阅读说明：本技术 多层柔性线路板假接机 (Multilayer flexible circuit board splicer ) 是由 韦佳民 方勇 于 2019-07-23 设计创作，主要内容包括：本发明涉及一种多层柔性线路板假接机,包括机架、设置于机架上的用于吸附下层铜箔的能够升降的吸真空下模、设置于机架上的用于吸附上层铜箔的能够翻转的吸真空上模。吸真空下模包括用于吸附下层铜箔的下模板、设置于下模板下方并与机架相连接的底板、与底板相连接并用于驱动下模板升降的升降气缸。吸真空上模包括用于吸附上层铜箔的上模板、分别与机架和上模板相连接的翻转机构。翻转机构包括与上模板相固定连接并与机架相转动连接的翻转轴、一端与翻转轴相固定连接的翻转臂、安装于机架上并连接至翻转臂的另一端而用于推动翻转臂的翻转气缸。本发明可避免撕除离型膜时损伤铜箔,从而实现平整的、无偏移的假接压合,从而可以提升产品良率。(The invention relates to a multilayer flexible circuit board splicer which comprises a rack, a liftable vacuum absorption lower die and a turnable vacuum absorption upper die, wherein the liftable vacuum absorption lower die is arranged on the rack and is used for absorbing a lower copper foil, and the turnable vacuum absorption upper die is arranged on the rack and is used for absorbing an upper copper foil. The vacuum-absorbing lower die comprises a lower die plate for absorbing lower copper foil, a bottom plate arranged below the lower die plate and connected with the rack, and a lifting cylinder connected with the bottom plate and used for driving the lower die plate to lift. The vacuum absorption upper die comprises an upper die plate for absorbing the upper copper foil and a turnover mechanism respectively connected with the rack and the upper die plate. The turnover mechanism comprises a turnover shaft fixedly connected with the upper die plate and rotatably connected with the frame, a turnover arm with one end fixedly connected with the turnover shaft, and a turnover cylinder arranged on the frame and connected to the other end of the turnover arm for pushing the turnover arm. The invention can avoid damaging the copper foil when the release film is torn off, thereby realizing smooth and non-offset false connection pressing, and improving the yield of products.)

1. A multilayer flexible circuit board splicer is used for splicing three copper foils to form a multilayer flexible circuit board, and is characterized in that: the multilayer flexible circuit board splicer comprises a rack, a liftable vacuum absorption lower die and a turnover vacuum absorption upper die, wherein the vacuum absorption lower die is arranged on the rack and used for absorbing a lower layer of copper foil, and the turnover vacuum absorption upper die is arranged on the rack and used for absorbing an upper layer of copper foil.

2. The multilayer flexible circuit board splicing machine of claim 1, wherein: the vacuum absorption lower die comprises a lower die plate used for absorbing the lower copper foil, a bottom plate arranged below the lower die plate and connected with the rack, and a lifting cylinder connected with the bottom plate and used for driving the lower die plate to lift.

3. The multilayer flexible circuit board splicing machine of claim 1 or 2, wherein: the rack is provided with a discharging position and a false connecting position, and the vacuum suction lower die is connected with the rack through a moving mechanism capable of enabling the vacuum suction lower die to be transferred between the discharging position and the false connecting position.

4. The multilayer flexible circuit board splicing machine of claim 3, wherein: the moving mechanism comprises a guide rail arranged on the rack and connected with the vacuum suction lower die and a moving cylinder used for driving the vacuum suction lower die to move along the guide rail.

5. The multilayer flexible circuit board splicing machine of claim 1, wherein: the vacuum absorption upper die comprises an upper die plate for absorbing the upper layer of the copper foil and a turnover mechanism respectively connected with the rack and the upper die plate.

6. The multilayer flexible circuit board splicing machine of claim 5, wherein: the turnover mechanism comprises a turnover shaft fixedly connected with the upper die plate and rotatably connected with the rack, a turnover arm with one end fixedly connected with the turnover shaft, and a turnover cylinder which is arranged on the rack and connected to the other end of the turnover arm and used for pushing the turnover arm.

7. The multilayer flexible circuit board splicing machine of claim 5, wherein: the vacuum-absorbing upper die further comprises a plurality of groups of telescopic positioning assemblies, each positioning assembly comprises a positioning needle and a positioning cylinder used for driving the corresponding positioning needle to stretch, the upper die plate is provided with positioning holes corresponding to the positioning needles, and the positioning needles penetrate through the positioning holes.

8. The multilayer flexible circuit board splicing machine of claim 5, wherein: the vacuum-absorbing upper die is further provided with a plurality of groups of hot-pressing assemblies, and each hot-pressing assembly comprises a hot-pressing cylinder arranged on the upper die plate, a heating sheet connected with a telescopic rod of the hot-pressing cylinder, and a heating head connected with the heating sheet.

9. The multilayer flexible circuit board splicing machine of claim 8, wherein: the telescopic rod of the hot-pressing cylinder is connected with the heating sheet through a joint and a heat insulation block.

10. The multilayer flexible circuit board splicing machine of claim 1, wherein: a safety light curtain is arranged on the frame.

Technical Field

The invention belongs to the technical field of flexible circuit board production, and particularly relates to a splicer for splicing a plurality of copper foils to form a multi-layer flexible circuit board.

Background

At present, the combination mode of the multilayer flexible circuit board mostly adopts manual removal of materials, and the materials are sleeved into the positioning columns on the jig through preset positioning holes, so that the materials are stacked and are subjected to false connection. The specific method is as shown in fig. 1, firstly tearing off the release film 28 from the a piece of copper foil 25 and putting the A piece of copper foil into a jig, then putting the B piece of copper foil 26 into the jig, finally tearing off the release film 28 from the C piece of copper foil 27 and putting the C piece of copper foil into the jig, and then laminating at high temperature to make the three pieces of copper foil joined together to form the combined soft board 29.

According to the pressfitting of current mode, when tearing off the release liner on A piece of copper foil 25 and the C piece of copper foil 27, inevitably can cause the power of pulling to the copper foil, make A piece of copper foil 25 and C piece of copper foil 27 warp, through 100% can produce the skew phenomenon after the pressfitting again.

Disclosure of Invention

The invention aims to provide a multilayer flexible circuit board splicer which can avoid the deformation of copper foil and improve the lamination quality.

In order to achieve the purpose, the invention adopts the technical scheme that:

the multilayer flexible circuit board splicer comprises a rack, a lifting vacuum absorption lower die and a turnover vacuum absorption upper die, wherein the lifting vacuum absorption lower die is arranged on the rack and used for absorbing a lower layer of copper foil, and the turnover vacuum absorption upper die is arranged on the rack and used for absorbing an upper layer of copper foil.

The vacuum absorption lower die comprises a lower die plate used for absorbing the lower copper foil, a bottom plate arranged below the lower die plate and connected with the rack, and a lifting cylinder connected with the bottom plate and used for driving the lower die plate to lift.

The rack is provided with a discharging position and a false connecting position, and the vacuum suction lower die is connected with the rack through a moving mechanism capable of enabling the vacuum suction lower die to be transferred between the discharging position and the false connecting position.

The moving mechanism comprises a guide rail arranged on the rack and connected with the vacuum suction lower die and a moving cylinder used for driving the vacuum suction lower die to move along the guide rail.

The vacuum absorption upper die comprises an upper die plate for absorbing the upper layer of the copper foil and a turnover mechanism respectively connected with the rack and the upper die plate.

The turnover mechanism comprises a turnover shaft fixedly connected with the upper die plate and rotatably connected with the rack, a turnover arm with one end fixedly connected with the turnover shaft, and a turnover cylinder which is arranged on the rack and connected to the other end of the turnover arm and used for pushing the turnover arm.

The vacuum-absorbing upper die further comprises a plurality of groups of telescopic positioning assemblies, each positioning assembly comprises a positioning needle and a positioning cylinder used for driving the corresponding positioning needle to stretch, the upper die plate is provided with positioning holes corresponding to the positioning needles, and the positioning needles penetrate through the positioning holes.

The vacuum-absorbing upper die is further provided with a plurality of groups of hot-pressing assemblies, and each hot-pressing assembly comprises a hot-pressing cylinder arranged on the upper die plate, a heating sheet connected with a telescopic rod of the hot-pressing cylinder, and a heating head connected with the heating sheet.

The telescopic rod of the hot-pressing cylinder is connected with the heating sheet through a joint and a heat insulation block.

A safety light curtain is arranged on the frame.

Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: according to the invention, the copper foil is prevented from being damaged when the release film is torn off in a vacuum adsorption mode, so that smooth and offset-free false connection pressing is realized, and the product yield can be improved.

Drawings

Fig. 1 is a schematic diagram of a conventional multi-layer flexible circuit board.

Fig. 2 is an overall schematic diagram of the multilayer flexible circuit board splicer of the invention.

Fig. 3 is a partial front view of the multi-layer flexible circuit board splicer of the invention.

Fig. 4 is a partial side view of the multi-layer flexible circuit board splicer of the invention.

FIG. 5 is a schematic view of a thermocompression assembly in the multilayer flexible circuit board splicer of the present invention.

In the above drawings: 1. a frame; 2. vacuum suction lower die; 3. vacuum suction upper die; 4. a safety light curtain; 5. a lower template; 6. a base plate; 7. a lifting cylinder; 8. a guide rail; 9. a guide post; 10. mounting a template; 11. a turning shaft; 12. a fixed block; 13. a turning arm; 14. turning over the air cylinder; 15. mounting a plate; 16. a positioning pin; 17. positioning the air cylinder; 18. a cylinder mounting seat; 19. a cylinder mounting block; 20. a hot-pressing cylinder; 21. a joint; 22. a heat insulation block; 23. a heating plate; 24. a heating head; 25. a piece of copper foil; 26. b piece of copper foil; 27. c, copper foil; 28. a release film; 29. combining the soft boards; 30. and (7) hot-pressing the assembly.

Detailed Description

The invention will be further described with reference to examples of embodiments shown in the drawings to which the invention is attached.