阅读说明：本技术 可适性压头结构 (Adaptive pressure head structure ) 是由 洪诗雅 魏敬训 于 2019-10-14 设计创作，主要内容包括：一种可适性压头结构,包括有：一微形压头容置部、一热压部及一帮浦槽；其中,进行热压合一曲面产品时,可先将该热压部下压该曲面产品,使该等微形压头配合该曲面产品之形状,而缩入该微形压头容置部内改变高度,来改变该热压部之形状成配合该曲面产品之形状后,接着再关闭该帮浦槽与该微形压头容置部之连接,而藉由该微形压头容置部内之液体的液体压力,令该热压部之形状固定于改变后之形状,之后再上抬该热压部,即可将该曲面产品放置好后,进行该曲面产品之热压合,热压合结束后,再开启该帮浦槽与该微形压头容置部之连接而解除固定,该等微形压头又回复初始等高的状态。(An adaptive indenter structure, comprising: a micro-pressure head container, a hot-pressing part and a pump groove; when a curved surface product is hot pressed, the hot pressing part presses the curved surface product, the micro pressing heads are matched with the shape of the curved surface product, the curved surface product is retracted into the micro pressing head containing part to change the height, the shape of the hot pressing part is changed to match the shape of the curved surface product, then the connection between the pump tank and the micro pressing head containing part is closed, the shape of the hot pressing part is fixed in the changed shape by the liquid pressure of the liquid in the micro pressing head containing part, then the hot pressing part is lifted, the curved surface product is placed, then the hot pressing of the curved surface product is carried out, after the hot pressing is finished, the connection between the pump tank and the micro pressing head containing part is opened to release the fixation, and the micro pressing heads return to the initial equal height state.)

1. An adaptive indenter structure, comprising:

the micro pressure head containing part is hollow and is internally provided with liquid;

a heat pressing part, which is provided with a plurality of micro-pressing heads, the rear ends of the micro-pressing heads are movably inserted in the front end of the accommodating part of the micro-pressing head, so that the rear ends of the micro-pressing heads can be retracted into the accommodating part of the micro-pressing head to change the shape of the heat pressing part, and the micro-pressing heads are provided with a heating module which can heat and press a compound to be heated; and

a pump tank connected to the micro-indenter accommodating portion, the pump tank having a space for accommodating the liquid, so that the liquid can flow into the pump tank from the micro-indenter accommodating portion or into the micro-indenter accommodating portion from the pump tank, and the rear end of each micro-indenter can be retracted into the micro-indenter accommodating portion to change the shape of the hot-pressing portion;

the curved surface product can be pressed by the hot pressing part, the micro pressing heads are matched with the curved surface product in shape and are retracted into the micro pressing head containing part to change the height, so that the shape of the hot pressing part is changed to be matched with the shape of the curved surface product, then the connection between the pump groove and the micro pressing head containing part is closed, the micro pressing heads are fixed at the positions with the changed heights by the liquid pressure of the liquid in the micro pressing head containing part, so that the shape of the hot pressing part is fixed at the changed shape, then the hot pressing part is lifted up, the hot pressing of the curved surface product can be carried out, after the hot pressing is finished, the connection between the pump groove and the micro pressing head containing part is opened to release the fixation, and the micro pressing heads return to the initial equal height state.

2. The adaptive indenter structure of claim 1, wherein the material of the micro-indenter is stainless steel, titanium alloy, or tungsten steel.

3. The adaptive indenter structure of claim 2, wherein the micro-indenter is square or circular in shape.

4. The adaptive indenter structure of claim 3, wherein the heating temperature of the heating module of the micro-indenter is between 60 degrees and 300 degrees.

5. The adaptive indenter structure of claim 4, wherein the micro-indenters are arranged in rows that are staggered with respect to each other in units of rows perpendicular to the electrode direction.

6. The adaptive ram structure of claim 1, wherein the liquid in the micro ram receiving portion is hydraulic oil.

7. The adaptive indenter structure of claim 1, wherein a valve is disposed at the connection between the pump tank and the indenter container, and the valve is used to close the connection between the pump tank and the indenter container and open the connection between the pump tank and the indenter container.

8. The adaptive indenter structure of claim 2, wherein the micro-indenters are polygonal in shape.

Technical Field

The present invention relates to a structure of adaptive pressing head, and more particularly, to a structure of adaptive pressing head, in which the shape of the hot pressing portion can be changed to match with the shape of the material to be pressed, and the pressing head is not required to be remanufactured due to the change of the hot pressing position or the shape of the material to be pressed.

Background

Along with the evolution of the times, scientific and technological products are closer to life more and more, and the button on the product is replaced gradually to the touch screen, and in order to answer the rapid development of systems such as on-vehicle system and wearable, pursue the design that more fashion more accords with the trend simultaneously, the plane product can't satisfy user's demand yet, the development of curved surface laminating technique is imperative, and the display screen of curved surface makes the image more fresh and alive, also more is closer to human user demand.

According to the conventional thermal compression method for the curved surface product 1, please refer to fig. 1, a region is remained to extend out of the curved surface to be used as a Bonding Pad 11(Bonding Pad) when manufacturing a touch layer 10, and a Flexible Printed Circuit (FPC) 12 and the Bonding Pad 11 are thermally compressed by a planar compression head 13.

However, the retention of the bonding pad 11 causes a great problem in the thermoplastic bonding of the front portion, for example, it takes time to cut the excess material after bonding, the bonding pad 11 is not protected by glass when the internal circuit is formed, and the overall resistance value of the circuit is increased. To solve these problems, it is preferable to omit the bonding pad 11, but in this case, the flexible printed circuit board 12(FPC) and the touch layer 10 must be thermocompressed in a curved surface, and the conventional flat indenter 13 cannot perform curved surface thermocompression bonding.

In order to solve the problem that the flat indenter 13 cannot perform curved surface thermal compression, we have proposed to design an indenter conforming to the shape of the curved surface product 1, and perform thermal compression in the curved surface product 1, which can improve the uniformity of pressure and temperature compared to the flat indenter 13, but has the following disadvantages: once the design of the curved surface product 1 is changed or the thermal compression position is changed, the pressure head must be redesigned, the manufacture of the curved surface pressure head is not easy, time and labor are wasted, and great inconvenience is brought.

Therefore, the conventional articles have many defects, and are not good designers, so that improvement is needed.

Disclosure of Invention

In view of the above, the present inventors have made various experiments on the manufacturing, development and design of related products for many years, and have made detailed design and careful evaluation to achieve the above objectives, and finally have obtained a practical invention.

The object of the present invention is to provide an adaptive indenter structure, which allows the hot pressing portion to change to a shape matching with the shape of the hot pressing compound, without re-manufacturing the indenter due to the change of the hot pressing position or the shape of the hot pressing compound.

In accordance with the above purpose, the adaptive indenter structure of the present invention mainly comprises: a micro-pressure head container, a hot-pressing part and a pump groove; wherein, the micro pressure head containing part is hollow and is internally provided with liquid; the hot pressing part is provided with a plurality of micro pressing heads, the rear ends of the micro pressing heads are movably inserted into the front end of the micro pressing head containing part, so that the rear ends of the micro pressing heads can be retracted into the micro pressing head containing part to change the shape of the hot pressing part, and the micro pressing heads are provided with a heating module which can heat and press a compound to be hot pressed; the pump tank is connected to the micro-indenter receiving portion, and the pump tank is provided therein with a receiving space for receiving the liquid, so that the liquid can flow into the pump tank from the micro-indenter receiving portion, or can flow into the micro-indenter receiving portion from the pump tank, and the rear end of each micro-indenter can be retracted into the micro-indenter receiving portion to change the shape of the hot-pressing portion; thus, when a curved surface product is hot pressed, the hot pressing part presses the curved surface product, so that the micro indenter is retracted into the micro indenter receiving part to change the height, thereby changing the shape of the hot pressing part to match the shape of the curved surface product, then the pump tank is closed to connect with the micro indenter receiving part, and the micro indenter is fixed at the position after the height is changed by the liquid pressure of the liquid in the micro indenter receiving part, thereby fixing the shape of the hot pressing part in the changed shape, and then the hot pressing part is lifted up, so that the hot pressing part is pressed down and heated after the Flexible Printed Circuit (FPC), the Anisotropic Conductive Film (ACF) and the buffer material of the curved surface product are placed, thereby hot pressing and heating the curved surface product, then, the pump tank is opened to connect with the accommodating portion of the micro indenter to release the fixing, and the micro indenter returns to the original state of equal height, so that the hot pressing portion can change the shape of the object to be hot pressed into a matching shape without making an indenter again due to the change of the hot pressing position or the shape of the object to be hot pressed.

For further understanding and appreciation of the objects, shapes, structural features, and functions of the present invention, reference will now be made in detail to the embodiments illustrated in the accompanying drawings, in which:

drawings

FIG. 1 is an external view of a material to be thermocompressed.

Fig. 2 is a schematic view of an adaptive indenter structure according to the present invention.

FIG. 3 is a schematic diagram of the continuous operation of the adaptive indenter structure of the present invention.

FIG. 4 is a schematic diagram of the continuous use of the adaptive indenter structure of the present invention.

FIG. 5 is a schematic diagram of the adaptive indenter structure of the present invention in a staggered arrangement.

Reference numerals

Micro indenter receiving portion 20

Liquid 21

Hot-pressing part 30

Miniature indenter 31

Pump tank 40

Accommodating space 41

Curved surface product 50

Object to be pressed 51

Electrode 52

Detailed Description

The present invention relates to an adaptive indenter structure, which is shown in fig. 2, fig. 3 and fig. 4, and mainly comprises: a micro-indenter receptacle 20, a hot-pressing portion 30, and a pump slot 40.

Wherein, the micro indenter housing part 20 is hollow and contains a liquid 21.

The hot pressing part 30 is provided with a plurality of micro-pressing heads 31, the rear ends of the micro-pressing heads 31 are movably inserted into the front end of the micro-pressing head accommodating part 20, so that the rear ends of the micro-pressing heads 31 can be retracted into the micro-pressing head accommodating part 20 to change the shape of the hot pressing part 30, and the micro-pressing heads 31 are provided with a heating module (not shown) capable of heating to carry out hot pressing on a compound to be hot pressed.

The pump tank 40 is connected to the micro-indenter housing portion 20, and the pump tank 40 is provided with a housing space 41 for housing the liquid 21, so that the liquid 21 can flow into the pump tank 40 from the micro-indenter housing portion 20, or can flow into the micro-indenter housing portion 20 from the pump tank 40, and the rear end of each micro-indenter 31 can be retracted into the micro-indenter housing portion 20 to change the shape of the hot pressing portion 30.

By means of the above components, when performing hot pressing to a curved surface product 50, the hot pressing part 30 can press down the curved surface product 50 first, so that the micro indenter 31 matches the shape of the curved surface product 50 and retracts into the micro indenter receiving part 20 to change the height, so as to change the shape of the hot pressing part 30 to match the shape of the curved surface product 50, then the connection between the pump tank 40 and the micro indenter receiving part 20 is closed, and the micro indenter 31 is fixed at the position after changing the height by the liquid pressure 211 of the liquid 21 in the micro indenter receiving part 20, so that the shape of the hot pressing part 30 is fixed at the changed shape, then the hot pressing part 30 is lifted up, so as to press down and heat the hot pressing part 30 after the soft printed circuit board (FPC), the Anisotropic Conductive Film (ACF) and the buffer material 51 of the curved surface product 50 are placed, the curved product 50 is thermally pressed, after the thermal pressing, the pump tank 40 and the micro indenter container 20 are opened to release the fixation, and the micro indenters 31 return to the original state of equal height.

Thus, the hot pressing portion 30 can be changed to a shape matching the shape of the hot pressing compound, and the pressing head is not required to be re-manufactured due to the change of the hot pressing position or the shape of the hot pressing compound.

Referring to fig. 2, 3 and 4, the material of the micro indenter 31 may be stainless steel, titanium alloy or tungsten steel.

Referring to fig. 2, 3 and 4, the micro indenter 31 may be square or circular in shape.

Referring to fig. 2, 3 and 4, the micro indenter 31 may be polygonal in shape.

Referring to fig. 2, 3 and 4, the heating temperature of the heating module of the micro indenter 31 depends on the requirement of Anisotropic Conductive Film (ACF) to be pressed, and is usually between 60 degrees and 300 degrees.

Referring to FIG. 5, the micro indenters 31 are arranged in a manner that the rows are staggered with respect to each other in units of rows perpendicular to the direction of the electrodes 52.

Referring to fig. 2, 3 and 4, the liquid 21 in the micro-indenter housing 20 can be hydraulic oil.

Referring to fig. 2, 3 and 4, a valve (not shown) may be disposed at the connection between the pump tank 40 and the micro-indenter container 20, and the valve is used to close the connection between the pump tank 40 and the micro-indenter container 20 and open the connection between the pump tank 40 and the micro-indenter container 20.

While the invention has been described with reference to specific preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.