阅读说明：本技术 一种5g母排的制作方法 (Manufacturing method of 5G busbars ) 是由 伍海霞 黄玉辉 刘成 刘满 曾维清 于 2019-10-18 设计创作，主要内容包括：一种5G母排的制作方法,包括以下步骤：步骤一,开料；步骤二,内层图形制作；步骤三,钻孔开槽；步骤四,叠板压合；步骤五,锣板；步骤六,控深锣；步骤七,FQC(最终品质管制)；步骤八,电气性能测试；步骤九,成品检验和包装；按照5G母排的尺寸合理的开料；在LDI机上做图像,显影,并蚀刻图像；铜条圆孔中心到中心间距15mm+/-0.1mm；圆孔中心到板边14.35+/-0.2mm；铜条偏位0.3mm；铜条在母排中心位置,不接受偏心,且铜条表面电镀镍层。本发明从工艺流程及用生产模具解决5G母排在压合时流胶和端子锣板露铜的问题,用PCB生产工艺和设备批量生产5G母排,避免因做5G母排而重新设计生产线,节约大量的设备成本,效率高。(manufacturing methods of 5G busbars comprise the following steps of cutting, second manufacturing of inner layer patterns, third drilling and grooving, fourth laminating and pressing, fifth milling, sixth controlling depth milling, seventh conducting FQC (final quality control), eighth testing electrical performance, ninth testing and packaging of finished products, cutting according to reasonable size of the 5G busbars, making images, developing and etching the images on an LDI (laser direct structuring) machine, 15mm +/-0.1mm of distance between the centers of copper bar round holes and the center, 14.35+/-0.2mm of distance between the centers of the round holes and the plate edges, 0.3mm of deviation of the copper bars, enabling the copper bars to be located in the centers of the busbars and not to be eccentric, electroplating the surfaces of the copper bars, solving the problems of glue flowing and terminal milling and copper exposing of the plates when the 5G busbars are pressed by using a PCB production process and production equipment, avoiding redesigning a production line due to the fact that 5G busbars are made, saving a large amount of nickel layers, and saving equipment cost.)

The manufacturing method of the 5G busbars of 1 and includes the following steps of cutting, the second step of manufacturing inner layer graphs, the third step of drilling and grooving, the fourth step of laminating and pressing, the fifth step of routing boards, the sixth step of depth control routing, the seventh step of final quality control FQC, the eighth step of testing electrical performance, the ninth step of inspecting and packaging finished products, and is characterized in that:

in the step , cutting according to the size of the 5G busbar;

in the second step, making an image on an LDI machine, developing and etching the image;

in the third step, the drilling and slotting comprises the following steps:

1) only tool holes and rivet holes are drilled, and all the core plates PP system are drilled with belts;

2) burying the copper strips in the middle of the core board, and then routing the copper strips in the middle of the core board for placing the copper strips;

in the fourth step, the lamination and pressing comprises the following steps:

1) placing PP (meaning of PP), a core plate and a copper bar according to a pressing structure of a 5G busbar;

2) arranging the stacked 5G female die in a die for pressing;

in the fifth step, routing the shape of a finished product;

in the sixth step, redundant flowing glue at the position of the busbar terminal is gonged out;

in the seventh step, the product is finally checked and verified in the manufacturing process, and qualified persons carry out subsequent processes and unqualified persons carry out correction;

in the above step eight, the test conditions are insulation resistance: 500VDC >100M ohm; voltage resistance: 1500VDC, 60S, less than 0.1 MA;

in the ninth step, the plate appearance of the FQC is subjected to spot inspection and engineering measurement, and qualified 5G busbar is packaged and delivered.

2. The method for manufacturing kinds of 5G busbars according to claim 1, wherein in the step , the busbars are spliced as many as possible on the premise of ensuring high quality and efficiency.

3. The method for manufacturing the kinds of 5G busbars according to claim 1, wherein in the third step, the distance between the centers of the round holes of the copper bars and the center is 15mm +/-0.1mm, the distance between the centers of the round holes and the edges of the plates is 14.35+/-0.2mm, and the offset of the copper bars is 0.3 mm.

4. The method for manufacturing kinds of 5G busbars according to claim 1, wherein in the third step 2), the copper bars are not eccentric in the central position of the busbar, and the surfaces of the copper bars are plated with nickel layers.

5. The method for manufacturing the kinds of 5G busbars according to claim 1, wherein in the step four 1), the position of the copper bar is fixed by an external die.

6. The method for manufacturing kinds of 5G busbars according to claim 1, wherein in the step four 2), the dimensional deviation after pressing is ensured to be within 15+/-0.1 mm.

7. The method for manufacturing kinds of 5G busbars according to claim 1, wherein in the seventh step, whether the surface of a product has appearance defects such as scratches, bruises, impurities, bubbles and the like, and whether the bottom of a port connection has the phenomena of layering, whitening, PP adhesive residue and no adhesive at the port are checked.

8. The method for manufacturing kinds of 5G busbars according to claim 1, wherein in the eighth step, 500VDC means DC voltage 500V, and 1500VDC means DC voltage 1500V.

Technical Field

The invention relates to the technical field of 5G, in particular to a manufacturing method of 5G busbars.

Background

With the development of 5G, the 5G network technology is continuously perfected and developed, the demand for 5G busbars increases year by year, the product structure is new technologies for the circuit board industry, and redesigning the production line when manufacturing the 5G busbars consumes much cost, wastes time and labor, so it is necessary to develop low-cost and high-efficiency process manufacturing flows to solve the problem.

Disclosure of Invention

The invention aims to provide a manufacturing method of types of 5G busbars so as to solve the problems in the background technology.

In order to solve the technical problems, the invention provides the following technical scheme that the manufacturing method of 5G busbars comprises the following steps of cutting, second manufacturing of inner layer graphics, third drilling and slotting, fourth laminating, fifth milling, sixth depth control milling, seventh milling, FQC (final quality control), eighth testing of electrical performance, ninth testing and packaging of finished products;

in the step , cutting according to the size of the 5G busbar;

in the second step, making an image on an LDI machine, developing and etching the image;

in the third step, the drilling and slotting comprises the following steps:

1) only tool holes and rivet holes are drilled, and all the core plates PP system are drilled with belts;

2) burying the copper strips in the middle of the core board, and then routing the copper strips in the middle of the core board for placing the copper strips;

in the fourth step, the lamination and pressing comprises the following steps:

1) placing PP, a core plate and copper bars according to a pressing structure of a 5G busbar;

2) arranging the stacked 5G female die in a specific die for pressing;

in the fifth step, routing the shape of a finished product;

in the sixth step, redundant flowing glue at the position of the busbar terminal is gonged out;

in the seventh step, the product is finally checked and verified in the manufacturing process, and qualified persons carry out subsequent processes and unqualified persons carry out correction;

in the above step eight, the test conditions are insulation resistance: 500VDC >100M ohm; voltage resistance: 1500VDC, 60S, less than 0.1 MA;

and step nine, performing spot inspection and engineering measurement on the plate appearance of the FQC, and packaging qualified 5G busbars for shipment.

According to the above technical solution, in the step , as many pieces as possible are combined on the premise of ensuring high quality and efficiency.

According to the technical scheme, in the third step, the distance between the centers of the round holes of the copper bars and the center is 15mm +/-0.1 mm; the center of the circular hole is 14.35+/-0.2mm to the plate edge; the deviation of the copper bar is 0.3 mm.

According to the technical scheme, in the step three 2), the copper bar is located at the center of the busbar and is not eccentric, and a nickel layer is electroplated on the surface of the copper bar.

According to the technical scheme, in the step four 1), the position of the copper bar is fixed by using an external die.

According to the technical scheme, in the step four 2), the dimensional deviation after pressing is ensured to be within 15+/-0.1 mm.

According to the technical scheme, in the seventh step, whether the surface of the product has appearance defects such as scratches, bruises, impurities, bubbles and the like, and whether the bottom of the port connection has the phenomena of layering, whitening, PP (polypropylene) adhesive residue and no adhesive at the port are checked.

According to the technical scheme, in the eighth step, 500VDC means 500V of direct current voltage, and 1500VDC means 1500V of direct current voltage.

Compared with the prior art, the invention has the following beneficial effects: according to the manufacturing method of the 5G busbar, the problem that the glue and the terminal routing board expose copper when the 5G busbar is pressed is solved through a process flow and a production die, the 5G busbar is produced in batch through the existing PCB production process and equipment, the production line is prevented from being redesigned due to the fact that the 5G busbar is made, a large amount of equipment cost is saved, and the efficiency is high.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and constitute a part of this specification, and are included to explain the invention and not to limit the invention by way of example .

FIG. 1 is an overall process flow diagram of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, it is to be understood that the described embodiments are only a partial embodiment , rather than a complete embodiment.

Referring to fig. 1, the invention provides technical schemes, namely a manufacturing method of 5G busbars, which comprises the following steps of cutting, second manufacturing of inner layer graphics, third drilling and slotting, fourth laminating, fifth milling, sixth depth control milling, seventh milling, FQC (final quality control), eighth testing of electrical performance, ninth testing and packaging of finished products;

in the step , cutting is carried out reasonably according to the size of the 5G busbar, and the assembly is carried out as many as possible on the premise of ensuring high quality and efficiency;

in the second step, making an image on an LDI machine, developing and etching the image;

wherein in the third step, the drilling and slotting comprises the following steps:

1) only tool holes and rivet holes are drilled, and all the core plates PP system are drilled with belts;

2) burying the copper bar in the middle of a core board, and then routing the copper bar in the middle of the core board to provide the copper bar, wherein the copper bar is arranged in the center of the busbar and is not subjected to eccentricity, a nickel layer is electroplated on the surface of the copper bar, and the distance between the center of a circular hole of the copper bar and the center is 15mm +/-0.1 mm; the center of the circular hole is 14.35+/-0.2mm to the plate edge; the deviation of the copper bar is 0.3 mm;

in the fourth step, the lamination and pressing comprises the following steps:

1) placing PP, a core plate and a copper bar according to a pressing structure of a 5G bus bar, and fixing the position of the copper bar by using an external mould;

2) arranging the stacked 5G female die in a specific die for pressing, and ensuring that the dimensional deviation is within 15+/-0.1mm after pressing;

in the fifth step, routing the shape of a finished product;

in the sixth step, redundant flowing glue at the position of the busbar terminal is gonged out;

in the seventh step, the product is finally checked and verified in the manufacturing process, whether the surface of the product has appearance defects such as scratches, bruises, impurities, bubbles and the like, and whether the bottom of the port connection has the phenomena of layering, whitening, PP (polypropylene) residual glue and no glue at the port are checked, qualified persons carry out subsequent procedures, and unqualified persons carry out correction;

in the eighth step, the test conditions are insulation resistance: 500VDC >100M ohm; voltage resistance: 1500VDC, 60S, less than 0.1 MA;

and step nine, performing spot inspection and engineering measurement on the plate appearance of the FQC, and packaging qualified 5G busbars for shipment.

In this case, 500VDC means a direct current voltage of 500V, and 1500VDC means a direct current voltage of 1500V.

Based on the above, the invention has the advantages that the problem of copper leakage of the glue and the terminal routing board during the lamination of the 5G busbar is solved by the process flow and the production mold, the 5G busbar is produced in batch by the PCB production process and the equipment, the redesign of the production line caused by the production of the 5G busbar is avoided, a large amount of equipment cost is saved, and the efficiency is high.

It is noted that, herein, relational terms such as , second, and the like are used solely to distinguish entities or operations from another entities or operations without necessarily requiring or implying any actual such relationship or order between such entities or operations, further, the terms "comprise," "include," or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a series of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.