阅读说明：本技术 电子装置及其制造方法 (Electronic device and method for manufacturing the same ) 是由 川井若浩 于 2018-02-16 设计创作，主要内容包括：电子装置具备：树脂成形体(10)；以及包含电线(32b)的导电电缆(31b)。导电电缆(31b)的一端部(35b)埋设于树脂成形体(10)中。树脂成形体(10)的表面包含使导电电缆(31b)中的一端部(35b)侧的端面(34b)露出并且与端面(34b)连续的面(11)。电子装置进而具备：以与端面(34b)内的电线(32b)连接的方式形成于端面(34b)及面(11)上的配线(40f,40i)。(The electronic device is provided with: a resin molded body (10); and a conductive cable (31b) containing the electric wire (32 b). One end (35b) of the conductive cable (31b) is embedded in the resin molded body (10). The surface of the resin molded body (10) includes a surface (11) that exposes an end surface (34b) of the conductive cable (31b) on the side of the one end (35b) and is continuous with the end surface (34 b). The electronic device further includes: and wiring lines (40f, 40i) formed on the end surface (34b) and the surface (11) so as to be connected to the electric wire (32b) in the end surface (34 b).)

1. An electronic device, comprising:

a resin molded body; and

an electrically conductive cable comprising an electrical conductor, and

one end portion of the conductive cable is embedded in the resin molded body,

the surface of the resin molded body includes a continuous surface that exposes an end surface of the conductive cable on the one end side and is continuous with the end surface,

the electronic device further includes: and wiring formed on the end surface and the continuous surface so as to be connected to the conductor in the end surface.

2. The electronic device according to claim 1, wherein the conductive cable contains a plurality of wires as the electrical conductors, and

the wiring is connected to at least one of the plurality of electric wires exposed at the end surface.

3. The electronic device of claim 1, wherein the conductive cable comprises: an insulating substrate; a conductive circuit formed on a surface of the insulating substrate as the conductor; and an insulating layer covering the conductive circuit.

4. The electronic device of any of claims 1-3, further comprising: an electronic component embedded in the resin molded body, and

the electrodes of the electronic component are exposed from the continuous surface,

the wiring is connected to the electrode.

5. The electronic device of any of claims 1-4, further comprising: and a resist formed on the continuous surface and the end surface so as to cover the wiring.

6. A method of manufacturing an electronic device, comprising:

attaching a sheet to an end surface on one end side of a conductive cable including a conductor;

disposing the one end portion of the conductive cable and the sheet in an inner space of a molding die;

a step of molding a resin molded body in which the one end portion of the conductive cable is embedded by injecting a resin into the internal space;

a step of exposing the end face on a surface of the resin molded body by peeling the sheet from the resin molded body; and

and forming wiring connected to the conductor in the end surface on the surface of the resin molded body.

7. The method of manufacturing an electronic device according to claim 6, further comprising: a step of supporting the conductive cable by the support body in such a manner that the one end portion protrudes from the support body, and

in the attaching step, the sheet is attached to the end face of the conductive cable supported by the support body,

in the disposing step, the sheet and the support are disposed in the internal space such that a surface of the sheet on which the end face is not attached contacts an inner surface of the molding die, and a surface of the support on the side opposite to the side from which the one end portion protrudes contacts the inner surface of the molding die.

8. The method of manufacturing an electronic device according to claim 6 or 7, wherein in the step of attaching, the electronic part is attached to the sheet in such a manner that an electrode of the electronic part is in contact with the sheet, and

in the molding step, the electronic component is embedded in the resin molded body,

in the exposing step, the electrode is exposed on the surface of the resin molded body,

in the forming, the wiring is formed so as to be connected to the electrode.

9. A method of manufacturing an electronic device, comprising:

disposing one end portion of a conductive cable including a conductor and a sheet in an inner space of a molding die so that an end surface of the conductive cable on the one end portion side is in contact with the sheet;

a step of molding a resin molded body in which the one end portion of the conductive cable is embedded by injecting a resin into the internal space while pressing the conductive cable against the sheet;

a step of exposing the end face on a surface of the resin molded body by peeling the sheet from the resin molded body; and

and forming wiring connected to the conductor in the end surface on the surface of the resin molded body.

10. The method of manufacturing an electronic device according to claim 9, further comprising: a step of attaching an electronic part to the sheet in such a manner that an electrode of the electronic part is in contact with the sheet, before the step of arranging, and

in the molding step, the electronic component is embedded in the resin molded body,

in the exposing step, the electrode is exposed on the surface of the resin molded body,

in the forming, the wiring is formed so as to be connected to the electrode.

Technical Field

The present technology relates to an electronic device in which a conductive cable and a wiring are electrically connected and a method of manufacturing the same.

Background

Electrically connecting the conductive cables electrically connected between the different substrates with the wiring on each substrate. As a connection structure between a conductive cable and a wiring on a substrate, a structure using a connector described in japanese patent laid-open No. 2006-93378 (patent document 1) and the like are known.

Fig. 12 is a diagram showing an example of a prior connection structure between a conductive cable and wiring on a substrate. Fig. 13 is a diagram showing still another example of a prior connection structure between a conductive cable and wiring on a substrate. In the example shown in fig. 12 and 13, the wiring 140 on the substrate 110 on which the electronic component 121 is mounted is electrically connected to the conductive cable 131.

In the example shown in fig. 12, a plurality of wires 142 included in the conductive cable 131 are separated from each other, and each wire 142 is electrically connected to the wiring 140 by the solder 141.

In the example shown in fig. 13, the connector housing 136 is mounted in advance on the board 110. The connector housing 136 is electrically connected to the wiring 140 by solder 141. A connector terminal electrically connected to an electric wire in the conductive cable 131 is attached to one end of the conductive cable 131. The conductive cable 131 is electrically connected to the wiring 140 by inserting the connector terminal into the connector housing 136.

Disclosure of Invention

Problems to be solved by the invention

However, in the connection configuration shown in fig. 12, the following operation is required: the electric wire 142 is drawn out from the conductive cable 131, and the electric wire 142 is fixed to the substrate 110 while being positioned, and the electric wire 142 is soldered to the wiring 140. Therefore, the process steps are complicated and the manufacturing cost is increased. Further, a space for arranging a fixing part 135 for fixing the conductive cable 131 to the substrate 110 and a space for connecting the wire 142 to the wiring 140 are required.

In the connection structure shown in fig. 13, an operation of attaching a connector terminal electrically connected to the electric wire 142 to one end of the conductive cable 131 and an operation of soldering the connector housing 136 to the wiring 140 are also required, and the manufacturing cost is increased. Further, a space for disposing the connector housing 136 on the substrate 110 is required.

The present disclosure has been made in view of the above problems, and an object thereof is to provide an electronic device and a method of manufacturing the same, in which an increase in manufacturing cost is suppressed and a space required for connection between a conductive cable and a wiring is small.

Means for solving the problems

According to one aspect, an electronic device includes: a resin molded body; and an electrically conductive cable comprising the electrical conductor. One end of the conductive cable is embedded in the resin molded body. The surface of the resin molded body includes a continuous surface that exposes an end surface of the conductive cable on one end side and is continuous with the end surface. The electronic device further includes: and wiring formed on the end face and the continuous face so as to be connected to the conductor in the end face.

The conductive cable preferably comprises a plurality of wires as the electrical conductor. The wiring is connected to at least one of the plurality of electric wires exposed at the end surface.

Alternatively, the conductive cable may also comprise: an insulating substrate; a conductive circuit as a conductor formed on a surface of the insulating substrate; and an insulating layer covering the conductive circuit.

The electronic device preferably further includes: an electronic component embedded in the resin molded body. The electrodes of the electronic component are exposed from the continuous surface. The wiring is connected to the electrode.

The electronic device preferably further includes: and a resist formed on the continuous surface and the end surface so as to cover the wiring.

According to still another aspect, a method of manufacturing an electronic device includes: a step of attaching a sheet (sheet) to an end surface on one end side of a conductive cable including a conductive body; disposing one end portion of the conductive cable and the sheet in an inner space of a forming mold; a step of molding a resin molded body in which one end portion of the conductive cable is embedded by injecting a resin into the internal space; a step of exposing an end face of the conductive cable on a surface of the resin molded body by peeling the sheet from the resin molded body; and a step of forming wiring connected to the conductor in the end face of the conductive cable on the surface of the resin molded body.

The method of manufacturing an electronic device preferably further includes: a step of supporting the conductive cable by the support body in such a manner that one end portion protrudes from the support body. In the attaching step, the sheet is attached to an end face of the conductive cable supported by the support body. In the disposing step, the sheet and the support are disposed in the internal space such that a surface of the sheet on which the end face is not attached contacts an inner surface of the molding die and a surface of the support on which the side protruding from the one end portion is opposite contacts the inner surface of the molding die.

In the step of attaching, the electronic component is preferably attached to the sheet so that the electrode of the electronic component is in contact with the sheet. In the molding step, the electronic component is embedded in the resin molded body. In the exposing step, the electrode is exposed on the surface of the resin molded body. In the forming step, a wiring is formed so as to be connected to the electrode.

According to still another aspect, a method of manufacturing an electronic device includes: a step of disposing one end portion of the conductive cable and the sheet in an internal space of the molding die so that an end surface of the conductive cable including the conductor on the one end portion side is in contact with the sheet; a step of injecting resin into the internal space while pressing the conductive cable against the sheet, thereby molding a resin molded body in which one end portion of the conductive cable is embedded; a step of peeling the sheet from the resin molded body to expose the end face on the surface of the resin molded body; and forming wiring connected to the conductor in the end face on the surface of the resin molded body.

The method of manufacturing an electronic device preferably further includes: a step of attaching the electronic part to the sheet in such a manner that the electrode of the electronic part is in contact with the sheet, prior to the step of arranging. In the molding step, an electronic component is embedded in the resin molded body. In the exposing step, the electrode is exposed on the surface of the resin molded body. In the forming step, a wiring is formed so as to be connected to the electrode.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present disclosure, an electronic device and a manufacturing method thereof can be provided in which an increase in manufacturing cost is suppressed and a space required for connection between a conductive cable and a wiring is small.

Drawings

Fig. 1 is a plan view showing a schematic configuration of an electronic device according to embodiment 1.

FIG. 2 is an arrow cross-sectional view taken along line X-X of FIG. 1.

FIG. 3 is an arrow sectional view along line XI-XI of FIG. 2.

Fig. 4 is a diagram illustrating steps up to the attaching step in the method of manufacturing the electronic device 1 according to embodiment 1.

Fig. 5 is a diagram illustrating steps up to the end face exposing step in steps subsequent to the step shown in fig. 4.

Fig. 6 is a diagram for explaining a step subsequent to the step shown in fig. 5.

Fig. 7 is a plan view showing a schematic configuration of an electronic device according to embodiment 2.

Fig. 8 is an X-X line arrow sectional view of fig. 7.

FIG. 9 is an arrow sectional view along line XI-XI of FIG. 8.

Fig. 10 is a diagram illustrating a first half of a process of a method of manufacturing an electronic device according to embodiment 3.

Fig. 11 is a diagram illustrating a procedure of the second half of the method for manufacturing an electronic device according to embodiment 3.

Fig. 12 is a diagram showing an example of a prior connection structure between a conductive cable and wiring on a substrate.

Fig. 13 is a diagram showing still another example of a prior connection structure between a conductive cable and wiring on a substrate.

Detailed Description

Embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated. The embodiments and modifications described below can also be combined as appropriate and selectively.

< embodiment 1 >

(Structure of electronic device)

Fig. 1 is a plan view showing a schematic configuration of an electronic device 1 according to embodiment 1. FIG. 2 is an arrow cross-sectional view taken along line X-X of FIG. 1. FIG. 3 is an arrow sectional view along line XI-XI of FIG. 2. In fig. 1, the resist 60 shown in fig. 2 is not shown.

As shown in fig. 1 to 3, the electronic device 1 includes: a resin molded body 10; electronic components 21a to 21 d; conductive cables 31a, 31 b; wiring 40a to wiring 40 i; a support body 50; and a resist 60.

The resin molded article 10 is plate-shaped and includes a resin such as Polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), Polyamide (PA), or the like. However, the material of the resin molded article 10 is not particularly limited. The thickness of the resin molded article 10 is not particularly limited, and is, for example, 3 mm. The surface of the resin molded body 10 includes: a surface 11 on which wiring 40a to wiring 40i are formed; and a face 12 on the back side of the face 11.

The electronic components 21a to 21d are selected from passive components (such as resistors and capacitors), active components (such as Large-Scale Integrated (LSI) and Integrated Circuits (ICs)), power supply devices (such as batteries), display devices (such as Light Emitting Diodes (LEDs)), sensors, and switches. Here, the electronic components 21a to 21c are chip-type capacitors, inductors, or resistors, and the electronic component 21d is an IC. However, the types of the electronic components 21a to 21d are not particularly limited.

The electronic components 21a to 21d have electrodes 22a to 22d, respectively. Hereinafter, each of the electronic components 21a to 21d is referred to as "electronic component 21" without particularly distinguishing the electronic components 21a to 21 d. Further, each of the electrodes 22a to 22d is referred to as "electrode 22" without particularly distinguishing the electrodes 22a to 22 d.

The electronic component 21 is embedded in the resin molded body 10 such that the electrode 22 is exposed from the surface 11 of the resin molded body 10. In other words, the electrode 22 is formed on a surface of the electronic component 21 exposed from the resin molded body 10. Of the surfaces of the electronic component 21, the surface exposed from the resin molded body 10 is continuous with the surface 11 of the resin molded body 10. The term "continuous" on both surfaces means that the level difference between the two surfaces is small enough to prevent the wiring formed on the two surfaces from being cut.

The conductive cable 31a includes: 4 wires (conductive wires) 32a as a conductive body; and an insulator 33a (see fig. 3) covering the electric wire 32 a. Likewise, the conductive cable 31b includes: 4 wires (conductive wires) 32 b; and an insulator 33b (see fig. 2 and 3) covering the electric wire 32 b. The wires 32a and 32b are, for example, stranded wires made of soft copper having a diameter of about 0.4 mm. The insulators 33a and 33b are made of insulating resin such as polyvinyl chloride (PVC), for example. The number of the wires 32a included in the conductive cable 31a is not limited to this, and may be 1 to 3 or 5 or more. Similarly, the number of the wires 32b included in the conductive cable 31b is not limited to this, and may be 1 to 3 or 5 or more. The wires 32a, 32b may be single wires. Hereinafter, each of the conductive cables 31a, 31b is referred to as "conductive cable 31" without particularly distinguishing the conductive cables 31a, 31 b. Each of the electric wires 32a, 32b is referred to as "electric wire 32" without particularly distinguishing the electric wires 32a, 32 b. Each of the insulators 33a, 33b is referred to as an "insulator 33" without particularly distinguishing the insulators 33a, 33 b.

One end 35b (see fig. 2) of the conductive cable 31b is embedded in the resin molded body 10. However, an end surface 34b (see fig. 1 and 2) of the conductive cable 31b on the side of the one end 35b is exposed from the surface 11 of the resin molded body 10. Although not shown in fig. 1 to 3, one end of conductive cable 31a is also embedded in resin molded body 10, as in conductive cable 31 b. An end surface 34a (see fig. 1) of the conductive cable 31a on the one end side is also exposed from the surface 11 of the resin molded body 10. The surface 11 of the resin molded body 10 is continuous with the end surfaces 34a and 34 b.

The conductive cables 31a and 31b protrude from the surface 12 of the resin molded body 10 except for one end portion. Hereinafter, each of the one end portion of the conductive cable 31a and the one end portion of the conductive cable 31b is referred to as "the one end portion 35" without particularly distinguishing the one end portion of the conductive cable 31a from the one end portion 35b of the conductive cable 31 b. Each of the end faces 34a, 34b is referred to as "end face 34" without particularly distinguishing the end faces 34a, 34 b.

The support body 50 supports the conductive cables 31a and 31 b. The support body 50 supports the conductive cables 31a and 31b by surrounding the outer peripheries of the conductive cables 31a and 31 b. The support 50 includes a resin. The resin constituting the support 50 may be the same as or different from the resin constituting the resin molded body 10.

The wires 40a to 40i are formed on at least one of the end surface 34 and the surface 11 of the resin molded body 10, and are electrically connected to at least one of the electrodes 22 of the electronic component 21 and the conductive cable 31. Specifically, the wiring 40a is connected to the electrode 22a of the electronic component 21a and the wire 32a of the conductive cable 31 a. The wiring 40b is connected to the electrode 22c of the electronic component 21c and the wire 32a of the conductive cable 31 a. The wiring 40c is connected to the electrode 22b of the electronic component 21b and the wire 32a of the conductive cable 31 a. The wiring 40d is connected to the electrode 22b of the electronic component 21b and the electrode 22c of the electronic component 21 c. The wiring 40e is connected to the electrode 22d of the electronic component 21d and the wire 32a of the conductive cable 31 a. The wires 40f, 40g, and 40h are connected to the electrodes 22d of the electronic component 21d and the wires 32b of the conductive cable 31 b. The wiring 40i is connected to the electrode 22a of the electronic component 21a and the wire 32b of the conductive cable 31 b. Hereinafter, each of the wirings 40a to 40i is referred to as "wiring 40" without particularly distinguishing the wirings 40a to 40 i. The wirings 40a to 40c and 40e to 40i are connected to one electric wire 32 of the conductive cable 31, but may be connected to a plurality of electric wires 32. For example, the wiring 40 may be connected to two wires 32a of the conductive cable 31a, or may also be connected to one wire 32a of the conductive cable 31a and one wire 32b of the conductive cable 31 b.

The wiring 40 can be easily formed by applying a liquid conductive ink (for example, silver (Ag) nano ink) onto the surface 11 of the resin molded body 10 by using, for example, an inkjet printing method or a screen printing method. The inkjet printing method is a printing method of ejecting liquid ink from a nozzle to deposit the ink on an ejection target surface. The wiring 40 may be made of a material other than Ag, or may be formed by another method, and the width, thickness, and the like are not particularly limited.

The resist 60 is formed on the surface 11 of the resin molded body 10, the end surface 34 of the conductive cable 31, and the exposed surface of the electronic component 21 so as to cover the wiring 40. The resist 60 is made of an insulating material, and provides moisture resistance and insulation to the wiring 40. The resist 60 is formed by, for example, an inkjet printing method or the like.

As described above, the electronic circuit including the electronic component 21 and the wiring 40 is formed on the surface 11 of the resin molded body 10. The electronic circuit is connected to other electronic circuits by means of a conductive cable 31.

(method of manufacturing electronic device)

Next, a method of manufacturing the electronic device 1 will be described with reference to fig. 4 to 6. Fig. 4 is a diagram illustrating steps up to the attaching step in the method of manufacturing the electronic device 1 according to embodiment 1. Fig. 5 is a diagram illustrating steps up to the end face exposing step in steps subsequent to the step shown in fig. 4. Fig. 6 is a diagram for explaining a step subsequent to the step shown in fig. 5. Fig. 4 (a), 5 (a), and 5 (b), and 6 (a) and c) are cross-sectional views illustrating steps of the method for manufacturing the electronic device 1. Fig. 4 (b) and (c) are side views illustrating the respective steps of the method for manufacturing the electronic device 1. Fig. 6 (b) is a plan view illustrating a step of the method for manufacturing the electronic device 1.

(first configuration step)

As shown in fig. 4 (a), the conductive cable 31 is inserted into the forming die 70. The forming die 70 includes a first die 71 and a second die 72. A recess 711 having a depth t1 into which the one end 35 of the conductive cable 31 is inserted is formed in the first mold 71. A through hole 721 through which the conductive cable 31 passes is formed in the second mold 72. An inner space 73 is formed between the first mold 71 and the second mold 72. The conductive cable 31 is inserted through the through hole 721 of the second mold 72 until it abuts against the bottom of the recess 711 of the first mold 71.

(Cable supporting step)

Then, the support 50 is molded by injecting the molten resin into the internal space 73. The resin is filled in the internal space 73 so as to surround the outer periphery of the conductive cable 31. Therefore, as shown in fig. 4 (b), a part of the conductive cable 31 is embedded in the support 50. Thereby, the conductive cable 31 is supported by the support body 50.

The conditions for performing the injection molding of the resin are appropriately selected depending on the material of the resin, and for example, when Polycarbonate (PC) is used, the injection resin temperature is 270 ℃ and the injection pressure is 100 MPa. The resin to be injection molded is appropriately selected from a variety of resin materials.

The one end portion 35 of the conductive cable 31 is inserted into the recess 711 of the first mold 71, and thus protrudes from the support 50. The length of protrusion from the support 50 is t1 equal to the depth of the recess 711 of the first mold 71.

(step of attachment)

Then, as shown in fig. 4 c, the sheet 80 is attached to the end surface 34 of the conductive cable 31 on the side of the one end 35 by an adhesive (not shown). Further, the electronic component 21 is also attached to the sheet 80 so that the electrode 22 is in contact with the sheet 80.

As a material of the sheet 80, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used. The sheet 80 preferably contains a material that transmits ultraviolet rays and has flexibility.

The conductive cable 31 and the electronic component 21 can be attached to the sheet 80 using, for example, an ultraviolet-curable adhesive (not shown) applied to the sheet 80. For example, the UV-curable adhesive is applied to a PET sheet in a thickness of 2 to 3 μm80 on one face 81. The coating may be performed by a method such as an inkjet printing method. Thereafter, the electronic component 21 and the conductive cable 31 are placed at predetermined positions. In this case, since the plurality of conductive cables 31 are integrated by the support 50, the plurality of conductive cables 31 can be easily positioned. Irradiating, for example, 3000mJ/cm from the other side 82 of the sheet 80 (i.e., the side on which the electronic part 21 and the conductive cable 31 are not provided)²The ultraviolet ray 83 of intensity of (3) is cured by the adhesive, and the electronic component 21 and the end face 34 of the conductive cable 31 are stuck to the sheet 80. At this time, the distance between the surface 82 of the sheet 80 and the surface 51 of the support 50 opposite to the sheet 80 is t 2.

(second configuration step)

Then, as shown in fig. 5 (a), the sheet 80, the one end portion 35 of the conductive cable 31, and the support 50 are disposed in the internal space 78 of the molding die 75. The forming die 75 includes a first die 76 and a second die 77. A through-hole 771 for passing the conductive cable 31 is formed in the second mold 77. The conductive cable 31 is drawn out to the outside of the molding die 75 through the through-hole 771 except for the one end 35 and the portion embedded in the support 50.

The face 761 of the first die 76 and the face 772 of the second die 77 face each other with the internal space 78 therebetween. The distance t3 between the surfaces 761 and 772 is designed to be the same as the distance t2 shown in fig. 4 (c) or slightly smaller than the distance t 2. The sheet 80 and the support 50 are disposed in the internal space 78 of the forming die 75 such that the surface 82 of the sheet 80 contacts the surface 761 of the first die 76 and the surface 51 of the support 50 contacts the surface 772 of the second die 77. Thus, even if the end surface 34 on the side of the one end 35 of the conductive cable 31 has a weak force of contact with the sheet 80, it is difficult to come off the sheet 80.

(resin Molding step)

Then, the resin molded body 10 is molded by injecting the molten resin into the internal space 78. The resin is filled in the internal space 78 so as to surround the electronic component 21, the one end 35 of the conductive cable 31, and the support 50. Therefore, as shown in fig. 5 (b), the electronic component 21, the one end portion 35 of the conductive cable 31, and the support 50 are embedded in the resin molded body 10.

The conditions for performing the injection molding of the resin are appropriately selected depending on the material of the resin, and for example, when polycarbonate is used, the injection resin temperature is 270 ℃ and the injection pressure is 100 MPa. The resin to be injection molded is appropriately selected from a variety of resin materials.

(end face exposing step)

Then, as shown in fig. 6 (a), the sheet 80 is peeled off from the surface of the resin molded body 10. The surface 11 of the resin molded body 10 is a surface in contact with the sheet 80. By peeling off the sheet 80, the electrode 22 of the electronic component 21 and the end face 34 of the conductive cable 31 are exposed from the surface 11. In this case, the surface 11 is continuous with the end surface 34.

(Wiring Forming step)

Then, as shown in fig. 6 (b), a wiring 40 connected to at least one of the wire 32 of the conductive cable 31 and the electrode 22 of the electronic component 21 is formed on the surface 11 of the resin molded body 10.

The wiring 40 is formed by a method (ink jet printing method) of ejecting a conductive material (for example, silver nano ink) by an ink jet printer or the like and printing, a screen printing method, or the like.

(resist Forming step)

Finally, as shown in fig. 6 (c), a resist 60 covering the wiring 40 is formed on the surface 11 of the resin molded body 10 in order to prevent oxidation of the wiring 40. The resist 60 of the electronic device 1 is formed by using a known technique of printing an ultraviolet-curable resist material by an ink jet printer or the like and curing the resist material by irradiation with ultraviolet light.

The electronic device 1 is manufactured by the steps. In addition, in the case where the end face 34 of the conductive cable 31 is firmly attached to the sheet 80 in the attaching step and the end face 34 of the conductive cable 31 is hard to come off from the sheet 80 in the resin molding step, the cable supporting step may be omitted. In this case, the electronic device 1 does not include the support 50.

(advantages)

As described above, the electronic device 1 according to embodiment 1 includes: a resin molded body 10; and a conductive cable 31 containing an electric wire 32 as a conductive body. One end 35 of the conductive cable 31 is embedded in the resin molded body 10. The surface of the resin molded body 10 includes a surface (continuous surface) 11 that exposes the end surface 34 of the conductive cable 31 on the side of the one end portion 35 and is continuous with the end surface 34. The electronic device 1 further includes: the wiring 40 is formed on the end surface 34 and the surface 11 so as to be connected to the electric wire 32 in the end surface 34.

With the above configuration, the conductive cable 31 is fixed by the resin molded body 10. Therefore, the wiring 40 connected to the electric wire 32 of the conductive cable 31 can be easily formed. That is, a complicated operation of positioning and fixing the conductive cable on the substrate or the like as in the above-described case is not necessary. Further, it is not necessary to provide a separate component for fixing the conductive cable 31 as in the above-described case, and a space for disposing the component is not necessary.

Further, the wiring 40 is formed on the end surface 34 of the conductive cable 31 and the surface 11 of the resin molded body 10 continuous to the end surface 34. This eliminates the need for other parts such as connectors. Further, a space for connecting the wires of the conductive cable and the wiring by solder or the like as in the above is not required, and a complicated connecting operation such as soldering is not required.

As described above, according to the electronic device 1, the space required for connecting the conductive cable 31 and the wiring 40 can be reduced while suppressing an increase in manufacturing cost.

The conductive cable 31 includes a plurality of wires 32 as electrical conductors. The wiring 40 is connected to at least one of the plurality of wires 32 exposed at the end surface 34. In the case where the conductive cable 31 includes a plurality of electric wires 32, the plurality of electric wires 32 are also exposed at the end surface 34. Thereby, the wiring 40 connected to each of the plurality of electric wires 32 can be easily formed. That is, as described above, it is not necessary to perform a complicated operation of pulling out a plurality of wires one by one from a conductive cable and connecting the wires to a wiring.

The electronic device 1 further includes an electronic component 21 embedded in the resin molded body 10. The electrode 22 of the electronic component 21 is exposed from the surface 11. The wiring 40 is connected to the electrode 22. Thus, in the electronic device 1, the electronic circuit is constituted by the electronic component 21 and the wiring 40. The electronic circuit can be easily connected to other electronic devices by means of the conductive cable 31.

The electronic device 1 further includes: and a resist 60 formed on the surface 11 and the end surface 34 so as to cover the wiring 40. As described, the face 11 is connected to the end face 34. Therefore, the resist 60 covering the wiring 40 can be easily formed.

The method of manufacturing the electronic device 1 may include at least the following steps.

A step of attaching the sheet 80 to the end surface 34 on the side of the one end portion 35 in the conductive cable 31 including the electric wire 32 as the conductor (attaching step).

A step of disposing the one end portion 35 of the conductive cable 31 and the sheet 80 in the internal space 78 of the molding die 75 (second disposing step).

A step of molding the resin molded body 10 in which the one end portion 35 of the conductive cable 31 is embedded by injecting resin into the internal space 78 (resin molding step).

A step of exposing the end face 34 on the surface of the resin molded body 10 by peeling the sheet 80 from the resin molded body 10 (end face exposing step).

A step of forming the wiring 40 connected to the electric wire 32 in the end face 34 on the surface of the resin molded body 10 (wiring forming step).

With this configuration, it is possible to manufacture the electronic apparatus 1 in which an increase in manufacturing cost is suppressed and a space required for connection of the conductive cable 31 and the wiring 40 is reduced.

The method of manufacturing the electronic device 1 further includes: a step of supporting the conductive cable 31 by the support 50 in such a manner that the one end portion 35 of the conductive cable 31 protrudes from the support 50. In the attaching step, the sheet 80 is attached to the end face 34 of the conductive cable 31 supported by the support 50. In the second arrangement step, the surface 82 of the sheet 80 on the side to which the end face 34 is not attached contacts the surface 761 of the forming die 75, and the surface 51 of the support 50 on the side opposite to the side from which the one end portion 35 protrudes contacts the surface 772 of the forming die 75. Thereby, the position of the sheet 80 and the support 50 is stabilized in the internal space 78. As a result, when the resin molded body 10 is molded, the end face 34 of the conductive cable 31 can be prevented from coming off the sheet 80.

In the attaching step, the electronic part 21 is attached to the sheet 80 so that the electrode 22 of the electronic part 21 is in contact with the sheet 80. In the resin molding step, the electronic component 21 is embedded in the resin molded body 10. In the end face exposing step, the electrode 22 is exposed on the surface of the resin molded body 10. In the wiring forming step, the wiring 40 is formed so as to be connected to the electrode 22. Thus, the electronic component 21 and the wiring 40 constitute an electronic circuit, and the electronic circuit can be easily connected to another electronic device via the conductive cable 31.

< embodiment 2 >

In embodiment 1, the electronic device 1 including the conductive cable 31 including the electric wire 32 as the circular conductor is explained. However, the shape of the conductive cable provided in the electronic device is not limited to this. The electronic device according to embodiment 2 includes a flexible flat cable including a flat conductor as a conductive cable.

Fig. 7 is a plan view showing a schematic configuration of an electronic device 1A according to embodiment 2. Fig. 8 is an X-X line arrow sectional view of fig. 7. FIG. 9 is an arrow sectional view along line XI-XI of FIG. 8. In fig. 7, the resist 60 shown in fig. 8 is not shown.

As shown in fig. 7 to 9, the electronic device 1A is different from the electronic device 1 of embodiment 1 in that: instead of the 2 conductive cables 31a and 31b, 2 conductive cables 91a and 91b are provided. The electronic device 1A according to embodiment 2 is manufactured by the same manufacturing method as that of embodiment 1.

The conductive cables 91a and 91b are flexible flat cables. The conductive cables 91a and 91b include: a flexible substrate 92; 4 conductive circuits 93; and an insulating layer 94 and an insulating layer 95 (see fig. 9).

The flexible substrate 92 is a flexible, tape-shaped insulating substrate, and includes, for example, Polyimide (PI). 2 of the 4 conductive circuits 93 are formed on one face of the flexible substrate 92, and the remaining 2 strips are formed on the other face of the flexible substrate 92. The conductive circuit 93 is a conductor having a flat cross section, and includes copper, for example. The 4 conductive circuits 93 are formed linearly along the longitudinal direction of the flexible substrate 92, and are insulated from each other. An insulating layer 94 is formed on one surface of the flexible substrate 92 so as to cover the conductive circuit 93. An insulating layer 95 is formed on the other surface of the flexible substrate 92 so as to cover the conductive circuit 93. The insulating layers 94 and 95 include resin. As described above, the conductive cables 91a and 91b are multilayer boards obtained by laminating the flexible substrate 92, the conductive circuit 93, the insulating layer 94, and the insulating layer 95.

One end portions 96 (see fig. 8) of the conductive cables 91a and 91b are embedded in the resin molded body 10. However, end surfaces 97 (see fig. 7 and 8) of the conductive cables 91a and 91b on the side of the one end portion 96 are exposed from the surface 11 of the resin molded body 10. Face 11 is continuous with end face 97. The wiring 40 is formed on the surface 11 so as to be connected to the conductive circuit 93 in the end surface 97.

The electronic device 1A according to embodiment 2 has the same advantages as the electronic device 1 according to embodiment 1.

< embodiment 3 >

In embodiment 1, the surface 51 of the support 50 is brought into contact with the surface 772 of the second mold 77, whereby the end surface 34 of the conductive cable 31 is maintained in contact with the sheet 80 in the internal space 78 of the molding mold 75. In contrast, in embodiment 3, the contact state between end surface 34 of conductive cable 31 and sheet 80 is maintained by applying force F to conductive cable 31 toward sheet 80. Therefore, the electronic device according to embodiment 3 does not include the support 50. In the method for manufacturing an electronic device according to embodiment 3, "first arranging step" and "support body forming step" in embodiment 1 are omitted.

A method for manufacturing the electronic device 1B according to embodiment 3 will be described with reference to fig. 10 and 11. Fig. 10 is a diagram illustrating a first half of a method of manufacturing the electronic device 1B according to embodiment 3. Fig. 11 is a diagram illustrating a procedure of the second half of the method for manufacturing the electronic device 1B according to embodiment 3. Fig. 10 (B) and (c) and fig. 11 (a) and (c) are cross-sectional views for explaining the respective steps of the method for manufacturing the electronic device 1B. Fig. 10 (a) is a side view illustrating a step of the method for manufacturing the electronic device 1B. Fig. 11 (B) is a plan view illustrating a step of the method for manufacturing the electronic device 1B.

(step of attachment)

First, as shown in fig. 10 (a), the electronic component 21 is attached to the sheet 80. At this time, the electrode 22 of the electronic component 21 is in contact with the sheet 80. The method of attaching the electronic component 21 to the sheet 80 is the same as the attaching step of embodiment 1, and for example, the ultraviolet-curable adhesive is applied to one surface 81 of the sheet 80 and irradiated with the ultraviolet rays 83, thereby attaching the electronic component 21 to the sheet 80.

(configuration step)

Then, as shown in fig. 10 (b), the one end portion 35 of the conductive cable 31 and the sheet 80 are disposed in the internal space 78 of the molding die 75 so that the end surface 34 of the conductive cable 31 contacts the sheet 80. At this time, conductive cable 31 passes through-hole 771 of second mold 77 and is pressed against surface 81 of sheet 80 by roller 79. The roller 79 is driven by a motor not shown, and applies a force F toward the sheet 80 to the conductive cable 31.

(resin Molding step)

Then, as shown in fig. 10 (c), the resin molded body 10 is molded by injecting the molten resin into the internal space 78 while pressing the conductive cable 31 against the sheet 80. The resin is filled in the internal space 78 so as to surround the electronic component 21 and the conductive cable 31. Therefore, as shown in fig. 10 (c), the electronic component 21 and the one end 35 of the conductive cable 31 are embedded in the resin molded body 10. At this time, since the conductive cable 31 is pressed against the sheet 80, the end face 34 of the conductive cable 31 can be suppressed from falling off from the sheet 80 by the flow pressure of the molten resin.

Thereafter, as shown in fig. 11 (a) to (c), the same steps as in embodiment 1 (end face exposing step), (wiring forming step), (resist forming step) are performed to manufacture an electronic device 1B including the electronic component 21, the conductive cable 31, the resin molded body 10, the wiring 40, and the resist 60. In the above description, the force F toward the sheet 80 side is applied to the conductive cable 31 in the disposing step and the resin molding step, but the force F may be applied to the conductive cable 31 at least in the resin molding step.

As described above, the method for manufacturing the electronic device 1B includes the following steps.

A step (disposing step) of disposing the one end portion 35 of the conductive cable 31 and the sheet 80 in the internal space 78 of the molding die 75 so that the end surface 34 on the one end portion 35 side of the conductive cable 31 including the electric wire 32 as the conductor is in contact with the sheet 80.

A step of molding the resin molded body 10 in which the one end portion 35 of the conductive cable 31 is embedded by injecting resin into the internal space 78 while pressing the conductive cable 31 against the sheet 80 (resin molding step).

A step of exposing the end face 34 on the surface of the resin molded body 10 by peeling the sheet 80 from the resin molded body 10 (end face exposing step).

A step of forming the wiring 40 connected to the electric wire 32 in the end face 34 on the surface of the resin molded body 10 (wiring forming step).

In embodiment 3, it is possible to manufacture the electronic device 1B in which the space required for connecting the conductive cable 31 and the wiring 40 is reduced while suppressing an increase in manufacturing cost. The electronic device 1B does not include the support 50. Therefore, the manufacturing cost for manufacturing the support 50 can be suppressed. Further, in the case of the electronic device 1 including the support 50, the design of the electronic device 1 is restricted by the support 50, but in embodiment 3, the restriction is suppressed.

The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined not by the description but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Description of the symbols

1. 1A, 1B: electronic device

10: resin molded article

11. 12, 51, 81, 82, 761, 772: noodle

21. 21a to 21d, 121: electronic component

22. 22a to 22 d: electrode for electrochemical cell

31. 31a, 31b, 91a, 91b, 131: conductive cable

32. 32a, 32b, 142: electric wire

33a, 33 b: insulator

34. 34a, 34b, 97: end face

35. 35b, 96: one end part

40. 40a to 40i, 140: wiring harness

50: support body

60: resist and method for producing the same

70. 75: forming die

71. 76: first mold

72. 77: second mold

73. 78: inner space

79: roller

80: sheet

83: ultraviolet ray

92: flexible substrate

93: conductive circuit

94. 95: insulating layer

110: substrate

135: fixing element

136: connector frame

141: solder

711: concave part

721. 771: through hole