer circuit, welding resistance, characters, surface treatment, shape processing, electrical testing, and checking and packaging.

Preferably, the line is provided with a compensation factor comprising: IC compensation 1.2mil, ball grid array pad compensation 1.3mil, trace compensation 1.4 mil.

In a second aspect, an embodiment of the present invention provides a device for manufacturing a multilayer multi-stage HDI board, including: the board unit is used for enabling the laminate provided with the buried holes to be an H/Hoz core board; the buried hole unit is used for plugging the buried hole in a pressing glue filling mode, a 1080 semi-solidified glue film is used as a glue filling layer, and the resin content is RC 68%; and the blind hole unit is used for enabling the blind holes to be arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled and leveled by adopting electroplating copper plating.

Preferably, the blind holes comprise stacked holes, and correspondingly, the lines of the laminate where the blind holes are located are provided with compensation coefficients.

Preferably, the specification of the inner layer circuit of the HDI board comprises that the minimum line width/line distance is 3/3mil, the distance from an inner layer hole to a line is 6mil, the aperture of a blind hole is 0.10mm, and the single side of a welding ring is 3 mil; correspondingly, 1/3oz copper foil is pressed in an inner-layer pressing mode and an outer-layer pressing mode.

Preferably, the HDI plate manufacturing step includes: cutting, drilling and burying holes, depositing copper, electroplating the whole board, transferring the pattern of a buried hole laminate, pressing, drilling blind holes by laser, depositing copper, electroplating and filling the blind holes, transferring the pattern of a non-buried hole laminate, pressing, electroplating the pattern, etching the outer layer circuit, welding resistance, characters, surface treatment, shape processing, electrical testing, and checking and packaging.

Preferably, the line is provided with a compensation factor comprising: IC compensation 1.2mil, ball grid array pad compensation 1.3mil, trace compensation 1.4 mil.

The embodiment of the invention has the beneficial effects that:

according to the embodiment of the invention, the laminated board provided with the buried holes is the H/Hoz core board, the thickness of the multilayer HDI board can be reduced, the buried holes are plugged in a pressing glue filling mode, the glue filling layer uses 1080 semi-cured glue, the resin content is RC 68%, the balance of hardness and processing efficiency can be met, the blind holes are arranged on the bonding pads of the ball grid array, and the holes of the blind holes are filled by electroplating copper plating, so that the influence of welding on the flatness can be reduced.

Drawings

FIG. 1 is a flow chart of one embodiment of a method for manufacturing a multilayer multi-order HDI plate;

FIG. 2 is a schematic structural diagram of an eight-layer third-order HDI board;

FIG. 3 is a connection diagram of an embodiment of a device for manufacturing a multilayer multi-stage HDI plate.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The technical terms involved include:

pp sheets are prepregs (Prepreg is the acronym for Pre-preg), which are a sheet-like bonding material synthesized from resin and a carrier.

BGA: ball Grid Array packaging (Ball Grid Array).

The PAD is a PAD or a PAD.

HDI is an abbreviation for High Density interconnect (High Density interconnect) and is a technique for producing printed circuit boards, a relatively High line distribution Density circuit board using micro-blind buried via technology.

H/Hoz is half the thickness relative to 1 oz. Hoz the copper thickness was: 0.0354 mm.

1/3oz, oz (case free) is an abbreviation for the symbol spence (ounce).

Current density, ASD: ampere per square decimeter.