阅读说明：本技术 一种用于收发组件的控制信号传输结构及该相控阵雷达 (Control signal transmission structure for transceiving component and phased array radar ) 是由 莫学敏 宁兴华 高瞻 于 2020-10-10 设计创作，主要内容包括：本发明公开了一种用于收发组件的控制信号传输结构及该相控阵雷达,其特征在于,所述结构包括壳体；所述壳体包括上下开口的围壁,以及由所述围壁向内延伸出的带有镂空的中间隔板；位于所述中间隔板镂空处的信号转接板,所述信号转接板结合所述中间隔板将所述壳体内腔分隔为第一腔体与第二腔体；以及配置在所述壳体内部的信号传输构件；所述信号传输构件至少包括：位于第一腔体的微带片；以及位于第二腔体的电源板。一种相控阵雷达,其特征在于包括所述控制信号传输结构。本发明能够简化传统收发组件的装配形式,满足相控阵雷达研制的快速响应需求,同时可实现多重信号的传输,可有效提高收发组件的集成度。(The invention discloses a control signal transmission structure for a transceiving component and a phased array radar, and is characterized in that the structure comprises a shell; the shell comprises a surrounding wall with an upper opening and a lower opening, and a hollow middle partition plate which extends inwards from the surrounding wall; the signal adapter plate is positioned at the hollow part of the middle partition plate, and the signal adapter plate is combined with the middle partition plate to divide the inner cavity of the shell into a first cavity and a second cavity; and a signal transmission member disposed inside the housing; the signal transmission member includes at least: the microstrip sheet is positioned in the first cavity; and the power panel is positioned in the second cavity. A phased array radar comprising the control signal transmission structure. The invention can simplify the assembly form of the traditional transceiving component, meet the quick response requirement of the phased array radar development, simultaneously realize the transmission of multiple signals and effectively improve the integration level of the transceiving component.)

1. A control signal transmission structure for a transceiver component, the structure comprising:

a housing; the shell comprises a surrounding wall with an upper opening and a lower opening, and a hollow middle partition plate which extends inwards from the surrounding wall;

the signal adapter plate is positioned at the hollow part of the middle partition plate, and the signal adapter plate is combined with the middle partition plate to divide the inner cavity of the shell into a first cavity and a second cavity; and

a signal transmission member disposed inside the housing; the signal transmission member includes at least:

the microstrip sheet is positioned in the first cavity; and

and the power panel is positioned in the second cavity.

2. The control signal transmission structure according to claim 1, wherein the microstrip sheet is fixed on a side of the middle partition plate away from the second cavity without covering the hollow.

3. The control signal transmission structure according to claim 1, wherein the power board is fixedly combined with a side of the middle partition board, which faces away from the first cavity;

one side of the power panel, which faces away from the middle partition plate, comprises a metal coating, and the metal coating is configured to be a mounting carrier for welding components and chips.

4. The control signal transmission structure according to claim 3, wherein the signal transmission member further comprises a molybdenum-copper carrier, and the molybdenum-copper carrier is fixedly combined with one side of the middle partition plate, which faces away from the second cavity, and does not block the hollow position.

5. The control signal transmission structure according to claim 4, wherein the structure comprises a first chip and a second chip;

the first chip is fixedly combined on the molybdenum-copper carrier in the first cavity;

the second chip is fixedly combined with the metal plating layer on one side, away from the middle partition plate, of the power panel in the second cavity.

6. The control signal transmission structure according to claim 1, wherein the signal interposer includes a plurality of metal through holes configured to connect pads of the signal interposer on both board surfaces of the first cavity and the second cavity to each other;

the top plate surface of the signal adapter plate exposed to the first cavity is a bonding surface, and the bonding surface comprises a soft gold plating layer with the thickness of at least 3 um.

7. The control signal transmission structure according to claim 1, wherein a bottom plate surface of the signal adapter plate is connected with one side of the power supply plate, which is away from the lower opening of the shell, through the hollow-out part on the middle partition plate; and the top plate surface of the signal transfer plate exposed to the first cavity is connected with the bonding pad of the microstrip sheet through gold wire bonding.

8. The control signal transmission structure according to claim 5, wherein the first chip located in the first cavity is connected to the microstrip chip and the bonding pad of the signal interposer exposed on the top surface of the first cavity by gold wire bonding, and the second chip located in the second cavity and mounted on the power board is connected to the bonding pad of the power board on the side away from the intermediate partition by gold wire bonding.

9. The control signal transmission structure according to claim 1, further comprising upper and lower cover plates, the upper cover plate covering the upper opening of the housing, the lower cover plate covering the lower opening of the housing, so that the housing forms an airtight structure.

10. A phased array radar, characterized in that it comprises a control signal transmission structure according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of phased array radars. And more particularly, to a control signal transmission structure for a transceiving component and the phased array radar

Background

Compared with a mechanical scanning radar, one of the most prominent characteristics of the phased array radar is a phased array radar antenna beam, and the beam agility is realized by controlling the amplitude and phase chips of each channel of the transceiver module in real time. The traditional transceiving component consists of a microstrip piece, a power panel, a structural member, an upper cover plate and a lower cover plate, wherein the microstrip piece and the power panel are respectively arranged on the front side and the back side of a cavity, the middle of the microstrip piece and the power panel are separated by a partition plate, and control signal transmission between the microstrip piece and the panel is realized by a lead or a glass insulator.

However, as the requirements of phased array radar on volume and channel number are continuously improved, the required number of wires or glass insulators is increased, and the receiving and transmitting assembly adopting the traditional control signal transmission structure needs to spend a great deal of manpower and time for assembly, so that the fast response requirement developed by the current phased array radar is difficult to meet,

disclosure of Invention

In view of the foregoing problems, an object of the present invention is to provide a control signal transmission structure for a transceiver module and a phased array radar, which can simplify the assembly form of the conventional transceiver module, meet the requirement of fast response in the development of the phased array radar, and simultaneously can realize the transmission of multiple signals, thereby effectively improving the integration level of the transceiver module.

In order to achieve the purpose, the invention adopts the following technical scheme:

a control signal transmission structure for a transceiver component, the control signal transmission structure comprising:

a housing; the shell comprises a surrounding wall with an upper opening and a lower opening, and a hollow middle partition plate which extends inwards from the surrounding wall;

the signal adapter plate is positioned at the hollow part of the middle partition plate, and the signal adapter plate is combined with the middle partition plate to divide the inner cavity of the shell into a first cavity and a second cavity; and

a signal transmission member disposed inside the housing; the signal transmission member includes at least:

the microstrip sheet is positioned in the first cavity; and

and the power panel is positioned in the second cavity.

In addition, preferably, the microstrip piece is fixedly combined with one side of the middle partition plate, which is away from the second cavity, and the hollowed-out position is not shielded.

In addition, preferably, the power panel is fixedly combined with one side of the middle partition plate, which is away from the first cavity;

one side of the power panel, which faces away from the middle partition plate, comprises a metal coating, and the metal coating is configured to be a mounting carrier for welding components and chips.

In addition, preferably, the signal transmission member further includes a molybdenum-copper carrier, and the molybdenum-copper carrier is fixedly combined with one side of the middle partition plate, which is away from the second cavity, and does not block the hollow position.

In addition, preferably, the structure comprises a first chip and a second chip;

the first chip is fixedly combined on the molybdenum-copper carrier in the first cavity;

the second chip is fixedly combined with the metal plating layer on one side, away from the middle partition plate, of the power panel in the second cavity.

In addition, it is preferable that the signal adapting board includes a plurality of metal through holes, and the metal through holes are configured to make pads of the signal adapting board on two board surfaces of the first cavity and the second cavity communicate with each other;

the top plate surface of the signal adapter plate exposed to the first cavity is a bonding surface, and the bonding surface comprises a soft gold plating layer with the thickness of at least 3 um.

In addition, preferably, the bottom plate surface of the signal adapter plate is connected with one side of the power panel, which is far away from the lower opening of the shell, through the hollow-out part on the middle partition plate; and the top plate surface of the signal transfer plate exposed to the first cavity is connected with the bonding pad of the microstrip sheet through gold wire bonding.

In addition, preferably, the first chip located in the first cavity is connected to the microstrip chip and the bonding pad of the signal adapter board exposed on the top plate surface of the first cavity in a gold wire bonding manner, and the second chip located in the second cavity and mounted on the power board is connected to the bonding pad of the power board on the surface deviating from the middle partition plate in the gold wire bonding manner.

Furthermore, it is preferable that the control signal transmission structure further includes an upper cover plate and a lower cover plate, the upper cover plate covers the upper opening of the housing, and the lower cover plate covers the lower opening of the housing, so that the housing forms an airtight structure.

Further, it is preferable that a phased array radar includes the above-described control signal transmission structure.

The invention has the following beneficial effects:

compared with the prior art, the control signal transmission structure for the transceiving component and the phased array radar provided by the invention have the advantages that the circuits on the front surface and the back surface of the shell are communicated by the signal adapter plate, so that the transmission of the control signals of the transceiving component is realized, the assembly form of the component is simplified, the labor and time costs are saved, the corresponding rapid requirements for the development of the phased array radar are met, meanwhile, the signal adapter plate can realize the transmission of various control signals, and the integration level of the transceiving component is effectively improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram illustrating an overall structure of a control signal transmission structure according to the present invention.

Fig. 2 shows a schematic diagram of the connection between the control signal transmission members provided by the present invention.

Detailed Description

In order to make the technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In order to solve the defects of the prior art and meet the requirement of fast response of phased array radar development, the invention provides a new control signal transmission structure for a transceiving component and the phased array radar, which is shown in a combined figure 1, wherein the control signal transmission structure comprises

A housing 1; the shell 1 comprises a surrounding wall 13 with an upper opening and a lower opening, and an intermediate partition plate 14 with a hollow 140 and extending inwards from the surrounding wall 13;

the signal adapter plate 2 is positioned at the hollow-out part 140 of the middle partition plate 14, and the signal adapter plate 2 is combined with the middle partition plate 14 to divide the inner cavity of the shell 1 into a first cavity 11 and a second cavity 12; and

a signal transmission member disposed inside the housing 1; the signal transmission member includes at least:

the microstrip sheet 3 is positioned in the first cavity 11; and

a power panel 4 located in the second cavity 12.

The signal transmission member transmits a microwave signal in the first cavity 11, and transmits a power supply and a control signal in the second cavity 12.

Referring to fig. 1, in the present embodiment, the microstrip sheet 3 is fixed to a side 141 of the middle partition 14 away from the second cavity 12 by brazing, and the position of the microstrip sheet 3 is any position on the side 141 of the middle partition 14 away from the second cavity 12 that does not overlap with the hollow 140.

In a specific embodiment, the present invention provides a preferred embodiment for combining and fixing the signal transmission member inside the housing 1, specifically, as shown in fig. 1, a side 41 of the power board 4 facing away from the lower opening of the housing 1 and a side 142 of the middle partition 14 facing away from the first cavity 11 are combined and fixed by soldering, it is obvious to those skilled in the art that the form of combining and fixing the power board and the middle partition is not limited to the form provided by the present embodiment, and the power board and the middle partition may also adopt other forms of connection means known in the art, and the present invention is not limited thereto.

Further, as shown in fig. 1, the signal adapter plate 2 is connected to the power supply plate 4 through the hollow 140 on the intermediate partition plate 14, in this embodiment, the present invention further includes a solder ball 7, the solder ball 7 is soldered on the pad 21 on the side of the signal adapter plate 2 away from the upper opening of the housing, and the solder ball 7 is fixedly combined with the pad on the side 41 of the power supply plate 4 away from the lower opening of the housing 1 through the hollow 140 on the intermediate partition plate 14. It should be noted that the connection form of the power board and the signal adapter board is not limited to the connection form provided in the present embodiment, and the power board and the signal adapter board may also adopt other connection forms known in the art, such as wire connection, and the present invention is not limited thereto.

In combination with the illustrated structure, in a preferred embodiment, the control signal transmission structure further includes a molybdenum-copper carrier 5 fixed inside the casing 1 in a combined manner, specifically, the molybdenum-copper carrier 5 is fixed on a side 141 of the middle partition 14 away from the second cavity 12 in a combined manner by brazing, and the position of the molybdenum-copper carrier 5 does not coincide with the position of the hollow 140.

In a specific embodiment, the structure further comprises a first chip 61 and a second chip 62, and the molybdenum-copper carrier is configured as a mounting carrier of the first chip 61 in the first cavity 11. In this embodiment, a side of the power supply board 4 facing away from the middle partition board has a metal plating 40, and the metal plating 40 is configured as a mounting carrier for soldering components and the second chip 62 in the second cavity 12. Referring to fig. 1, in the first cavity 11, the first chip 61 is mounted on the molybdenum-copper carrier 5 in a eutectic manner, and the second chip 62 disposed in the second cavity 12 is mounted on the metal plating 40 on a side of the power board 4 away from the middle partition plate in a conductive adhesive manner.

In addition, in this embodiment, the signal interposer 2 further includes a plurality of metal through holes, so that pads on two surfaces of the first cavity 11 and the second cavity 12 of the signal interposer 2 are connected to each other; furthermore, the surface of the top plate of the signal adapter plate 2 exposed to the first cavity 11 is a bonding surface, and the bonding surface comprises a soft gold plating layer with a thickness of at least 3 um.

In the present embodiment, the connection relationship between the parts of the signal transmission member is as shown in fig. 1 and fig. 2, specifically, in the first cavity 11, the first chip 61 is connected to the pad on the top plate surface of the signal adapting plate 2 and the pad of the microstrip sheet 3 by gold wire bonding, and the pad on the top plate surface of the signal adapting plate 2 and the pad of the microstrip sheet 3 are also connected by gold wire bonding; inside the second cavity 12, the second chip 62 that is fixed on the power strip 4 is combined with the pad that deviates from the corresponding position on the metal coating 40 of one side of intermediate bottom plate with the power strip 4 and is connected by the mode of gold wire bonding, and after the connection is accomplished, the signal accessible between the first cavity 11 and the second cavity 12 the conversion of signal keysets 2 is transmitted, compares with prior art, has simplified the assembly form of receiving and dispatching subassembly, has solved the problem of wire and glass insulator assembly difficulty. The fast corresponding requirement of phased array radar development is met, meanwhile, the signal adapter plate can realize transmission of various control signals, and the integration level of the receiving and transmitting assembly is effectively improved.

In addition, as shown in fig. one, in the present embodiment, the control signal transmission structure further includes an upper cover plate 15 and a lower cover plate 16, where the upper cover plate 15 covers the upper opening of the housing 1, and the lower cover plate 16 covers the lower opening of the housing 1, and both of them are combined and fixed in a laser welding manner, so that the first cavity 11 and the second cavity 12 form an airtight structure to protect the chip in the housing 1.

In one particular embodiment, a phased array radar includes the novel control signal transmission structure provided by the present invention.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.