阅读说明：本技术 一种真空溅射镀膜机及其吸灰方法 (Vacuum sputtering coating machine and dust absorption method thereof ) 是由 陆张武 於霄峰 徐勇军 李恭剑 于 2020-06-05 设计创作，主要内容包括：一种真空溅射镀膜机及其吸灰方法,属于镀膜技术领域。真空溅射镀膜机包括镀膜腔室PR-CH、搬送腔室LL-CH、开门阀；LL-CH和PR-CH处均设有吸灰基板,或者PR-CH设有吸灰基板；吸灰基板面朝腔室内侧面设有粘灰层。当两个腔室均设有吸灰基板时；方法包括：将LL-CH抽气至小于压强阈值；对PR-CH进行充气净化,使得PR-CH内污染物吸附在吸灰基板上；在LL-CH完成抽气和放气后,停止对LL-CH抽气,打开开门阀,对连通的LL-CH和PR-CH抽气一段时间并关闭开门阀；对LL-CH进行充气净化,使得LL-CH内污染物吸附在吸灰基板上。当镀膜腔室设有吸灰基板时,方法包括对PR-CH进行充气净化,使得PR-CH内污染物吸附在吸灰基板上。本发明在不开箱清洁的条件下,对腔体内部进行吸灰,吸灰完成后产品表面质量得到提高。(A vacuum sputtering coating machine and an ash absorption method thereof belong to the technical field of coating. The vacuum sputtering coating machine comprises a coating chamber PR-CH, a conveying chamber LL-CH and a door opening valve; dust absorption base plates are arranged at the LL-CH and the PR-CH, or the PR-CH is provided with a dust absorption base plate; an ash sticking layer is arranged on the inner side surface of the ash absorption substrate facing the cavity. When the two chambers are provided with the dust absorption substrates; the method comprises the following steps: pumping the LL-CH to be smaller than the pressure threshold value; aerating and purifying the PR-CH to enable pollutants in the PR-CH to be adsorbed on the ash absorption substrate; after the LL-CH finishes air suction and air discharge, stopping air suction on the LL-CH, opening a door opening valve, sucking air on the communicated LL-CH and PR-CH for a period of time, and closing the door opening valve; and (4) aerating and purifying the LL-CH to enable pollutants in the LL-CH to be adsorbed on the ash absorption substrate. When the coating chamber is provided with the dust absorption substrate, the method comprises the step of inflating and purifying the PR-CH, so that pollutants in the PR-CH are adsorbed on the dust absorption substrate. According to the invention, the interior of the cavity is sucked without opening the box for cleaning, and the surface quality of the product is improved after the dust suction is finished.)

1. A vacuum sputtering coating machine is characterized by comprising a coating chamber, a conveying chamber and a gate valve, wherein the gate valve is used for controlling the communication or isolation of the coating chamber and the conveying chamber; dust-absorbing substrates are arranged at the coating chamber and the conveying chamber, or the coating chamber is provided with the dust-absorbing substrates; and an ash sticking layer is arranged on the inner side surface of the ash absorption substrate facing the cavity.

2. The vacuum sputter coating machine according to claim 1, wherein a plurality of ash-absorbing substrates are provided, the plurality of ash-absorbing substrates are circumferentially arranged around the coating chamber, and the plurality of ash-absorbing substrates are circumferentially arranged around the transfer chamber; or the plurality of dust-absorbing substrates are arranged in the coating cavity in a surrounding manner along the circumferential direction.

3. The vacuum sputter coating machine of claim 1 wherein said adhesion layer is a tape layer.

4. A method for absorbing dust of a vacuum sputter coating machine, which is characterized by being realized by the vacuum sputter coating machine as claimed in claim 1; dust absorption substrates are arranged at the coating chamber and the conveying chamber; the method comprises the following steps:

step S01, pumping the conveying chamber to be smaller than the pressure threshold value;

step S02, inflating and purifying the coating chamber to make pollutants in the coating chamber adsorbed on the dust absorption substrate;

step S03, stopping air suction to the conveying chamber after the conveying chamber finishes air suction and air discharge for at most five times, opening a door opening valve, sucking air to the communicated conveying chamber and a film coating chamber for a period of time, and closing the door opening valve; step S04, the transfer chamber is aerated and purified, so that the contaminants in the transfer chamber are adsorbed on the ash absorption substrate.

5. The dust suction method of the vacuum sputter coating machine according to claim 4, wherein the step S02 comprises: filling inert gas or nitrogen near the target material and ICP of the coating chamber, and exhausting the coating chamber; the coating chamber is circularly purified by the reciprocating way.

6. The method of claim 4, wherein the evacuation and the degassing of the transfer chamber in step S03 are performed at most five times simultaneously with step S02.

7. The dust suction method of the vacuum sputter coating machine according to claim 4, wherein the step S04 comprises: filling inert gas or nitrogen into the conveying chamber, and exhausting the conveying chamber; this operation is repeated to cyclically purge the transfer chamber.

8. A method for absorbing dust of a vacuum sputter coating machine, which is characterized by being realized by the vacuum sputter coating machine as claimed in claim 1; a dust absorption substrate is arranged at the coating cavity; the method comprises the following steps: and aerating and purifying the coating cavity, so that pollutants in the coating cavity are adsorbed on the dust absorption substrate.

9. The method of claim 8, further comprising the step of cleaning the transfer chamber by opening the box.

10. The method of claim 9, wherein the step of cleaning the transfer chamber by opening the box is performed simultaneously with the step of cleaning the coating chamber by inflating the coating chamber.

Technical Field

The invention belongs to the technical field of coating, and particularly relates to a vacuum sputtering coating machine and an ash absorption method thereof.

Background

After the vacuum sputtering coating machine carries out sputtering coating for a long time, the cavity is seriously polluted, and dense particles are suspended in the cavity after the phenomena of film collapse and fragmentation occur. The prior method comprises the following steps: and (4) removing the pollution guard plate after opening the box, polishing the cavity, sucking dust by a dust collector, installing a new guard plate, vacuumizing, washing the target and coating. After the existing process finds that the surface quality of a coated product is poor, the surface quality of the product is improved by opening the box for cleaning, but the time from opening the box to coating the next time is longer, and the efficiency of equipment is reduced.

The invention patent application CN201510391872.X discloses a method for cleaning an ITO thin film sputtering target material, and particularly discloses a method comprising the following steps: (1) firstly, sucking large particles by a dust collector; (2) polishing the sputtering surface of the target by using abrasive paper with a corresponding mesh number, wherein the polishing direction conforms to the direction of a runway formed on the sputtering surface of the target, and removing oxides and impurities on the sputtering surface; (3) a dust collector is adopted to absorb and remove particles and dust generated by sanding the sand paper on the sputtering surface of the target material; (4) dipping a small amount of alcohol by using a dust-free cloth to wipe and clean the sputtering surface of the target material, and removing dust which is not completely absorbed; (5) and (5) repeating the step (4) until the surface of the dust-free cloth has slight color change. The method needs box opening operation, and each cleaning process is long, so that the film coating efficiency of the equipment is influenced.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides the vacuum sputtering coating machine and the dust suction method thereof for sucking dust in the cavity under the condition of not opening the box for cleaning, so that the cleaning is convenient and fast, and the productivity of equipment is improved.

The invention is realized by the following technical scheme:

the invention relates to a vacuum sputtering coating machine, which comprises a coating chamber, a conveying chamber and a gate valve, wherein the gate valve is used for controlling the communication or isolation of the coating chamber and the conveying chamber; dust-absorbing substrates are arranged at the coating chamber and the conveying chamber, or the coating chamber is provided with the dust-absorbing substrates; and an ash sticking layer is arranged on the inner side surface of the ash absorption substrate facing the cavity.

The manual unpacking cleaning treatment is not needed, and the gas flow is realized through the rotation of the revolution plate, the air release of each target material air pipe, the pressure drop difference of the cavity and other performances based on the working characteristics of the vacuum sputtering film plating machine under the condition of not unpacking cleaning, so that the dirt in the cavity is adsorbed on the sticky layer. One embodiment comprises arranging the dust absorption base plates in the two chambers, so that dust absorption cleaning can be carried out on the two chambers, cleaning work can be carried out simultaneously, or the cleaning work can be carried out successively according to needs. Another embodiment includes disposing the ash absorption substrate in one chamber, and mainly considering disposing the ash absorption substrate at the coating chamber, the ash absorption substrate is not needed for the transfer chamber, and the ash absorption substrate can be cleaned by the conventional cleaning method. In addition, the dust absorption substrate can be arranged at the conveying chamber for cleaning, and the dust absorption substrate is mainly concentrated in the coating chamber, so that the dust absorption substrate is not necessary to be arranged at the conveying chamber, and if necessary, a person skilled in the art can think of arranging the dust absorption substrate at the conveying chamber based on the disclosure of the invention.

Preferably, the dust absorption substrates are arranged in a plurality and surround the film coating chamber along the circumferential direction, and the dust absorption substrates surround the conveying chamber along the circumferential direction; or the plurality of dust-absorbing substrates are arranged in the coating cavity in a surrounding manner along the circumferential direction.

Preferably, the adhesive layer is an adhesive tape layer.

The invention also provides a dust absorption method of the vacuum sputtering coating machine, which is realized by adopting the vacuum sputtering coating machine; dust absorption substrates are arranged at the coating chamber and the conveying chamber; the method comprises the following steps:

step S01, pumping the conveying chamber to be smaller than the pressure threshold value;

step S02, inflating and purifying the coating chamber to make pollutants in the coating chamber adsorbed on the dust absorption substrate;

step S03, stopping air suction to the conveying chamber after the conveying chamber finishes air suction and air discharge for at most five times, opening a door opening valve, sucking air to the communicated conveying chamber and a film coating chamber for a period of time, and closing the door opening valve;

step S04, the transfer chamber is aerated and purified, so that the contaminants in the transfer chamber are adsorbed on the ash absorption substrate.

The method achieves the effect of adsorbing suspended particles through dust absorption treatment, so as to ensure that the surface quality of the subsequent film-forming coated sheet reaches the standard, reduce the times of opening the box and cleaning the machine and improve the productivity.

Preferably, step S01 specifically includes: the transfer chamber is evacuated to less than 10 pa.

Preferably, step S02 includes: filling inert gas or nitrogen near the target material and ICP of the coating chamber, and exhausting the coating chamber; the coating chamber is circularly purified by the reciprocating way.

Preferably, the evacuation and the gas release of the transfer chamber in step S03 are completed at most five times, and are performed simultaneously with step S02.

Preferably, the step of exhausting and deflating the transfer chamber is performed at most five times by: the conveying chamber is deflated, and then the conveying chamber is evacuated to be less than 10 pa.

Preferably, step S03 includes: and stopping pumping the conveying chamber, opening the door opening valve, pumping the communicated conveying chamber and the film coating chamber for at most 20 minutes by using the TMP of the film coating chamber, and closing the door opening valve.

Preferably, step S04 includes: filling inert gas or nitrogen into the conveying chamber, and exhausting the coating chamber; this operation is repeated to cyclically purge the transfer chamber.

The invention also provides a dust absorption method of the vacuum sputtering coating machine, which is realized by adopting the vacuum sputtering coating machine; the coating cavity is provided with a dust absorption substrate; the method comprises the following steps: and aerating and purifying the coating cavity, so that pollutants in the coating cavity are adsorbed on the dust absorption substrate.

The method achieves the effect of adsorbing suspended particles through dust absorption treatment, so as to ensure that the surface quality of the subsequent film-forming coated sheet reaches the standard, reduce the times of opening the box and cleaning the machine and improve the productivity.

Preferably, the method further comprises performing an open box cleaning of the transfer chamber.

Preferably, the step of opening the box and cleaning the conveying chamber and the step of inflating and purifying the coating chamber are carried out simultaneously.

Preferably, the step of inflating and purifying the coating chamber to make the pollutants in the coating chamber adsorbed on the dust-absorbing substrate specifically comprises: filling inert gas or nitrogen near the target material and ICP of the coating chamber, and exhausting the coating chamber; the coating chamber is circularly purified by the reciprocating way.

The invention has the following beneficial effects:

the invention relates to a vacuum sputtering film coating machine and an ash absorption method thereof.A film in a cavity is cut and blown away by a gas charging and discharging mode, and the blown film is cut and adsorbed on an ash absorption substrate with an ash adhesion layer by using the rotation of a turntable; through different vacuum differences of the two chambers, dust near the LL-CH and the PR-CH is pressed into the opposite rotary disc, so that the cleaning effect of the double chambers is achieved.

Drawings

FIG. 1 is a general flow chart of the dust suction method of a vacuum sputtering coating machine according to the present invention;

FIG. 2 is a flow chart of an embodiment of the dust absorption method of the vacuum sputter coating machine of the present invention.

FIG. 3 is a general flow chart of the dust suction method of the vacuum sputter coating machine according to the present invention;

FIG. 4 is a flow chart of an embodiment of the dust absorption method of the vacuum sputter coating machine of the present invention.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

The vacuum sputter coater generally has a coating chamber (PR-CH), a transfer chamber (LL-CH), and a gate opening valve (DV 21). When the opening door valve is closed, the two chambers are kept independent; when the door is opened, the two chambers are communicated. The two chambers are respectively independent exhaust systems, the conveying chamber (LL-CH) is a low vacuum chamber, and RP and MBP pump sets are adopted to mainly provide required vacuum requirements for substrate exchange. The coating chamber (PR-CH) is a high vacuum chamber, adopts RP, MBP and TMP pump sets and is mainly used for meeting the vacuum requirement required by the product in the process production.

The vacuum sputtering coating machine adopts a magnetron ion sputtering mode to deposit target atoms on a substrate to realize film growth, and then the film is designed through ICP auxiliary reaction. For example, vacuum sputter coaters employ 3 sets of rotating targets as sputtering sources. The ICP mainly comprises a radio frequency power supply, a matcher, a coupling coil, a gas introduction system and the like, wherein the radio frequency power supply outputs high-frequency current which is coupled through the radio frequency coil to ionize process gas introduced into a cavity, so that the effects of cleaning a substrate and assisting the growth of a film by Plasma are realized.