阅读说明：本技术 一种柔性线路板精密蚀刻装置 (Precise etching device for flexible circuit board ) 是由 郭立铭 郭立德 于 2018-07-16 设计创作，主要内容包括：本发明提供一种柔性线路板精密蚀刻装置,包括主槽、虹吸部分、喷淋部分和吸液部分,所述虹吸部分包括虹吸管,所述虹吸管的一端与虹吸工作泵连接,一端通过吸液连接软管与吸液部分连接,所述吸液部分包括吸液管,所述吸液管通过吸液连接软管与虹吸管连接,所述喷淋部分包括上主喷淋管,所述上主喷淋管的一端与喷淋工作泵连接,另一端与多个上喷淋管连接,所述上喷淋管和吸液管位于主槽内,所述虹吸管、虹吸工作泵、喷淋工作泵和上喷淋主管位于主槽外部。本发明柔性线路板精密蚀刻装置具有药液喷淋均匀、蚀刻均匀性高、蚀刻因子高,以及能够实现超薄基板和超细线路蚀刻且不会卡板的优点。(The invention provides a precise etching device for a flexible circuit board, which comprises a main tank, a siphon part, a spraying part and a liquid absorption part, wherein the siphon part comprises a siphon, one end of the siphon is connected with a siphon working pump, the other end of the siphon is connected with the liquid absorption part through a liquid absorption connecting hose, the liquid absorption part comprises a liquid absorption pipe, the liquid absorption pipe is connected with the siphon through the liquid absorption connecting hose, the spraying part comprises an upper main spraying pipe, one end of the upper main spraying pipe is connected with the spraying working pump, the other end of the upper main spraying pipe is connected with a plurality of upper spraying pipes, the upper spraying pipes and the liquid absorption pipe are positioned in the main tank, and the siphon, the siphon working pump, the spraying working pump and the upper spraying main pipe are. The flexible circuit board precision etching device has the advantages of uniform liquid medicine spraying, high etching uniformity, high etching factor, capability of realizing the etching of ultrathin substrates and ultrathin circuits and no clamping.)

1. The utility model provides a flexible line way board precision etching device which characterized in that: including main tank, siphon part, spray portion and imbibition part, the siphon part includes the siphon, the one end and the siphon working pump of siphon are connected, and one end is passed through imbibition coupling hose and is connected with the imbibition part, the imbibition part includes the pipette, the pipette passes through imbibition coupling hose and is connected with the siphon, spray the part including last main shower, the one end of going up main shower is connected with the work pump that sprays, and the other end is connected with a plurality of spray pipes that go up, it is located the main tank with the pipette to go up shower and be connected, siphon working pump, spray the work pump and go up to spray and be responsible for and be located the main tank outside.

2. The precision etching device for the flexible circuit board according to claim 1, wherein: the siphon is connected with the imbibition connecting hose through a siphon pipeline, and a transparent pipeline is arranged between the siphon pipeline and the imbibition connecting hose.

3. The precision etching device for the flexible circuit board according to claim 2, wherein: and a pneumatic valve is arranged on the siphon pipeline and is controlled by a PLC automatic control system.

4. The precision etching device for the flexible circuit board according to claim 3, wherein: and a plurality of proximity nozzles for spraying towards the substrate direction are uniformly distributed on each upper spraying pipe, and the nozzles on the adjacent upper spraying pipes are in staggered distribution.

5. The precision etching device for the flexible circuit board according to claim 4, wherein: the proximity nozzle is fixedly arranged on the upper spraying pipe, and the distance from the proximity nozzle to the surface of the substrate plate is 60 mm.

6. The precision etching device for the flexible circuit board according to claim 5, wherein: the number of the proximity nozzles on each spray pipe is 16.

7. A precision etching apparatus for a flexible wiring board according to any one of claims 1 to 6, characterized in that: the siphon is a three-way pipe, one end of the siphon is connected with the siphon working pump, one end of the siphon is connected with the liquid suction part through the liquid suction connecting hose, and the other end of the siphon is a liquid outlet of the siphon.

8. The precision etching device for the flexible circuit board according to claim 7, wherein: the pipette is installed on the conveying wheel in the main groove through a movable fixing seat, and the movable fixing seat is connected with the conveying wheel in a clamping mode.

9. The precision etching device for the flexible circuit board according to claim 8, wherein: the pipette is made of a titanium material.

10. The working principle is as follows:

1. the spraying pump extracts the liquid medicine in the main tank and sprays the liquid medicine on the surface of the substrate through the upper main spraying pipe and the upper spraying pipe;

2. the siphon working pump extracts the liquid medicine in the main tank and generates negative pressure in the liquid suction pipe through the liquid flow speed difference in the siphon pipe;

3. the liquid medicine on the surface of the substrate is sucked by the liquid suction pipe, returns to the siphon through the transparent pipe and the pneumatic valve, and returns to the etching main tank from the outlet of the siphon;

4. movable fixing seat: the pipette is fixed to the upper conveying branch by means of a movable seat, the purpose of which is to ensure that the printed circuit board is not in any way damaged

The device comprises a conveying wheel sheet, a proximity test nozzle, a movable fixing seat, a liquid suction pipe, a pneumatic valve, a siphon, a liquid suction pipe connecting hose and a main groove device (comprising the liquid suction pipe, the pneumatic valve, the siphon, a liquid suction pipe connecting pipe structure, a main groove structure and installation).

Technical Field

The invention relates to the technical field of flexible circuit board etching, in particular to a flexible circuit board precision etching device.

Background

With the development of the industry, the printed circuit board is developed towards multilayering, densification and flexibility, the lines are thinner and thinner, the thickness of the substrate is thinner and thinner, the requirement on the etching process is higher and higher, the traditional etching equipment cannot enable the thin plate to pass when the thin plate reaches below 0.050mm, and the circuit board with fine circuits below 50um is difficult to etch.

Disclosure of Invention

The invention provides a flexible circuit board precision etching device which can uniformly spray liquid medicine, can enable a 0.036mm thin plate to smoothly pass through without causing clamping plates, and can manufacture a 30um ~ 50um superfine circuit.

The invention can be realized by the following technical scheme:

the utility model provides a flexible line way board precision etching device, includes main groove, siphon part, spray part and imbibition part, the siphon part includes the siphon, the one end and the siphon working pump of siphon are connected, and one end is passed through imbibition coupling hose and is connected with the imbibition part, the imbibition part includes the pipette, the pipette passes through the imbibition coupling hose and is connected with the siphon, spray part includes main shower, the one end of going up main shower is connected with the spray working pump, and the other end is connected with a plurality of spray pipes that go up, it is located the main groove to go up shower and pipette, siphon working pump, spray working pump and upward spray the person in charge and be located the main groove outside. The flexible circuit board precision etching device is adopted to carry out precision etching on the flexible circuit board, the liquid medicine in the main tank is pumped by the spraying working pump and is sprayed to the surface of the substrate through the upper main spraying pipe and the upper spraying pipe, then the liquid medicine in the main tank is pumped by the siphon working pump and generates negative pressure in the liquid suction pipe through the liquid flow speed difference in the siphon pipe, and the liquid suction pipe sucks the liquid medicine on the surface of the substrate, returns to the siphon pipe through the transparent pipe and the pneumatic valve and returns to the etching main tank from the liquid outlet of the siphon pipe. The flexible circuit board precision etching device is adopted to carry out precision etching on the flexible circuit board, the liquid flow speed difference in the siphon tube is utilized to generate negative pressure in the siphon tube, the liquid medicine on the surface of the substrate sucked by the liquid suction tube returns to the siphon tube through the transparent tube and the pneumatic valve, the purpose of absorbing the liquid medicine after the reaction of the printed circuit board is achieved, the pool effect is effectively reduced, the etching uniformity is improved, the flexible circuit board etching uniformity is good, can reach more than 95 percent, improves the etching uniformity by 5 to 10 percent compared with the traditional etching equipment, has high etching factor reaching more than 4.5 percent, improves the etching factor by more than 30 percent compared with the traditional etching equipment, can ensure that the ultrathin substrate with the thickness of 0.036mm can pass smoothly without clamping, and can etch 30um superfine circuit, traditional etching equipment can only produce circuit more than 50um, provides the guarantee to the development of ultra-thinness direction for flexible line way board.

Furthermore, the siphon is connected with the imbibition connecting hose through a siphon pipeline, and a transparent pipeline is arranged between the siphon pipeline and the imbibition connecting hose. The setting of imbibition coupling hose, the installation of being convenient for, the setting of transparent pipeline is convenient for observe in real time.

Furthermore, a pneumatic valve is arranged on the siphon pipeline and controlled by a PLC automatic control system. Set up the pneumatic valve in the siphon pipeline, through the switching of PLC automatic control system control pneumatic valve, when the base plate front plate limit passes through 5cm, PLC automatic control pneumatic valve opens, and the liquid medicine of base plate face is absorb to the pipette, and when reacing base plate rear plate limit 5cm, PLC automatic control system control pneumatic valve is closed, effectively ensures that the ultra-thin base plate of 0.036mm thickness passes through smoothly, can not the cardboard. Specifically, a plurality of proximity nozzles spraying towards the substrate direction are uniformly distributed on each upper spraying pipe, and the nozzles on the adjacent upper spraying pipes are in staggered distribution. The proximity nozzle is fixedly arranged on the upper spraying pipe, and the distance from the proximity nozzle to the surface of the substrate plate is 60 mm. The number of the proximity nozzles on each spray pipe is 16. The siphon is a three-way pipe, one end of the siphon is connected with the siphon working pump, one end of the siphon is connected with the liquid suction part through the liquid suction connecting hose, and the other end of the siphon is a liquid outlet of the siphon. The pipette is installed on the conveying wheel in the main groove through a movable fixing seat, and the movable fixing seat is connected with the conveying wheel in a clamping mode. The pipette is made of titanium materials and has the advantages of high strength, long service life, difficult deformation and the like.

The precise etching device for the flexible circuit board has the following beneficial effects:

the flexible circuit board precision etching device is adopted to carry out precision etching on the flexible circuit board, the liquid flow speed difference in the siphon tube is utilized to generate negative pressure in the siphon tube, the liquid medicine on the surface of the substrate sucked by the liquid suction tube returns to the siphon tube through the transparent tube and the pneumatic valve, the purpose of absorbing the liquid medicine after the reaction of the printed circuit board is achieved, the pool effect is effectively reduced, the etching uniformity is improved, the flexible circuit board etching uniformity is good, can reach more than 95 percent, improves the etching uniformity by 5 to 10 percent compared with the traditional etching equipment, has high etching factor reaching more than 4.5 percent, improves the etching factor by more than 30 percent compared with the traditional etching equipment, can ensure that the ultrathin substrate with the thickness of 0.036mm can pass smoothly without clamping, and can etch 30um superfine circuit, traditional etching equipment can only produce circuit more than 50um, provides the guarantee to the development of ultra-thinness direction for flexible line way board.

Drawings

FIG. 1 is a schematic structural arrangement diagram of a flexible circuit board precision etching device of the present invention;

fig. 2 is a partially enlarged view of fig. 1.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the following detailed description of the present invention is provided with reference to the accompanying drawings.

As shown in fig. 1, a flexible circuit board precision etching device comprises a main tank 10, a siphon part 20, a spraying part 30 and a liquid absorbing part 40, wherein the siphon part 20 comprises a siphon 22, one end of the siphon 22 is connected with a siphon working pump 21, the other end is connected with the liquid absorbing part 40 through a liquid absorbing connecting hose 44, the liquid absorbing part 40 comprises a liquid absorbing pipe 41, and the liquid absorbing pipe 41 is made of titanium material, and has the advantages of high strength, long service life, difficult deformation and the like. The liquid suction pipe 41 is connected with the siphon 22 through a liquid suction connection hose 44, the spraying part 30 includes an upper main spraying pipe 32, one end of the upper main spraying pipe 32 is connected with the spraying work pump 31, the other end is connected with the plurality of upper spraying pipes 33, the upper spraying pipes 33 and the liquid suction pipe 41 are positioned in the main tank 10, and the siphon 22, the siphon work pump 21, the spraying work pump 31 and the upper spraying main pipe are positioned outside the main tank 10. The siphon tube 22 is connected to a suction connection hose 44 through a siphon tube 22 line, and a transparent tube 45 line is provided between the siphon tube 22 line and the suction connection hose 44. The liquid suction connecting hose 44 is convenient to install, and the transparent pipe 45 is convenient to observe in real time. And a pneumatic valve 23 is arranged on the siphon 22, and the pneumatic valve 23 is controlled by a PLC automatic control system. Set up pneumatic valve 23 in siphon 22 way, through the switching of PLC automatic control system control pneumatic valve 23, when the base plate front plate limit passes through 5cm, PLC automatic control pneumatic valve 23 opens, and pipette 41 absorbs the liquid medicine of base plate face, and when reacing base plate rear plate limit 5cm, PLC automatic control system control pneumatic valve 23 closes, effectively ensures that the ultra-thin base plate of 0.036mm thickness passes through smoothly, can not the cardboard.

As shown in fig. 1 and 2, a plurality of proximity nozzles 34 for spraying toward the substrate are uniformly distributed on each upper shower 33, and the nozzles 34 on adjacent upper shower 33 are distributed in a staggered manner. The proximity nozzle 34 is fixedly arranged on the upper spray pipe 33, and the distance from the proximity nozzle 34 to the surface of the substrate plate is 60 mm. The number of proximity nozzles 34 per shower is 16. The siphon 22 is a three-way pipe, one end of the siphon 22 is connected with the siphon working pump 21, one end is connected with the liquid suction part 40 through a liquid suction connecting hose 44, and the other end is a liquid outlet 24 of the siphon 22. The pipette 41 is mounted on a conveying wheel 43 in the main tank 10 by means of a movable fixing seat 42, the movable fixing seat 42 being snap-linked with the conveying wheel 43. Specifically, the movable fixing seats 42 are movably mounted on vertical plates at two ends of the mounting frame 11 in the main groove 10, and the movable fixing seats 42 are clamped on the vertical plates through movable parts to form movable connection.

Referring to fig. 1 and 2, the flexible printed circuit board precision etching apparatus of the present invention is used to precisely etch the flexible printed circuit board, the spraying working pump 31 pumps the liquid medicine in the main tank 10 to spray the liquid medicine on the surface of the substrate through the upper main spraying pipe 32 and the upper spraying pipe 33, then the siphon 22 working pump pumps the liquid medicine in the main tank 10 to generate negative pressure in the liquid suction pipe 41 through the flow rate difference in the siphon 22, and the liquid suction pipe 41 sucks the liquid medicine on the surface of the substrate to return to the siphon 22 through the transparent pipe 45 and the pneumatic valve 23, and returns to the etching main tank 10 from the liquid outlet 24 of the siphon 22. The flexible circuit board precision etching device is adopted to carry out precision etching on the flexible circuit board, the liquid flow speed difference in the siphon 22 is utilized to generate negative pressure in the siphon 22, the liquid medicine on the surface of the substrate sucked by the liquid suction pipe 41 returns to the siphon 22 through the transparent pipe 45 and the pneumatic valve 23, the liquid medicine after the reaction of the printed circuit board is absorbed, the pool effect is effectively reduced, the etching uniformity is improved, the etching uniformity of the flexible circuit board is good, can reach more than 95 percent, improves the etching uniformity by 5 to 10 percent compared with the traditional etching equipment, has high etching factor reaching more than 4.5 percent, improves the etching factor by more than 30 percent compared with the traditional etching equipment, can ensure that the ultrathin substrate with the thickness of 0.036mm can pass smoothly without clamping, and can etch 30um superfine circuit, traditional etching equipment can only produce circuit more than 50um, provides the guarantee to the development of ultra-thinness direction for flexible line way board.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; the present invention may be readily implemented by those of ordinary skill in the art as illustrated in the accompanying drawings and described above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.