阅读说明：本技术 一种微波tr组件封装壳体结构及装配方法及其方法 (Microwave TR component packaging shell structure, assembly method and assembly method ) 是由 钟剑锋 杜小辉 王日初 于 2020-06-04 设计创作，主要内容包括：本发明公开了一种微波TR组件封装壳体结构及装配方法及其方法,其壳体结构包括盖板、过渡环和底部壳体,所述盖板采用钛合金材料的薄板制造而成,所述过渡环采用钛合金材料的方框结构制造而成,所述底部壳体是采用铝基碳化硅材料的盒状结构制成,所述盖板和过渡环紧密贴合,且盖板和过渡环贴合位置为第二焊接部位,所述第二焊接部位采用激光焊接；本发明封装壳体将最理想的壳体封装材料和焊接封装方法充分结合,其中,铝基碳化硅材料用于底部壳体材料,散热性好,重量轻,热膨胀系数与基板、热沉等器件更接近,更适合焊接,过渡环和盖板采用钛合金材料,强度大,重量轻,更适合激光封焊,密封性更好。(The invention discloses a microwave TR component packaging shell structure, an assembly method and a method thereof, wherein the shell structure comprises a cover plate, a transition ring and a bottom shell, the cover plate is made of a thin plate made of a titanium alloy material, the transition ring is made of a square frame structure made of the titanium alloy material, the bottom shell is made of a box-shaped structure made of an aluminum-based silicon carbide material, the cover plate and the transition ring are tightly attached, the attachment position of the cover plate and the transition ring is a second welding position, and the second welding position is laser welded; the packaging shell fully combines the optimal shell packaging material and the welding packaging method, wherein the aluminum-based silicon carbide material is used as the bottom shell material, the heat dissipation performance is good, the weight is light, the thermal expansion coefficient is closer to that of devices such as a substrate and a heat sink, the welding is more suitable, the transition ring and the cover plate are made of titanium alloy materials, the strength is high, the weight is light, the laser sealing welding is more suitable, and the sealing performance is better.)

1. The utility model provides a microwave TR subassembly encapsulation shell structure, includes apron (101), transition ring (102) and bottom casing (103), its characterized in that, apron (101) adopt the sheet metal of titanium alloy material to make and form, transition ring (102) adopt the square frame structure of titanium alloy material to make and form, bottom casing (103) are the box-like structure that adopts aluminium base carborundum material to make, apron (101) and transition ring (102) closely laminate, and apron (101) and transition ring (102) laminating position be second welding position (105), second welding position (105) adopt laser welding, transition ring (102) and bottom casing (103) closely laminate, and transition ring (102) and bottom casing (103) case laminating position be first welding position (104), first welding position (104) adopt high temperature brazing, fixedly mounted has one-way discharge valve (109) on the central point of apron (101), the bottom of one-way discharge valve (109) extends to in bottom casing (103), the bottom fixed mounting of apron (101) has sealed the pad (107), annular seal groove (108) have been seted up to the top annular of transition ring (102), and the bottom of sealed pad (107) extends to in annular seal groove (108) and clamps mutually with annular seal groove (108).

2. A microwave TR module package housing structure according to claim 1, wherein the thickness of the cover plate (101) is 1mm, the height of the transition ring (102) is not less than 3mm, the height of the transition ring (102) is not more than the thickness of the whole T/R module housing, the width of each frame of the transition ring (102) is consistent with the width of each frame of the corresponding bottom housing (103), and the size of the bottom housing (103) is determined according to the module design.

3. The microwave TR assembly package housing structure of claim 1, wherein all right angle ends of the second welding part (105) of the laser sealing part of the cover plate (101) and the transition ring (102) and the first welding part (104) of the brazing part of the transition ring (102) and the housing (103) are machined into circular arc chamfers (106).

4. A microwave TR assembly package housing structure according to claim 1, wherein said transition ring (102) is machined with at least 1mm of allowance for flatness trimming after welding with the bottom housing (103).

5. The microwave TR assembly package housing structure of claim 1, wherein the cover plate (101) is provided with a cover plate side surface (101 a) and a cover plate bottom surface (101 b), the transition ring (102) is provided with a transition ring lower step surface (102 a), a transition ring upper step surface (102 b), a transition ring upper step side surface (102 c), a transition ring lower step upper surface (102 d) and a transition ring lower step side surface (102 e), and the bottom housing (103) is provided with a bottom housing enclosure frame step surface (103 a), a bottom housing enclosure frame step side surface (103 b) and a bottom housing enclosure frame step upper surface (103 c).

6. A method for assembling a microwave TR component packaging shell structure is characterized by comprising the following steps:

(A) placing a gold-tin solder ring on the upper surface (103 c) of the step of the surrounding frame of the bottom shell;

(B) overlapping a transition ring lower step surface (102 a) of a transition ring (102) on a bottom shell enclosure frame step surface (103 a), and attaching a transition ring lower step side surface (102 e) of the transition ring (102) to a bottom shell enclosure frame step side surface (103 b);

(C) the transition ring (102) is brazed with the bottom shell (103) at high temperature;

(D) the flatness of a step surface (102 b) on the upper surface of the transition ring on the transition ring (102) and a side surface (102 c) on the upper step of the transition ring is finely finished;

(E) assembling and welding a substrate, a connector, a capacitance resistance piece and a shell of the T/R assembly;

(F) detecting the air tightness of the packaging shell;

(G) micro-assembling other components of the T/R assembly; debugging and testing;

(H) when the T/R assembly is debugged to be qualified, lapping the bottom surface (101 b) of the cover plate on the step surface (102 b) of the upper surface of the transition ring, and attaching the side surface (101 a) of the cover plate to the side surface (102 c) of the upper step of the transition ring;

(I) laser seal welding is carried out on the cover plate (101) and the transition ring (102);

(J) carrying out air tightness detection on the whole T/R assembly;

(K) and (5) finishing the assembly.

Technical Field

The invention relates to the technical field of electronic packaging shell structures, in particular to a microwave TR component packaging shell structure, an assembling method and an assembling method.

Background

A microwave Transmitter and Receiver (abbreviated as T/R) component is one of the most important components of an active phased array radar system, and the volume, weight, electrical property and the like of the T/R component directly determine various technical indexes of receiving and transmitting signals of the active phased array radar. The T/R assembly packaging shell is an important component of the T/R assembly, not only plays a role in bearing components and substrates, but also plays roles in grounding, heat dissipation, sealing protection and the like.

Along with the development of high integration and modularization of the active phased array radar, the number of phased array antenna units is large, unit spacing is smaller and smaller, the integration level of internal devices is higher and higher, output power is larger and larger, higher requirements are provided for a T/R assembly, and higher requirements are provided for the weight, strength, thermal expansion coefficient, heat dissipation performance, weldability and other performances of a T/R assembly packaging shell.

At present, shell materials commonly adopted at home and abroad comprise aluminum alloy, kovar alloy, titanium alloy, ceramic, aluminum-based silicon carbide and the like, wherein the aluminum alloy has a large thermal expansion coefficient, and a high-density integrated assembly can generate thermal stress in the using process, so that a chip and a substrate are subjected to fatigue cracking or electrical property failure; the heat conductivity of the kovar alloy, the titanium alloy and other metals is low, the heat dissipation requirement cannot be met, and the density is high; the cost of the ceramic is too high; the aluminum-based silicon carbide has adjustable expansion coefficient, low density and good heat dissipation, and is an ideal material for the T/R assembly shell at present.

Meanwhile, the sealing welding method for the T/R assembly shell and the cover plate, which is commonly adopted at home and abroad, comprises epoxy glue bonding, soft soldering, parallel seam welding, electron beam welding, laser sealing welding and the like.

However, further development of TR assembly housings is limited because aluminum-based silicon carbide materials cannot be used for laser welding, resulting in less than simultaneous compatibility of the most desirable materials and sealing welding methods.

Disclosure of Invention

Based on the technical problems in the background art, the invention provides a microwave TR component packaging shell structure, an assembly method and an assembly method.

The invention provides a microwave TR component packaging shell structure which comprises a cover plate, a transition ring and a bottom shell, wherein the cover plate is made of a thin plate made of a titanium alloy material, the transition ring is made of a square frame structure made of the titanium alloy material, the bottom shell is made of a box-shaped structure made of an aluminum-based silicon carbide material, the cover plate is tightly attached to the transition ring, the attachment position of the cover plate and the transition ring is a second welding position, the second welding position is laser welded, the transition ring is tightly attached to the bottom shell, the attachment position of the transition ring and a bottom shell box is a first welding position, the first welding position is subjected to high-temperature brazing, a one-way exhaust valve is fixedly installed at the center position of the cover plate, the bottom of the one-way exhaust valve extends into the bottom shell, a sealing gasket is fixedly installed at the bottom of the cover plate, and an annular sealing groove is annularly formed at the top of the transition ring, and the bottom of the sealing gasket extends into the annular sealing groove and is clamped with the annular sealing groove.

Preferably, the thickness of the cover plate is 1mm, the height of the transition ring is not less than 3mm, the height of the transition ring is not more than the thickness of the whole T/R assembly shell, the width of each frame of the transition ring is consistent with the width of each surrounding frame of the corresponding bottom shell, and the size of the bottom shell is determined according to the design of the assembly.

Preferably, all right-angle ends of the second welding part of the laser sealing part of the cover plate and the transition ring and the first welding part of the brazing part of the transition ring and the shell are processed into arc chamfers.

Preferably, at least 1mm of margin is reserved in the transition ring processing process for flatness finishing after the transition ring is welded with the bottom shell.

Preferably, be provided with apron side and apron bottom surface on the apron respectively, be provided with transition ring lower step face, transition ring upper surface step face, transition ring upper step side, transition ring lower step upper surface and transition ring lower step side on the transition ring respectively, be provided with bottom casing on the casing of bottom respectively and enclose frame step face, bottom casing and enclose frame step side and bottom casing and enclose frame step upper surface.

A method for assembling a packaging shell structure of a microwave TR component comprises the following steps:

(A) placing a gold-tin solder ring on the upper surface c of the step of the surrounding frame of the bottom shell;

(B) lapping the lower step surface of the transition ring on the step surface of the surrounding frame of the bottom shell, and attaching the side surface of the lower step of the transition ring to the side surface of the surrounding frame step of the bottom shell;

(C) the transition ring and the bottom shell are brazed at high temperature;

(D) the step surface of the upper surface of the transition ring on the transition ring and the side surface of the upper step of the transition ring are subjected to flatness fine trimming;

(E) assembling and welding a substrate, a connector, a capacitance resistance piece and a shell of the T/R assembly;

(F) detecting the air tightness of the packaging shell;

(G) micro-assembling other components of the T/R assembly; debugging and testing;

(H) when the T/R assembly is debugged to be qualified, lapping the bottom surface of the cover plate on the step surface of the upper surface of the transition ring, and attaching the side surface of the cover plate to the side surface of the step of the upper surface of the transition ring;

(I) laser seal welding is carried out on the cover plate and the transition ring;

(J) carrying out air tightness detection on the whole T/R assembly;

(K) and (5) finishing the assembly.

Specifically, in the step A, the solder adopts a gold-tin solder ring with the thickness of 0.1mm, and the width of the gold-tin solder ring is slightly smaller than that of the upper surface 103c of the step of the surrounding frame of the bottom shell.

Specifically, in step C, a vacuum brazing furnace is used as the welding equipment for the transition ring 102 and the bottom shell 103, and a pressing block is arranged above the transition ring 102 for reinforcement during welding.

Specifically, in step D, the flatness of the transition ring upper surface step surface 102b and the transition ring upper step side surface 102c is required to be 0.05 mm.

Specifically, in step F, the tightness test is performed by using a helium mass spectrometer leak detector, and the tightness of the fitting of each connector is also tested in addition to the tightness of the transition ring 102 and the bottom case 103.

The invention has the beneficial effects that:

1. the packaging shell fully combines the optimal shell packaging material and the welding packaging method, wherein the aluminum-based silicon carbide material is used as the bottom shell material, the heat dissipation performance is good, the weight is light, the thermal expansion coefficient is closer to that of devices such as a substrate and a heat sink, the welding is more suitable, the transition ring and the cover plate are made of titanium alloy materials, the strength is high, the weight is light, the laser sealing welding is more suitable, and the sealing performance is better.

2. The invention can be connected with exhaust equipment (not shown in the attached drawing) by utilizing the one-way exhaust valve, and can exhaust air in the shell by utilizing the exhaust equipment, thereby realizing that the shell is in a vacuum state, effectively preventing the electric elements in the shell from being oxidized and rusted, and undoubtedly prolonging the service life of the electric elements in the shell.

3. The sealing performance of the connection between the cover plate and the transition ring can be greatly improved by arranging the sealing gasket and the annular sealing groove.

Drawings

Fig. 1 is a schematic front view of a package housing structure of a microwave TR module according to the present invention;

fig. 2 is a schematic top view of a microwave TR package housing structure according to the present invention;

fig. 3 is a schematic front view of the cover plate in fig. 1 of a packaging housing structure of a microwave TR assembly according to the present invention;

fig. 4 is an enlarged structural schematic diagram of a portion a of fig. 1 of a packaging housing structure of a microwave TR assembly according to the present invention;

fig. 5 is an exploded view of the microwave TR package housing structure shown in fig. 4 according to the present invention.

In the figure: 101 cover plate, 101a cover plate side surface, 101b cover plate bottom surface, 102 transition ring, 102a transition ring lower step surface, 102b transition ring upper surface step surface, 102c transition ring upper step side surface, 102d transition ring lower step upper surface, 102e transition ring lower step side surface, 103 bottom shell, 103a bottom shell enclosure frame step surface, 103b bottom shell enclosure frame step side surface, 103c bottom shell enclosure frame step upper surface, 104 first welding part, 105 second welding part, 106 arc chamfer, 107 sealing gasket, 108 annular sealing groove and 109 one-way exhaust valve.

Detailed Description

The present invention will be further illustrated with reference to the following specific examples.

Examples

Referring to fig. 1-5, the present embodiment provides a microwave TR module package casing structure, which includes a cover plate 101, a transition ring 102 and a bottom casing 103, wherein the cover plate 101 is made of a thin plate made of a titanium alloy material, the transition ring 102 is made of a square frame made of a titanium alloy material, the bottom casing 103 is made of a box-shaped structure made of an aluminum-based silicon carbide material, the cover plate 101 and the transition ring 102 are tightly attached, the attachment position of the cover plate 101 and the transition ring 102 is a second welding position 105, the second welding position 105 is laser welding, the transition ring 102 and the bottom casing 103 are tightly attached, the attachment position of the transition ring 102 and the bottom casing 103 is a first welding position 104, the first welding position 104 is high temperature brazing, a one-way exhaust valve 109 is fixedly installed at the center position of the cover plate 101, the bottom of the one-way exhaust valve 109 extends into the bottom casing 103, a sealing gasket 107 is fixedly installed at the bottom of the cover plate 101, an annular sealing groove 108 is annularly formed at the top of the transition ring 102, and the bottom of the sealing gasket 107 extends into the annular sealing groove 108 and is clamped with the annular sealing groove 108.

In this embodiment, the thickness of the cover plate 101 is 1mm, the height of the transition ring 102 is not less than 3mm, the height of the transition ring 102 is not greater than the thickness of the whole T/R assembly housing, the width of each frame of the transition ring 102 is consistent with the width of each surrounding frame of the corresponding bottom housing 103, and the size of the bottom housing 103 is determined according to the assembly design.

In this embodiment, all right-angled ends of the second welding portion 105 of the laser seal portion of the cover plate 101 and the transition ring 102 and the first welding portion 104 of the brazing portion of the transition ring 102 and the housing 103 are processed into the arc chamfer 106.

In this embodiment, at least 1mm of margin should be left in the process of processing the transition ring 102 for finishing the flatness after the welding with the bottom shell 103 is completed.

In this embodiment, the cover plate 101 is provided with a cover plate side surface 101a and a cover plate bottom surface 101b, the transition ring 102 is provided with a transition ring lower step surface 102a, a transition ring upper surface step surface 102b, a transition ring upper step side surface 102c, a transition ring lower step upper surface 102d, and a transition ring lower step side surface 102e, and the bottom shell 103 is provided with a bottom shell surrounding frame step surface 103a, a bottom shell surrounding frame step side surface 103b, and a bottom shell surrounding frame step upper surface 103 c.

A method for assembling a packaging shell structure of a microwave TR component comprises the following steps:

(A) placing a gold-tin solder ring on the upper surface 103c of the step of the surrounding frame of the bottom shell;

(B) lapping a transition ring lower step surface 102a of the transition ring 102 on a bottom shell enclosure frame step surface 103a, and attaching a transition ring lower step side surface 102e of the transition ring 102 to a bottom shell enclosure frame step side surface 103 b;

(C) the transition ring 102 and the bottom shell 103 are brazed at high temperature;

(D) the flatness of the step surface 102b of the upper surface of the transition ring on the transition ring 102 and the step side surface 102c of the upper surface of the transition ring is finely finished;

(E) assembling and welding a substrate, a connector, a capacitance resistance piece and a shell of the T/R assembly;

(F) detecting the air tightness of the packaging shell;

(G) micro-assembling other components of the T/R assembly; debugging and testing;

(H) when the T/R assembly is debugged to be qualified, lapping the bottom surface 101b of the cover plate on the step surface 102b of the upper surface of the transition ring, and attaching the side surface 101a of the cover plate to the side surface 102c of the upper step of the transition ring;

(I) laser sealing welding is carried out on the cover plate 101 and the transition ring 102;

(J) carrying out air tightness detection on the whole T/R assembly;

(K) and (5) finishing the assembly.

Specifically, in the step A, the solder adopts a gold-tin solder ring with the thickness of 0.1mm, and the width of the gold-tin solder ring is slightly smaller than that of the upper surface 103c of the step of the surrounding frame of the bottom shell.

Specifically, in step C, a vacuum brazing furnace is used as the welding equipment for the transition ring 102 and the bottom shell 103, and a pressing block is arranged above the transition ring 102 for reinforcement during welding.

Specifically, in step D, the flatness of the transition ring upper surface step surface 102b and the transition ring upper step side surface 102c is required to be 0.05 mm.

Specifically, in step F, the tightness test is performed by using a helium mass spectrometer leak detector, and the tightness of the fitting of each connector is also tested in addition to the tightness of the transition ring 102 and the bottom case 103.

As shown in fig. 4 and 5, steps are provided on both the upper surface and the lower surface of the transition ring 102, the size of the step on the upper surface of the transition ring 102 matches with the size of the cover plate 101, the cover plate 101 is lapped on the step, and the step on the lower surface of the transition ring 102 matches with the step on the upper surface of the enclosure frame of the bottom shell 103.

The height of the upper step side 102c of the transition ring 102 is the same as that of the side 101a of the cover plate 101, the width of the lower step side 102a of the transition ring 102 is the same as that of the bottom casing enclosure step side 103a, the height of the lower step side 102e of the transition ring 102 is 0.1mm higher than that of the bottom casing enclosure step side 103b, and the width of the lower step upper surface 102d of the transition ring is the same as that of the bottom casing enclosure step upper surface 103 c.

Plating the steps 102a, 102d, 102e on the lower surface of the transition ring 102; the bottom housing enclosure upper surface steps 103a, 103b, 103c are plated.

The surface plating adopts a nickel-gold plating layer.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.