阅读说明：本技术 抗干扰的刚挠结合板制作方法及装置 (Method and device for manufacturing anti-interference rigid-flex printed circuit board ) 是由 孙启双 孙文兵 于 2019-09-26 设计创作，主要内容包括：本发明公开了一种抗干扰的刚挠结合板制作方法及装置,方法包括：制作两个挠性板,在挠性板的上下表面贴附银膜,在银膜上贴绝缘覆盖膜,压合两个挠性板得到复合挠性板；压合复合挠性板和刚性板,得到刚挠结合板。装置用于执行方法。本发明实施例通过制作两个挠性板,在挠性板的上下表面贴附银膜,在银膜上贴绝缘覆盖膜,压合两个挠性板得到复合挠性板；压合复合挠性板和刚性板,得到刚挠结合板；能够防止通过银膜屏蔽信号,通过绝缘覆盖膜保护电路,通过刚挠结合提高PCB的适用性,降低传输损耗。(The invention discloses a method and a device for manufacturing an anti-interference rigid-flex printed circuit board, wherein the method comprises the following steps: manufacturing two flexible boards, attaching silver films to the upper and lower surfaces of the flexible boards, attaching insulating cover films to the silver films, and pressing the two flexible boards to obtain a composite flexible board; and pressing the composite flexible plate and the rigid plate to obtain the rigid-flex printed circuit board. The apparatus is for performing a method. In the embodiment of the invention, two flexible plates are manufactured, silver films are attached to the upper surface and the lower surface of each flexible plate, insulating cover films are attached to the silver films, and the two flexible plates are pressed to obtain the composite flexible plate; pressing the composite flexible plate and the rigid plate to obtain a rigid-flex printed circuit board; can prevent through silver membrane shielding signal, through insulating cover membrane protection circuit, through the suitability that rigid-flex combined improved PCB, reduce transmission loss.)

1. A manufacturing method of an anti-interference rigid-flex printed circuit board is characterized by comprising the following steps:

manufacturing two flexible boards, attaching silver films to the upper and lower surfaces of the flexible boards, attaching insulating cover films to the silver films, and pressing the two flexible boards to obtain a composite flexible board;

and pressing the composite flexible plate and the rigid plate to obtain the rigid-flex printed circuit board.

2. The method for manufacturing an anti-interference rigid-flex printed circuit board according to claim 1, wherein a type 106 low-flow glue PP sheet containing 63% glue is arranged between the composite flexible board and the rigid board.

3. The method of claim 1, wherein the flexplate includes a bending region, and the silver film is disposed in the bending region.

4. The method for manufacturing an anti-interference rigid-flex printed circuit board according to claim 1, wherein the rigid board comprises a single-layer rigid board and/or a composite rigid board, wherein the single-layer rigid board and a 1080 model PP sheet with a glue content of 68% are pressed to form the composite rigid board.

5. The method for manufacturing an anti-interference rigid-flex printed circuit board according to any one of claims 1 to 4, wherein the flexible boards are pressed together through epoxy AD glue.

6. The method for manufacturing an anti-interference rigid-flex printed circuit board according to claim 4, wherein the single-layer rigid board conforms to the specification of FR4, and the thickness of the single-layer rigid board is 0.15mm or 0.1 mm; the thickness of the flexible plate is 50 um; the thickness of the silver film is 80 um; the thickness of the insulating cover film is 80 um.

7. The method of claim 5, wherein the flexplate includes a non-bending region, and the epoxy AD glue is disposed in the non-bending region.

8. The method for manufacturing an anti-interference rigid-flex printed circuit board according to claim 6 or 7, wherein the area of the insulating cover film between the two flexible boards is equal to the area of the flexible boards;

the area of the insulating covering film, which is in contact with the rigid plate, of the flexible plate is not smaller than the area of the bending area.

9. The method of claim 8, wherein the flexible board and the rigid board are provided with 1.0mm exhaust holes.

10. The utility model provides an anti-interference rigid-flex printed circuit board making devices which characterized in that includes:

the manufacturing module is used for manufacturing two flexible boards, attaching silver films to the upper and lower surfaces of the flexible boards, attaching insulating cover films to the silver films, and pressing the two flexible boards to obtain a composite flexible board;

and the pressing module is used for pressing the composite flexible plate and the rigid plate to obtain the rigid-flex printed circuit board.

Technical Field

The invention relates to the technical field of PCBs, in particular to a method and a device for manufacturing an anti-interference rigid-flex printed circuit board.

Background

Rigid-flex boards are comprised of rigid and flexible substrates that are selectively laminated together. The layers are conductively connected using metallized holes. Each panel reveals one or more soft zones. The rigid-flexible printed board is convenient to install, can be bent and installed in a three-dimensional mode, and effectively utilizes the installation space, so that the reliability is high. The combination of rigidity and flexibility can replace a press plug-in unit, and high reliability under vibration impact, humid and severe environments is guaranteed.

With the development of 5G communication, the output of a Rigid-Flex printed circuit board (Rigid-Flex PCB) is promoted to be continuously increased, and particularly, the Rigid-Flex printed circuit board combines the advantages of Rigid materials and the characteristics of flexible materials, so that the Rigid-Flex printed circuit board has good superiority on communication with higher signal transmission requirements. Powerful function can be realized to 5G equipment, and is corresponding, and the controller needs multilayer rigid-flex printed circuit board, can carry out 5G equipment of drive and carry out more functions, and at this moment, if the interference of the appearance signal of multilayer rigid-flex printed circuit board, then can influence the whole realization with partial function of PCB, improve the transmission loss of circuit.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the invention aims to provide a method for manufacturing an anti-interference rigid-flex printed circuit board.

Therefore, the second purpose of the invention is to provide an anti-interference rigid-flex printed circuit board manufacturing device.

The technical scheme adopted by the invention is as follows:

in a first aspect, an embodiment of the present invention provides a method for manufacturing an anti-interference rigid-flex printed circuit board, including: manufacturing two flexible boards, attaching silver films to the upper and lower surfaces of the flexible boards, attaching insulating cover films to the silver films, and pressing the two flexible boards to obtain a composite flexible board; and pressing the composite flexible plate and the rigid plate to obtain the rigid-flex printed circuit board.

Preferably, a low-flow-adhesive PP sheet with adhesive 63% of type 106 is included between the composite flexible plate and the rigid plate.

Preferably, the flexible board includes a bending region, and the silver film is provided to the bending region.

Preferably, the rigid plate comprises a single-layer rigid plate and/or a composite rigid plate, wherein the single-layer rigid plate and a 1080 model PP sheet with the glue content of 68% are pressed to form the composite rigid plate.

Preferably, the flexible plates are pressed together through epoxy AD glue.

Preferably, the single-layer rigid plate conforms to the FR4 specification and has a thickness of 0.15mm or 0.1 mm; the thickness of the flexible plate is 50 um; the thickness of the silver film is 80 um; the thickness of the insulating cover film is 80 um.

Preferably, the flexible board includes a non-bending region, and the epoxy AD glue is disposed on the non-bending region.

Preferably, the area of the insulating cover film between the two flexible sheets is equal to the area of the flexible sheets; the area of the insulating cover film where the flexible board contacts the rigid board is not smaller than the area of the bending area.

Preferably, the flexible and rigid plates are provided with 1.0mm vent holes.

In a second aspect, an embodiment of the present invention provides an apparatus for manufacturing an anti-interference rigid-flex printed circuit board, including: the manufacturing module is used for manufacturing two flexible boards, attaching silver films to the upper and lower surfaces of the flexible boards, attaching insulating cover films to the silver films, and pressing the two flexible boards to obtain a composite flexible board; and the pressing module is used for pressing the composite flexible plate and the rigid plate to obtain the rigid-flex printed circuit board.

The embodiment of the invention has the beneficial effects that:

in the embodiment of the invention, two flexible plates are manufactured, silver films are attached to the upper surface and the lower surface of each flexible plate, insulating cover films are attached to the silver films, and the two flexible plates are pressed to obtain the composite flexible plate; pressing the composite flexible plate and the rigid plate to obtain a rigid-flex printed circuit board; can prevent through silver membrane shielding signal, through insulating cover membrane protection circuit, through the suitability that rigid-flex combined improved PCB, reduce transmission loss.

Drawings

FIG. 1 is a flow chart of an embodiment of a method for fabricating an anti-interference rigid-flex printed circuit board;

FIG. 2 is a block diagram of an embodiment of a 20-layer rigid-flex bonded panel;

FIG. 3 is a flow diagram of an embodiment of a hardboard fabrication process;

FIG. 4 is a flow chart of an embodiment of a soft board fabrication process;

FIG. 5 is a connection diagram of an embodiment of a device for making a rigid-flex printed circuit board resistant to interference.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.