Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board
阅读说明:本技术 电路基板用半制品板材的制造方法、电路基板用半制品板材及金属基体电路基板的制造方法 (Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board ) 是由 瓦林朋弘 于 2020-02-05 设计创作,主要内容包括:本发明提供一电路基板用半制品板材的制造方法、电路基板用半制品板材以及金属基体电路基板的制造方法,其即使在电路图案中存在浮岛形状部也能对应,即使在与大电流化对应的厚度的电路图案也能提高加工速度,也能提高对降低成本需求的对应,能在该状态下如电路图案那样精度良好地进行库存化。具备相对于材料板冲切具有电路用独立部(3a)的电路图案(3)的冲切工序(S1)和使被冲切的电路用独立部(3a)从其冲切位置返回并回收到落料(S)而成为平板状的电路基板用半制品板材(W1)的回收工序(S2),由于能使维持了电路图案的电路基板用半制品板材(W1)库存化,因此能原样如电路图案那样位置精度良好地库存化。(The invention provides a method for manufacturing a semi-finished plate material for a circuit board, a semi-finished plate material for a circuit board and a method for manufacturing a metal base circuit board, which can correspond to a circuit pattern even if a floating island shape part exists in the circuit pattern, can improve the processing speed even if the circuit pattern with the thickness corresponding to the large current increase, can also improve the correspondence to the requirement of reducing the cost, and can be stored in a stock with good precision like the circuit pattern in the state. The method comprises a punching step (S1) for punching a circuit pattern (3) having a circuit independent part (3a) from a material plate and a recovery step (S2) for returning the punched circuit independent part (3a) from the punching position and recovering the punched circuit independent part (3a) to a blank (S) to form a circuit board semi-product plate material (W1) in a flat plate shape, wherein the circuit board semi-product plate material (W1) maintaining the circuit pattern can be stocked, and thus the circuit board semi-product plate material can be stocked with excellent position accuracy as the circuit pattern.)
1. A method for manufacturing a semi-finished plate for a circuit board,
the disclosed device is provided with:
a die-cutting step of die-cutting a circuit pattern having a circuit independent portion on a material sheet; and
and a recovery step of returning the punched independent circuit part from the punching position to the blank to obtain a flat plate-like semi-finished circuit board material.
2. The method for manufacturing a semifinished sheet for circuit substrates according to claim 1,
the punching step is a half-punching step of punching the circuit pattern into a half-punched state,
in the recovery step, the circuit independent part punched in the half-punched state is returned from the punching position by horizontal pushing and recovered to the blank.
3. The method for manufacturing a semifinished sheet for circuit substrates according to claim 2,
the half-blanking process sets a negative clearance and a half-blanking press-in amount,
the recovery step is to cut the outer periphery of the circuit independent portion from the blank material or to partially integrate the circuit independent portion with the blank material by setting the press-in amount.
4. The method for manufacturing a semifinished sheet for circuit substrates according to claim 3,
in the recovery step, when the outer periphery of the circuit independent portion is cut off from the blank material, the circuit independent portion is still fitted in the cross-sectional shape of the blank material, and circumferential recesses are formed in both upper and lower surfaces of the circuit independent portion.
5. A method for manufacturing a semi-finished plate for a circuit board,
the disclosed device is provided with:
a punching step of punching a circuit pattern having a circuit independent portion on a material plate into a half-punched state; and
and a recovery step of recovering the blank material together with the semi-punched independent circuit part to form a semi-finished circuit board material.
6. A semi-finished plate material for a circuit board having independent circuit portions positioned in correspondence with the circuit patterns, characterized in that,
the circuit independent part is embedded with the blanking material and positioned in a flat plate shape.
7. The intermediate plate for a circuit substrate according to claim 6,
the outer periphery of the circuit independent part is separated from the blanking part or partially integrated with the blanking part.
8. The intermediate plate for a circuit substrate according to claim 7,
when the outer periphery of the circuit independent portion is cut off from the blank material, the blank material and the circuit independent portion have a cross-sectional shape in which the circuit independent portion is still fitted in the blank material, and the circuit independent portion has recesses in a circumferential shape on both upper and lower surfaces thereof.
9. A semi-finished plate material for a circuit board, which has independent circuit parts positioned in correspondence with circuit patterns, characterized in that,
the circuit independent part is positioned on the plate of the blanking material in a half punching state.
10. The semifinished sheet for circuit substrates according to any one of claims 6 to 9,
the thickness of the circuit pattern exceeds 0.5 mm.
11. A method for manufacturing a metal base circuit board using the semi-finished plate material for a circuit board according to any one of claims 6 to 10,
the circuit independent part is pushed out from the blank material and transferred to an insulating layer on a metal substrate to form a circuit pattern.
Technical Field
The present invention relates to a method for manufacturing a semi-finished plate material for a current substrate for a metal base circuit board having a circuit pattern on a flat-plate-shaped or heat-dissipating metal substrate with an insulating layer interposed therebetween, a semi-finished plate material for a circuit substrate, and a method for manufacturing a metal base circuit board.
Background
In recent years, demand for large current in power equipment has been increasing, and demand for cost reduction of semiconductors has also been increasing. That is, the demand for development of a metal base circuit board that can handle a large current at a low cost is increasing.
A conventional metal base circuit board includes a board described in
However, there is a problem that the circuit pattern is deviated when the circuit pattern is pressed.
In contrast to this problem, there is a method of forming the circuit pattern 103 of the metal base circuit board 100 shown in fig. 13 using the half-product 101 of fig. 14. The half product 101 of fig. 14 is formed by, for example, etching processing or the like. The semi-product 101 of the circuit pattern supports the circuit pattern 103 on a frame 107 via positioning pins 105.
Then, the semi-product 101 of the current pattern 103 is stuck to an uncured insulating layer applied to the metal substrate, and the insulating layer is cured by heat treatment performed simultaneously with the pressurization. Thereafter, block 107 is removed, etc.
Therefore, there is an advantage that the problem of the deviation of the circuit pattern 103 can be improved by the leg 105 and the frame 107 existing at the time of pressing.
However, since the circuit pattern 103A of the metal base circuit board 100A shown in fig. 15 has the floating island-shaped portion 109, there is a problem that the floating island-shaped portion 109 cannot be supported on the frame 107 by the legs 105 as in the case of the semi-finished product 101A shown in fig. 16.
In the case of such a conventional manufacturing method, the speed of etching processing or the like is reduced in a thick copper pattern corresponding to a demand for a large current exceeding 0.5mm, and the frame 107 and the leg 105 are unnecessary as the circuit pattern 103, so that there is a limit to cost reduction.
On the other hand, as a manufacturing method capable of suppressing the deviation of the pattern without using a frame, there is a method described in
The method comprises the steps of punching a metal strip into a half-punched state and forming a convex portion in the shape of a circuit conductor component, coating an insulating film on the convex portion, and separating the convex portion coated with the insulating film from the metal strip.
Therefore, if the convex portion in the shape of the circuit conductor member is formed at the position where the metal strip is punched into the half-punched state and has the desired circuit pattern, the convex portion to be the circuit conductor member is connected to other unnecessary portions in this state, and therefore the convex portion to be each circuit conductor member can be held at the desired position.
In this state, the insulating film is applied to the surface of the convex portion, and then the convex portion is separated from the metal strip, and the insulating film is applied to the other surface of the convex portion, whereby the circuit conductor member can be arranged on the insulating film as a circuit pattern.
However, when the circuit conductor member is stored as it is, the circuit conductor member cannot be stored with good positional accuracy as in the case of a circuit pattern due to deformation of the insulating film or the like, and therefore there is a limit to cost reduction.
Disclosure of Invention
The present invention aims to respond to a circuit pattern having a floating island shape, to increase the processing speed of a circuit pattern having a thickness corresponding to a large current, to meet a cost reduction demand, and to meet a cost reduction demand by accurately stocking the circuit pattern.
In order to achieve the above object, a method for manufacturing a circuit board blank according to the present invention includes a punching step of punching a circuit pattern having a circuit independent portion from a material sheet, and a recovering step of returning the punched circuit independent portion from a punching position thereof to a blank circuit board blank and forming the blank circuit board blank into a flat plate shape.
The method for manufacturing a circuit board blank according to the present invention includes a half-blanking step of blanking a circuit pattern having a circuit independent portion from a material sheet into a half-blanked state, and a recovery step of recovering the half-blanked circuit independent portion together with a blank material to produce a circuit board blank.
A circuit board blank has a circuit independent portion positioned in correspondence with a circuit pattern, and is in the form of a flat plate positioned with the circuit independent portion fitted into a blank material.
Further, the circuit board blank according to the present invention is a plate-like blank material in which the circuit independent portion is positioned in a half die-cut state.
The method for manufacturing a metal base circuit board according to the present invention includes a separation and transfer step of pushing out the circuit independent portion from a blank of the circuit board semi-product plate material, transferring the insulating layer on the metal board, and forming a circuit pattern.
The effects of the present invention are as follows.
According to the present invention, since the stock of the circuit board blank maintaining the positional accuracy of the circuit pattern can be made, the manufacturing flow in the die cutting process of the circuit pattern can be shortened without being affected by the continuous production line, the work rate in the continuous production line can be improved, and the demand for cost reduction can be met.
The stock management of the circuit substrate semi-finished plate material can be performed, and the stable production can be realized.
By pushing out the circuit pattern using the produced circuit board blank, the individual circuit portions can be transferred from the pushed-out positions to the insulating layer on the metal substrate, and the circuit pattern can be handled even if the floating island-shaped portions are present in the circuit pattern.
Even a thick circuit pattern corresponding to a demand for a large current can be processed at a high speed, and the cost can be reduced.
The deviation of the circuit pattern can be suppressed, and the short circuit of the current can be prevented.
Drawings
Fig. 1 is a schematic plan view of a metal base circuit board (embodiment one).
Fig. 2 is a schematic cross-sectional view of a metal base circuit board (embodiment one).
Fig. 3 is a schematic sectional view of a press machine (embodiment one).
Fig. 4 shows a process for producing a circuit board blank. Fig. 4(a) is a schematic cross-sectional explanatory view of a state in which a material plate to be a material is disposed on a press apparatus. Fig. 4(B) is a schematic cross-sectional explanatory view of the half-blanking step. FIG. 4(C) is a schematic sectional explanatory view of the recovery step. Fig. 4D is a schematic cross-sectional explanatory view of a circuit board blank taken out from a press apparatus (first embodiment).
Fig. 5 shows a main part of a manufacturing process of a circuit board blank. Fig. 5(a) is an explanatory view of the half blanking step. FIG. 5B is a diagram illustrating the recovery step (example I).
Fig. 6 shows a semi-finished plate for a circuit board. Fig. 6(a) is a plan view of a circuit board blank. Fig. 6B is a cross-sectional view of a half-product plate for a circuit board (embodiment i).
Fig. 7 is a schematic sectional explanatory view showing a manufacturing process of a circuit board blank, a separation and transfer process, and a heat bonding process.
Fig. 8 is a diagram illustrating a main part of a manufacturing process of a metal base circuit board, and is an explanatory view of a separation transfer process (first embodiment).
Fig. 9 is a plan view of a metal base circuit board having circuit patterns with different heights (example two).
Fig. 10 is a cross-sectional view of a metal base circuit board having circuit patterns with different heights (example two).
Fig. 11 shows a process for producing a circuit board blank. Fig. 11(a) is a schematic cross-sectional explanatory view of a state in which a material plate to be a material is disposed on a press apparatus. Fig. 11(B) is a schematic sectional explanatory view of the half-blanking step. FIG. 11C is a schematic sectional explanatory view of a recovery step (example III).
Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a cross-sectional view of a circuit board blank (example three).
Fig. 13 is a plan view of a metal base circuit board (conventional example).
Fig. 14 is a plan view of a metal base circuit board provided with a circuit pattern having no floating island-shaped portion (conventional example).
Fig. 15 is a plan view of a metal base circuit board provided with a circuit pattern having a floating island-shaped portion (conventional example).
Fig. 16 is a plan view of a circuit pattern showing a state in which the floating island-shaped portion cannot be supported on the frame.
1. 1A-metal base circuit board, 3A-circuit pattern, 3A, 3 b-circuit independent part, 5A-metal substrate, 7-insulating layer, S1-half die cutting process (die cutting process), S2-recovery process, S3-separation transfer process, S4-heat bonding process, S-blanking, W-copper plate material (material plate), W1-circuit board semi-product plate material.
Detailed Description
The following objects are achieved as follows: even if the circuit pattern has a floating island shape portion, the processing speed can be improved even if the circuit pattern is thick according to the requirement of large current, the cost can be reduced, and the position precision can be stored as the circuit pattern.
The method for manufacturing a circuit board blank according to the present embodiment includes a punching step of collectively punching a circuit pattern having a plurality of circuit independent portions with respect to a material plate by a vertical punching method in a cutting process, and a collecting step of returning the plurality of punched circuit independent portions from the punching positions thereof and collectively collecting the circuit pattern into a flat circuit board blank.
The punching step is a half-punching step of punching the circuit patterns collectively into a half-punched state, and the recovery step returns the plurality of circuit independent portions punched into the half-punched state from the punching positions thereof by flat pressing and recovers collectively into the blank.
The half-punching step sets a press-in amount of the half-punching, and the recovery step cuts or partially integrates the outer periphery of the independent circuit portion from or with the blank material by setting the press-in amount.
In the recovery step, when the outer periphery of the circuit independent portion is cut off from the blank material, the circuit independent portion is formed into a cross-sectional shape that remains fitted to the blank material, and recesses are formed in a circumferential shape on both upper and lower surfaces of the circuit independent portion.
The circuit board blank according to the present embodiment has a plurality of circuit independent portions positioned corresponding to circuit patterns, and is a flat plate in which the plurality of circuit independent portions are fitted into the blank material of the circuit board blank and positioned.
The periphery of the circuit independent part is separated from the blanking or partially integrated with the blanking.
The blank material and the space between the independent circuit portions are in a cross-sectional shape that is still fitted in the blank material when the outer periphery of the independent circuit portion is cut away from the blank material, and the independent circuit portion has recesses in a circumferential shape on both upper and lower surfaces of the independent circuit portion.
The method of manufacturing a metal base circuit board according to the present embodiment includes a separation and transfer step of pushing out the plurality of circuit independent portions from the blank material, collectively transferring the circuit independent portions to an insulating layer on a metal board, and forming a circuit pattern.
A method for manufacturing a circuit board blank according to another embodiment includes a half-blanking step of blanking a circuit pattern having an independent circuit portion from a material sheet into a half-blanked state, and a recovery step of recovering the independent circuit portion in the half-blanked state together with a blank material to obtain the circuit board blank.
The circuit board blank according to another embodiment is a circuit board blank having circuit independent portions positioned in correspondence with circuit patterns, and is a plate-like blank in which the circuit independent portions are positioned in a half die-cut state.
[ example one ]
[ Metal base Circuit Board ]
Fig. 1 is a schematic plan view of a metal base circuit board. Fig. 2 is a schematic cross-sectional view of a metal base circuit board using a flat-plate-shaped metal substrate.
The metal
The
The
The insulating
As the base resin of the insulating
The inorganic filler contained in the insulating
The filling ratio of the inorganic filler in the insulating
The insulating
As the insulating
The
The
The
The metal
[ production method ]
Fig. 3 is a schematic cross-sectional view of the press device. Fig. 4 shows a process for producing a circuit board blank. Fig. 4(a) is a schematic cross-sectional explanatory view of a state in which a material plate as a material is disposed in a press apparatus. Fig. 4(B) is a schematic cross-sectional explanatory view of the half-blanking step. FIG. 4(C) is a schematic sectional explanatory view of the recovery step. Fig. 4(D) is a schematic cross-sectional explanatory view of the circuit board blank before it is taken out of the press apparatus.
The method for manufacturing a semi-finished plate material for a circuit board according to the embodiment of the present invention includes a semi-blanking step S1 and a recovery step S2 as blanking steps.
The punching step is a step of punching the
In the embodiment, the punching process is a half-punching process S1 for punching the
The collecting step S2 is a step of returning the plurality of punched
In the embodiment, the collecting step S2 returns the plurality of circuit
(punching apparatus)
As shown in fig. 3, the press apparatus 9 includes an
The
The upper die 11 mounts a punch plate 17 on the upper die set 15.
The
The lower die set 24 is fixed to a substrate not shown. The lower die plate set 24 and the upper die plate set 15 are coupled by guide posts 28.
The
The ejector 27 is supported on the substrate side so as to be able to be lifted. The ejector 27 includes an
The ejector 27 has the upper ends of the ejector pins 27a flush with the upper surface of the
Before half blanking of the material sheet, the ejector 27 is supported on the substrate side by the
The substrate side is provided with a hydraulic device, an air pressure device, and the like for pushing up and driving the ejector 27 after half blanking of the material plate.
(half die cutting Process)
As shown in fig. 3 and 4, the half-blanking step S1 is a step of blanking the
As shown in fig. 4(a), a flat rectangular copper plate W is fed between the
A guide hole, which will be described later, is formed in advance in the copper plate W. The outer shape of the copper plate material W has positional accuracy with respect to the guide hole. Therefore, the positional relationship between the outer shape of the copper plate material W and the
As shown in fig. 4(B), in the half-blanking step S1, the
A part of the portion corresponding to the plurality of
(recovering step)
As shown in fig. 4(C), in the recovery step S2, after the half blanking of the copper plate material W, the ejector 27 is pushed out toward the
The portions corresponding to the plurality of circuit
Thereafter, as shown in fig. 4(D), the
The horizontal pushing after the half blanking of the copper plate material W can be performed by another pressing apparatus including upper and lower dies for performing the pressing in a flat plane.
(Main part of half-punching step and recovery step)
Fig. 5 shows a main part of a manufacturing process of a circuit board blank. Fig. 5(a) is an explanatory view of the half blanking step. FIG. 5(B) is an explanatory view of the recovery step.
In fig. 5(a), the
In the half-blanking step S1, the
As shown in fig. 5(B), in the recovery step S2, when the plurality of
In fig. 5(B), the outer periphery of the
In the case where the thickness of the
In this case, a cross-sectional shape for maintaining the fitting of the circuit
The setting of whether or not to separate the
The cross-sectional shape in the case of cutting off is, for example, a radially uneven shape obtained by an up-down punching method. The cross-sectional shape can be controlled by the depth of the half blanking process, and the engagement of the circuit
(semi-finished sheet for Circuit Board)
Fig. 6 shows a semi-finished plate for a circuit board. Fig. 6(a) is a plan view of a circuit board blank. Fig. 6(B) is a sectional view of the intermediate plate for circuit board.
As shown in fig. 6, the circuit board blank W1 has a plurality of circuit
That is, the portions corresponding to the plurality of circuit
The outer periphery of the circuit
The cut material S and the
(separation transfer step and Heat-bonding step)
Fig. 7 is a schematic sectional explanatory view showing a manufacturing process of a circuit board blank, a separation and transfer process, and a heat bonding process.
As shown in the left side of fig. 7, in the separation transfer step S3, the plurality of
The
The pushing out by the
The
In the separation and transfer step S3, the circuit board blank W1 is carried in from the Y direction by a carrying jig, for example. By this carrying in, the guide holes n of the blank S are fitted to the guide holes (not shown) of the
On the lower side of the
At this position, the
At this time, by setting the gap between the
In order to prevent the transferred
As shown in the right part of fig. 7, in the heat bonding step S4, heat treatment is performed. In this heating step, as described above, the
The
(main part of separation transfer step)
Fig. 8 is a diagram illustrating a main part of a manufacturing process of the metal base circuit board, and is an explanatory view of a separation transfer process.
When the circuit
The circuit
[ Effect of the example ]
According to the embodiment of the present invention, the half blanking step S1 of collectively blanking the
Therefore, the circuit board blank W1 for circuit boards that maintains the
The
Even if the
The half blanking step S1 sets the press-in amount of the half blanking, and the recovery step S2 separates the outer periphery of the
Therefore, the following selection can be made: in the case of the
In the collecting step S2, when the outer periphery of the
The cross-sectional shape is a combination of a shape in which the punched hole formed on the side of the material drop S slightly protrudes toward the inner peripheral side at the middle portion of the thickness and a shape in which the peripheral-shaped recesses are formed at the corners of the upper and lower surfaces of the
The setting of whether or not to separate the
The cross-sectional shape in the case of cutting off is, for example, a radially uneven shape obtained by an up-down punching method. The cross-sectional shape can be controlled by the depth of the half blanking process, and the cross-sectional shape is set to maintain the engagement of the
Therefore, even when the outer periphery of the
The circuit board blank W1 has a plurality of circuit
Therefore, when the circuit board blank W1 is stocked, the scrap can be managed, and the management can be performed efficiently. Further, since the integrated plate shape is used, handling at the time of carrying in and carrying out is also easy.
The outer periphery of the circuit
Therefore, the following semi-finished sheet material W1 for circuit boards can be selected: for example, in the case of the
When the outer periphery of the
The cross-sectional shape is a combination of a shape in which the punched hole formed on the side of the material drop S slightly protrudes toward the inner peripheral side at the middle portion of the thickness and a shape in which the peripheral-shaped recesses are formed at the corners of the upper and lower surfaces of the
The setting of whether or not to separate the
The cross-sectional shape in the case of cutting off is, for example, a radially uneven shape obtained by an up-down punching method. The cross-sectional shape can be controlled by the depth of the half blanking process, and the cross-sectional shape is set to maintain the engagement of the
Therefore, even when the outer periphery of the
The method of manufacturing a metal base circuit board according to the present embodiment includes a separation and transfer step S3 of pushing out the plurality of circuit
Therefore, the
[ example two ]
Fig. 9 to 10 show a second embodiment of the present invention. Fig. 9 is a plan view of a metal base circuit board having circuit patterns with different heights. Fig. 10 is a cross-sectional view of a metal base circuit board having circuit patterns with different heights.
The second embodiment relates to a method for manufacturing a metal base circuit board having a circuit pattern including circuit independent portions having different heights.
The height of the circuit
In this case, the circuit board blank is formed into two types of circuit
In manufacturing the metal
Therefore, the same operation and effect as those of the first embodiment can be obtained also in the second embodiment.
Further, a plurality of
In a method for manufacturing a metal base circuit board using a plurality of types of circuit board semi-finished plate materials, even a circuit independent part with uniform height can be applied to the change of the pattern of a floating island shape part and the like.
[ third example ]
Fig. 11 and 12 show a third embodiment of the present invention. Fig. 11 shows a process for producing a circuit board blank. Fig. 11(a) is a schematic cross-sectional explanatory view of a state in which a material plate as a material is disposed on a press apparatus. Fig. 11(B) is a schematic sectional explanatory view of the half-blanking step. Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a sectional view of the circuit board blank.
In the third embodiment, the circuit board blank is formed in a plate shape in which the circuit
(half die cutting Process)
In the case of using the press apparatus of fig. 3 in common, as shown in fig. 3 and 11, in the half-blanking step S1 of the third embodiment, the
As shown in fig. 11(a), a flat rectangular copper plate W is fed between the
Guide holes, which will be described later, are formed in the copper plate W in the same manner as in the first embodiment.
As shown in fig. 11(B), in the half-blanking step S1, the
A part of the portion corresponding to the plurality of
(recovering step)
As shown in fig. 11(C), in the recovery step S2, after half blanking of the copper plate W, the
The plate-like circuit board blank W1 can be carried out by the above-described pushing out in the recovery step S2. The circuit board blank W1 has the
Thereafter, the circuit board blank W1 is taken out by the conveying jig, so that the circuit board blank W1 can be cut and stored from the continuous line in which the metal
(semi-finished sheet for Circuit Board)
Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a sectional view of the circuit board blank.
As shown in fig. 12, the circuit board blank W1 is a plate-like blank S in which a plurality of circuit
That is, the portions corresponding to the plurality of
The circuit board blank W1 is in a state where the outer periphery of the circuit
(separation transfer step and Heat-bonding step)
The separation transfer step S3 is performed in the same manner as in the left drawing of fig. 7. In the separation and transfer step S3, the circuit board blank W1 of fig. 12 is used to push out the plurality of circuit
The pushing out by the
In the separation and transfer step S3, the circuit board blank W1 is carried in, for example, from the Y direction by the carrying jig in the same manner as in the first embodiment, and the circuit board blank W1 is positioned with respect to the
As in the first embodiment, the
At this time, by setting the gap between the
In the heat bonding step S4, the heat treatment is performed in the same manner as in the first embodiment, as in the right part of fig. 7.
Even in the third embodiment, the relative position of each circuit
(main part of separation transfer step)
The semi-finished circuit board material W1 according to the third embodiment receives a force of pushing the
Even in the
Therefore, in the third embodiment, the same operational effects as those of the method for manufacturing the circuit board blank, and the method for manufacturing the metal base circuit board of the first embodiment can be obtained. In addition, in the third embodiment, since the flat pushing in the recovering step S2 can be omitted, the semi-finished plate material W1 for circuit board can be manufactured more easily by shortening the pressing step and simplifying the cleaning step.
The half-product sheet material W1 for a circuit board having the height of the third embodiment can be applied to the method for manufacturing a metal base circuit board of the second embodiment.