阅读说明：本技术 一种新的led封装载板电镀制作方法 (Novel electroplating manufacturing method for LED packaging carrier plate ) 是由 李清春 苏南兵 邱小华 龚程程 于 2019-08-23 设计创作，主要内容包括：本发明提供一种新的LED封装载板电镀制作方法,其特征在于,包括以下步骤：开料→钻孔→化学沉铜→裁板→电镀填孔；所述电镀填孔包括预填孔阶段和快速填孔阶段。本发明使得多合一LED封装模组化可行,驱动LED显示屏技术发展,相对于传统的分立LED灯珠SMD封装技术,多合一采用共用部分引脚的方式可节省较大比例的封装面积；还可以在0.2mm的BT材料上通孔填孔,实现LED导通散热效果,以及高密度化模组封装。(The invention provides a novel electroplating manufacturing method of an LED packaging carrier plate, which is characterized by comprising the following steps of: cutting → drilling → chemical copper deposition → cutting board → electroplating for hole filling; the electroplating hole filling comprises a pre-hole filling stage and a rapid hole filling stage. The invention enables the all-in-one LED packaging modularization to be feasible, drives the technical development of the LED display screen, and can save a larger proportion of packaging area by adopting a mode of sharing part of pins in all-in-one compared with the traditional discrete LED lamp bead SMD packaging technology; and holes can be filled in through holes on the BT material with the thickness of 0.2mm, so that the LED conduction and heat dissipation effect is realized, and the high-density module is packaged.)

1. A novel electroplating manufacturing method of an LED packaging carrier plate is characterized by comprising the following steps:

cutting → drilling → chemical copper deposition → cutting board → electroplating for hole filling;

the electroplating hole filling comprises a pre-hole filling stage and a rapid hole filling stage.

2. The method for manufacturing the LED package carrier by electroplating according to claim 1, wherein the plating solution used in the pre-hole filling stage comprises the following components: 260g/L of copper sulfate 220-.

3. The method for manufacturing the LED package carrier by electroplating according to claim 1, wherein the plating solution used in the rapid hole filling stage comprises the following components: 220g/L of copper sulfate 180-.

4. The method as claimed in claim 2, wherein the pre-hole filling step divides the through holes into blind holes on two sides.

5. The method as claimed in claim 3, wherein the step of filling the blind holes is performed by filling the two separated parts of the blind holes.

6. The method as claimed in claim 1, wherein the electroplating process is preceded by degreasing, microetching, washing, and acidifying, and the current density and time of electroplating depend on the thickness and diameter of the plated hole.

7. The method for manufacturing the LED package carrier by electroplating according to claim 6, wherein the current density of the electroplating is 1.1-2.2A/dm²The electroplating time is 50-100 min.

8. The method for manufacturing the LED package carrier by electroplating according to claim 1, wherein the drilling process is laser drilling, and the laser drilling adopts a processing mode of butt joint of blind holes drilled on two sides.

9. The method for manufacturing the LED package carrier by electroplating according to claim 1, wherein the drilling process is mechanical drilling, and the mechanical drilling adopts a processing mode of directly drilling through a mechanical hole.

10. The method for manufacturing the LED package carrier by electroplating according to claim 8 or 9, wherein the diameter of the drilled hole is 0.08-0.1 mm.

Technical Field

The invention belongs to the technical field of LED circuit board processing, and particularly relates to a novel electroplating manufacturing method of an LED packaging carrier plate.

Background

In order to achieve higher display definition, the LED display screen develops towards smaller dot spacing, the current mainstream LED discrete component SMD technology is limited by the limitation of component size and packaging technology, and the minimum limit of the center distance of the LED lamp beads is 1mm, so that the LED display screen is limited in technical capability in the development towards the direction of higher definition. The problem is solved to appearance of new unification LED encapsulation module for the point interval of LED display screen can reach about 0.5mm to more little development, breaks through the prior art limitation, and unification LED encapsulation module is two the most important parts, and the first is the LED chip, and the second is the LED encapsulation support plate, in order to reach certain rigidity, stable harmomegathus and good radiating effect, at present adopt BT or class BT material about 0.2mm to make basically.

In the existing process, laser drilling is adopted to drill blind holes on two sides of BT or BT-like materials for butt joint or directly drill mechanical holes, the hole diameter is 0.08-0.1mm, and hole filling is performed by electroplating after drilling, the biggest difficulty is hole filling, and the conventional electroplating technology cannot realize full copper filling of the via hole.

Disclosure of Invention

In view of the above, the invention provides a novel electroplating manufacturing method of an LED package carrier, which provides feasibility for manufacturing a small-pitch LED package carrier and can realize electroplating hole filling of through hole via holes.

The technical scheme of the invention is as follows:

a novel electroplating manufacturing method of an LED packaging carrier plate is characterized by comprising the following steps:

cutting → drilling → chemical copper deposition → cutting board → electroplating for hole filling; the electroplating hole filling comprises a pre-hole filling stage and a rapid hole filling stage.

Further, the plating solution adopted in the pre-hole filling stage comprises the following components: 260g/L of copper sulfate 220-.

Further, the plating solution adopted in the rapid hole filling stage comprises the following components: 220g/L of copper sulfate 180-.

Furthermore, the through holes are divided into blind holes on two sides in the pre-hole filling stage.

Furthermore, the two parts of the blind holes which are divided are filled and leveled in the rapid hole filling stage.

Furthermore, the electroplating needs to be carried out with pretreatment including degreasing, micro-etching, water washing and acidification processes before filling the hole, and the current density and the electroplating time of electroplating depend on the thickness and the diameter of the hole.

Further, the current density of the electroplating is 1.1-2.2 A/dm²The electroplating time is 50-100 min.

Further, the drilling process is laser drilling, and the laser drilling adopts a processing mode of butt joint of blind holes drilled on two sides.

Further, the drilling process is mechanical drilling, and the mechanical drilling adopts a processing mode of directly drilling through a mechanical hole.

Further, the bore diameter of the drill hole is 0.08-0.1 mm.

According to the invention, a sectional electroplating hole filling mode is originally adopted, the through hole filling is divided into two stages, a bridge is lapped in the center of the through hole in the first stage, and the concentration of plating solution is obtained through a large number of creative tests, so that the through hole can be divided into blind holes on two sides in the process, and the step is the most critical; and in the second stage, the blind holes of the two parts are filled and leveled by matching with proper plating solution concentration. And the through hole filling technology is adopted to realize 100% full filling of the through hole and two ends of the through hole are flattened.

The invention has the beneficial effects that:

1. the invention enables the all-in-one LED packaging modularization to be feasible, drives the technical development of the LED display screen, and can save a larger proportion of packaging area by adopting a mode of sharing part of pins in all-in-one compared with the traditional discrete LED lamp bead SMD packaging technology.

2. The invention can fill the through holes on the BT material with the thickness of 0.2mm, thereby realizing the conduction and heat dissipation effects of the LED and high-density module packaging.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.