阅读说明：本技术 一种触控屏底膜溅镀工艺 (Sputtering process for bottom film of touch screen ) 是由 林行 葛健国 吕育仁 范小荣 朱育民 庄胜智 于 2018-08-10 设计创作，主要内容包括：本发明公开了一种触控屏底膜溅镀工艺,包括触控屏底膜、氩气、永磁体、靶材、冷却水、正电极、镀膜、负电极、真空镀室,其特征在于：本发明采用在真空镀室的上部平整设置触控屏底膜作为正电极,下部设置永磁体和冷却水,所述永磁体的上面设置靶材作为负电极构成正交电磁场,高真空状态注入氩气形成低真空环境下的光辉放电,电离且加速氩气的氩离子撞击所述靶材的原子逸出,在电磁场的加速下垒积在所述触控屏底膜的表面形成镀膜。实现被镀工料范围广,适应金属或非金属镀件与金属或非金属镀靶材的交互溅镀,镀层均匀性好,镀层粘附度高,镀层厚度具有可控性。克服了现有技术的不足。(The invention discloses a touch screen basement membrane sputtering process, which comprises a touch screen basement membrane, argon, a permanent magnet, a target, cooling water, a positive electrode, a coating film, a negative electrode and a vacuum plating chamber, and is characterized in that: the invention adopts the technical scheme that a touch screen basement membrane is flatly arranged at the upper part of a vacuum plating chamber to serve as a positive electrode, a permanent magnet and cooling water are arranged at the lower part of the vacuum plating chamber, a target is arranged on the permanent magnet to serve as a negative electrode to form an orthogonal electromagnetic field, argon is injected in a high vacuum state to form glow discharge in a low vacuum environment, argon ions of the argon are ionized and accelerated to collide atoms of the target to escape, and the argon ions are accumulated on the surface of the touch screen basement membrane to form a plated film under the acceleration of the. The method has the advantages of wide range of the plated work material, suitability for interactive sputtering of metal or nonmetal plated parts and metal or nonmetal plated target materials, good uniformity of the plating layer, high adhesion of the plating layer and controllability of the thickness of the plating layer. The defects of the prior art are overcome.)

1. A sputtering process for a bottom film of a touch screen comprises the steps of sputtering the bottom film of the touch screen, argon, a permanent magnet, a target, cooling water, a positive electrode, a coating film, a negative electrode and a vacuum plating chamber, and is characterized in that:

the sputtering process adopts the technical scheme that a touch screen basement membrane is flatly arranged on the upper part of a vacuum plating chamber to serve as a positive electrode, a permanent magnet and cooling water are arranged on the lower part of the vacuum plating chamber, a target is arranged on the permanent magnet to serve as a negative electrode to form an orthogonal electromagnetic field, and the vacuum plating chamber is firstly arranged to be 1.3 multiplied by 10^-3High vacuum of Pa, and 1X 10 argon reinjection^-1Pa, ionizing by adopting glow discharge and accelerating the argon ions of the argon to collide with atoms of the target material to escape, and accumulating on the surface of the bottom film of the touch screen under the acceleration of an electromagnetic field to form a coating film;

the sputtering process further comprises the following steps:

step one, ultrasonic cleaning: the pre-plated touch screen bottom film is cleaned by ultrasonic,

step two, drying: drying the pre-plated touch screen bottom film cleaned by ultrasonic,

step three, feeding: mounting the pre-plated touch screen bottom film on a positive electrode of the vacuum plating chamber,

step four, sputtering: starting the glow discharge, debugging to normal glow discharge by adopting 200 ten thousand volts of starting voltage to finish sputtering,

and fifthly, blanking inspection is carried out, and the sputtering process of the bottom film of the touch screen is formed.

2. The sputtering process for forming a bottom film of a touch screen of claim 1, wherein: the touch screen base film comprises but is not limited to a PC film, a PET film, a TAC film, a transparent dry film and a PMMA film.

3. The sputtering process for forming a bottom film of a touch screen of claim 1, wherein: the target includes, but is not limited to, ITO, copper, aluminum, indium, tin, metal, alloy metal.

Technical Field

The invention relates to the technical field of touch screens, in particular to a sputtering process of a bottom film of a touch screen.

Background

Disclosure of Invention

The invention aims to provide a sputtering process for a bottom film of a touch screen, which reasonably solves the problems that the plating process in the prior art adopts electrolyte electroplating or vacuum evaporation, and the two methods are suitable for small range of plated work materials, poor uniformity of a plating layer and low adhesion degree of the plating layer.

The invention adopts the following technical scheme:

a sputtering process for a bottom film of a touch screen comprises the steps of sputtering the bottom film of the touch screen, argon, a permanent magnet, a target, cooling water, a positive electrode, a coating film, a negative electrode and a vacuum plating chamber, and is characterized in that:

the sputtering process adopts the technical scheme that a touch screen basement membrane is flatly arranged on the upper part of a vacuum plating chamber to serve as a positive electrode, a permanent magnet and cooling water are arranged on the lower part of the vacuum plating chamber, a target is arranged on the permanent magnet to serve as a negative electrode to form an orthogonal electromagnetic field, and the vacuum plating chamber is firstly arranged to be 1.3 multiplied by 10^-3High vacuum of Pa, and 1X 10 argon reinjection^-1Low vacuum of Pa, ionization and acceleration by glow dischargeArgon ions of the argon gas collide with atoms of the target material to escape, and are stacked on the surface of the bottom film of the touch screen under the acceleration of an electromagnetic field to form a coating film;

the sputtering process further comprises the following steps:

step one, ultrasonic cleaning: the pre-plated touch screen bottom film is cleaned by ultrasonic,

step two, drying: drying the pre-plated touch screen bottom film cleaned by ultrasonic,

step three, feeding: mounting the pre-plated touch screen bottom film on a positive electrode of the vacuum plating chamber,

step four, sputtering: starting the glow discharge, debugging to normal glow discharge by adopting 200 ten thousand volts of starting voltage to finish sputtering,

and fifthly, blanking inspection is carried out, and the sputtering process of the bottom film of the touch screen is formed.

Further, the touch screen base film includes, but is not limited to, a PC film, a PET film, a TAC film, a transparent dry film, and a PMMA film.

Further, the target includes, but is not limited to, ITO, copper, aluminum, indium, tin, metal, alloy metal.

The beneficial technical effects of the invention are as follows:

the invention discloses a sputtering process for a bottom film of a touch screen, which reasonably solves the problems of small range of plated work materials, poor uniformity of a plating layer and low adhesion degree of the plating layer of the plating process in the prior art adopting electrolyte electroplating or vacuum evaporation.

The invention adopts the technical scheme that a touch screen basement membrane is flatly arranged at the upper part of a vacuum plating chamber to serve as a positive electrode, a permanent magnet and cooling water are arranged at the lower part of the vacuum plating chamber, a target is arranged on the permanent magnet to serve as a negative electrode to form an orthogonal electromagnetic field, argon is injected in a high vacuum state to form glow discharge in a low vacuum environment, argon ions of the argon are ionized and accelerated to collide atoms of the target to escape, and the argon ions are accumulated on the surface of the touch screen basement membrane to form a plated film under the acceleration of the. The method has the advantages of wide range of the plated work material, suitability for interactive sputtering of metal or nonmetal plated parts and metal or nonmetal plated target materials, good uniformity of the plating layer, high adhesion of the plating layer and controllability of the thickness of the plating layer. The defects of the prior art are overcome.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Shown in the figure: 1-touch screen basement membrane, 2-argon, 3-permanent magnet 4-target, 5-cooling water, 6-positive electrode, 7-negative electrode, 8-vacuum plating chamber and 9-plating membrane.

Detailed Description

The invention will be better understood by the following description of embodiments thereof, but the applicant's specific embodiments are not intended to limit the invention to the particular embodiments shown, and any changes in the definition of parts or features and/or in the overall structure, not essential changes, are intended to define the scope of the invention.