阅读说明：本技术 一种增加油墨在陶瓷基板上附着力的方法 (Method for increasing adhesion of printing ink on ceramic substrate ) 是由 孔仕进 郭晓泉 何浩波 康为 于 2021-07-08 设计创作，主要内容包括：本发明公开一种增加油墨在陶瓷基板上附着力的方法,包括有以下步骤：(1)将待做油墨的覆铜陶瓷基板进行喷砂和蚀刻粗化处理,喷砂时采用的金刚砂目数为200-800目,喷砂压力2.0-6.0Mpa,蚀刻时采用蚀刻药水,使得覆铜陶瓷基板的粗糙度大于0.15微米以上；(2)将粗化后的覆铜陶瓷基板置于清洗溶液中超声清洗30-60min；(3)清洗后的覆铜陶瓷基板取出至于烤箱中50-100℃下烘烤10-60min；通过采用本发明方法在陶瓷基板上形成油墨,可以有效增加油墨在陶瓷基板附着力,从而保证产品在严苛的环境下进行加工使用,提高产品的加工及使用良率,为生产作业带来便利。(The invention discloses a method for increasing the adhesion of ink on a ceramic substrate, which comprises the following steps: (1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micron; (2) placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60 min; (3) taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60 min; by adopting the method of the invention to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, thereby ensuring that the product is processed and used in a harsh environment, improving the processing and use yield of the product and bringing convenience to production operation.)

1. A method of increasing the adhesion of an ink to a ceramic substrate, comprising: the method comprises the following steps:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micron;

(2) placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60 min;

(3) taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60 min;

(4) printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil-water to the ink is 150-500ml/KG, then adding 50-200ml of curing agent, and printing the ink with different thicknesses by using screen plates with different meshes, wherein the printing pressure is 0.4-1.2 Mpa;

(5) horizontally standing for 15-45min after printing ink, and pre-baking in an oven at 75-125 deg.C for 30-60 min;

(6) the exposure treatment is carried out by adopting a high-energy exposure machine, the exposure energy is 100-²The exposure time is 5-15 s;

(7) developing by adopting sodium carbonate with the mass concentration of 0.7-1.5% and the developing speed of 120-350 cm/min;

(8) baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.

2. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.

3. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.

4. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the inks with different colors in the step (4) comprise green, white, black and blue.

5. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the otter boards with different meshes in the step (4) comprise 36T, 45T, 63T and 100T.

Technical Field

The invention relates to the technical field of ceramic substrates, in particular to a method for increasing the adhesion of ink on a ceramic substrate.

Background

With the development of integration and miniaturization of semiconductor devices, the precision requirement on circuit patterns on a ceramic substrate bearing a chip is higher and higher, so that the adhesive force for manufacturing ink on a substrate with high circuit resolution has certain requirement, and the adhesive force of the ink with small line width on the ceramic substrate is more challenging. The ceramic substrate with ink may be stripped off due to the surface treatment in a strong acid environment and the high temperature treatment in the packaging process, resulting in poor product reliability. Therefore, there is a need to develop a solution to the above problems.

Disclosure of Invention

In view of the above, the present invention is directed to a method for increasing the adhesion of ink on a ceramic substrate, which can increase the adhesion of ink on the ceramic substrate.

In order to achieve the purpose, the invention adopts the following technical scheme:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micron;

(2) placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60 min;

(3) taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60 min;

(4) printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil-water to the ink is 150-500ml/KG, then adding 50-200ml of curing agent, and printing the ink with different thicknesses by using screen plates with different meshes, wherein the printing pressure is 0.4-1.2 Mpa;

(5) horizontally standing for 15-45min after printing ink, and pre-baking in an oven at 75-125 deg.C for 30-60 min;

(6) the exposure treatment is carried out by adopting a high-energy exposure machine, the exposure energy is 100-²The exposure time is 5-15 s;

(7) developing by adopting sodium carbonate with the mass concentration of 0.7-1.5% and the developing speed of 120-350 cm/min;

(8) baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.

Preferably, the etching solution is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.

As a preferable scheme, the cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.

Preferably, the inks of different colors in step (4) include green, white, black and blue.

As a preferable scheme, the mesh plates with different mesh numbers in the step (4) comprise 36T, 45T, 63T and 100T.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:

by adopting the method of the invention to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, thereby ensuring that the product is processed and used in a harsh environment, improving the processing and use yield of the product and bringing convenience to production operation.

Detailed Description

The invention discloses a method for increasing the adhesion of ink on a ceramic substrate, which comprises the following steps:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60 min. The cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water is 150-500ml/KG, then adding 50-200ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.4-1.2 Mpa. The inks of different colors include green, white, black and blue inks or other color inks, and the screens of different meshes include 36T, 45T, 63T and 100T or other meshes.

(5) Printing ink, horizontally standing for 15-45min, and pre-baking in oven at 75-125 deg.C for 30-60 min.

(6) The exposure treatment is carried out by adopting a high-energy exposure machine, the exposure energy is 100-²And the exposure time is 5-15 s.

(7) Developing with sodium carbonate of 0.7-1.5 wt% and developing speed of 120-350 cm/min.

(8) Baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.

The invention is illustrated in more detail below in the following examples:

example 1:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200 meshes, the sand blasting pressure is 2.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5g/L, and the mass concentration of the sulfuric acid is 1%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30 min. The cleaning solution comprises the following components in percentage by mass: 35% of alcohol, 10% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven for 50min at 50 ℃.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 500ml/KG, then adding 100ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 1.2 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, horizontally standing for 15min, and pre-baking in oven at 80 deg.C for 40 min.

(6) Exposing with high energy exposure machine at 500mj/cm²Exposure time 10 s.

(7) And developing with sodium carbonate of 0.8% mass concentration and at a developing speed of 120 cm/min.

(8) And baking the developed copper-clad ceramic substrate for 1H at 150 ℃.

Example 2:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 800 meshes, the sand blasting pressure is 5.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 60g/L, and the mass concentration of the sulfuric acid is 20%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 60 min. The cleaning solution comprises the following components in percentage by mass: 5% of alcohol, 2% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 100 ℃ for 10 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 150ml/KG, then adding 50ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.4 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, horizontally standing for 35min, and pre-baking in oven at 75 deg.C for 30 min.

(6) Performing exposure treatment with high energy exposure machine with exposure energy of 100mj/cm²Exposure time 5 s.

(7) The development was carried out using sodium carbonate of 0.7% by mass and at a development speed of 200 cm/min.

(8) And baking the developed copper-clad ceramic substrate for 2H at 150 ℃.

Example 3:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 500 meshes, the sand blasting pressure is 6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 20g/L, and the mass concentration of the sulfuric acid is 10%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 35 min. The cleaning solution comprises the following components in percentage by mass: 15% of alcohol, 5% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 70 ℃ for 60 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 200ml/KG, then adding 150ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.8 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, horizontally standing for 45min, and pre-baking in oven at 125 deg.C for 35 min.

(6) By heightThe energy exposure machine carries out exposure treatment, and the exposure energy is 200mj/cm²Exposure time 8 s.

(7) The development was carried out using sodium carbonate of 1.2% by mass and at a development speed of 350 cm/min.

(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.5H.

Example 4:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 600 meshes, the sand blasting pressure is 4.0Mpa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micron. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 30g/L, and the mass concentration of the sulfuric acid is 13%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 40 min. The cleaning solution comprises the following components in percentage by mass: 25% of alcohol, 1% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 60 ℃ for 30 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 250ml/KG, then adding 200ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.7 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, horizontally standing for 30min, and pre-baking in oven at 90 deg.C for 45 min.

(6) Performing exposure treatment with high energy exposure machine with exposure energy of 300mj/cm²Exposure time 12 s.

(7) The development was carried out using sodium carbonate of 1.5% by mass and at a development speed of 320 cm/min.

(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.2H.

Example 5:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 400 meshes, the sand blasting pressure is 3.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 25g/L, and the mass concentration of the sulfuric acid is 16%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 45 min. The cleaning solution comprises the following components in percentage by mass: 30% of alcohol, 7% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 80 ℃ for 40 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 350ml/KG, then adding 180ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.5 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, standing for 20min, and pre-baking in an oven at 85 deg.C for 50 min.

(6) Exposing with high energy exposure machine at exposure energy of 250mj/cm²Exposure time 15 s.

(7) The development was carried out using sodium carbonate of 1.3% by mass and at a development speed of 250 cm/min.

(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.8H.

Example 6:

a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:

(1) carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 300 meshes, the sand blasting pressure is 5.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 48g/L, and the mass concentration of the sulfuric acid is 8%.

(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 50 min. The cleaning solution comprises the following components in percentage by mass: 20% of alcohol, 8% of acetone and the balance of deionized water.

(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 75 ℃ for 45 min.

(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 400ml/KG, then adding 120ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.9 Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.

(5) Printing ink, standing for 18min, and pre-baking in an oven at 100 deg.C for 60 min.

(6) Performing exposure treatment with high energy exposure machine with exposure energy of 400mj/cm²Exposure time 12 s.

(7) The development was carried out using sodium carbonate of 0.9% by mass and at a development speed of 300 cm/min.

(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.7H.

Comparative example:

the copper-clad ceramic substrates of the embodiments are respectively processed by adopting the traditional process, and the steps are as follows: 1. cleaning the board surface by a certain sulfuric acid solution; 2. printing ink; 3. pre-baking; 4. exposing and developing; 5. and (5) post-baking. To obtain the corresponding six comparative examples.

The above examples and comparative examples were tested by the following methods:

the first step is as follows: adopting a 1mm 11-edge louver knife to perform scribing, partitioning, transverse and vertical 10 times respectively on the substrate ink printing surface with the same area, wherein the area can be 100 x 100mm, the unit area is 1 x 1mm, and the total area is 10000 unit areas.

The second step is that: and (5) observing the proportion of ink falling in unit area by using a 3M adhesive tape to perform the same angle and the same rolling frequency.

The test results are shown in the following table:

serial number	The number of the ink falling off in unit area	Number of ink drop per unit area in conventional process
			1	2	25
2	1	51
			3	0	54
4	3	35
			5	1	42
6	2	32

As can be seen from the above table, the adhesion of the ink on the ceramic substrate is greatly improved by adopting the method of the invention.

The design of the invention is characterized in that: by adopting the method of the invention to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, thereby ensuring that the product is processed and used in a harsh environment, improving the processing and use yield of the product and bringing convenience to production operation.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.