阅读说明：本技术 一种基于不流动pp结构的线路板制板方法 (Circuit board manufacturing method based on no-flow PP structure ) 是由 万小亮 王平 李超谋 于 2019-08-08 设计创作，主要内容包括：本发明涉及一种基于不流动PP结构的线路板制板方法,包括如下步骤：内层加工,内层加工工艺包括开料、前处理、影像转移、线路蚀刻、光学检查、铜面粗化、排板、压合、钻管位孔、修边；外层加工,外层加工工艺包括钻孔、电镀、堵孔、砂带、图像转移、图形电镀、线路蚀刻、防焊油丝印；不流动PP洗开窗,在标准开窗尺寸的基础上增设0.4mm-0.5mm的余量；不流动PP压合,采用PINLAM的定位方式,并且配合使用离型膜、PE膜、垫板、硅胶垫共同压合；阻焊,采用防焊油丝印工艺在最外层再次覆盖保护层；烘干成型,将防焊油墨烘干后进行表面处理、外轮廓加工成型得到成品。完善了该种不流动PP材料的线路板易产生的胶点问题、压合空洞问题和不流动PP层破孔的问题。(The invention relates to a circuit board manufacturing method based on a non-flowing PP structure, which comprises the following steps: processing an inner layer, wherein the inner layer processing technology comprises cutting, pretreatment, image transfer, line etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming; processing an outer layer, wherein the outer layer processing technology comprises drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing; washing and windowing the non-flowing PP, and adding a margin of 0.4mm-0.5mm on the basis of the standard windowing size; pressing the non-flowing PP by adopting a PINLAM positioning mode and cooperatively pressing a release film, a PE film, a base plate and a silica gel pad; solder resist, adopting a solder resist screen printing process to cover the protective layer on the outermost layer again; and (4) drying and forming, namely drying the solder mask ink, and then performing surface treatment and outline machining and forming to obtain a finished product. The problem of glue spots, stitching cavities and holes of the non-flowing PP layer which are easily generated by the circuit board made of the non-flowing PP material are improved.)

1. A circuit board manufacturing method based on a non-flowing PP structure is characterized by comprising the following steps:

S1, processing an inner layer, wherein the inner layer processing technology comprises cutting, pre-processing, image transfer, line etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming, a plate base material is utilized, copper layer pattern etching is carried out, each layer of plate and a copper-coated film are aligned, interlayer superposition is formed under the coordination of controlled heating power, and the inner layer manufacturing process is completed after trimming processing, so that a basis is provided for conduction between outer layer lines;

S2, outer layer processing, wherein the outer layer processing technology comprises the working procedures of drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing, the finished inner layer working procedure sheet material base material is utilized to drill holes and penetrate through the inner layer circuit, the electroplated copper layer is interconnected and thickened, the pattern is etched, and the copper surface is protected;

S3, washing and windowing the non-flowing PP, and adding a margin of 0.4mm-0.5mm on the basis of the standard windowing size;

S4, pressing the non-flowing PP by adopting a PINLAM positioning mode and pressing by using a release film, a PE film, a base plate and a silica gel pad together;

s5, solder resist, and covering the outermost layer with a protective layer again by adopting a solder resist screen printing process;

And S6, drying and forming, namely drying the solder mask ink, performing surface treatment and outer contour machining and forming to obtain a finished product.

2. A circuit board manufacturing method based on a no-flow PP structure according to claim 1, characterized in that: in the step S3, multiple layers of soft PP layers are stacked together for processing, and a copper-free core material layer is added between two adjacent PP layers to avoid adhesion.

3. A circuit board manufacturing method based on the no-flow PP structure according to claim 2, characterized in that: and (4) drilling positioning holes in the PP layers and the copper-core-free material layers which are stacked alternately in a multilayer mode in advance.

4. A circuit board manufacturing method based on a no-flow PP structure according to claim 1, characterized in that: and in the step S4, the release film, the PE film, the backing plate and the silica gel pad are subjected to a pin punching and nailing process.

5. A circuit board manufacturing method based on a no-flow PP structure according to claim 1, characterized in that: in the step S4, the copper surface of the no-flow PP layer is wiped by a wax cloth during lamination.

6. A circuit board manufacturing method based on a no-flow PP structure according to claim 1, characterized in that: and the hole blocking in the step S2 adopts a resin material to prevent the hole breaking of the non-flowing PP layer during the tin spraying surface treatment process.

7. a circuit board manufacturing method based on a no-flow PP structure according to claim 1, characterized in that: the abrasive belt in the step S2 is a flexible abrasive tool for pre-grinding treatment.

Technical Field

The invention relates to the field of circuit board manufacturing, in particular to a circuit board manufacturing method based on a no-flow PP structure.

background

Circuit boards, also known as circuit boards, PCB boards, etc., are providers of electrical connections for electronic components. The design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.

Polypropylene, PP for short, is a colorless, odorless, nontoxic and semitransparent solid substance. Polypropylene (PP) is a thermoplastic synthetic resin with excellent performance, and is colorless translucent thermoplastic light general-purpose plastic. The polypropylene has chemical resistance, heat resistance, electrical insulation, high-strength mechanical property, good high-wear-resistance processing property and the like, so that the polypropylene can be rapidly and widely developed and applied in a plurality of fields such as machinery, automobiles, electronic and electric appliances, printed circuit boards, buildings, textiles, packaging, agriculture, forestry, fishery, food industry and the like since the coming out.

"No-flow" is the greatest characteristic of no-flow PP, and has better mechanical strength compared with ordinary PP; since the plate needs to leave a welding point and a welding disc, and PP needs to be subjected to windowing treatment, low fluidity and glue overflow amount are needed, and good toughness and machinability are also needed. The currently used non-flowing PP has two types of general Tg and high Tg, mainly for matching use, and in order to improve the electrical properties of the printed board, the non-flowing PP with high Tg is usually selected.

The current no-flow PP structure technology is lack, and the problem of wane is mainly used for solving in the prior art, however because the characteristic of no-flow PP, has leaded to appearing the problem of pressfitting cavity in the pressfitting process. In addition, the prior art can also cause the problems of hole breaking of the non-flowing PP and glue spots on the surface of the product after pressing.

Disclosure of Invention

In order to solve the problems, the invention adopts the following technical scheme: a circuit board manufacturing method based on a non-flowing PP structure comprises the following steps:

s1, processing an inner layer, wherein the inner layer processing technology comprises cutting, pre-processing, image transfer, line etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming, a plate base material is utilized, copper layer pattern etching is carried out, each layer of plate and a copper-coated film are aligned, interlayer superposition is formed under the coordination of controlled heating power, and the inner layer manufacturing process is completed after trimming processing, so that a basis is provided for conduction between outer layer lines;

S2, outer layer processing, wherein the outer layer processing technology comprises the working procedures of drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing, the finished inner layer working procedure sheet material base material is utilized to drill holes and penetrate through the inner layer circuit, the electroplated copper layer is interconnected and thickened, the pattern is etched, and the copper surface is protected;

S3, washing and windowing the non-flowing PP, and adding a margin of 0.4mm-0.5mm on the basis of the standard windowing size;

S4, pressing the non-flowing PP by adopting a PINLAM positioning mode and pressing by using a release film, a PE film, a base plate and a silica gel pad together;

S5, solder resist, and covering the outermost layer with a protective layer again by adopting a solder resist screen printing process;

And S6, drying and forming, namely drying the solder mask ink, performing surface treatment and outer contour machining and forming to obtain a finished product.

Further, in the step S3, multiple layers of soft PP layers are stacked together and processed, and a copper-free core material layer is added between two adjacent PP layers to prevent adhesion.

Furthermore, the multilayer PP layers and the copper-core-free material layers which are alternately stacked are subjected to positioning hole drilling in advance.

Further, in the step S4, the release film, the PE film, the backing plate, and the silicone pad are all subjected to a pin punching and nailing process.

Further, in the step S4, the copper surface of the no-flow PP layer is wiped by a wax cloth during lamination.

further, the hole plugging in the step S2 is performed by using a resin material to prevent the hole breaking of the non-flowing PP layer during the tin spraying surface treatment process.

Further, the coated belt in the step S2 is a flexible abrasive tool for pre-polishing treatment.

the working principle of the invention is as follows: in order to enhance the comprehensive performance of the circuit board with the non-flowing PP structure and reduce a plurality of problems in the process of manufacturing the circuit board. The invention improves the original circuit board process. First, the panel making process is generally divided into an inner layer process and an outer layer process. The inner layer processing is that a sheet material base material is utilized, copper layer pattern etching is carried out, each layer of sheet material and copper-coated film are aligned, interlayer superposition is formed under the coordination of controlled heating power, and the inner layer manufacturing process is completed after trimming processing, so that a basis is provided for conduction between outer layer circuits. And the outer layer processing comprises the working procedures of drilling and penetrating through an inner layer circuit, interconnecting and thickening of an electroplated copper layer, pattern etching and copper surface protection by using the finished inner layer working procedure sheet material base material. Meanwhile, the outer layer process also comprises outer contour machining, reliability testing, finished product testing and the like.

And processing the inner layer, wherein the inner layer processing technology comprises cutting, pretreatment, image transfer, circuit etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming. The invention mainly constructs the internal structure of the plate, and the traditional process main body is adopted.

And (4) outer layer processing, wherein the outer layer processing technology comprises drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing. And processing the outer layer of the plate. Comprises drilling a through hole and forming a passage by cooperating with electroplating and copper deposition. And the pre-polishing is carried out on the abrasive belt, and then the initial solder mask printing is carried out, so that the subsequent processes such as windowing and the like are facilitated. It is worth mentioning that because the invention adopts the non-flowing PP material, the hole-blocking treatment is needed after the through hole is drilled in consideration of the hole-covering position of the non-flowing PP layer, so as to avoid the hole breaking problem of the non-flowing PP layer during the tin spraying surface processing. Meanwhile, because the green oil strength is insufficient, the ink can be separated from the hole wall under stress in the pressing process. Therefore, the material for plugging the holes is selected from resin materials.

The non-flowing PP washes the windowing, in processing and milling the windowing, the position of the windowing needs to be 0.4-0.5mm more than that of the windowing in the original gerber data in programming, so as to prevent the glue from flowing to the adjacent copper disc or hole in the pressing process. Milling the windowing in-process, milling cutter high-speed operation, the processing together is overlapped to the soft PP of multilayer texture, mills the course of working and glues and can't get rid of, then can have the windowing position and mill the adhesion problem that paste and lead to, consequently, increases the no copper core bed of material of one deck between every two adjacent PP layers, reduces each layer and glues the volume, avoids the adhesion.

However, when milling is performed, effective positioning is not performed, only the periphery is fixed by paper tapes, and a milled non-flowing PP structure is easy to generate large alignment deviation when being pressed with a product. Therefore, before the pressing processing, the non-flowing PP layer and the copper-core-free material layer are punched in advance, the punching position is consistent with the position of the alignment target of the pressing product, the positioning mode is improved, the processed PP sheet is aligned with the product, the alignment precision is obviously improved, and the pressing requirement of the product can be met.

The non-flowing PP is pressed, the product is pressed by a PINLAM positioning mode, and auxiliary materials such as a release film, a PE film, a base plate and a silica gel pad are required. And (3) release film: the isolation effect is achieved in the pressing process, the non-flowing PP layer can be isolated from the silica gel pad or the steel plate, pollution is avoided, and the PP layer is not adhered and can be easily separated after being pressed. Before the release film is used, pin holes need to be punched for lamination. PE film: the coating effect is achieved in the pressing process, and the non-flowing PP layer is assisted to fill the circuit pattern under uniform pressure. Before the PE film is used, punching is also needed, and it is noted that the size of the PE film is close to that of a production plate, the PE film is too large and is easy to flow glue to pollute a steel plate, and the PE film is too small and can cause insufficient coverage area to cause pressing cavities.

And finally, covering the solder resist ink layer again through a solder resist process, and performing surface treatment and outline processing after drying to obtain a finished product circuit board.

it should be noted that the surface of the product after pressing may have glue dots, so that pressing should be performed immediately after browning, and the copper surface on one side of the no-flow PP layer is cleaned by using a wax cloth during lamination. The generation rate of glue spots can be effectively reduced.

The invention has the beneficial effects that: the circuit board has the advantages of high electrical performance and mechanical strength, low warping rate and improved board making process, and the circuit board made of the non-flowing PP material has easy generation of glue spots, stitching holes and holes.

Drawings

The figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.

Fig. 1 is a flow chart of a circuit board manufacturing method based on a no-flow PP structure according to an embodiment of the present invention.

Detailed Description

as shown in fig. 1, a method for manufacturing a circuit board based on a no-flow PP structure according to an embodiment of the present invention includes the following steps:

s1, processing an inner layer, wherein the inner layer processing technology comprises cutting, pre-processing, image transfer, line etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming, a plate base material is utilized, copper layer pattern etching is carried out, each layer of plate and a copper-coated film are aligned, interlayer superposition is formed under the coordination of controlled heating power, and the inner layer manufacturing process is completed after trimming processing, so that a basis is provided for conduction between outer layer lines;

S2, outer layer processing, wherein the outer layer processing technology comprises the working procedures of drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing, the finished inner layer working procedure sheet material base material is utilized to drill holes and penetrate through the inner layer circuit, the electroplated copper layer is interconnected and thickened, the pattern is etched, and the copper surface is protected;

S3, washing and windowing the non-flowing PP, and adding a margin of 0.4mm-0.5mm on the basis of the standard windowing size;

s4, pressing the non-flowing PP by adopting a PINLAM positioning mode and pressing by using a release film, a PE film, a base plate and a silica gel pad together;

S5, solder resist, and covering the outermost layer with a protective layer again by adopting a solder resist screen printing process;

And S6, drying and forming, namely drying the solder mask ink, performing surface treatment and outer contour machining and forming to obtain a finished product.

Further, in the step S3, multiple layers of soft PP layers are stacked together and processed, and a copper-free core material layer is added between two adjacent PP layers to prevent adhesion.

furthermore, the multilayer PP layers and the copper-core-free material layers which are alternately stacked are subjected to positioning hole drilling in advance.

Further, in the step S4, the release film, the PE film, the backing plate, and the silicone pad are all subjected to a pin punching and nailing process.

further, in the step S4, the copper surface of the no-flow PP layer is wiped by a wax cloth during lamination.

further, the hole plugging in the step S2 is performed by using a resin material to prevent the hole breaking of the non-flowing PP layer during the tin spraying surface treatment process.

Further, the coated belt in the step S2 is a flexible abrasive tool for pre-polishing treatment.

In order to enhance the comprehensive performance of the circuit board with the non-flowing PP structure and reduce a plurality of problems in the process of manufacturing the circuit board. The invention improves the original circuit board process. First, the panel making process is generally divided into an inner layer process and an outer layer process. The inner layer processing is that a sheet material base material is utilized, copper layer pattern etching is carried out, each layer of sheet material and copper-coated film are aligned, interlayer superposition is formed under the coordination of controlled heating power, and the inner layer manufacturing process is completed after trimming processing, so that a basis is provided for conduction between outer layer circuits. And the outer layer processing comprises the working procedures of drilling and penetrating through an inner layer circuit, interconnecting and thickening of an electroplated copper layer, pattern etching and copper surface protection by using the finished inner layer working procedure sheet material base material. Meanwhile, the outer layer process also comprises outer contour machining, reliability testing, finished product testing and the like.

And processing the inner layer, wherein the inner layer processing technology comprises cutting, pretreatment, image transfer, circuit etching, optical inspection, copper surface roughening, plate arrangement, pressing, pipe position hole drilling and trimming. The invention mainly constructs the internal structure of the plate, and the traditional process main body is adopted.

and (4) outer layer processing, wherein the outer layer processing technology comprises drilling, electroplating, hole plugging, abrasive belt, image transfer, pattern electroplating, circuit etching and solder paste prevention screen printing. And processing the outer layer of the plate. Comprises drilling a through hole and forming a passage by cooperating with electroplating and copper deposition. And the pre-polishing is carried out on the abrasive belt, and then the initial solder mask printing is carried out, so that the subsequent processes such as windowing and the like are facilitated. It is worth mentioning that because the invention adopts the non-flowing PP material, the hole-blocking treatment is needed after the through hole is drilled in consideration of the hole-covering position of the non-flowing PP layer, so as to avoid the hole breaking problem of the non-flowing PP layer during the tin spraying surface processing. Meanwhile, because the green oil strength is insufficient, the ink can be separated from the hole wall under stress in the pressing process. Therefore, the material for plugging the holes is selected from resin materials.

The non-flowing PP washes the windowing, in processing and milling the windowing, the position of the windowing needs to be 0.4-0.5mm more than that of the windowing in the original gerber data in programming, so as to prevent the glue from flowing to the adjacent copper disc or hole in the pressing process. Milling the windowing in-process, milling cutter high-speed operation, the processing together is overlapped to the soft PP of multilayer texture, mills the course of working and glues and can't get rid of, then can have the windowing position and mill the adhesion problem that paste and lead to, consequently, increases the no copper core bed of material of one deck between every two adjacent PP layers, reduces each layer and glues the volume, avoids the adhesion.

However, when milling is performed, effective positioning is not performed, only the periphery is fixed by paper tapes, and a milled non-flowing PP structure is easy to generate large alignment deviation when being pressed with a product. Therefore, before the pressing processing, the non-flowing PP layer and the copper-core-free material layer are punched in advance, the punching position is consistent with the position of the alignment target of the pressing product, the positioning mode is improved, the processed PP sheet is aligned with the product, the alignment precision is obviously improved, and the pressing requirement of the product can be met.

The non-flowing PP is pressed, the product is pressed by a PINLAM positioning mode, and auxiliary materials such as a release film, a PE film, a base plate and a silica gel pad are required. And (3) release film: the isolation effect is achieved in the pressing process, the non-flowing PP layer can be isolated from the silica gel pad or the steel plate, pollution is avoided, and the PP layer is not adhered and can be easily separated after being pressed. Before the release film is used, pin holes need to be punched for lamination. PE film: the coating effect is achieved in the pressing process, and the non-flowing PP layer is assisted to fill the circuit pattern under uniform pressure. Before the PE film is used, punching is also needed, and it is noted that the size of the PE film is close to that of a production plate, the PE film is too large and is easy to flow glue to pollute a steel plate, and the PE film is too small and can cause insufficient coverage area to cause pressing cavities.

and finally, covering the solder resist ink layer again through a solder resist process, and performing surface treatment and outline processing after drying to obtain a finished product circuit board.

It should be noted that the surface of the product after pressing may have glue dots, so that pressing should be performed immediately after browning, and the copper surface on one side of the no-flow PP layer is cleaned by using a wax cloth during lamination. The generation rate of glue spots can be effectively reduced.

The circuit board has the advantages of high electrical performance and mechanical strength, low warping rate and improved board making process, and the circuit board made of the non-flowing PP material has easy generation of glue spots, stitching holes and holes.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the core technical attack of the large data server system socket based on the purley platform in the patent of the invention shall be subject to the appended claims.