阅读说明：本技术 配线基板及配线基板的制造方法 (Wiring board and method for manufacturing wiring board ) 是由 山崎丰 加藤诚 于 2019-07-18 设计创作，主要内容包括：本发明涉及一种提高了金属配线相对于基板的紧贴性的配线基板及配线基板的制造方法。配线基板(1)为形成有金属配线的配线基板,其特征在于,具备：基板(2),其以树脂为主成分,并含有具有羟基的有机物(3)；金属电镀层(6),其构成了所述金属配线,所述基板(2)的一个面(2a)上的所述金属配线的形成部分(4)与所述基板(2)的一个面(2a)上的所述金属配线的非形成部分(14)相比而粗糙度较大,并具有与所述树脂交错缠绕的状态下的所述有机物(3)、和催化剂。通过设为这种结构的配线基板(1),从而能够提高金属配线相对于基板(2)的紧贴性。(The present invention relates to a wiring board in which adhesion of a metal wiring to a board is improved, and a method for manufacturing the wiring board. A wiring board (1) on which metal wiring is formed, the wiring board being characterized by comprising: a substrate (2) which contains a resin as a main component and contains an organic substance (3) having a hydroxyl group; and a metal plating layer (6) that constitutes the metal wiring, wherein a portion (4) where the metal wiring is formed on the one surface (2a) of the substrate (2) has a higher roughness than a portion (14) where the metal wiring is not formed on the one surface (2a) of the substrate (2), and the metal plating layer has the organic substance (3) and a catalyst in a state of being intertwined with the resin. With the wiring board (1) having such a configuration, the adhesion of the metal wiring to the substrate (2) can be improved.)

1. A wiring board on which a metal wiring is formed, comprising:

a substrate which contains a resin as a main component and an organic substance having a hydroxyl group;

a metal plating layer constituting the metal wiring,

the metal wiring formed on one surface of the substrate has a roughness larger than that of a non-formed portion of the metal wiring on the one surface of the substrate, and the organic material and the catalyst are entangled with each other in a state of being entangled with the resin.

2. The wiring board according to claim 1,

the organic material has a bulk density higher on one surface side of the substrate than on a central side in a thickness direction of the substrate.

3. A wiring board on which a metal wiring is formed, comprising:

a substrate mainly composed of a resin;

a metal plating layer constituting the metal wiring,

the substrate has metal particles, the metal particles cover an organic material having a hydroxyl group with a metal,

the metal wiring forming portion on one surface of the substrate is in a state where the metal particles and the resin are intertwined with each other.

4. The wiring substrate according to claim 3,

the metal wiring formed on the one surface of the substrate has a larger roughness than the metal wiring non-formed portion on the one surface of the substrate.

5. The wiring substrate according to claim 3,

the metal particles have a bulk density higher on one surface side of the substrate than on a central side in a thickness direction of the substrate.

6. A method for manufacturing a wiring board, comprising:

a substrate molding step of molding a substrate using a material containing a resin as a main component and an organic substance having a hydroxyl group;

a laser irradiation step of irradiating the substrate with laser light;

a catalyst coating step of coating a catalyst on a laser irradiation region on the substrate;

and a metal plating step of performing metal plating on a laser irradiation region on the substrate to which the catalyst is applied.

7. The method of manufacturing a wiring board according to claim 6,

in the substrate forming step, the material is injected into a metal mold, and a mold clamping force applied to the metal mold is adjusted to form a surface layer and an inner layer,

in the laser irradiation step, the resin of the surface layer is ablated to expose the organic material contained in the internal layer.

8. A method for manufacturing a wiring board, comprising:

a precipitation step of obtaining metal particles by precipitating metal ions in an aqueous solution containing the metal ions, an organic substance, and a catalyst;

a kneading step of kneading the metal particles and a resin;

a substrate molding step of molding a substrate using the material kneaded in the kneading step;

a laser irradiation step of irradiating the substrate with laser light;

and a metal plating step of performing metal plating on the laser-irradiated region on the substrate.

Technical Field

The present invention relates to a wiring board and a method of manufacturing the wiring board.

Background

Various wiring boards have been used. On such a wiring board, a metal wiring is formed as a wiring made of metal.

For example, patent document 1 discloses a method for manufacturing a wiring board, i.e., a molded circuit member, in which a synthetic resin substrate is irradiated with a laser beam to modify the surface of the substrate, and the surface-modified portion is brought into contact with an ion catalyst to perform electroless plating, thereby forming metal wiring.

In the method for manufacturing a molded circuit member disclosed in patent document 1, a synthetic resin substrate is irradiated with a laser beam to modify the surface of the synthetic resin substrate, and the surface-modified portion is brought into contact with an ion catalyst. However, if only the surface-modified portion is brought into contact with the ion catalyst, the ion catalyst is merely applied to the surface of the synthetic resin substrate, and the metal wiring formed by electroless plating may not have sufficient adhesion to the substrate.

Patent document 1: japanese laid-open patent publication No. 2012-136769

Disclosure of Invention

A wiring board according to the present invention for solving the above problems is a wiring board on which metal wiring is formed, the wiring board including: a substrate which contains a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer which constitutes the metal wiring, wherein a portion of the substrate on which the metal wiring is formed has a higher roughness than a portion of the substrate on which the metal wiring is not formed, and the metal plating layer has the organic substance and the catalyst in a state of being intertwined with the resin.

Drawings

Fig. 1 is a schematic diagram for explaining a wiring board and a method of manufacturing the wiring board according to embodiment 1 of the present invention.

Fig. 2 is a flowchart of a method for manufacturing a wiring board according to embodiment 1 of the present invention.

Fig. 3 is a schematic diagram for explaining a wiring board and a method of manufacturing the wiring board according to embodiment 2 of the present invention.

Fig. 4 is a flowchart of a method for manufacturing a wiring board according to embodiment 2 of the present invention.

Detailed Description

First, the present invention will be described in brief.

A wiring board according to a first aspect of the present invention for solving the above problems is a wiring board on which metal wiring is formed, the wiring board including: a substrate which contains a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer which constitutes the metal wiring, wherein a portion of the substrate on which the metal wiring is formed has a higher roughness than a portion of the substrate on which the metal wiring is not formed, and the metal plating layer has the organic material and the catalyst in a state of being intertwined with the resin.

According to this aspect, the metal plating layer as the metal wiring is disposed at a position having a larger roughness than the non-formed portion of the metal wiring. That is, by disposing the metal plating layer at a position having a larger roughness than the non-formed portion of the metal wiring, the adhesion of the metal wiring to the substrate is improved. The metal plating layer is disposed at a position having the organic matter and the catalyst in a state of being intertwined with the resin. That is, the hydroxyl groups of the organic material in a state of being intertwined with the resin of the substrate and the catalyst are chemically bonded to each other, so that the metal plating is performed using the catalyst in which the organic material in a state of being intertwined with the resin of the substrate is bonded. Therefore, by performing metal plating using not only the catalyst applied to one surface of the substrate but also an organic material and a catalyst in a state of being intertwined with the resin of the substrate, the adhesion of the metal wiring to the substrate can be improved.

Here, the term "catalyst" means a catalyst in a metal deposition reaction when a metal plating layer is formed. The term "large roughness" means that the condition that the roughened position of one surface of the substrate is higher in adhesion of the metal plating layer than the non-roughened position of one surface of the substrate is satisfied. Therefore, "the roughness is large" also includes a case where one surface of the substrate is rough in advance and a portion where the metal plating layer is not formed is planarized. When the roughness of one surface of the substrate on which the metal wiring is formed and on which the metal wiring is not formed is compared, the roughness is quantified using parameters indicating the roughness such as arithmetic mean roughness (Ra) and root mean square roughness (Rms) based on a cross-sectional image of the substrate obtained by a microscope or information obtained by measuring the roughness of one surface of the substrate by contact or non-contact (atomic force microscope (AFM), Scanning Probe Microscope (SPM), laser microscope, ultrasonic non-destructive method, etc.), and the comparison is performed.

In a wiring board according to a second aspect of the present invention, in the first aspect, the bulk density of the organic material is higher on one surface side of the board than on a central side in a thickness direction of the board.

According to this aspect, since the organic material has a higher bulk density on one surface side of the substrate than on the central side in the thickness direction of the substrate, the organic material can be effectively increased in a state of being intertwined with the resin of the substrate, and the adhesion of the metal wiring to the substrate can be improved.

A wiring board of a wiring board according to a third aspect of the present invention is a wiring board on which metal wiring is formed, the wiring board including: a substrate mainly composed of a resin; and a metal plating layer that constitutes the metal wiring, wherein the substrate has metal particles, the metal particles cover an organic substance having hydroxyl groups with a metal, and a portion of the substrate where the metal wiring is formed on one surface of the substrate is in a state where the metal particles and the resin are intertwined.

According to this aspect, the substrate has metal particles which are formed by covering an organic material having a hydroxyl group with a metal and depositing a metal on the metal particles in a state of being intertwined with the substrate to form a metal plating layer. Therefore, the adhesion of the metal wiring to the substrate can be improved.

A wiring board according to a fourth aspect of the present invention is characterized in that, in the third aspect, a portion of the substrate on which the metal wiring is formed has a larger roughness than a portion of the substrate on which the metal wiring is not formed.

According to this aspect, the metal plating layer as the metal wiring is disposed at a position where the roughness is larger than that of the non-formed portion of the metal wiring. That is, by disposing the metal plating layer at a position having a larger roughness than the non-formed portion of the metal wiring, the adhesion of the metal wiring to the substrate is improved.

A wiring board according to a fifth aspect of the present invention is characterized in that, in the third or fourth aspect, the metal particles have a higher bulk density on one surface side of the substrate than on a central side in a thickness direction of the substrate.

According to this aspect, since the volume density of the metal particles is higher on one surface side of the substrate than on the central side in the thickness direction of the substrate, the metal particles in a state of being intertwined with the resin of the substrate can be effectively increased, and the adhesion of the metal wiring to the substrate can be improved.

A method for manufacturing a wiring board according to a sixth aspect of the present invention includes: a substrate molding step of molding a substrate using a material containing a resin as a main component and an organic substance having a hydroxyl group; a laser irradiation step of irradiating the substrate with laser light; a catalyst coating step of coating a catalyst on a laser irradiation region on the substrate; and a metal plating step of performing metal plating on a laser irradiation region on the substrate to which the catalyst is applied.

According to this embodiment, metal plating as a metal wiring is formed on the laser-irradiated region. That is, by forming the metal plating on the roughened portion by the laser, the adhesion of the metal wiring to the substrate is improved. The metal plating is formed at a position having an organic material exposed by irradiation of the laser beam and intertwined with the resin. Then, the hydroxyl groups of the organic material in a state of being intertwined with the resin of the substrate and the catalyst are chemically bonded to each other, so that the metal plating is performed using the catalyst in which the organic material in a state of being intertwined with the resin of the substrate is bonded. Therefore, by performing metal plating using not only the catalyst coated on one surface of the substrate but also an organic material and a catalyst in a state of being intertwined with the resin of the substrate, the adhesion of the metal wiring to the substrate can be improved.

A seventh aspect of the present invention is directed to the method for manufacturing a wiring board, in the sixth aspect, the material is injected into a mold in the substrate forming step, and a mold clamping force applied to the mold is adjusted to form a surface layer and an internal layer, and the resin of the surface layer is ablated in the laser irradiation step to expose the organic material contained in the internal layer.

According to this aspect, the organic material contained in the internal layer is exposed by ablation of the resin of the surface layer, and therefore the organic material can be efficiently formed in a state of being intertwined with the resin of the substrate, and the adhesion of the metal wiring to the substrate can be improved.

A method for manufacturing a wiring board according to an eighth aspect of the present invention includes: a precipitation step of obtaining metal particles by precipitating metal ions in an aqueous solution containing the metal ions, an organic substance, and a catalyst; a kneading step of kneading the metal particles and a resin; a substrate molding step of molding a substrate using the material kneaded in the kneading step; a laser irradiation step of irradiating the substrate with laser light; and a metal plating step of performing metal plating on the laser-irradiated region on the substrate.

According to this embodiment, metal plating as a metal wiring is formed on the laser-irradiated region. That is, the metal plating is formed at the roughened position by the laser beam, thereby improving the adhesion of the metal wiring to the substrate. The metal plating is formed at a position having an organic material exposed by irradiation of the laser beam and intertwined with the resin. Then, metal plating is performed by depositing metal on metal particles in a state of being intertwined with the resin of the substrate, and metal plating is performed using metal particles in a state of being intertwined with the resin of the substrate. Therefore, the adhesion of the metal wiring to the substrate can be improved.

The metal constituting the metal particles and the metal used in the metal plating may not be the same metal, but the same metal is preferable.

Hereinafter, a wiring board and a method of manufacturing the wiring board according to an embodiment of the present invention will be described in detail with reference to the drawings.