阅读说明：本技术 一种混压板制作的定位压合方法 (A kind of positioning compression method of mixed-compression board production ) 是由 谭祖兵 于 2019-09-17 设计创作，主要内容包括：本发明公开了制作方法技术领域的一种混压板制作的定位压合方法,该方法步骤如下：步骤一：材料确认：需要进行材料的选取,材料为FR4材料板、主高频材料板、副高频材料板、主半固化片和副半固化片,收到客户提供的最终要求后,专业的工程人员对要求进行详细梳理；该种混压板制作的定位压合方法,具备加热器的内腔底部,配合模具四周开槽多组隔栏,可在对高频材料板进行内置后施力,进行加热的同时对超量满溢出隔栏的半固化液进行刮除,有效的提高加温固化的速度的同时,可保证对超量的半固化液去除,避免二次处理,配合反向内置二次压合的过程,使两层高频材料板的受压力度相近,组合厚度相近,两端受热,稳定性好,抗卷边能力强。(The invention discloses a kind of positioning compression methods of mixed-compression board of production method technical field production, the method steps are as follows: step 1: material confirmation: needing to carry out the selection of material, material is FR4 plate of material, main high frequency material plate, secondary high frequency material plate, main prepreg and secondary prepreg, receive client's offer it is final require after, professional engineering staff is to requiring to be combed in detail；The positioning compression method of this kind of mixed-compression board production, the intracavity bottom for having heater, mating mold surrounding fluting multiple groups jube, force can be postponed in carrying out to high frequency material plate, the semi-solidified liquid for going out jube to excess spill-over while heating strikes off, while the effective speed for improving heating cure, it can guarantee and the semi-solidified liquid of excess is removed, secondary treatment is avoided, cooperates the process of reversed built-in second pressing, makes the close by surging of two layers of high frequency material plate, combination thickness is close, both ends are heated, and stability is good, and anti-roll side ability is strong.)

1. a kind of positioning compression method of mixed-compression board production, it is characterised in that: the method steps are as follows:

Step 1: material confirmation: needing to carry out the selection of material, and material is FR4 plate of material, main high frequency material plate, secondary high frequency material Flitch, main prepreg and secondary prepreg, receive client's offer it is final require after, professional engineering staff is to requiring to carry out Combing in detail, and make product PPT and be supplied to client's progress review；

Step 2: mold molding: the mode of selection room temperature tripping in molding system is chosen solid respectively to the two sides of the mold after mold It is fixed, it prevents from shaking, and slot respectively multiple groups jube at the four sides of the mold, the bottom of the inner cavity bottom plate of the mold passes through spiral shell The fixed having heaters of silk, the inner cavity bottom plate are to be threadedly coupled with the combination of mold；

Step 3: enter mould: choosing the top that the main high frequency material plate is put into the inner cavity bottom plate, and to the main high frequency material The quadrangle of plate exerts a force, and the force time is 8min~16min, pressure 10kg/cm²；

Step 4: base is fixed: being laid with semi-solidified liquid at the top of the main high frequency material plate, and chooses the main prepreg It is laid in the top of semi-solidified liquid, 3min~5min is stood in the case where the intracavity bottom is warming up to 20 DEG C~25 DEG C, is matched It closes external drying device to be dried, while cooperating pressure, pressure 5kg/cm², the pressure time is 10min~15min, to full The semi-solidified liquid for overflowing the jube is struck off, and is gradually warming up to 25 DEG C~30 DEG C to the inner cavity bottom plate；

Step 5: lamination is fixed: being laid on the top of the main prepreg again using semi-solidified liquid, and is chosen the FR4 Plate of material makes to contact at the top of the bottom and semi-solidified liquid of the FR4 plate of material, quadrangle force, the force time for 2min~ 5min, pressure 3kg/cm², subsequent central point force, the force time is 5min~10min, pressure 5kg/cm²；

Step 6: top layer is fixed: in the top of the FR4 plate of material cooperation semi-solidified liquid bonding secondary prepreg, quadrangle Force, force time are 5min~8min, pressure 6kg/cm², and it is laid with semi-solidified liquid at the top of the secondary prepreg, Take and contact at the top of the secondary high frequency material plate quadrangle and the secondary prepreg, the cooperation pressing plate cooperation mold carry out by Pressure, pressure 12kg/cm², the semi-solidified liquid for continuing spill-over the jube strikes off, the temperature of the inner cavity bottom plate by Step is appreciated 35 DEG C~45 DEG C, and 45min~65min is continued；

Step 7: molding: after whole taking-up, being reversely pressed again by the mold, continue to exert a force, pressure 12kg/cm², described interior The temperature of bottom of chamber plate is maintained at 45 DEG C~50 DEG C, continues 30min~50min, and mixed-compression board is obtained after taking-up.

2. a kind of positioning compression method of mixed-compression board production according to claim 1, it is characterised in that: the FR4 material Plate, the main high frequency material plate, the secondary high frequency material plate, the main prepreg and the secondary prepreg with a thickness of 2.2 ± 0.22mm, having a size of 80*200mm, surface treatment mode is turmeric.

3. a kind of positioning compression method of mixed-compression board production according to claim 1, it is characterised in that: the height of the mold Degree is greater than the FR4 plate of material, the main high frequency material plate, the secondary high frequency material plate, the main prepreg and the pair The overall height of prepreg.

4. a kind of positioning compression method of mixed-compression board production according to claim 1, it is characterised in that: the intracavity bottom Material be thermal conductive metal plate, the heater has thermoregulation knob.

5. a kind of positioning compression method of mixed-compression board production according to claim 1, it is characterised in that: the FR4 material Plate is epoxy resin and glass fabric presses plate, and the main high frequency material plate, the secondary high frequency material plate are PTFE material Or ceramic packing and glass fabric press plate.

Technical field

The invention discloses a kind of positioning compression methods of mixed-compression board production, specially production method technical field.

Background technique

The high speed development of electronic communication technology is the necessary process of modernization construction, in order to realize signal high speed, high-fidelity It transmits, high frequency printed circuit boards is more and more used in communication apparatus；Its used dielectric material of high frequency plate has excellent Electrical property, good chemical stability, high frequency plate are widely used in wireless antenna, base station receiving antenna, power amplifier, first device In the communication apparatus such as part (current divider, interflow device, filter), radar system, navigation system.

The design of multilayer high frequency plate based on cost savings, improves the factors such as bending strength, electromagnetic interference control, often with mixed pressure The form of plate occurs, referred to as mixed-compression board.

During carrying out mixed-compression board combination at present, because FR4 plate of material and high frequency material plate be there are the difference in material, The semi-solidified liquid being used cooperatively in anabolic process can not be mentioned effectively if there is excess situation, and for the speed of combination and solidification In the case where rising, easily making FR4 plate of material and the fitting process of high frequency material plate, there are male and fomale(M&F)s, and stability is caused to reduce, Crimping situation occurs often, while conventional bonding processes not can guarantee the close by surging of plate of material, and combination thickness is by shadow It rings, further reduced the stability used.

Summary of the invention

The purpose of the present invention is to provide a kind of positioning compression methods of mixed-compression board production, to solve in above-mentioned background technique During the current existing progress mixed-compression board combination proposed, because there are in material for FR4 plate of material and high frequency material plate Difference, the semi-solidified liquid being used cooperatively in anabolic process, and can not for the speed of combination and solidification if there is excess situation In the case where effectively being promoted, easily making FR4 plate of material and the fitting process of high frequency material plate, there are male and fomale(M&F)s, lead to stability Reduce, crimping situation occurs often, while conventional bonding processes not can guarantee the close by surging of plate of material, combination thickness by To influence, the problem of further reduced the stability used.

To achieve the above object, the invention provides the following technical scheme: a kind of positioning compression method of mixed-compression board production, is somebody's turn to do Method and step is as follows:

Step 1: material confirmation: needing to carry out the selection of material, and material is FR4 plate of material, main high frequency material plate, secondary height Frequency plate of material, main prepreg and secondary prepreg, receive client's offer it is final require after, professional engineering staff is to requiring It is combed in detail, and makes product PPT and be supplied to client's progress review；

Step 2: mold forms: the mode of selection room temperature tripping in molding system divides the two sides of the mold after choosing mold Not Gu Ding, prevent from shaking, and slot respectively multiple groups jube at the four sides of the mold, the bottom of the inner cavity bottom plate of the mold is logical The fixed having heaters of screw is crossed, the inner cavity bottom plate is to be threadedly coupled with the combination of mold；

Step 3: enter mould: choosing the top that the main high frequency material plate is put into the inner cavity bottom plate, and to the main high frequency The quadrangle of plate of material exerts a force, and the force time is 8min~16min, pressure 10kg/cm²；

Step 4: base is fixed: being laid with semi-solidified liquid at the top of the main high frequency material plate, and it is solid to choose the master half Change piece and be laid in the top of semi-solidified liquid, stood in the case where the intracavity bottom is warming up to 20 DEG C~25 DEG C 3min~ 5min cooperates external drying device to be dried, while cooperating pressure, pressure 5kg/cm², the pressure time be 10min~ 15min, the semi-solidified liquid for going out the jube to spill-over strike off, and to the inner cavity bottom plate be gradually warming up to 25 DEG C~ 30℃；

Step 5: lamination is fixed: being laid on the top of the main prepreg again using semi-solidified liquid, and described in selection FR4 plate of material makes to contact at the top of the bottom and semi-solidified liquid of the FR4 plate of material, quadrangle force, the force time for 2min~ 5min, pressure 3kg/cm², subsequent central point force, the force time is 5min~10min, pressure 5kg/cm²；

Step 6: top layer is fixed: at the top of the FR4 plate of material, cooperation semi-solidified liquid is bonded the secondary prepreg, Quadrangle force, force time are 5min~8min, pressure 6kg/cm², and half is laid with admittedly at the top of the secondary prepreg Change liquid, is contacted at the top of the take secondary high frequency material plate quadrangle and the secondary prepreg, cooperation pressing plate cooperates the mold It is pressed, pressure 12kg/cm², the semi-solidified liquid for continuing spill-over the jube strikes off, the inner cavity bottom plate Temperature is gradually appreciated 35 DEG C~45 DEG C, and 45min~65min is continued；

Step 7: molding: after whole taking-up, being reversely pressed again by the mold, continue to exert a force, pressure 12kg/cm², The temperature of the inner cavity bottom plate is maintained at 45 DEG C~50 DEG C, continues 30min~50min, and mixed-compression board is obtained after taking-up.

Preferably, the FR4 plate of material, the main high frequency material plate, the secondary high frequency material plate, the main prepreg With the secondary prepreg with a thickness of 2.2 ± 0.22mm, having a size of 80*200mm, surface treatment mode is turmeric.

Preferably, the height of the mold is greater than the FR4 plate of material, the main high frequency material plate, the secondary high frequency material The overall height of flitch, the main prepreg and the secondary prepreg.

Preferably, the material of the intracavity bottom is thermal conductive metal plate, and the heater has thermoregulation knob.

Preferably, the FR4 plate of material is that epoxy resin and glass fabric press plate, the main high frequency material plate, The pair high frequency material plate is that PTFE material or ceramic packing and glass fabric press plate.

Compared with prior art, the beneficial effects of the present invention are: the positioning compression method of this kind of mixed-compression board production, available Having the intracavity bottom of heater, mating mold surrounding fluting multiple groups jube can postpone force in carrying out to high frequency material plate, The semi-solidified liquid for going out jube to excess spill-over while heating strikes off, and effectively improves the same of the speed of heating cure When, it is ensured that the semi-solidified liquid of excess is removed, secondary treatment is avoided, in high frequency material plate is combined with FR4 plate of material, cooperation The process of reversed built-in second pressing, makes the close by surging of two layers of high frequency material plate, effectively guarantees combination when layer connects Thickness is close, and both ends are heated, and stability is good, and anti-roll side ability is strong.

Specific embodiment

Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described, Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all Belong to the scope of protection of the invention.

The present invention provides a kind of technical solution: a kind of positioning compression method of mixed-compression board production, the method steps are as follows:

Step 1: material confirmation: needing to carry out the selection of material, and material is FR4 plate of material, main high frequency material plate, secondary height Frequency plate of material, main prepreg and secondary prepreg, receive client's offer it is final require after, professional engineering staff is to requiring It is combed in detail, and makes product PPT and be supplied to client's progress review；

Step 2: mold molding: the mode of selection room temperature tripping in molding system is chosen solid respectively to the two sides of mold after mold It is fixed, it prevents from shaking, and slot respectively multiple groups jube at the four sides of mold, the bottom of the inner cavity bottom plate of mold has been screwed Heater, inner cavity bottom plate are to be threadedly coupled with the combination of mold；

Step 3: enter mould: choosing the top that main high frequency material plate is put into inner cavity bottom plate, and to the quadrangle of main high frequency material plate Force, force time are 8min~16min, pressure 10kg/cm²；

Step 4: base is fixed: being laid with semi-solidified liquid at the top of main high frequency material plate, and chooses main prepreg tiling At the top of semi-solidified liquid, 3min~5min is stood in the case where intracavity bottom is warming up to 20 DEG C~25 DEG C, is cooperated external dry Dry device is dried, while cooperating pressure, pressure 5kg/cm², the pressure time is 10min~15min, goes out jube to spill-over Semi-solidified liquid struck off, and internally bottom of chamber plate is gradually warming up to 25 DEG C~30 DEG C；

Step 5: lamination is fixed: being laid on the top of main prepreg again using semi-solidified liquid, and is chosen FR4 material Plate makes to contact at the top of the bottom of FR4 plate of material and semi-solidified liquid, and quadrangle force, the force time is 2min~5min, and pressure is 3kg/cm², subsequent central point force, the force time is 5min~10min, pressure 5kg/cm²；

Step 6: top layer is fixed: at the top of FR4 plate of material, cooperation semi-solidified liquid is bonded secondary prepreg, and quadrangle exerts a force, The force time is 5min~8min, pressure 6kg/cm², and it is laid with semi-solidified liquid at the top of secondary prepreg, secondary height of taking It is contacted at the top of frequency plate of material quadrangle and secondary prepreg, cooperation pressing plate mating mold is pressed, pressure 12kg/cm², after The continuous semi-solidified liquid for going out jube to spill-over strikes off, and the temperature of inner cavity bottom plate is gradually appreciated 35 DEG C~45 DEG C, and lasting 45min~ 65min；

Step 7: molding: after whole taking-up, being reversely pressed again by mold, continue to exert a force, pressure 12kg/cm², inner cavity The temperature of bottom plate is maintained at 45 DEG C~50 DEG C, continues 30min~50min, and mixed-compression board is obtained after taking-up.

Wherein, FR4 plate of material, main high frequency material plate, secondary high frequency material plate, main prepreg and secondary prepreg thickness For 2.2 ± 0.22mm, having a size of 80*200mm, surface treatment mode is turmeric, and the height of mold is greater than FR4 plate of material, main height The overall height of frequency plate of material, secondary high frequency material plate, main prepreg and secondary prepreg, the material of intracavity bottom are thermally conductive gold Belonging to plate, heater has a thermoregulation knob, and FR4 plate of material is epoxy resin and glass fabric presses plate, main high frequency material plate, Secondary high frequency material plate is that PTFE material or ceramic packing and glass fabric press plate.