阅读说明：本技术 抗高电压pcb板制作工艺 (Manufacturing process of high-voltage-resistant PCB ) 是由 萧永慈 张立 吕邦红 刘维 于 2020-04-15 设计创作，主要内容包括：本发明涉及一种抗高电压PCB板制作工艺,用于加工PCB板主体及半固化片,所述抗高电压PCB板制作工艺包括：步骤S10：所述PCB板主体进行板面处理；步骤S20：所述半固化片进行外形处理；步骤S30：叠板；步骤S40：进行第一段压合加工；步骤S50：进行第二段压合加工；步骤S60：进行第三段压合加工。本发明的抗高电压PCB板制作工作,可将半固化片成型于PCB板主体的表面形成阻焊,具有良好的抗击穿能力,提高板件的绝缘性能。(The invention relates to a manufacturing process of a high-voltage-resistant PCB (printed circuit board), which is used for processing a PCB main body and a prepreg, and comprises the following steps: step S10: the PCB main body is subjected to board surface treatment; step S20: carrying out appearance treatment on the prepreg; step S30: stacking the plates; step S40: carrying out first-stage pressing processing; step S50: performing second-stage pressing processing; step S60: and carrying out third-stage pressing processing. The high-voltage-resistant PCB can be manufactured by molding the prepreg on the surface of the PCB main body to form a solder resist, has good breakdown resistance and improves the insulating property of a plate.)

1. The utility model provides an anti high voltage PCB board manufacture craft for processing PCB board main part and prepreg, its characterized in that, anti high voltage PCB board manufacture craft includes:

step S10: the PCB main body is subjected to board surface treatment;

step S20: carrying out appearance treatment on the prepreg;

step S30: stacking the plates;

step S40: carrying out first-stage pressing processing;

step S50: performing second-stage pressing processing;

step S60: and carrying out third-stage pressing processing.

2. The manufacturing process of the high voltage resistant PCB as claimed in claim 1, wherein the first stage of pressing process comprises steps S41-S45;

step S41: pressing the PCB main body and the prepreg for a certain time at the temperature of 130 ℃ and under the pressure of 140psi, and then entering step S42;

step S42: keeping the PCB main body and the prepreg in a pressing and combining environment with the temperature of 150 ℃ and the pressure of 180psi for a certain time, and then entering the step S43;

step S43: pressing the PCB main body and the prepreg for a certain time at the temperature of 170 ℃ and under the pressure of 240psi, and then entering step S44;

step S44: pressing the PCB main body and the prepreg for a certain time at the temperature of 180 ℃ and under the pressure of 300psi, and then entering step S45;

step S45: and (3) keeping the PCB main body and the prepreg in a temperature of 190 ℃ and a pressure of 360psi for a certain time.

3. The manufacturing process of the high voltage resistant PCB as claimed in claim 2, wherein the stitching time of step S41 is 28 minutes.

4. The manufacturing process of the high voltage resistant PCB as claimed in claim 2, wherein the stitching time of step S42 is 6 minutes.

5. The manufacturing process of the high voltage resistant PCB as claimed in claim 2, wherein the stitching time of step S43 is 6 minutes.

6. The manufacturing process of the high voltage resistant PCB as claimed in claim 2, wherein the stitching time of step S44 is 20 minutes.

7. The manufacturing process of the high voltage resistant PCB as claimed in claim 2, wherein the stitching time of step S45 is 25 minutes.

8. The manufacturing process of the high voltage PCB as claimed in claim 1, wherein the second stage of pressing process comprises steps S51 and S52;

step S51: pressing the PCB main body and the prepreg for a certain time at the temperature of 200 ℃ and under the pressure of 250psi, and then entering step S52;

step S52: and keeping the PCB main body and the prepreg for a certain time in an environment with the temperature of 130 ℃ and the pressure of 80 psi.

9. The manufacturing process of the high voltage resistant PCB board as claimed in claim 1, wherein the stitching time of the step S51 is 20 minutes; the stitching time of step S52 is 15 minutes.

10. The manufacturing process of the high voltage resistant PCB board of claim 1, wherein the third stage of pressing process is: keeping the PCB main body and the prepreg in a pressure environment with the temperature of 30 ℃ and the pressure of 300psi for a certain time; the pressing time of the third stage of pressing processing is 45 minutes.

Technical Field

The invention relates to the technical field of PCB production, in particular to a manufacturing process of a high-voltage-resistant PCB.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components.

With the development of science and technology, the PCB is widely applied to large-scale electrical appliances, so that the requirement for the PCB to bear high voltage is higher and higher. Traditional PCB board utilizes the build-up layer to block electric current and voltage for PCB board surface, nevertheless along with the bearing current and the voltage of PCB board are bigger and bigger, leads to the increasingly easy high voltage breakdown of solder mask of PCB board, and electric leakage, short circuit problem appear in the PCB board, cause electrical product to scrap.

Disclosure of Invention

Based on the above, the invention provides a manufacturing process of a high-voltage resistant PCB.

In order to realize the purpose of the invention, the invention adopts the following technical scheme:

the manufacturing process of the high-voltage-resistant PCB is used for processing a PCB main body and a prepreg and comprises the following steps:

step S10: the PCB main body is subjected to board surface treatment;

step S20: carrying out appearance treatment on the prepreg;

step S30: stacking the plates;

step S40: carrying out first-stage pressing processing;

step S50: performing second-stage pressing processing;

step S60: and carrying out third-stage pressing processing.

The high-voltage-resistant PCB can be manufactured by molding the prepreg on the surface of the PCB main body to form a solder resist, has good breakdown resistance and improves the insulating property of a plate.

In one embodiment, the first stage pressing process comprises steps S41-S45;

step S41: pressing the PCB main body and the prepreg for a certain time at the temperature of 130 ℃ and under the pressure of 140psi, and then entering step S42;

step S42: keeping the PCB main body and the prepreg in a pressing and combining environment with the temperature of 150 ℃ and the pressure of 180psi for a certain time, and then entering the step S43;

step S43: pressing the PCB main body and the prepreg for a certain time at the temperature of 170 ℃ and under the pressure of 240psi, and then entering step S44;

step S44: pressing the PCB main body and the prepreg for a certain time at the temperature of 180 ℃ and under the pressure of 300psi, and then entering step S45;

step S45: and (3) keeping the PCB main body and the prepreg in a temperature of 190 ℃ and a pressure of 360psi for a certain time.

In one embodiment, the stitching time of step S41 is 28 minutes.

In one embodiment, the stitching time of step S42 is 6 minutes.

In one embodiment, the stitching time of step S43 is 6 minutes.

In one embodiment, the stitching time of step S44 is 20 minutes.

In one embodiment, the stitching time of step S45 is 25 minutes.

In one embodiment, the second stage of pressing process includes steps S51 and S52;

step S51: pressing the PCB main body and the prepreg for a certain time at the temperature of 200 ℃ and under the pressure of 250psi, and then entering step S52;

step S52: and keeping the PCB main body and the prepreg for a certain time in an environment with the temperature of 130 ℃ and the pressure of 80 psi.

In one embodiment, the stitching time of step S51 is 20 minutes; the stitching time of step S52 is 15 minutes.

In one embodiment, the third stage pressing process includes: keeping the PCB main body and the prepreg in a pressure environment with the temperature of 30 ℃ and the pressure of 300psi for a certain time; the pressing time of the third stage of pressing processing is 45 minutes.

Drawings

Fig. 1 is a flow chart of a manufacturing process of a high voltage resistant PCB according to an embodiment of the present invention;

fig. 2 is a table of control parameters of the process for manufacturing the high voltage resistant PCB shown in fig. 1.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 and 2, a manufacturing process of a high voltage resistant PCB according to an embodiment of the invention is applied to process a PCB main body and a prepreg, and the prepreg is used as a solder resist layer to generate the high voltage resistant PCB. The PCB body herein refers to a semi-finished PCB without solder resist, i.e., the semi-finished PCB is processed by all processes before solder resist.

The manufacturing process of the high-voltage resistant PCB comprises the following steps:

step S10: and carrying out board surface treatment on the PCB main body. Specifically, in this embodiment, the board surface treatment process to be performed by the PCB main body is a browning treatment process, which can effectively remove impurities, organic matters, fingerprints and the like on the surface of the PCB main body, thereby ensuring the board surface cleanliness of the PCB main body. Meanwhile, the browning treatment process can also coarsen the copper surface of the PCB main body, so that the copper surface of the PCB main body becomes rough, the binding force between the PCB main body and the prepreg is improved, and the formed prepreg solder mask is prevented from being separated.

It is understood that, in other embodiments, the board surface treatment of the PCB board main body may also adopt a blackening treatment process, which can achieve the same effect as the board surface treatment in this embodiment, and is not limited to the browning treatment process in this embodiment.

Step S20: and (5) carrying out appearance treatment on the prepreg. Specifically, step S20 includes:

cutting: opening a prepreg according to the size of the PCB main body, wherein the size of the prepreg is slightly larger than that of the PCB main body; in this example, the thickness of the prepreg is less than 75 μm, and the gel content of the prepreg is greater than 70%; preferably, the thickness of the prepreg is 50 μm; preferably, the prepreg is 106 or 1037 in model number.

Gong shape: processing the shape of the prepreg according to the shape of the PCB main body so that the shape outline of the prepreg is matched with the shape outline of the PCB main body;

resistance welding and windowing: and windowing at corresponding positions on the prepreg according to the positions of the pads on the PCB main body, wherein the windowing size of the prepreg is 2mm smaller than the size of one side of the pads of the PCB main body. It should be noted that the bonding pads herein include, but are not limited to, bonding pads, SMDs, BGAs, and the like, and the bonding pads are collectively referred to herein.

Step S30: and (5) stacking the plates. And aligning and laminating the PCB main body and the prepreg.

Step S40: and carrying out first-stage pressing processing. Specifically, the first stage of pressing process is a temperature and pressure raising process, that is, the temperature and pressure raising are performed simultaneously in the first stage of pressing process. The first stage of pressing process includes steps S41-S45, and the control parameters of steps S41-S45 are shown in FIG. 2.

After the lamination is finished, putting the laminated PCB main body and the prepreg into laminating equipment, wherein the initial temperature of the laminating equipment is 130 ℃, the initial pressure is 40psi, and keeping the laminated PCB main body and the prepreg in a temperature environment of 130 ℃ and a pressure environment of 40psi for laminating for 28 minutes, namely step S41;

after the step S41 is completed, the temperature of the laminating device is raised to 150 ℃, the pressure is raised to 180psi, and the PCB main body and the prepreg are pressed together for 6 minutes in the environment of 150 ℃ and 180psi, that is, step S42;

after the step S42 is completed, the temperature of the laminating device is raised to 170 ℃, the pressure is raised to 240psi, and the PCB main body and the prepreg are pressed together for 6 minutes in the environment of 170 ℃ and 240psi, that is, step S43;

after the step S43 is completed, the temperature of the laminating device is raised to 180 ℃, the pressure is raised to 300psi, and the PCB main body and the prepreg are pressed together for 20 minutes in the environment of 180 ℃ and 300psi, that is, step S44;

after step S44 is completed, the temperature of the laminating apparatus is raised to 190 ℃, the pressure is raised to 360psi, and the PCB main body and the prepreg are pressed together for 25 minutes in the environment of 190 ℃ and 360psi, which is step S45.

In the process of step S41, the prepreg is affected by high temperature and high pressure, and the prepreg melts slowly, at this time, the fluidity of the resin is good, and the pressure can promote the flow of the resin; and then, performing steps S42-S45, wherein the flowability of the resin is better, and after the temperature and pressure are kept and maintained for a certain time at 130 ℃ and 40psi, the temperature is gradually increased and the pressure is increased, so that the flowability of the resin in the prepreg can be further improved, and the prepreg is better combined with the PCB main body. In the process of steps S41-S45, the temperature and pressure are increased in a sectional manner, so that the dimensional instability of the prepreg due to the direct application of high temperature or high pressure is avoided, and the quality is ensured.

Step S50: and performing second-stage pressing processing. Specifically, the second stage processing is a temperature and pressure changing process, namely, the temperature is increased and then decreased in the second stage pressing process, and the pressure is kept reduced all the time. The second stage of the pressing process includes steps S51 and S52, and the control parameters of steps S51 and S52 are shown in fig. 2.

After step S45 is completed, the temperature of the laminating apparatus is raised to 200 ℃, the pressure is reduced to 250psi, and the PCB main body and the prepreg are pressed together for 20 minutes in the environment of 200 ℃ and 250psi, that is, step S51;

after step S51 is completed, the temperature of the laminating apparatus is reduced to 130 ℃, the pressure is reduced to 80psi, and the PCB main body and the prepreg are pressed together for 15 minutes in the environment of 130 ℃ and 80psi, which is step S52.

Step S60: and carrying out third-stage pressing processing. Specifically, the third processing is a cooling and pressurizing process, after step S52 is completed, the temperature of the laminating equipment is reduced to 30 ℃, the pressure is increased to 300psi, and the PCB main body and the prepreg are kept pressed for 45 minutes in an environment with the temperature of 30 ℃ and the pressure of 300 psi. After the first stage of pressing and the second stage of pressing are completed, the temperature and the pressure must be reduced and increased, so that the prepreg can be cooled and shaped, and the prepreg and the PCB main body are combined and molded.

In the processes of the first stage pressing process, the second stage pressing process and the third stage pressing process, the temperature and the pressure are regulated rapidly, so the time spent on temperature regulation and pressure regulation is ignored.

The high-voltage-resistant PCB can be manufactured by molding the prepreg on the surface of the PCB main body to form a solder resist, has good breakdown resistance and improves the insulating property of a plate.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.