阅读说明：本技术 一种柔性led线路板功能孔的加工方法 (A kind of processing method in flexibility led circuit board function hole ) 是由 翁金钟 于 2019-07-09 设计创作，主要内容包括：本发明公开了一种柔性led线路板功能孔的加工方法,包括A面板上孔加工、B面板上孔加工和过孔加工,在加工过孔时,采用刻蚀操作,不直接对铜箔进行机械加工,避免铜箔变形,能够最大限度的降低铜箔厚度,增加柔性led线路板的弯曲能力,避免柔性led线路板在孔加工中出现穿孔现象,减少残次品。(The invention discloses a kind of processing methods in flexibility led circuit board function hole, including hole machined on hole machined on A panel, B panel and cross hole machined, when processing via hole, using etching operation, directly copper foil is not machined, copper foil is avoided to deform, copper thickness can be reduced to greatest extent, the bending ability for increasing flexibility led wiring board avoids flexible led wiring board from occurring perforated phenomenon in hole machined, reduces defect ware.)

1. a kind of processing method in flexibility led circuit board function hole, which is characterized in that the flexibility led wiring board is two-sided soft Property wiring board, includes A panel and B panel, insulating cement is provided between A panel and B panel, A panel is by insulating cement side It is another by insulating cement to be disposed with protective film 1A, transparent adhesive tape 1A, copper foil A, transparent adhesive tape 2A and protective film 2A, the B panel outward Side is disposed with protective film 1B, transparent adhesive tape 1B, copper foil B, transparent adhesive tape 2B and protective film 2B, the processing method in the hole outward The following steps are included:

(1) hole machined on A panel:

S1, circuit, including pad, lead and via hole A are etched on copper foil A one side using etching liquid, after the completion and cleared up Etching liquid；

S2, compacting fenestra A is carried out on protective film 2A using mold, the fenestra location A is determined by pad locations on copper foil A；

S3, using film laminator protective film 1A and protective film 2A are fitted in the non-etched circuit side copper foil A respectively and etch electricity The side on road, and ensure that fenestra A is aligned with pad locations on copper foil A；

(2) hole machined on B panel:

U1, circuit, including pad, lead and via hole B are etched on copper foil B one side using etching liquid, after the completion and cleared up Etching liquid；

U2, compacting fenestra B is carried out on protective film 2B using mold, the fenestra B location is determined by pad locations on copper foil B；

U2, protective film 1B is fitted in the non-etched circuit side copper foil B using film laminator；

(3) hole machined is crossed:

L1, A panel and B panel are separately positioned on to insulating cement two sides, and protective film 1A and protective film 1B is straight with insulating cement respectively Contact is simultaneously even integral；

L2, using laser drilling machine from the side copper foil B to internal drilling, laser drill head is directly right directly through the via hole B on copper foil B Transparent adhesive tape 1B, protective film 1B, insulating cement, transparent adhesive tape 1A and protective film 1A carry out drilling one, one both ends of hole respectively with via hole A and mistake Hole B is connected to arrive via hole；

L3, copper chaff is passed through in via hole, copper chaff both ends are welded with copper foil A and copper foil B respectively；

L4, protective film 2B is fitted in the side that copper foil B etches circuit using film laminator.

Technical field

The invention belongs to the processing method in circuit board function hole, more specifically to a kind of flexibility led circuit board function The processing method in hole.

Background technique

In recent years, with light and handyization of electronic product, multifunction, it is desirable that internal flexible circuit board wiring density is more next It is higher.Meanwhile in order to reach soft feature resistant to bending and thinner, the final copper thickness of product is also very thin, that is, requires raw material Insulating layer, final products copper layer thickness is all than relatively thin.

Summary of the invention

The purpose of the present invention is to provide a kind of processing methods in flexibility led circuit board function hole, not directly to copper foil into Row machining, avoids copper foil from deforming, and can reduce copper thickness to greatest extent, increases the bending energy of flexibility led wiring board Power avoids flexible led wiring board from occurring perforated phenomenon in hole machined, reduces defect ware.

A kind of processing method in flexibility led circuit board function hole of technical solution of the present invention, the flexibility led wiring board is double Face flexible circuit board includes A panel and B panel, insulating cement is provided between A panel and B panel, A panel is by insulating cement Side is disposed with protective film 1A, transparent adhesive tape 1A, copper foil A, transparent adhesive tape 2A and protective film 2A outward, and the B panel is by insulating The glue other side is disposed with protective film 1B, transparent adhesive tape 1B, copper foil B, transparent adhesive tape 2B and protective film 2B, the processing in the hole outward Method the following steps are included:

(1) hole machined on A panel:

S1, circuit, including pad, lead and via hole A are etched on copper foil A one side using etching liquid, after the completion simultaneously Clean-up etch liquid；

S2, compacting fenestra A is carried out on protective film 2A using mold, the fenestra location A is true by pad locations on copper foil A It is fixed；

S3, protective film 1A and protective film 2A are fitted in the non-etched circuit side copper foil A and etching respectively using film laminator The side of circuit out, and ensure that fenestra A is aligned with pad locations on copper foil A；

(2) hole machined on B panel:

U1, circuit, including pad, lead and via hole B are etched on copper foil B one side using etching liquid, after the completion simultaneously Clean-up etch liquid；

U2, compacting fenestra B is carried out on protective film 2B using mold, the fenestra B location is true by pad locations on copper foil B It is fixed；

U2, protective film 1B is fitted in the non-etched circuit side copper foil B using film laminator；

(3) hole machined is crossed:

L1, A panel and B panel be separately positioned on to insulating cement two sides, and protective film 1A and protective film 1B respectively with insulation Glue is directly contacted and is even integral；

L2, using laser drilling machine from the side copper foil B to internal drilling, laser drill head is directly through the via hole B on copper foil B, directly Connect and drilling one carried out to transparent adhesive tape 1B, protective film 1B, insulating cement, transparent adhesive tape 1A and protective film 1A, one both ends of hole respectively with via hole A It is connected to via hole B to get via hole is arrived；

L3, copper chaff is passed through in via hole, copper chaff both ends are welded with copper foil A and copper foil B respectively；

L4, protective film 2B is fitted in the side that copper foil B etches circuit using film laminator.

The beneficial effect of technical solution of the present invention is:

A kind of processing method in flexibility led circuit board function hole of technical solution of the present invention, operating method is simple, utilizes quarter Through-hole, the via hole on copper foil are processed in erosion operation, are effectively avoided and are carried out machining operations to copper foil, avoid copper The deformation of foil can reduce copper thickness, i.e., reduction flexibility led wiring board integral thickness, improve flexibility led wiring board performance with Entire ability.

Detailed description of the invention

A kind of flexibility led circuit board structure schematic diagram Fig. 1 of the invention.

Specific embodiment

For convenient for those skilled in the art understand that technical solution of the present invention, now in conjunction with Figure of description to the technology of the present invention side Case is described further.

As shown in Figure 1, a kind of flexibility led circuit board structure schematic diagram, flexible led wiring board is double-faced flexible wiring board, Include A panel and B panel, be provided with insulating cement between A panel and B panel, A panel by 011 side of insulating cement outward according to Secondary to be provided with protective film 1A01, transparent adhesive tape 1A02, copper foil A03, transparent adhesive tape 2A04 and protective film 2A05, the B panel is by insulating 011 other side of glue is disposed with protective film 1B06, transparent adhesive tape 1B07, copper foil B08, transparent adhesive tape 2B09 and protective film outward 2B010。

A kind of processing method in flexibility led circuit board function hole, comprising the following steps:

(1) hole machined on A panel:

S1, circuit, including pad, lead and via hole A are etched on copper foil A03 one side using etching liquid, after the completion And clean-up etch liquid；

S2, compacting fenestra A is carried out on protective film 2A04 using mold, the fenestra location A is by pad locations on copper foil A It determines；

S3, protective film 1A02 and protective film 2A05 are fitted in the non-etched circuit side copper foil A03 respectively using film laminator With etch the side of circuit, and ensure that fenestra A is aligned with pad locations on copper foil A03；

(2) hole machined on B panel:

U1, circuit, including pad, lead and via hole B are etched on copper foil B08 one side using etching liquid, after the completion And clean-up etch liquid；

U2, compacting fenestra B is carried out on protective film 2B010 using mold, the fenestra B location is by pad on copper foil 08B Position determines；

U2, protective film 1B06 is fitted in the non-etched circuit side copper foil B08 using film laminator；

(3) hole machined is crossed:

L1, A panel and B panel are separately positioned on to 011 two sides of insulating cement, and protective film 1A01 and protective film 1B06 distinguishes It directly contacts with insulating cement 011 and is even integral；

L2, using laser drilling machine from the side copper foil B08 to internal drilling, laser drill head is directly through the via hole on copper foil B08 B directly carries out drilling one, Kong Yi to transparent adhesive tape 1B07, protective film 1B06, insulating cement 011, transparent adhesive tape 1A01 and protective film 1A02 Both ends are connected to arrive via hole 012 respectively with via hole A and via hole B；

L3, copper chaff is passed through in via hole 12, copper chaff both ends are welded with copper foil A03 and copper foil B08 respectively；

L4, protective film 2B010 is fitted in the side that copper foil B08 etches circuit using film laminator.

In the present invention, in film laminator press mold, need that first corresponding glue is coated on film, and avoid the hole on film, then Directly film is bonded with copper foil.

Technical solution of the present invention is exemplarily described invention above in conjunction with attached drawing, it is clear that present invention specific implementation It is not subject to the restrictions described above, changes as long as using the various unsubstantialities that the inventive concept and technical scheme of the present invention carry out Into, or it is not improved the conception and technical scheme of invention are directly applied into other occasions, in protection scope of the present invention Within.