阅读说明：本技术 一种有mic孔设计的pcb板制作方法 (Manufacturing method of PCB with MIC hole design ) 是由 何艳球 张宏 韩法宝 万品银 张亚锋 于 2018-07-03 设计创作，主要内容包括：一种有MIC孔设计的PCB板制作方法,包括以下步骤：(1)开料,将基板剪裁出符合设计要求的尺寸；(2)钻孔,对PCB板进行钻孔；(3)制作线路；(4)防焊；(5)文字；(6)二次钻孔,指定全新的UC型钻针,对PCB板进行钻孔形成MIC孔；(7)对MIC孔进行喷砂；(8)表面处理；(9)成型；(10)测试、FQC和包装。本发明二次钻孔前先测量PCB板的靶距,根据PCB板的涨缩数据调整靶距数据,保证孔位精准,制成的MIC孔的孔壁光滑,孔粗糙度小于0.025mm,孔内无油墨等杂质残留,改善MIC孔的品质,减少因MIC孔制作不良导致麦克风异常的情况,提高了产品品质,增强企业市场竞争力。(A method for manufacturing a PCB with an MIC hole design comprises the following steps: (1) cutting, namely cutting the substrate into a size meeting the design requirement; (2) drilling, namely drilling the PCB; (3) manufacturing a circuit; (4) welding prevention; (5) characters; (6) secondary drilling, wherein a brand new UC-type drill bit is designated, and drilling is carried out on the PCB to form an MIC hole; (7) sand blasting is carried out on the MIC hole; (8) surface treatment; (9) molding; (10) testing, FQC and packaging. According to the invention, the target distance of the PCB is measured before secondary drilling, the target distance data is adjusted according to the expansion and contraction data of the PCB, the hole position is ensured to be accurate, the hole wall of the manufactured MIC hole is smooth, the hole roughness is less than 0.025mm, no impurities such as ink and the like are left in the hole, the quality of the MIC hole is improved, the abnormal condition of the microphone caused by poor manufacture of the MIC hole is reduced, the product quality is improved, and the market competitiveness of enterprises is enhanced.)

1. A method for manufacturing a PCB with an MIC hole design is characterized by comprising the following steps: the method comprises the following steps: (1) cutting, namely cutting the substrate into a size meeting the design requirement; (2) drilling, namely drilling the PCB; (3) manufacturing a circuit; (4) welding prevention; (5) characters; (6) secondary drilling, wherein a brand new UC-type drill bit is designated, and drilling is carried out on the PCB to form an MIC hole; (7) sand blasting is carried out on the MIC hole; (8) surface treatment; (9) molding; (10) testing, FQC and packaging.

2. The method of claim 1, wherein the method comprises the steps of: the method also comprises the following steps after the material cutting in the step (1): (11) manufacturing a circuit on the inner layer plate; (12) laminating the multilayer substrate; electroplating the PCB after drilling; and (3) manufacturing an outer layer circuit.

3. The method of claim 1, wherein the method comprises the steps of: and (6) secondary drilling, wherein a brand-new UC-type drill point is designated, the target distance of the PCB is measured before the PCB is drilled to form an MIC hole, the target distance data is adjusted according to the expansion and contraction data of the PCB, and then drilling is carried out.

4. The method of claim 1, wherein the method comprises the steps of: the wall roughness of MIC hole is less than 0.025 mm.

5. The method of claim 1, wherein the method comprises the steps of: the aperture of the MIC hole is 0.6mm, and the tolerance is plus or minus 0.05 mm.

6. The method of claim 1, wherein the method comprises the steps of: and (4) the cutter feeding speed of the drilling in the step (6) is 0.5m/min, the cutter withdrawing speed is 6m/min, and the rotating speed is 50 Krpm.

7. The method of claim 1, wherein the method comprises the steps of: the test involves measuring the aperture of the MIC hole, which is measured in a three-dimensional measurement.

8. The method of claim 1, wherein the method comprises the steps of: the molding is controlled by CNC.

9. The method of claim 1, wherein the method comprises the steps of: and cleaning the PCB after FQC, and packaging after cleaning.

Technical Field

The invention relates to the field of PCBs (printed circuit boards), in particular to a manufacturing method of a PCB with an MIC (many integrated core) hole design.

Background

MIC is called Microphone or learning name Microphone, Microphone is an energy conversion device for converting sound signal into electric signal, commonly called Microphone, and is widely applied to mobile phone, computer, sound, headset, recording pen, etc., taking smart phone as example, there are 1 or 2 holes on top or back of mobile phone, which is the key of mobile phone 'noise reduction technique', during conversation, MIC at bottom of mobile phone is used to collect user's sound, while MIC at top or back is responsible for collecting noisy background sound, software system will compare background sound collected by holes with background noise sound wave in information base, thus accurately distinguishing which sound belongs to noise and shielding it, and finally only outputting pure user's sound.

MIC hole is the key place of making an uproar that falls, and the MIC hole needs special treatment on the PCB, generally needs to satisfy following condition: the periphery of the MIC hole is not provided with pads, welding rings are complete and consistent, the holes are smooth, the roughness is less than 0.025mm, meanwhile, impurities such as printing ink cannot exist in the MIC hole, and the conventional PCB manufacturing method cannot meet the conditions, so that the conventional PCB manufacturing method is not suitable for the PCB with the MIC hole, and a new PCB manufacturing method with the MIC hole design needs to be researched and developed.

Disclosure of Invention

According to the special requirements of the MIC hole, the invention improves the existing PCB manufacturing method, ensures that the wall of the MIC hole on the PCB is smooth, no impurities such as ink and the like are left in the hole, the roughness is less than 0.025mm, and the quality requirement is met.

A method for manufacturing a PCB with an MIC hole design comprises the following steps: (1) cutting, namely cutting the substrate into a size meeting the design requirement; (2) drilling, namely drilling the PCB; (3) manufacturing a circuit; (4) welding prevention; (5) characters; (6) secondary drilling, wherein a brand new UC-type drill bit is designated, and drilling is carried out on the PCB to form an MIC hole; (7) sand blasting is carried out on the MIC hole; (8) surface treatment; (9) molding; (10) testing, FQC and packaging.

Preferably, the method further comprises the following steps after the material cutting in the step (1): (11) manufacturing a circuit on the inner layer plate; (12) laminating the multilayer substrate; electroplating the PCB after drilling; and (3) manufacturing an outer layer circuit.

Preferably, before drilling the PCB to form the MIC hole in the step (6), measuring the target distance of the PCB, adjusting the target distance data according to the expansion and contraction data of the PCB, and then drilling.

Preferably, the MIC well has a wall roughness of less than 0.025 mm.

Preferably, the aperture of the MIC hole is 0.6mm, and the tolerance is plus or minus 0.05 mm.

Preferably, the feed speed of the drilling in the step (6) is 0.5m/min, the withdrawal speed of the drilling is 6m/min, and the rotating speed is 50 Krpm.

Preferably, the testing comprises measuring the pore size of the MIC pore, and measuring the pore size of the MIC pore using a three-dimensional measurement.

Preferably, the forming is controlled by CNC.

Preferably, the PCB is washed after FQC and then packaged after washing.

The invention provides a method for manufacturing a PCB with an MIC hole design, which is characterized in that secondary drilling and sand blasting processes are added, the target distance of the PCB is measured before secondary drilling, and the target distance data is adjusted according to the expansion and contraction data of the PCB, so that the precision of hole positions is ensured. The MIC hole manufactured by the method has smooth hole wall, the hole roughness is less than 0.025mm, no impurities such as ink and the like are left in the hole, the quality of the MIC hole is improved, the condition that the microphone is abnormal due to poor manufacture of the MIC hole is reduced, the product quality is improved, and the market competitiveness of enterprises is enhanced. In addition, the bonding pads around the MIC hole are not cut, the integrity of the bonding pads is ensured, and the problem that the bonding pads cannot be connected and sealed with the element can be solved.

Detailed Description

The present invention will be further described with reference to the following examples.

A method for manufacturing a PCB with an MIC hole design comprises the following steps:

(1) cutting, namely cutting the substrate into a size meeting the design requirement; (11) manufacturing a circuit on the inner layer plate; (12) laminating the multilayer substrate;

(2) drilling holes, namely drilling holes in the PCB, and electroplating the PCB after the holes are drilled to conduct the layers of the PCB;

(3) manufacturing a circuit, namely manufacturing an outer layer circuit;

(4) welding prevention;

(5) characters;

(6) secondary drilling: measuring the target distance of the PCB, adjusting target distance data according to the expansion and contraction data of the PCB, ensuring that hole positions are accurate, drilling the PCB to form an MIC hole, controlling the feeding speed of the drilling to be 0.5m/min, the retracting speed to be 6m/min and the rotating speed to be 50Krpm, designating a brand-new UC-type drill bit, controlling the hole limit of the drilling of the drill bit within 1500 holes, namely replacing a new drill bit after completing 1500 holes, ensuring that the wall of the MIC hole is smooth, and ensuring that the roughness of the wall of the MIC hole is less than 0.025 mm; drilling after characters can effectively prevent the problems of glue removal and undercut of hole walls and solder and character ink hole entering before copper deposition, and reduce the problem of microphone abnormity caused by poor manufacture of MIC holes;

(7) carrying out sand blasting on the MIC hole to remove dust and impurities in the drill hole;

(8) surface treatment;

(9) forming, wherein the forming is controlled by CNC, burrs can be avoided through CNC forming, and the smoothness of plate edges is ensured;

(10) and (3) testing: the test comprises measuring the aperture of the MIC hole, measuring the aperture of the MIC hole by adopting a three-dimensional measurement mode, measuring accurately, and avoiding the problem that the hole wall of the MIC hole is scratched due to the conventional use of a needle gauge, wherein the aperture of the MIC hole is 0.6mm, and the tolerance is 0.05mm plus or minus; and after the test, carrying out FQC on the PCB, cleaning the PCB after the FQC, and finishing vacuum packaging on the PCB in a dust-free room after cleaning.

For a PCB with an MIC hole design, if the manufacturing mode of the MIC hole is the same as that of a common hole, the degumming liquid medicine can bite the hole wall of the MIC hole, so that the hole wall is not smooth; because the diameter in MIC hole is less, silk screen printing character and prevent having printing ink to get into the MIC hole when welding, lead to downthehole printing ink to remain, thereby lead to MIC hole bad manufacture to influence the product quality at last. The PCB manufacturing method with the MIC hole design is provided, secondary drilling and sand blasting processes are added, the target distance of the PCB is measured before secondary drilling, target distance data are adjusted according to the expansion and contraction data of the PCB, and hole position accuracy is guaranteed. The MIC hole manufactured by the method has smooth hole wall, the hole roughness is less than 0.025mm, no impurities such as ink and the like are left in the hole, the quality of the MIC hole is improved, the condition that the microphone is abnormal due to poor manufacture of the MIC hole is reduced, the product quality is improved, and the market competitiveness of enterprises is enhanced. In addition, the bonding pads around the MIC hole are not cut, so that the integrity of the bonding pads is ensured, and the bonding pads can be prevented from being connected and sealed with the element.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.