阅读说明：本技术 一种采用高分子导电聚合工艺的hdi线路板制作方法 (A kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique ) 是由 肖安 于 2019-08-05 设计创作，主要内容包括：本发明涉及线路板制作技术领域,尤其为一种采用高分子导电聚合工艺的HDI线路板制作方法,包括基板开料：选用板材内部带有两层平行铜箔；本发明工序简易、药水消耗量低、污水产生量低、水消耗量低、不含有害化学物质、低螯合物以及少沉淀物产生等环保效益,亦具有不受钯价格影响、占用空间低、减省投资成本、低生产成本以及高收益等经济效益,更具有选择性工序、无铜粒生产、盲孔能力、水平和垂直均可、出色内层结合力、盲孔开窗位不起泡等技术优势,该线路板高分子导电膜孔工艺搭配图形电镀的生产工艺更具有线宽及BGA大小易控制,不会造成线细以及BGA变小问题,而且无需一铜后塞,缩减了成本。(The present invention relates to wiring board manufacture technology field, in particular a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique, including substrate sawing sheet: it selects and has two layers of parallel copper foil inside plate；Process of the present invention is simple, liquid medicine consumption is low, sewage yield is low, water consumption is low, without harmful chemical, the environmental benefits such as low chelate and few sediment generation, also have not by palladium price, occupied space is low, economization cost of investment, the economic benefits such as low production cost and high yield, more selective process, no copper particle production, blind hole ability, it is horizontal and vertical, outstanding internal layer binding force, the technical advantages such as blind hole windowing position is not blistering, the production technology of wiring board conductive polymer fenestra technique collocation graphic plating has more line width and BGA system easy to control in size, the problem that not will cause that line is thin and BGA becomes smaller, and it is not necessarily to a bronze medal rear plug, reduce cost.)

1. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique, it is characterised in that: the following steps are included:

A, it substrate sawing sheet: selects inside plate with the plate for being equipped with glass fibre between two layers of parallel copper foil and two layers of copper foil Material is as substrate, and the number of plies of plate is set according to use demand；

B, plate is cut: scheduled size when the substrate of selection is cut into production, and finishing processing is done in trimming；

C, plate drills: the substrate after cutting being drilled using digital control drilling machine, and the substrate after drilling is carried out clearly Reason；

D, plate route makes: carrying out internal layer circuit production to the substrate after drilling, obtains several sandwich circuit boards, and to wiring board Carry out quality restriction；

E, plate is radium-shine: radium-shine, formation blind hole is carried out using the upper and lower surface of the internal sandwich circuit board of laser；

F, plate conduction film production: the upper and lower surface using conductive polymer polymerization technique in substrate prepares macromolecule conductive film；

G, plate filling perforation: blind hole and through-hole on internal sandwich circuit board carry out plating and fill out copper；

H, plate presses: being pressed multiple substrates using supporting material, to obtain HDI wiring board.

2. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 1, feature Be: the substrate with a thickness of 0.5mm, the copper layer thickness of upper and lower surface is 1/18OZ, having a size of 460 × 575mm.

3. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 1, feature It is: before the radium-shine step of plate, also needs to carry out brownification processing to the upper and lower surface of substrate, make the upper and lower surface shape of substrate At one layer of brownification film.

4. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 1, feature It is: comprising following production process in the plate conductive film making step: adjustment, promotion, high molecular polymerization and microetch technique.

5. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 4, feature It is: needs to carry out de-smear operation before the microetch processing step, need to carry out three washings after microetch processing step Operation.

6. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 4, feature It is: in the plate conductive film making step, adjustment: impregnates in regulator to be cleaned and be adjusted to nonmetallic surface It is whole, sodium carbonate and sodium hydroxide, and 55~75mg/L of concentration of sodium carbonate are contained in regulator, and the pH value for controlling regulator is 10.5~12.5, at 60 ± 3 DEG C, the activity duration is controlled in 62 ± 5sec for operating temperature control.

7. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 4, feature It is: in the plate conductive film making step, promotes: being impregnated in promotor so that shape on nonmetallic surface after the adjustment At manganese dioxide coating, contain permanganate and boric acid in promotor, and MnO4 concentration is 80~120g/ in promotor L, mangaic acid root concentration is 0~3g/L and boric acid concentration is 8~19g/L, and the pH value for controlling promotor is 5~7, operating temperature control At 90 ± 3 DEG C, the activity duration controls in 70 ± 5sec system.

8. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 4, feature It is: in the plate conductive film making step, high molecular polymerization: impregnates in organic liquid so that in manganese dioxide coating Surface on form high molecular polymer conductive film, organic liquid contains organic acid and the list for being capable of forming high molecular polymer Body, and the concentration of monomer is 8.3~13.2mg/L and the concentration of organic acid is 11.5~25mg/L, and controls the pH of organic liquid Value is 1.8~2.5, and at 16~22 DEG C, the activity duration is controlled in 75 ± 5sec for operating temperature control.

9. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 4, feature It is: in the plate conductive film making step, microetch technique: impregnates in rear microetch liquid medicine to be cleaned and be stung to copper face It loses, hydrogen peroxide and sulfuric acid is contained in rear microetch liquid medicine.

10. a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique according to claim 9, special Sign is: the concentration of the hydrogen peroxide and sulfuric acid is hydrogen peroxide 13~21mg/L and 20~30mg/L of sulfuric acid, operating temperature At 30 ± 3 DEG C, activity duration control stings the control of erosion amount in 2~6 μ in 18 ± 5sec for control.

Technical field

The present invention relates to wiring board technology field, specially a kind of HDI wiring board using conductive polymer polymerization technique Production method.

Background technique

The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board, Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique) Circuit board etc., circuit board make circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting It acts on.

Summary of the invention

The purpose of the present invention is to provide a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique, tools Standby sequence is simple, liquid medicine consumption is low, sewage yield is low, water consumption is low, without harmful chemical, low chelate and few heavy The advantage of starch etc., solves electroless copper plating technique there are processes that various, the production cycle is long, high production cost, be easy to cause ring The problem of border pollutes and layers of copper is be easy to cause to separate.

To achieve the above object, the invention provides the following technical scheme: a kind of HDI using conductive polymer polymerization technique Method for manufacturing circuit board, comprising the following steps:

A, it substrate sawing sheet: selects inside plate and has between two layers of parallel copper foil and two layers of copper foil equipped with glass fibre Plate as substrate, and the number of plies of plate is set according to use demand；

B, plate is cut: scheduled size when the substrate of selection is cut into production, and trimming is finished Processing；

C, plate drills: the substrate after cutting is drilled using digital control drilling machine, and by the substrate after drilling into Row cleaning；

D, plate route makes: carrying out internal layer circuit production to the substrate after drilling, obtains several sandwich circuit boards, and to line Road plate carries out quality restriction；

E, plate is radium-shine: radium-shine, formation blind hole is carried out using the upper and lower surface of the internal sandwich circuit board of laser；

F, plate conduction film production: the upper and lower surface using conductive polymer polymerization technique in substrate prepares conductive polymer Film；

G, plate filling perforation: blind hole and through-hole on internal sandwich circuit board carry out plating and fill out copper；

H, plate presses: being pressed multiple substrates using supporting material, to obtain HDI wiring board.

Preferably, the substrate with a thickness of 0.5mm, the copper layer thickness of upper and lower surface is 1/18OZ, having a size of 460 × 575mm。

Preferably, it before the radium-shine step of the plate, also needs to carry out brownification processing to the upper and lower surface of substrate, makes substrate Upper and lower surface forms one layer of brownification film.

Preferably, include following production process in the plate conductive film making step: adjustment promotes, high molecular polymerization With microetch technique.

Preferably, need to carry out de-smear operation before the microetch processing step, needed after microetch processing step into Three washing operation of row.

Preferably, it in the plate conductive film making step, adjustment: impregnates in regulator to be carried out to nonmetallic surface It cleans and adjusts, sodium carbonate and sodium hydroxide, and 55~75mg/L of concentration of sodium carbonate are contained in regulator, and control regulator PH value be 10.5~12.5, at 60 ± 3 DEG C, the activity duration is controlled in 62 ± 5sec for operating temperature control.

Preferably, in the plate conductive film making step, promote: impregnating the non-gold so that after the adjustment in promotor Manganese dioxide coating is formed on metal surface, and permanganate and boric acid, and MnO4 concentration in promotor are contained in promotor For 80~120g/L, mangaic acid root concentration is 0~3g/L and boric acid concentration is 8~19g/L, and control promotor pH value be 5~ 7, at 90 ± 3 DEG C, the activity duration is controlled in 70 ± 5sec for operating temperature control.

Preferably, it in the plate conductive film making step, high molecular polymerization: impregnates in organic liquid so that in dioxy Change and form high molecular polymer conductive film on the surface of manganese coating, organic liquid contains organic acid and is capable of forming polyphosphazene polymer The monomer of object is closed, and the concentration of monomer is 8.3~13.2mg/L and the concentration of organic acid is 11.5~25mg/L, and controlled organic The pH value of liquid is 1.8~2.5, and at 16~22 DEG C, the activity duration is controlled in 75 ± 5sec for operating temperature control.

Preferably, in the plate conductive film making step, microetch technique: in rear microetch liquid medicine impregnate with to copper face into Row cleans and stings erosion, contains hydrogen peroxide and sulfuric acid in rear microetch liquid medicine.

Preferably, the concentration of the hydrogen peroxide and sulfuric acid be hydrogen peroxide 13~21mg/L and 20~30mg/L of sulfuric acid, At 30 ± 3 DEG C, activity duration control stings the control of erosion amount in 2~6 μ in 18 ± 5sec for operating temperature control.

Compared with prior art, beneficial effects of the present invention are as follows:

Process of the present invention is simple, liquid medicine consumption is low, sewage yield is low, water consumption is low, without harmful chemical, Low chelate and few sediment such as generate at the environmental benefits, also have not by palladium price, occupied space is low, economization investment at This, the economic benefits such as low production cost and high yield, more selective process, without copper particle production, blind hole ability, level and The technical advantages such as vertical, outstanding internal layer binding force, blind hole windowing position be not blistering, the wiring board conductive polymer fenestra technique The production technology of graphic plating of arranging in pairs or groups has more line width and BGA system easy to control in size, the problem that not will cause that line is thin and BGA becomes smaller, And it is not necessarily to a bronze medal rear plug, reduce cost.

Detailed description of the invention

Fig. 1 is process flow chart of the invention.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.

Referring to Fig. 1, a kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique, comprising the following steps:

A, it substrate sawing sheet: selects inside plate and has between two layers of parallel copper foil and two layers of copper foil equipped with glass fibre Plate as substrate, and the number of plies of plate is set according to use demand；

B, plate is cut: scheduled size when the substrate of selection is cut into production, and trimming is finished Processing；

C, plate drills: the substrate after cutting is drilled using digital control drilling machine, and by the substrate after drilling into Row cleaning；

D, plate route makes: carrying out internal layer circuit production to the substrate after drilling, obtains several sandwich circuit boards, and to line Road plate carries out quality restriction；

E, plate is radium-shine: radium-shine, formation blind hole is carried out using the upper and lower surface of the internal sandwich circuit board of laser；

F, plate conduction film production: the upper and lower surface using conductive polymer polymerization technique in substrate prepares conductive polymer Film；

G, plate filling perforation: blind hole and through-hole on internal sandwich circuit board carry out plating and fill out copper；

H, plate presses: being pressed multiple substrates using supporting material, to obtain HDI wiring board.