Preparation method and equipment of LED chip

文档序号:128882 发布日期:2021-10-22 浏览:42次 中文

阅读说明:本技术 一种led芯片的制备方法及设备 (Preparation method and equipment of LED chip ) 是由 陈炳寺 戴磊 于 2021-09-15 设计创作,主要内容包括:本发明涉及LED照明灯具技术领域,公开了一种LED芯片的制备方法及设备,所述的LED芯片的制备设备包括:支撑框架,设置有两个,支撑框架上开设有带槽,带槽的内部滑动设置有滑动带,支撑框架的端部设置有驱动件。安装板,安装板的两端固定连接有连接杆。支撑框架的内端设置有滑轨,滑轨上滑动设置有控向齿轮,控向齿轮的相对面开设有升降槽,连接杆的端部固定连接有升降块,升降块滑动嵌套在升降槽的内部。两个支撑框架之间依次固定设置有第一蒸镀机、快速退火炉和第二蒸镀机,且第一蒸镀机、快速退火炉、第二蒸镀机处于第一翻向齿条和第二翻向齿条之间;支撑框架上固定连接有支撑条,支撑条处于支撑框架的相对端,支撑条的上部开设有若干下沉槽。(The invention relates to the technical field of LED lighting lamps and lanterns, and discloses a preparation method and equipment of an LED chip, wherein the preparation equipment of the LED chip comprises the following steps: braced frame is provided with two, has seted up the trough of belt on the braced frame, and the inside slip of trough of belt is provided with the slip area, and braced frame's tip is provided with the driving piece. The mounting panel, the both ends fixedly connected with connecting rod of mounting panel. The inner of braced frame is provided with the slide rail, and the slip is provided with accuse to the gear on the slide rail, and the lift groove has been seted up to the opposite face of accuse to the gear, and the tip fixedly connected with elevator of connecting rod, elevator slip nestification are in the inside in lift groove. A first evaporator, a rapid annealing furnace and a second evaporator are sequentially and fixedly arranged between the two supporting frames, and the first evaporator, the rapid annealing furnace and the second evaporator are positioned between the first turning rack and the second turning rack; the supporting frame is fixedly connected with supporting bars, the supporting bars are located at opposite ends of the supporting frame, and the upper portions of the supporting bars are provided with a plurality of sinking grooves.)

1. The preparation equipment of the LED chip is characterized by comprising the following steps:

the two support frames are oppositely arranged and fixedly connected, a belt groove is formed in each support frame, a sliding belt is arranged in each belt groove in a sliding mode, and a driving piece is arranged at the end of each support frame and used for driving the sliding belt to rotate;

the mounting plate is used for placing and fixing the sapphire substrate, and two ends of the mounting plate are fixedly connected with connecting rods;

the inner end of the supporting frame is provided with a sliding rail, the shape of the sliding rail corresponds to that of the sliding belt, direction control gears are arranged on the sliding rail in a sliding mode, lifting grooves are formed in the opposite surfaces of the two direction control gears, the end portion of the connecting rod is fixedly connected with a lifting block, and the lifting block is nested in the lifting grooves in a sliding mode;

the direction control gear comprises a circular tooth part and a smooth part, the circular tooth part and the smooth part are arranged at intervals, the two smooth parts are arranged in parallel, a lifting groove is perpendicular to the smooth part, the lifting groove comprises a rotating end and a sinking end, the rotating end is positioned at the center of the direction control gear, a first turning rack and a second turning rack are arranged at two ends of the upper part of the sliding rail, a guide rod is coaxially and fixedly connected with the non-opposite surface of the direction control gear, and the guide rod is rotatably nested in the sliding belt;

a first evaporator, a rapid annealing furnace and a second evaporator are sequentially and fixedly arranged between the two supporting frames, and the first evaporator, the rapid annealing furnace and the second evaporator are positioned between the first turning rack and the second turning rack; the support frame is fixedly connected with support bars, the support bars are positioned on the opposite end surfaces of the support frame, the upper parts of the support bars are provided with a plurality of sinking grooves, and the positions of the sinking grooves correspond to the positions of the first evaporation machine, the rapid annealing furnace and the second evaporation machine one by one;

the sensor assembly is arranged on the supporting frame and used for sensing the position of the mounting plate and generating a stop signal and an operation signal;

the controller is used for receiving the stop signal and the operation signal, controlling the driving piece to stop operating so that the mounting plate sequentially enters the first evaporation plating machine, the rapid annealing furnace and the second evaporation plating machine, controlling the first evaporation plating machine, the rapid annealing furnace and the second evaporation plating machine to operate, ensuring the completion of the operation through signal delay and enabling the driving piece to operate so as to complete the station conversion of the mounting plate.

2. The apparatus of claim 1, wherein the support frame has a guide slot, the guide slot is aligned with a sliding track of the sliding belt, and an end of the guide rod extends into the guide slot.

3. The apparatus for preparing LED chip as claimed in claim 2, wherein the end of the guiding rod is rotatably disposed with a second roller, and the second roller is rotatably nested inside the guiding groove.

4. The apparatus of claim 1, wherein the connecting rod is rotatably provided with a first roller, and the first roller is overlapped on the supporting bar.

5. The apparatus of claim 1, wherein at least one fixing rod is fixedly disposed inside the lifting groove, the lifting block is slidably nested on the fixing rod, and the fixing rod guides the sliding of the lifting block.

6. The apparatus of claim 1, wherein the smooth portion has a rolling structure, and the slide rail has a guiding structure.

7. The apparatus of claim 1, wherein coolers are disposed at the rear side of the flow direction of the first evaporator, the rapid annealing furnace and the second evaporator, and the sapphire substrate is cooled by the cold air flow generated by the coolers, and the cooling capacity of each cooler is set according to the cooling requirement so that the cooling time is the same.

8. The apparatus of claim 1, wherein a lift assist structure is disposed between the slide belt and the support frame.

9. The apparatus of claim 8, wherein the auxiliary lifting structure comprises a rotation shaft, a force-bearing block, a lifting bar and a toggle block, the toggle block is fixedly connected to the rotation inner ring of the sliding belt, the toggle block is located on the flow direction side of the steering gear, the rotation shaft is rotatably arranged inside the support frame, the rotation shaft is located on the flow side of the sunken groove, one end of the rotation shaft is radially and fixedly connected with the force-bearing blocks, the other end of the rotation shaft is radially and fixedly connected with the lifting bar, and the lifting bar and the force-bearing blocks are in one-to-one correspondence.

10. A method for manufacturing an LED chip, applied to the apparatus for manufacturing an LED chip according to any one of claims 1 to 9, the method comprising the steps of:

mounting the sapphire substrate on a mounting plate;

the mounting plate is driven to slide through the sliding belt, the direction control gear at the end part of the mounting plate is in contact with the first turning rack, the circular tooth part on the direction control gear is meshed with the first turning rack, and the direction control gear rotates 180 degrees to enable the sapphire substrate to face downwards;

the sliding belt drives the mounting plate to slide above the first evaporation machine, the sensor assembly senses the position of the mounting plate, a stop signal and an operation signal are generated and transmitted to the controller, and the controller controls the sliding belt to stop;

the connecting rod at the end part of the mounting plate enters the sinking groove, so that the lifting block at the end part of the mounting plate enters the sinking end from the rotating end of the lifting groove and the mounting plate descends to cover the first evaporation machine;

the sapphire substrate enters the first evaporation machine, and the controller receives the operation signal and then controls the first evaporation machine to evaporate a silver film on the sapphire substrate;

the sliding belt slides to pull the mounting plate to move, so that the connecting rod slides out of the sinking groove, and the lifting block slides to the rotating end to lift the mounting plate;

the sapphire substrate slides out of the first evaporation machine to be cooled and then sequentially enters a rapid annealing furnace and a second evaporation machine to be annealed and evaporated;

the sliding belt drives the mounting plate to slide so that the circular tooth part on the direction control gear is meshed with the second turning rack and drives the direction control gear to rotate 180 degrees, and the LED chip faces upwards.

Technical Field

The invention relates to the technical field of LED lighting lamps, in particular to a preparation method and equipment of an LED chip.

Background

With the development of science and technology and the progress of society, people enter the electronic era, meanwhile, the dependence of people on energy is increased, and with the exploitation of energy, the earth faces the tension of energy. Due to the global threat of energy shortage and global environment huge change caused by over development, a light source with a new energy-saving and carbon-saving concept becomes one of the most important research subjects for lighting in the twenty-first century. People need to open sources, throttle, develop new energy and save resources to solve the energy problem. Light emitting diodes are representative of the most promising green illumination sources; the light emitting diode has the advantages of small volume, low heat productivity, low power consumption, long service life, high reaction speed, environmental protection, high brightness and the like. The existing LED processing is all processing at each station, and continuous processing cannot be realized, so that the processing efficiency is low.

Disclosure of Invention

In order to solve the above technical problem, the present invention provides an apparatus for manufacturing an LED chip, comprising:

the two support frames are oppositely arranged and fixedly connected, a belt groove is formed in each support frame, a sliding belt is arranged in each belt groove in a sliding mode, a driving piece is arranged at the end of each support frame, and the driving pieces drive the sliding belts to rotate;

the mounting plate is used for placing and fixing the sapphire substrate, and two ends of the mounting plate are fixedly connected with connecting rods;

the inner end of the supporting frame is provided with a sliding rail, the shape of the sliding rail corresponds to that of the sliding belt, a direction control gear is arranged on the sliding rail in a sliding mode, a lifting groove is formed in the opposite surface of the direction control gear, the end portion of the connecting rod is fixedly connected with a lifting block, and the lifting block is nested in the lifting groove in a sliding mode;

the direction control gear comprises a circular tooth part and a smooth part, the circular tooth part and the smooth part are arranged at intervals, the two smooth parts are arranged in parallel, a lifting groove is perpendicular to the smooth part, the lifting groove comprises a rotating end and a sinking end, the rotating end is positioned at the center of the direction control gear, a first turning rack and a second turning rack are arranged at two ends of the upper part of the sliding rail, a guide rod is coaxially and fixedly connected with the non-opposite surface of the direction control gear, and the guide rod is rotatably nested in the sliding belt;

a first evaporator, a rapid annealing furnace and a second evaporator are sequentially and fixedly arranged between the two supporting frames, and the first evaporator, the rapid annealing furnace and the second evaporator are positioned between the first turning rack and the second turning rack; the supporting frame is fixedly connected with supporting strips, the supporting strips are positioned at the opposite ends of the supporting frame, the upper parts of the supporting strips are provided with a plurality of sinking grooves, and the number and the positions of the sinking grooves correspond to the first evaporation machine, the rapid annealing furnace and the second evaporation machine one by one;

the sensor assembly is arranged on the supporting frame and used for sensing the position of the mounting plate and generating a stop signal and an operation signal;

and the controller is used for receiving the stop signal and the operation signal, controlling the driving piece to stop operating to enable the mounting plate to enter the first evaporation machine, the rapid annealing furnace and the second evaporation machine, controlling the first evaporation machine, the rapid annealing furnace and the second evaporation machine to operate, ensuring the processing completion through signal delay and enabling the driving piece to operate to complete the station conversion of the mounting plate.

Preferably: a guide groove is formed in the supporting frame, the guide groove is consistent with the sliding track of the sliding belt, and the end portion of the guide rod extends into the guide groove.

Preferably: the end part of the guide rod is rotatably provided with a second roller wheel, and the second roller wheel is rotatably nested in the guide groove.

Preferably: the connecting rod is rotatably provided with a first roller, and the first roller is arranged on the supporting bar in a lapping mode.

Preferably: at least one fixed rod is fixedly arranged in the lifting groove, the lifting block is slidably nested on the fixed rod, and the fixed rod guides the sliding of the lifting block.

Preferably: the smooth part surface is provided with a rolling structure, and the slide rail is provided with a guide structure.

Preferably: the flowing rear side of the first evaporation machine, the rapid annealing furnace and the second evaporation machine is provided with a cooler, cold air flow generated by the cooler cools the sapphire substrate, and the cooling capacity of each cooler is designed according to actual requirements, so that the cooling time of each cooler is the same.

Preferably: and a lifting auxiliary structure is arranged between the sliding belt and the supporting frame.

Preferably: the lifting auxiliary structure comprises a rotating shaft, stress blocks, lifting strips and a shifting block, wherein the shifting block is fixedly connected to a rotating inner ring of a sliding belt, the shifting block is located on the side of the flowing direction of the steering gear, the rotating shaft is arranged in the supporting frame in a rotating mode, the rotating shaft is located on the flowing side of the sinking groove, one end of the rotating shaft is radially and fixedly connected with the stress blocks, the other end of the rotating shaft is radially and fixedly connected with the lifting strips, and the lifting strips correspond to the stress blocks in a position-to-position mode.

The invention also provides a preparation method of the LED chip, which is applied to the preparation equipment of the LED chip, and the preparation method of the LED chip comprises the following steps:

mounting the sapphire substrate on a placing surface of the mounting plate;

the mounting plate is driven to slide through the sliding belt, the direction control gear at the end part of the mounting plate slides to be in contact with the first turning rack, a circular tooth part on the direction control gear is meshed with the first turning rack and drives the direction control gear to rotate 180 degrees, and the sapphire substrate faces downwards;

the sliding belt drives the mounting plate to slide above the first evaporation machine, and the sensor assembly senses the position of the mounting plate, generates a stop signal and an operation signal and transmits the stop signal and the operation signal to the controller;

the controller controls the sliding belt to stop and to enter the sinking groove through the end part of the mounting plate, so that the lifting block at the end part of the mounting plate enters the sinking end from the rotating end of the lifting groove arranged on the direction control gear and the mounting plate covers the first evaporation machine;

the sapphire substrate enters the first evaporation machine, and the controller receives the operation signal and then controls the first evaporation machine to evaporate a silver film on the sapphire substrate;

the sliding belt slides to pull the mounting plate to move, so that the connecting rod slides out of the sinking groove, and the lifting block slides to the rotating end to lift the mounting plate;

the sapphire substrate slides out of the first evaporation machine, is cooled to room temperature, and then is sequentially covered on a rapid annealing furnace and a second evaporation machine for annealing and evaporation;

the sliding belt drives the mounting plate to slide so that the circular tooth part on the direction control gear is meshed with the second turning rack and drives the direction control gear to rotate 180 degrees, and the LED chip faces upwards.

The invention has the technical effects and advantages that: the mounting plate is driven to slide through the sliding belt, so that the mounting plate can continuously and sequentially enter the first evaporation plating machine, the rapid annealing furnace and the second evaporation plating machine, continuous processing is performed, continuous production is realized, the processing efficiency is improved, and continuous production is realized. Through the cooperation of the direction control gear and the sliding rail and the cooperation of the circular tooth part, the smooth part, the first turning rack and the second turning rack, fixed-point turning, sliding operation and fixed-point resetting of the mounting plate are realized, automatic operation is realized, and automation is realized. Through sink tank cooperation connecting rod operation, accomplished the elevator and in the conversion of rotating the end and sinking the end to accomplish the mounting panel and go up and down, with this realization get into various processing stations, realized automatic switch-over, improved the automation ability. The driving is completed through one driving part, so that the equipment structure is simplified, the energy is saved, and the sequential linkage is realized.

Drawings

Fig. 1 is a schematic perspective view of an LED chip manufacturing apparatus according to the present invention.

Fig. 2 is a schematic top view of an apparatus for manufacturing an LED chip according to the present invention.

Fig. 3 is a partial sectional structural view of the section a in fig. 2.

Fig. 4 is a partial sectional structural view of the section B in fig. 2.

Fig. 5 is a schematic structural diagram of a direction control gear in the manufacturing apparatus of the LED chip according to the present invention.

Fig. 6 is a partially enlarged structural diagram of a portion a in fig. 4.

Fig. 7 is a schematic perspective view of a lifting assistance structure in an LED chip manufacturing apparatus according to the present invention.

Fig. 8 is a schematic front view of a lifting auxiliary structure in an LED chip manufacturing apparatus according to the present invention.

Fig. 9 is a flow chart of a method for manufacturing an LED chip according to the present invention.

Description of reference numerals: the device comprises a supporting frame 1, a motor 2, a supporting frame 3, a sliding belt 4, a belt groove 5, a sliding rail 6, a mounting plate 7, a connecting rod 8, a direction control gear 9, a first turning rack 10, a guide groove 11, a first evaporation machine 12, a cooler 13, a rapid annealing furnace 14, a first roller 15, a second evaporation machine 16, a second turning rack 17, a guide rod 19, a second roller 20, a lifting auxiliary structure 21, a circular tooth part 22, a smooth part 23, a roller 24, a lifting block 25, a lifting groove 26, a fixing rod 27, a shifting block 29, a stress block 30, a rotating shaft 31 and a lifting strip 32.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Example 1

Referring to fig. 1 to 4, in the present embodiment, an apparatus for manufacturing an LED chip is provided, which is used to perform coating, annealing, and cooling on a sapphire substrate, thereby producing an LED chip. The preparation equipment of the LED chip comprises: support frame 1, driving member, mounting plate 7, first evaporator 12, rapid annealing furnace 14, second evaporator 16, and slide belt 4.

Braced frame 1, relative being provided with two, 1 fixed connection of two braced frames, two braced frame 1 can be connected through connecting the lever, braced frame 1 can be the semicircle waist type structure in both ends, has seted up trough of belt 5 on braced frame 1, and the inside slip of trough of belt 5 is provided with sliding belt 4, and braced frame 1's tip is provided with the driving piece, drives sliding belt 4 through the driving piece and rotates to drive sliding belt 4 rotation on braced frame 1. The driving member may include a motor 2, a driving roller, and a driven roller. The driving roller is rotatably arranged at one end of the supporting frame 1, the driving rollers on the two supporting frames 1 can be coaxially and fixedly connected, and the driven roller is rotatably connected at the other end of the supporting frame 1. The driving roller is connected with the driven roller through a sliding belt 4, and the driving roller is coaxially and fixedly connected with an output shaft of the motor 2. The driving roller is driven to rotate by the driving piece, so that the sliding belt 4 is driven to slide on the supporting frame 1.

And the mounting plate 7 is used for placing and fixing the sapphire substrate, and one surface of the mounting plate 7 is set as a placing surface. The mounting plate is provided with a fixing piece on the placing surface, the sapphire substrate can be fixed through the fixing piece, and the machining surface of the sapphire substrate is far away from the mounting plate 7. The two ends of the mounting plate 7 are fixedly connected with connecting rods 8.

The inner of braced frame 1 is provided with slide rail 6, and the shape of slide rail 6 corresponds with the slip belt 4 shape, and it is provided with accuse gear 9 to slide on the slide rail 6, and wherein accuse gear 9's opposite face has seted up lift groove 26, and the tip fixedly connected with elevator 25 of connecting rod 8, elevator 25 slip nestification are in the inside of lift groove 26, and lift groove 26 and elevator 25 this moment all can be square structure to can make elevator 25 slide but can not rotate in the inside of lift groove 26. Wherein, accuse gear 9 includes circle tooth portion 22 and smooth portion 23 (refer to fig. 5), circle tooth portion 22 and smooth portion 23 all set up two and the interval sets up, two smooth portions 23 are parallel, lift groove 26 is perpendicular with smooth portion 23, lift groove 26 includes rotation end and end of sinking, wherein rotate the central point that the end is in accuse gear 9, first turning rack 10 and second turning rack 17 have been seted up at the upper portion both ends of slide rail 6, the coaxial fixedly connected with guide bar 19 of non-opposite face of accuse gear 9, guide bar 19 rotates the nestification in the inside of sliding belt 4.

A first evaporation machine 12, a rapid annealing furnace 14 and a second evaporation machine 16 are sequentially and fixedly arranged between the two support frames 1, and the first evaporation machine 12, the rapid annealing furnace 14 and the second evaporation machine 16 are positioned between a first turning rack 10 and a second turning rack 17. The supporting frame 1 is fixedly connected with supporting bars, the supporting bars are located on the opposite sides of the supporting frame 1, the upper portions of the supporting bars are provided with a plurality of sinking grooves 18, and the number and the positions of the sinking grooves 18 correspond to the first evaporation machine 12, the rapid annealing furnace 14 and the second evaporation machine 16 one by one. The support bar supports the connecting rod 8 and keeps the lifting block 25 at the rotating end, the connecting rod 8 enters the interior of the sink tank 18, and the lifting block 25 enters the sink end.

And a sensor assembly (not shown) mounted on the support frame 1 for sensing the position of the mounting plate 7 and generating a stop signal and a working signal.

A controller (not shown in the figure), a driving part, a first evaporation machine 12, a rapid annealing furnace 14 and a second evaporation machine 16, wherein the sliding belt 4 drives the mounting plate 7 to move to change the position of the direction control gear 9, the mounting plate 7 is arranged at the end part of the supporting frame 1 and is arranged at the front side of the flowing direction of the first overturning rack 10, the sapphire substrate is arranged on the placing surface of the mounting plate 7, one smooth part 23 of the direction control gear 9 is contacted with the slide rail 6 and slides, the driving part is started, the sliding belt 4 slides on the supporting frame 1 under the action of the driving part, the sliding belt 4 drives the direction control gear 9 and the mounting plate 7 to slide in the flowing direction, the direction control gear 9 slides to be contacted with the first overturning rack 10, the circular tooth part 22 is meshed with the first overturning rack 10 to drive the direction control gear 9 to rotate, the direction control gear 9 drives the mounting plate 7 to rotate, and leads the other smooth part 23 of the direction control gear 9 to be contacted with the slide rail 6, thereby flipping the mounting plate 7 180 degrees so that the sapphire substrate is facing downward. Sliding belt 4 drives the top that mounting panel 7 slided to first coating by vaporization machine 12, and the mounting panel 7 position is sensed to the inductor subassembly, and generate stop signal and send the controller to, controller control driving piece stop work, and generate operation signal and give first coating by vaporization machine 12, connecting rod 8 enters into the position of sink 18 this moment, and connecting rod 8 enters into the inside of sink 18 under the effect of gravity, and elevator 25 enters into the end that sinks from the rotation end of lift groove 26. Mounting panel 7 covers on first coating by vaporization machine 12, and the sapphire substrate enters into the inside of first coating by vaporization machine 12, carries out the one deck silver film of coating by vaporization to the sapphire substrate behind the first coating by vaporization machine 12 received signal. When the controller passesThe time delay completes the evaporation of the silver film. The sliding belt 4 continues to pull the mounting plate 7 to move, the connecting rod 8 slides out of the sinking groove 18, and the lifting block 25 slides to the rotating end. The sapphire substrate slides out of the first evaporator 12 and is cooled to room temperature. By analogy, the sapphire substrate enters the rapid annealing furnace 14, the mounting plate 7 covers the rapid annealing furnace 14 and enables the sapphire substrate to be placed in the rapid annealing furnace 14, the sapphire substrate is annealed, and the annealed silver film is accumulated and silver particles scattered on the surface of the sapphire substrate are formed. The sapphire substrate after cooling similarly enters the second evaporator 16, and TiO is evaporated on the surface layer of the silver particles by the physical vapor deposition method through the second evaporator 162/SiO2And a reflective layer. Therefore, the LED chips are processed, the sliding belt 4 drives the mounting plate 7 to continuously slide, the circular tooth part 22 is meshed with the second turning rack 17 to drive the direction control gear 9 to rotate, the direction control gear 9 drives the mounting plate 7 to rotate, the original smooth part 23 of the direction control gear 9 is in contact with the sliding rail 6, the mounting plate 7 is turned over for 180 degrees, the sapphire substrate is sequentially turned upwards, and the processed LED chips are taken out and enter the next process. The mounting plate 7 is driven to slide through the sliding belt 4, so that the mounting plate can continuously and sequentially enter the first evaporation machine 12, the rapid annealing furnace 14 and the second evaporation machine 16, continuous processing is performed, continuous production is realized, the processing efficiency is improved, and the continuous production is realized. The fixed-point turning, sliding and fixed-point resetting of the mounting plate 7 are realized through the matching of the direction control gear 9 and the sliding rail 6 and the matching of the circular tooth part 22, the smooth part 23, the first turning rack 10 and the second turning rack 17, and the automatic operation is realized. The operation of the sunken groove 18 matched with the connecting rod 8 completes the conversion of the lifting block 25 at the rotating end and the sunken end, thereby completing the lifting of the mounting plate 7, realizing the entering of various processing stations, realizing the automatic conversion and improving the automation capability. The driving is completed through one driving part, so that the equipment structure is simplified, the energy is saved, and the sequential linkage is realized.

In this embodiment, the two support frames 1 are arranged in parallel, and both ends of the support frames 1 are arc-shaped, so as to facilitate the sliding and steering of the sliding belt 4, the support frames 1 may be of a metal structure, and the support frames 1Are supported by the support frame 3, so that the support frame 1 is at a certain height, which is convenient for operation. The sliding belt 4 may be made of rubber, chain, etc. so as to facilitate the up-and-down circular sliding of the mounting plate 7. In the first evaporator 12, the coating may be performed by a physical vapor deposition method mainly including an evaporation coating method or a sputtering coating method. Setting the annealing temperature and the annealing time of the rapid annealing furnace in the rapid annealing furnace 14, wherein the annealing temperature is 300-500 ℃ of the stress block, the annealing time is 5-20 min of the second roller, and carrying out heating treatment and annealing processing on the silver film through the rapid annealing furnace 14. In the second evaporator 16, after the silver particles are annealed and cooled, TiO for reflecting light emitted from the active layer is evaporated on the surface layer of the silver particles2/SiO2And a reflective layer. The mounting plate 7 fixes the sapphire substrate in the prior art, which is not described herein. The first evaporator 12, the rapid annealing furnace 14 and the second evaporator 16 may include a box body and internal processing components, and the mounting plate 7 may be in sealing fit with the first evaporator 12, the rapid annealing furnace 14 and the second evaporator 16, and the gravity of the mounting plate 7 covers the first evaporator 12, the rapid annealing furnace 14 and the second evaporator 16. Of course, when the gravity is insufficient, a pressing structure may be provided on the support frame 1, and the mounting plate 7 may be covered on the first evaporator 12, the rapid annealing furnace 14, and the second evaporator 16 by the pressing structure. The pressing structure can be a telescopic rod and a pressing plate, and the telescopic rod is electrically connected with the controller. When the telescopic rod receives the signal, the telescopic rod extends to lower the pressing plate, and the pressing plate presses on the mounting plate 7, so that the mounting plate 7 covers the first vapor deposition machine 12, the rapid annealing furnace 14 and the second vapor deposition machine 16. The controller and sensor assemblies are prior art and will not be described herein. Sapphire substrates and related structures thereof are prior art and are not described herein.

As an embodiment of the present invention, the support frame 1 is provided with a guide groove 11, the guide groove 11 is consistent with the sliding track of the sliding belt 4, and the end of the guide rod 19 extends into the guide groove 11 to guide the sliding of the mounting plate 7, so as to prevent the gravity of the mounting plate 7 from deforming the sliding belt 4, thereby increasing the stability of the sliding of the mounting plate 7. The end of the guide rod 19 is rotatably provided with a second roller 20 (refer to fig. 5), and the second roller 20 is rotatably nested inside the guide groove 11, so that the friction force between the guide rod 19 and the guide groove 11 is reduced, and the mounting plate 7 slides more smoothly.

According to one embodiment of the invention, the connecting rod 8 is rotatably provided with the first roller 15, the first roller 15 is erected on the supporting strip, and the friction force is large because the first roller 15 is slidably erected on the supporting strip and the supporting strip bears the gravity of the mounting plate 7, and the first roller 15 is used for supporting, so that the friction force is reduced. When the mounting plate 7 corresponds to the first evaporator 12, the rapid annealing furnace 14 and the second evaporator 16, the first roller 15 enters the interior of the sink groove 18, and the first roller 15 is of a rolling structure, so that the second turning rack 17 slides stably and can smoothly slide out of the sink groove 18, and the operation is smooth.

Referring to fig. 6, as an embodiment of the present invention, at least one fixing rod 27 is fixedly disposed inside the lifting groove 26, the lifting block 25 is slidably nested on the fixing rod 27, and the fixing rod 27 guides the sliding of the lifting block 25 and can limit the rotation of the lifting block 25.

As an embodiment of the present invention, a rolling structure may be disposed on the surface of the smooth portion 23 to facilitate sliding of the steering gear 9, the rolling structure may be a roller 24, a ball, and the like, and at this time, the slide rail 6 may be provided with a guiding structure, the guiding structure includes a roller groove, a ball groove, and the like corresponding to the roller 24 and the ball, so as to enable the steering gear 9 to slide smoothly and facilitate the steering gear 9 to enter the first turning rack 10 and the second turning rack 17 to rotate inside.

In an embodiment of the present invention, the coolers 13 are disposed behind the first evaporator 12, the rapid annealing furnace 14, and the second evaporator 16, and the cooling capability of each cooler 13 can be designed according to actual needs, so that the cooling time can be the same, the cooling time can be shortened to the maximum, the processing time can be reduced to the maximum, and the production efficiency can be improved.

Example 2

Be provided with lifting auxiliary structure 21 between slip belt 4 and braced frame 1, can make connecting rod 8 more smooth and easy roll-off sink 18 through lifting auxiliary structure 21 effect, avoided sink 18 to hinder connecting rod 8 to the slip of mounting panel 7 is smooth and easy. The corresponding sink 18 may be a circular slot type structure to facilitate the entry and exit of the connecting rod 8. But gravity also has some resistance, which also causes resistance to the sliding of the connecting rod 8. The auxiliary lifting is performed by the lifting auxiliary structure 21, facilitating the sliding of the connecting rod 8. Referring to fig. 7-8, the auxiliary lifting structure 21 includes a rotation shaft 31, force-receiving blocks 30, lifting strips 32 and a toggle block 29, the toggle block 29 is fixedly connected to the bottom of the sliding belt 4, the toggle block 29 is located on the side of the flow direction of the steering gear 9, the rotation shaft 31 is rotatably disposed inside the supporting frame 1, the rotation shaft 31 is located on the flow side of the sunken groove 18, one end of the rotation shaft 31 is radially and fixedly connected with the force-receiving blocks 30, the other end of the rotation shaft 31 is radially and fixedly connected with the lifting strips 32, and the lifting strips 32 correspond to the force-receiving blocks 30 one to one. In fig. 7, the steering gear 9 is not shown for ease of understanding. In fig. 8, for the sake of easy understanding, some portions of the support frame 1 that obstruct the view are not shown. The number of the lifting strips 32 and the force-bearing blocks 30 is set according to actual requirements. After the operation, the sliding belt 4 drives the shifting block 29 to move, the shifting block 29 drives the stressed block 30 to rotate, the stressed block 30 drives the lifting strip 32 to rotate, and the lifting strip 32 drives the connecting rod 8 to lift, so that the connecting rod 8 slides out of the sinking groove 18 smoothly.

Example 3

Referring to fig. 9, in the present embodiment, a method for manufacturing an LED chip is provided, including the following steps:

the sapphire substrate is mounted on the mounting surface of the mounting board 7.

The sliding belt 4 drives the mounting plate 7 to slide in the flowing direction, the direction control gear 9 at the end part of the mounting plate 7 slides to be in contact with the first turning rack 10, the circular tooth part 22 on the direction control gear 9 is meshed with the first turning rack 10, and the direction control gear 9 is driven to rotate 180 degrees, so that the sapphire substrate faces downwards.

The sliding belt 4 drives the mounting plate 7 to slide above the first evaporation machine 12, and the sensor assembly senses the position of the mounting plate 7, generates a stop signal and an operation signal and transmits the stop signal and the operation signal to the controller.

The slide belt 4 is stopped and the connecting rod 8 enters the position of the sink groove 18, enters the sink end from the rotation end of the lift groove 26 through the lift block 25, and the mounting plate 7 is covered on the first evaporator 12.

The sapphire substrate enters into the inside of first coating by vaporization machine 12, and the controller receives the operation signal after control first coating by vaporization machine 12 and carries out the one deck silver film of coating by vaporization to the sapphire substrate.

The sliding belt 4 slides to pull the mounting plate 7 to move so that the connecting rod 8 slides out of the sinking groove 18 and the lifting block 25 slides to the rotating end.

The sapphire substrate slides out of the first evaporator 12, is cooled to room temperature, and then is sequentially covered on a rapid annealing furnace 14 and a second evaporator 16 to be annealed and evaporated.

The sliding belt 4 drives the mounting plate 7 to slide, so that the circular tooth part 22 on the direction control gear 9 is meshed with the second turning rack 17, and drives the direction control gear 9 to rotate 180 degrees, so that the LED chip faces upwards. Therefore, the sapphire substrate faces upwards, and the processed LED chip can be conveniently taken out and enter the next process.

The mounting plate 7 is driven to slide through the sliding belt 4, so that the mounting plate can continuously and sequentially enter the first evaporation machine 12, the rapid annealing furnace 14 and the second evaporation machine 16, continuous processing is performed, continuous production is realized, the processing efficiency is improved, and the continuous production is realized. Through the cooperation of the direction control gear 9 and the slide rail 6 and the cooperation of the circular tooth part 22, the smooth part 23, the first turning rack 10 and the second turning rack 17, the fixed-point turning, sliding and fixed-point resetting of the mounting plate 7 are realized, the automatic operation is realized, and the automatic production is realized. The operation of the sunken groove 18 matched with the connecting rod 8 completes the conversion of the lifting block 25 at the rotating end and the sunken end, thereby completing the lifting of the mounting plate 7, realizing the entering of various processing stations, realizing the automatic station conversion and improving the automation capability. The driving is completed through one driving part, so that the equipment structure is simplified, the energy is saved, and the sequential linkage is realized.

It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art and related arts based on the embodiments of the present invention without any creative effort, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.

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