阅读说明：本技术 一种ist测试用板制作方法和系统 (Method and system for manufacturing board for testing IST (integrated test) ) 是由 孙启双 孙文兵 于 2019-09-18 设计创作，主要内容包括：本发明公开了一种IST测试用板制作方法和系统,方法包括：制作内层板的内层线路；进行内层板的表面处理；压合基板与所述内层板,生成新内层板或完整合成板；当生成新内层板时,制作新内层板的内层线路并重复压合作业,直至生成完整合成板；制作完整合成板的外层线路。系统用于执行方法。本发明实施例通过制作内层板的内层线路；进行内层板的表面处理；压合基板与内层板,生成新内层板或完整合成板；当生成新内层板时,制作新内层板的内层线路并重复压合作业,直至生成完整合成板；制作完整合成板的外层线路,能够通过合理的工序生产IST测试用板,以供后续的使用。(The invention discloses a method and a system for manufacturing a board for testing an integrated circuit (IST), wherein the method comprises the following steps: manufacturing an inner layer circuit of the inner layer plate; carrying out surface treatment on the inner-layer plate; laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate; when a new inner-layer board is generated, manufacturing an inner-layer circuit of the new inner-layer board and repeating the laminating operation until a complete composite board is generated; and manufacturing the outer layer circuit of the complete composite board. The system is used for executing the method. The embodiment of the invention manufactures the inner layer circuit of the inner layer plate; carrying out surface treatment on the inner-layer plate; laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate; when a new inner-layer board is generated, manufacturing an inner-layer circuit of the new inner-layer board and repeating the laminating operation until a complete composite board is generated; the outer layer circuit of the complete composite board can be manufactured, and the board for testing the IST can be produced through reasonable procedures for subsequent use.)

1. A method for manufacturing a board for testing IST, comprising:

manufacturing an inner layer circuit of the inner layer plate;

carrying out surface treatment on the inner-layer plate;

laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate;

when a new inner-layer board is generated, manufacturing an inner-layer circuit of the new inner-layer board and repeating the laminating operation until a complete composite board is generated;

and manufacturing the outer layer circuit of the complete composite board.

2. The method for manufacturing a board for testing IST according to claim 1, wherein the manufacturing of the inner layer wiring of the inner layer board comprises: and manufacturing an inner layer circuit pattern, etching the circuit and performing AOI detection on the circuit.

3. The board for IST testing as set forth in claim 1, wherein the surface treatment of the inner layer board comprises: browning the copper layer and cutting the plate.

4. The method for manufacturing a board for testing IST according to claim 1, wherein the inner layer circuit for manufacturing the new inner layer board and the outer layer circuit for manufacturing the complete composite board comprise: drilling, grinding a plate, depositing copper, plating copper on the whole plate, manufacturing a circuit pattern, pattern electro-copper, pattern electro-tin, etching copper and circuit AOI.

5. The method as claimed in claim 1, further comprising performing a surface treatment of the completed composite board: green oil coating, silk printing, gold immersion and plate milling.

6. The method for manufacturing a board for testing IST of any one of claims 1 to 5, further comprising baking at 170 ° for 4 hours before the inner layer circuit of the inner layer board is manufactured.

7. The method for manufacturing a board for testing IST of claim 6, wherein said parameters of said press-fitting operation include: the heating rate was 2.5 deg.C/min, the pressure was 80kg, and the time was 150 min.

8. A board making system for IST testing, comprising:

the inner layer circuit manufacturing module is used for manufacturing an inner layer circuit of the inner layer plate;

the inner layer surface treatment module is used for carrying out surface treatment on the inner layer plate;

the laminating module is used for laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate;

pressing the module again, and manufacturing an inner layer circuit of the new inner layer plate and repeating the pressing operation when the new inner layer plate is generated until a complete composite plate is generated;

and the outer layer processing module is used for manufacturing an outer layer circuit of the complete composite board.

Technical Field

The invention relates to the technical field of IST (integrated test) testing, in particular to a method and a system for manufacturing a board for IST testing.

Background

Interconnect Strength Testing (IST) is an accelerated strength testing method for evaluating the integrity of Printed Circuit Board (PCB) interconnect structures. It is an objective test, and the test result is timely, repeatable, reproducible, and unique. The IST makes a definitive assessment of the circuit board quality, providing insight into possible failure modes.

The main reason OEMs, CEMs and PCB manufacturers are using IST as the preferred PCB testing method is that cost and time can be saved. The cost of performing accelerated strength testing with an IST is low, and it is a more comprehensive test that reflects the reliability of the circuit board in assembly, rework, and end use environments.

If a reasonable processing method is adopted to manufacture the corresponding IST test plate, the route of later process improvement can be determined, and the improvement of competitiveness is facilitated.

Disclosure of Invention

Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. To this end, it is an object of embodiments of the present invention to provide a method and system for fabricating a board for IST testing.

The technical scheme adopted by the invention is as follows:

in a first aspect, an embodiment of the present invention provides a method for manufacturing a board for IST testing, including: manufacturing an inner layer circuit of the inner layer plate; carrying out surface treatment on the inner-layer plate; laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate; when a new inner-layer board is generated, manufacturing an inner-layer circuit of the new inner-layer board and repeating the laminating operation until a complete composite board is generated; and manufacturing the outer layer circuit of the complete composite board.

Preferably, the inner layer circuit for manufacturing the inner layer board comprises: and manufacturing an inner layer circuit pattern, etching the circuit and performing AOI detection on the circuit.

Preferably, the surface treatment of the inner layer panel includes: browning the copper layer and cutting the plate.

Preferably, the inner layer circuit for making a new inner layer board and the outer layer circuit for making a complete composite board comprise: drilling, grinding a plate, depositing copper, plating copper on the whole plate, manufacturing a circuit pattern, pattern electro-copper, pattern electro-tin, etching copper and circuit AOI.

Preferably, the method further comprises performing a surface treatment of the complete composite sheet: green oil coating, silk printing, gold immersion and plate milling.

Preferably, the method further comprises baking the inner layer wires of the inner layer plate at 170 ℃ for 4 hours.

Preferably, the parameters of the pressing operation include: the heating rate was 2.5 deg.C/min, the pressure was 80kg, and the time was 150 min.

In a second aspect, an embodiment of the present invention provides a board manufacturing system for IST testing, including: the inner layer circuit manufacturing module is used for manufacturing an inner layer circuit of the inner layer plate; the inner layer surface treatment module is used for carrying out surface treatment on the inner layer plate; the laminating module is used for laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate; pressing the module again, and manufacturing an inner layer circuit of the new inner layer plate and repeating the pressing operation when the new inner layer plate is generated until a complete composite plate is generated; and the outer layer processing module is used for manufacturing an outer layer circuit of the complete composite board.

The embodiment of the invention has the beneficial effects that:

the embodiment of the invention manufactures the inner layer circuit of the inner layer plate; carrying out surface treatment on the inner-layer plate; laminating the substrate and the inner-layer plate to generate a new inner-layer plate or a complete composite plate; when a new inner-layer board is generated, manufacturing an inner-layer circuit of the new inner-layer board and repeating the laminating operation until a complete composite board is generated; the outer layer circuit of the complete composite board can be manufactured, and the board for testing the IST can be produced through reasonable procedures for subsequent use.

Drawings

FIG. 1 is a flow chart of one embodiment of a method of making a plate for testing an IST;

FIG. 2 is a connection diagram of one embodiment of an IST test board fabrication system.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The related technical names comprise:

the operating principle of the IST is as follows: the samples were tested by performing rapid thermal cycling between ambient temperature (21 ℃) and 150 ℃ and then cooling the air to ambient temperature and monitoring the change in circuit resistance as the samples thermally cycled. A 10% increase in resistance is considered to be a fault and the test is terminated. The test temperature can be raised to 260 c (suitable for the new lead-free soldering procedure). The test is dependent on the design of the test piece, which reflects the characteristics of the circuit board, including finished aperture, copper thickness, number of layers, type of interconnect, etc. The sample is designed in accordance with two separate circuits-a power supply circuit and a readout circuit. The power circuit is used to heat the test specimen and test Post integrity, while the sense circuit is used to monitor the resistance change of the PTH or PTV (plated hole).

AOI (automated Optical inspection) is a device for detecting common defects encountered in welding production based on Optical principles, which is called automatic Optical inspection. AOI is a new emerging testing technology, but the development is rapid, and AOI testing equipment is released by many manufacturers. During automatic detection, the machine automatically scans the PCB through the camera, acquires images, compares the tested welding spots with qualified parameters in the database, inspects the defects on the PCB through image processing, and displays/marks the defects through a display or an automatic mark for repair personnel to repair.

OZ is ounce, HOZ is half an ounce, and in the PCB field, primarily refers to the thickness of copper.