阅读说明：本技术 一种pcb背钻加工的方法及装置 (Method and device for back drilling of PCB ) 是由 陈献华 黎勇军 翟学涛 于 2020-05-09 设计创作，主要内容包括：本申请公开了一种PCB背钻加工的方法及装置,所述方法通过在PCB板上预定位置进行第一次钻孔,其中,第一次钻孔贯穿PCB板,第一次钻孔在PCB板的第一表面形成第一钻孔,在PCB板的第二表面形成第二钻孔；获取第一钻孔的中心坐标,并根据第一钻孔的中心坐标,计算第二钻孔的理论中心坐标；对第二钻孔进行检测,计算第二钻孔的孔位偏差值；根据第二钻孔的理论中心坐标和孔位偏差值,计算第二钻孔的实际中心坐标；将第二钻孔的实际中心坐标作为第二次钻孔的初始坐标,对PCB板进行第二次钻孔。本申请通过对第二钻孔的理论中心坐标进行孔位偏差补偿,显著提高了背钻的精度,使得背钻时,能够将没有起到任何连接作用的金属通孔段完全去除。(The application discloses a method and a device for back drilling of a PCB (printed circuit board). according to the method, a first drilling hole is formed in a preset position on the PCB, wherein the first drilling hole penetrates through the PCB, the first drilling hole forms a first drilling hole in a first surface of the PCB, and a second drilling hole is formed in a second surface of the PCB; acquiring the central coordinate of the first drill hole, and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole; detecting the second drill hole, and calculating a hole site deviation value of the second drill hole; calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole; and taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and drilling the PCB for the second time. This application is through carrying out hole site deviation compensation to the theoretical center coordinate of second drilling, is showing the precision that has improved the back drilling for during the back drilling, can get rid of the metal through-hole section that does not play any connection effect completely.)

1. A PCB back drilling processing method is characterized by comprising the following steps:

performing first drilling on a preset position on a PCB, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on a first surface of the PCB, and a second drilling is formed on a second surface of the PCB;

acquiring the central coordinate of the first drill hole, and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole;

detecting the second drilling hole, and calculating a hole position deviation value of the second drilling hole;

calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate of the second drill hole and the hole position deviation value;

and taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and performing the second drilling on the PCB.

2. The method for backdrilling a PCB of claim 1, wherein the calculating the theoretical center coordinates of the second bore according to the center coordinates of the first bore comprises:

detecting the thickness of the PCB;

and calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

3. The method of claim 1, wherein the detecting the second bore hole and calculating the hole site deviation value of the second bore hole comprises:

detecting the second drilling hole to obtain first coordinate data of the second drilling hole;

acquiring first coordinate data of the first drill hole from the center coordinates of the first drill hole;

and calculating the hole position deviation value of the second drill hole according to the first coordinate data of the first drill hole and the first coordinate data of the second drill hole.

4. The method of claim 3, wherein the calculating the actual center coordinates of the second bore according to the theoretical center coordinates of the second bore and the hole site deviation values comprises:

and compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

5. A PCB back drilling processing device is characterized by comprising:

the PCB drilling device comprises a first drilling module, a second drilling module and a control module, wherein the first drilling module is used for performing first drilling on a preset position on a PCB, the first drilling penetrates through the PCB, the first drilling forms a first drilling on a first surface of the PCB, and a second drilling is formed on a second surface of the PCB;

the first calculation module is used for acquiring the central coordinate of the first drill hole and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole;

the detection module is used for detecting the second drilling hole and calculating a hole position deviation value of the second drilling hole;

the second calculation module is used for calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate of the second drill hole and the hole position deviation value;

and the second drilling module is used for drilling the PCB for the second time by taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole.

6. The PCB backdrilling apparatus of claim 5, wherein the first computing module specifically comprises:

the thickness detection unit is used for detecting the thickness of the PCB;

and the theoretical center coordinate calculating unit is used for calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

7. The PCB backdrilling apparatus of claim 5, wherein the detection module specifically comprises:

the second drilling detection unit is used for detecting the second drilling to acquire first coordinate data of the second drilling;

an acquisition unit configured to acquire first coordinate data of the first borehole from center coordinates of the first borehole;

and the hole position deviation calculating unit is used for calculating the hole position deviation value of the second drilling hole according to the first coordinate data of the first drilling hole and the first coordinate data of the second drilling hole.

8. The PCB backdrilling apparatus of any one of claim 7, wherein the second computing module specifically comprises:

and the compensation unit is used for compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

9. A computer arrangement comprising a memory having a computer program stored therein and a processor that when executed performs the method of PCB backdrilling according to any one of claims 1 to 4.

10. A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, implements a method of PCB backdrilling as claimed in any one of claims 1 to 4.

Technical Field

The invention belongs to the field of PCB processing and manufacturing, and particularly relates to a PCB back drilling processing method and device.

Background

Printed circuit board (pcb), which is one of the important parts in the electronics industry, is composed of an insulating substrate, connecting leads, and pads for mounting and soldering electronic components, and has the dual functions of a conductive trace and an insulating substrate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.

In the manufacturing process of the PCB, the PCB can be electrically connected with the inner-layer circuit board through the through holes, so that the different conducting layers are interconnected and conducted. For example, a PCB with 5 layers is manufactured, and in the actual use process, only the 1 st layer needs to be connected to the 4 th layer, when drilling, a through hole is drilled in the PCB (first drilling) first, the first drilling penetrates through the PCB, the first drilling forms a first drilling on the upper surface of the PCB, and a second drilling is formed on the lower surface of the PCB, so that the 1 st layer to the 5 th layer are connected, while only the 1 st layer needs to be connected to the 4 th layer, the 4 th layer to the 5 th layer on the PCB do not need to be connected, so that the metal layer between the 4 th layer and the 5 th layer needs to be demetallized, that is, the metal holes of the 4 th layer to the 5 th layer are drilled (second drilling) from the lower surface, and the second drilling is also called back drilling, and the back drilling is used for removing the metal through hole section which does not play any role in connection or transmission.

In the existing PCB drilling process, due to the reasons of PCB hardness, drill bit rigidity, heat generation and the like, when drilling for the first time, the drill bit is difficult to ensure vertical drilling, so that irregular hole site deviation is easily generated between the first drilling hole and the second drilling hole, and when drilling for the second time (back drilling), the second drilling hole is not corrected, so that the condition of incomplete demetallization occurs during the second drilling hole, and the processed PCB is not qualified.

Disclosure of Invention

The technical problem to be solved by the invention is that in the existing PCB drilling process, when the second drilling (back drilling) is carried out, the second drilling is not corrected, so that the condition of incomplete demetallization occurs during the second drilling, and the processed PCB is not qualified.

Therefore, according to a first aspect, an embodiment of the present invention discloses a method for PCB backdrilling, including:

performing first drilling on a preset position on the PCB, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on the first surface of the PCB, and a second drilling is formed on the second surface of the PCB;

acquiring the central coordinate of the first drill hole, and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole;

detecting the second drill hole, and calculating a hole site deviation value of the second drill hole;

calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole;

and taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and drilling the PCB for the second time.

Further, according to the central coordinates of the first borehole, calculating theoretical central coordinates of a second borehole, specifically including:

detecting the thickness of the PCB;

and calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

Further, detecting the second drilled hole, and calculating a hole position deviation value of the second drilled hole, specifically comprising:

detecting the second drilled hole to obtain first coordinate data of the second drilled hole;

acquiring first coordinate data of a first drill hole from the center coordinates of the first drill hole;

and calculating the hole position deviation value of the second drilling hole according to the first coordinate data of the first drilling hole and the first coordinate data of the second drilling hole.

Further, calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole, and specifically comprises:

and compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

According to a second aspect, an embodiment of the present invention provides an apparatus for PCB backdrilling, including:

the first drilling module is used for performing first drilling on a preset position on the PCB, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on the first surface of the PCB, and a second drilling is formed on the second surface of the PCB;

the first calculation module is used for acquiring the central coordinate of the first drilling hole and calculating the theoretical central coordinate of the second drilling hole according to the central coordinate of the first drilling hole;

the detection module is used for detecting the second drilling hole and calculating the hole position deviation value of the second drilling hole;

the second calculation module is used for calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole position deviation value of the second drill hole;

and the second drilling module is used for drilling the PCB for the second time by taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole.

Further, the first calculation module specifically includes:

the thickness detection unit is used for detecting the thickness of the PCB;

and the theoretical center coordinate calculating unit is used for calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

Further, the detection module specifically includes:

the second drilling detection unit is used for detecting a second drilling to acquire first coordinate data of the second drilling;

the acquiring unit is used for acquiring first coordinate data of the first drill hole from the center coordinate of the first drill hole;

and the hole position deviation calculating unit is used for calculating the hole position deviation value of the second drilling hole according to the first coordinate data of the first drilling hole and the first coordinate data of the second drilling hole.

Further, the second calculation module specifically includes:

and the compensation unit is used for compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

According to a third aspect, the present invention provides a computer apparatus comprising a memory and a processor, the memory having stored therein a computer program, the processor, when executing the computer program, implementing the method of PCB backdrilling as defined in any one of the above first aspects.

According to a fourth aspect, the present invention provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs a method of PCB backdrilling as in any one of the first aspects above.

The invention has the beneficial effects that:

the application discloses a method and a device for back drilling of a PCB (printed circuit board). according to the method, a first drilling hole is formed in a preset position on the PCB, wherein the first drilling hole penetrates through the PCB, the first drilling hole forms a first drilling hole in a first surface of the PCB, and a second drilling hole is formed in a second surface of the PCB; acquiring the central coordinate of the first drill hole, and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole; detecting the second drill hole, and calculating a hole site deviation value of the second drill hole; calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole; and taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and drilling the PCB for the second time. This application is through detecting the second drilling, acquires the coordinate data of second drilling, according to the coordinate data of first drilling and the coordinate data of second drilling, calculates the hole site deviation value of second drilling for first drilling to before carrying out the drilling of second time, utilize the theoretical central coordinate of hole site deviation value compensation second drilling, obtain the actual central coordinate of second drilling, regard the actual central coordinate of second drilling as the initial coordinate of drilling of second time at last, carry out the drilling of second time to the PCB board. Hole position deviation compensation is carried out on the theoretical center coordinate of the second drilling hole, so that the precision of back drilling is obviously improved, and the metal through hole section which does not play any connecting role can be completely removed during back drilling.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a flow chart of a method for PCB backdrilling according to an embodiment of the present invention;

FIG. 2 is a schematic view of a PCB before first drilling;

FIG. 3 is a schematic view of a PCB after a first drilling operation;

FIG. 4 is a schematic view of a second drilling operation without correcting the second drilling coordinates;

FIG. 5 is a top view of a PCB board after a second drilling without correcting the second drilling coordinates;

FIG. 6 is a schematic illustration of a second borehole coordinate correction by the imaging device;

FIG. 7 is a diagram illustrating a state after correction of the second borehole coordinate;

FIG. 8 is a schematic view of a second drilling operation with a second borehole coordinate correction;

FIG. 9 is a top view of a PCB board obtained by performing a second drilling while correcting coordinates of a second drilling;

FIG. 10 is a schematic structural diagram of an apparatus for PCB back drilling according to an embodiment of the present invention;

FIG. 11 is a schematic block diagram of one embodiment of a computer device according to the present application.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a flow chart of a method for PCB back drilling disclosed in this embodiment is shown, where the method for PCB back drilling includes:

s101, performing first drilling on a preset position on the PCB, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on the first surface of the PCB, and a second drilling is formed on the second surface of the PCB.

Specifically, a first drilling is performed on a preset position on the PCB according to the processing requirements on the processing file, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on the first surface of the PCB, and a second drilling is formed on the second surface of the PCB.

In a specific embodiment of the present application, when the second drilling hole is not corrected, hole site deviation may occur in the drilling process of the PCB, which may result in incomplete demetallization during the second drilling hole, and the processed PCB may not meet the requirements. Referring to fig. 2 and 3, L1 to L5 are conductive layers of the PCB, PP is a prepreg of the PCB, t1 is a first drill, a is a center of the first drill, B is a theoretical center of the second drill, and C is an actual center of the second drill. Referring to fig. 3, the first drill t1 drills holes vertically from top to bottom to form a first through hole h1, but in an actual machining process, due to the fact that the hardness of the PCB board is different, the rigidity of the drill bit is different, heat is generated, and the drill bit is difficult to guarantee vertical drilling when drilling for the first time, and therefore the actual center C of the second drill hole is not on the same vertical line as the center a of the first drill hole, that is, hole position deviation occurs.

Referring to fig. 4, t2 is the second drill, in the embodiment of the present application, for the purpose of partial metal plating in the first through hole h1, the cutting edge diameter of the second drill t2 is slightly larger than the cutting edge diameter of the first drill t1 during backdrilling, and in a specific embodiment of the present application, the cutting edge diameter of the second drill t2 is larger than the cutting edge diameter of the first drill t1 by 1-3 mm. When the second drilling (back drilling) is performed by using the second drill t2, if the coordinates of the second drilling are not corrected, but the coordinates of the theoretical center B of the second drilling are directly used as the initial coordinates of the second drilling to perform the second drilling on the PCB, the demetallization is incomplete when the second drilling (back drilling) is performed, for example, the metal plating on the left side of the first through hole h1 in fig. 4 is not removed, please refer to fig. 5, 1 represents the second drilling, 2 represents the actual hole position obtained after the second drilling (back drilling), and the metal plating on the first through hole h1 in the square frame X in fig. 5 is not removed, so that the processed PCB is not satisfactory.

S102, obtaining the central coordinate of the first drilling hole, and calculating the theoretical central coordinate of the second drilling hole according to the central coordinate of the first drilling hole.

In another embodiment of the present application, the center coordinate of the first drilling hole may also be obtained by detecting with a position sensor, and the first drilling hole is drilled at a predetermined position on the PCB board with the predetermined position as the center.

Further, according to the central coordinates of the first borehole, calculating theoretical central coordinates of a second borehole, specifically including:

and detecting the thickness of the PCB.

And calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

Specifically, in the embodiment of the present application, the center coordinates of the first borehole are obtained, the coordinates of the center a of the first borehole are obtained as (x1, y1, z1), and the coordinates of the theoretical center B of the second borehole (x2, y2, z2) are calculated according to the center coordinates of the first borehole. Based on theoretical calculations, the first drilling is performed vertically from top to bottom, theoretically with the center of the second drilling on the same vertical line as the center of the first drilling, so the value of x2 in the theoretical center coordinates of the second drilling is equal to the value of x1 in the center coordinates of the first drilling, the value of y2 in the theoretical center coordinates of the second drilling is equal to the value of y1 in the center coordinates of the first drilling, and the value of z2 in the theoretical center coordinates of the second drilling is equal to the value of z1+ d in the center coordinates of the first drilling, where d is the thickness of the PCB board.

S103, detecting the second drilled hole, and calculating the hole position deviation value of the second drilled hole.

Further, detecting the second drilled hole, and calculating a hole position deviation value of the second drilled hole, specifically comprising:

detecting the second drilled hole to obtain first coordinate data of the second drilled hole;

acquiring first coordinate data of a first drill hole from the center coordinates of the first drill hole;

and calculating the hole position deviation value of the second drilling hole according to the first coordinate data of the first drilling hole and the first coordinate data of the second drilling hole.

Specifically, referring to fig. 6, the actual hole position of the second borehole is detected by a CCD or AOI imaging device, and first coordinate data (x2 ', y 2') of the actual hole position of the second borehole is obtained, where the first coordinate data is coordinate values on an x axis and a y axis. First coordinate data (x1, y1) of the first borehole are acquired from center coordinates of the first borehole, and hole location deviation values (Δ x, Δ y) of the second borehole with respect to the first borehole are calculated based on the first coordinate data (x1, y1) of the first borehole and the first coordinate data (x2 ', y 2') of the second borehole.

And S104, calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole position deviation value of the second drill hole.

Further, calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole, and specifically comprises:

and compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

Specifically, the hole position deviation value (Δ x, Δ y) of the second borehole relative to the first borehole is compensated to the first coordinate data (x2, y2) of the coordinates (x2, y2, z2) of the theoretical center B of the second borehole, and the coordinates (x3, y3, z3) of the actual center C of the second borehole are obtained, wherein the value of x3 is the value of x2 plus Δ x, the value of y3 is the value of y2 plus Δ y, and the value of z3 is equal to the value of z 2. The hole site deviation value (delta x, delta y) is compensated to the coordinate of the theoretical center of the second drilling hole, the coordinate correction of the theoretical center B of the second drilling hole is completed, the actual center C of the second drilling hole is obtained after correction, the precision of back drilling is obviously improved through the coordinate correction, and the metal through hole section which does not play any connecting role can be completely removed during back drilling.

And S105, taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and performing second drilling on the PCB.

Specifically, referring to fig. 7 to 9, the coordinate of the actual center C of the second drilling hole obtained after the hole position deviation value (Δ x, Δ y) is compensated is used as the initial coordinate of the second drilling hole, and the h1 on the PCB board is drilled for the second time by using the drill cutter t2, so that the precision of the back drilling is significantly improved by compensating the hole position deviation value, and the metal through hole sections which do not have any connection function around the second drilling hole 1 are completely removed during the back drilling.

The embodiment discloses a method for back drilling a PCB, which comprises the steps of performing first drilling on a preset position on the PCB, wherein the first drilling penetrates through the PCB, the first drilling forms a first drilling on a first surface of the PCB, and a second drilling is formed on a second surface of the PCB; acquiring the central coordinate of the first drill hole, and calculating the theoretical central coordinate of the second drill hole according to the central coordinate of the first drill hole; detecting the second drill hole, and calculating a hole site deviation value of the second drill hole; calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole site deviation value of the second drill hole; and taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole, and drilling the PCB for the second time. This application is through detecting the second drilling, acquires the coordinate data of second drilling, according to the coordinate data of first drilling and the coordinate data of second drilling, calculates the hole site deviation value of second drilling for first drilling to before carrying out the drilling of second time, utilize the theoretical central coordinate of hole site deviation value compensation second drilling, obtain the actual central coordinate of second drilling, regard the actual central coordinate of second drilling as the initial coordinate of drilling of second time at last, carry out the drilling of second time to the PCB board. Hole position deviation compensation is carried out on the theoretical center coordinate of the second drilling hole, so that the precision of back drilling is obviously improved, and the metal through hole section which does not play any connecting role can be completely removed during back drilling.

Referring to fig. 10, a schematic structural diagram of the PCB back drilling device is shown, where the PCB back drilling device includes:

a first drilling module 1001, configured to perform a first drilling on a predetermined location on a PCB, where the first drilling penetrates through the PCB, the first drilling forms a first drilling on a first surface of the PCB, and the first drilling forms a second drilling on a second surface of the PCB;

the first calculation module 1002 is configured to obtain a central coordinate of a first drill hole, and calculate a theoretical central coordinate of a second drill hole according to the central coordinate of the first drill hole;

the detecting module 1003 is configured to detect the second drilled hole and calculate a hole position deviation value of the second drilled hole;

the second calculating module 1004 is used for calculating the actual center coordinate of the second drilling hole according to the theoretical center coordinate and the hole position deviation value of the second drilling hole;

and a second drilling module 1005 for drilling the PCB for the second time by using the actual center coordinates of the second drilling as the initial coordinates of the second drilling.

Further, the first calculating module 1002 specifically includes:

the thickness detection unit is used for detecting the thickness of the PCB;

and the theoretical center coordinate calculating unit is used for calculating the theoretical center coordinate of the second drilling hole according to the center coordinate of the first drilling hole and the thickness of the PCB.

Further, the detecting module 1003 specifically includes:

the second drilling detection unit is used for detecting a second drilling to acquire first coordinate data of the second drilling;

the acquiring unit is used for acquiring first coordinate data of the first drill hole from the center coordinate of the first drill hole;

and the hole position deviation calculating unit is used for calculating the deviation value of the hole position of the second drilling hole according to the first coordinate data of the first drilling hole and the first coordinate data of the second drilling hole.

Further, the second calculating module 1004 specifically includes:

and the compensation unit is used for compensating the first coordinate data of the theoretical center coordinate of the second drill hole according to the hole position deviation value to obtain the actual center coordinate of the second drill hole.

The embodiment discloses a device for back drilling of a PCB, which comprises a first drilling module, a second drilling module and a control module, wherein the first drilling module is used for performing first drilling on a preset position on the PCB, the first drilling penetrates through the PCB, the first drilling forms a first drilling hole on the first surface of the PCB, and a second drilling hole is formed on the second surface of the PCB; the first calculation module is used for acquiring the central coordinate of the first drilling hole and calculating the theoretical central coordinate of the second drilling hole according to the central coordinate of the first drilling hole; the detection module is used for detecting the second drilling hole and calculating the hole position deviation value of the second drilling hole; the second calculation module is used for calculating the actual center coordinate of the second drill hole according to the theoretical center coordinate and the hole position deviation value of the second drill hole; and the second drilling module is used for drilling the PCB for the second time by taking the actual center coordinate of the second drilling hole as the initial coordinate of the second drilling hole. This application is through detecting the second drilling, acquires the coordinate data of second drilling, according to the coordinate data of first drilling and the coordinate data of second drilling, calculates the hole site deviation value of second drilling for first drilling to before carrying out the drilling of second time, utilize the theoretical central coordinate of hole site deviation value compensation second drilling, obtain the actual central coordinate of second drilling, regard the actual central coordinate of second drilling as the initial coordinate of drilling of second time at last, carry out the drilling of second time to the PCB board. Hole position deviation compensation is carried out on the theoretical center coordinate of the second drilling hole, so that the precision of back drilling is obviously improved, and the metal through hole section which does not play any connecting role can be completely removed during back drilling.

In order to solve the technical problem, an embodiment of the present application further provides a computer device. Referring to fig. 11, fig. 11 is a block diagram of a basic structure of a computer device according to the present embodiment.

The computer device 11 includes a memory 111, a processor 112, and a network interface 113 communicatively connected to each other via a system bus. It is noted that only a computer device 11 having components 111 and 113 is shown, but it is understood that not all of the illustrated components are required and that more or fewer components may alternatively be implemented. As will be understood by those skilled in the art, the computer device is a device capable of automatically performing numerical calculation and/or information processing according to a preset or stored instruction, and the hardware includes, but is not limited to, a microprocessor, an Application Specific Integrated Circuit (ASIC), a Programmable Gate Array (FPGA), a Digital Signal Processor (DSP), an embedded device, and the like.

The computer device can be a desktop computer, a notebook, a palm computer, a cloud server and other computing devices. The computer equipment can carry out man-machine interaction with a user through a keyboard, a mouse, a remote controller, a touch panel or voice control equipment and the like.

The memory 111 includes at least one type of readable storage medium including a flash memory, a hard disk, a multimedia card, a card type memory (e.g., SD or DX memory, etc.), a Random Access Memory (RAM), a Static Random Access Memory (SRAM), a Read Only Memory (ROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a Programmable Read Only Memory (PROM), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the storage 111 may be an internal storage unit of the computer device 11, such as a hard disk or a memory of the computer device 11. In other embodiments, the memory 111 may also be an external storage device of the computer device 11, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the computer device 11. Of course, the memory 111 may also include both internal and external storage devices of the computer device 11. In this embodiment, the memory 111 is generally used for storing an operating system installed on the computer device 11 and various application software, such as a program code of a method for PCB back drilling. Further, the memory 111 may also be used to temporarily store various types of data that have been output or are to be output.

The processor 112 may be a Central Processing Unit (CPU), controller, microcontroller, microprocessor, or other data Processing chip in some embodiments. The processor 112 is typically used to control the overall operation of the computer device 11. In this embodiment, the processor 112 is configured to execute the program code stored in the memory 111 or process data, for example, execute the program code of the method for PCB back drilling.

The network interface 113 may include a wireless network interface or a wired network interface, and the network interface 113 is generally used to establish a communication connection between the computer device 11 and other electronic devices.

The present application further provides another embodiment, which is to provide a computer readable storage medium storing a program of a method of PCB back drilling processing, which is executable by at least one processor to cause the at least one processor to perform the steps of a PCB back drilling processing as described above.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.