阅读说明：本技术 变压器线路板的制作方法及其变压器 (The production method and its transformer of transformer lines plate ) 是由 汪炜杰 于 2018-10-19 设计创作，主要内容包括：本发明提供一种变压器线路板的制作方法,其包含以下步骤:模板冲压,多个金属线路板分别通过一模具冲压形成；初次堆叠,两个外绝缘层之间叠合有相互对准的金属线路板,且相邻的两个金属线路板间分别又设置有一内绝缘层；初次压合,以热压方式将金属线路板热熔固定在两个外绝缘层之间；二次堆叠,在两个外绝缘层的外侧对准内侧的金属线路板的相对位置再次堆叠一个金属线路板；二次压合,同样使用热压方式,将位于两个外绝缘层外侧上的金属线路板作紧密结合,并在热压后的各外绝缘层上印刷形成一个防焊绿漆层,最后裁切成形一个低漏感、高电磁干扰屏蔽的变压器线路板。(The present invention provides a kind of production method of transformer lines plate, and it includes following steps: template punching press, multiple metal circuit boards pass through a mould punching respectively and are formed；It is first to stack, it is superimposed with the metal circuit board being mutually aligned between two external insulation layers, and be provided with an inner insulating layer between two adjacent metal circuit boards again respectively；Metal circuit board hot melt is fixed between two external insulation layers by first pressing with hot pressing mode；The relative position of secondary stacking, the metal circuit board on the inside of the alignment of the outside of two external insulation layers stacks a metal circuit board again；Second pressing, equally use hot pressing mode, the metal circuit board being located on the outside of two external insulation layers is combined closely, and printing forms an anti-welding green paint layer on each external insulation layer after hot-pressing, finally cuts the transformer lines plate of one low drain sense of forming, high electromagnetic interference shield.)

1. a kind of production method of transformer lines plate, it includes the following steps:

Template punching press: multiple metal circuit boards pass through a mould punching respectively and are formed, and each metallic circuit layer is coaxially provided with One axis hole, and the shape of each metal circuit board can be identical or different；

It is first to stack: to be superimposed with the multiple metal circuit board between two external insulation layers, and by set each axis hole Alignment, and it is provided with an inner insulating layer again respectively between two adjacent metal circuit boards, to be formed with the institute of multi-layer intercrossed overlapping State metal circuit board and the inner insulating layer；

First pressing: being closed adjacent each external insulation layer and each hot melt of the inner insulating layer with hot pressing mode, and It is fixed on the multiple metal circuit board between described two external insulation layers；

Secondary stacking: after the first pressing step, in the outside of each external insulation layer in each gold of inside The axis hole alignment position for belonging to wiring board stacks a metal circuit board again；And

Second pressing: equally using hot pressing mode, will be located at the multiple metal circuit board on described two external insulation layers and makees It combines closely, and carries out screen painting after hot pressing on each external insulation layer, form an anti-welding green paint layer, finally cut Shape a transformer lines plate.

2. the production method of transformer lines plate according to claim 1, which is characterized in that in the first stacking procedure In the secondary stacking procedure, the multiple metal circuit board stacking aligned with each other of each layer, and each layer is positioned with X-ray correction Between the metal circuit board relative position and route whether deviate.

3. the production method of transformer lines plate according to claim 2, which is characterized in that in the first stacking procedure In, the metal circuit board of each layer has tack and is stacked by manual type, and the relative position of required laying is led to Cross infrared ray and be incident upon on corresponding each inner insulating layer with circuit image 1:1 and positioned, then by manually align will tool from Each metal circuit board of viscosity is fitted on the designated position of each inner insulating layer, is finally re-layed each described External insulation layer.

4. the production method of transformer lines plate according to claim 3, which is characterized in that in the secondary stacking procedure In, each metal circuit board for having tack is fitted in the specific bit of each external insulation layer with artificial alignment mode It sets, and is directed at the relative position of the metal circuit board on the inside of each external insulation layer；Wherein, the multiple metallic circuit Plate includes one first metal circuit board, one second metal circuit board, a third metal circuit board and one the 4th metal circuit board, institute It states the first metal circuit board and the 4th metal circuit board is located on the outside of described two external insulation layers, and described the Two metal circuit boards and the third metal circuit board are then located at the inside of described two external insulation layers, and sequentially fold be located at it is described Between two external insulation layers, the inner insulating layer is located between second metal circuit board and the third metal circuit board；Institute State metal circuit board and the external insulation layer and when the inner insulating layer staggeredly overlaps, first metal circuit board and described the The iterative structure of four metal circuit boards each other on the contrary, and second metal circuit board and the third metal circuit board overlapping Structure is opposite each other.

5. the production method of transformer lines plate according to claim 2, which is characterized in that in the first stacking procedure In, the multiple metal circuit board of each layer has tack and is stacked by automation equipment mode, is set by automation Each metal circuit board of standby upper manipulator clamping tool tack, and place be pasted onto it is corresponding be set in it is each it is described in The relative position of insulating layer finally re-lays each external insulation layer.

6. the production method of transformer lines plate according to claim 5, which is characterized in that in the secondary stacking procedure In, each metal circuit board of tack is placed on the corresponding relative position for being set in each external insulation layer, and It is directed at the relative position of the metal circuit board on the inside of each external insulation layer；Wherein, the multiple metal circuit board includes one First metal circuit board, one second metal circuit board, a third metal circuit board and one the 4th metal circuit board, first gold medal Belong to wiring board and the 4th metal circuit board is located on the outside of described two external insulation layers, and second metal wire Road plate and the third metal circuit board are then located at the inside of described two external insulation layers, and sequentially fold be located at it is described two it is outer absolutely Between edge layer, the inner insulating layer is located between second metal circuit board and the third metal circuit board；In the metal wire When road plate and the external insulation layer and the inner insulating layer staggeredly overlap, first metal circuit board and the 4th metal wire The iterative structure of road plate each other on the contrary, and second metal circuit board and the third metal circuit board iterative structure each other On the contrary.

7. the production method of transformer lines plate according to claim 1, which is characterized in that in the second pressing step Afterwards, also include a drill process: drilling through the via hole of a circuit transmission to the line construction of each metal circuit board, And the anti-welding green paint layer is printed on each external insulation layer, the subsequent each via hole scolding tin of correspondence has a connection Column, to be fixedly connected with each metal circuit board.

8. the production method of transformer lines plate according to claim 7, which is characterized in that each connecting column is presented Narrow lower wide cylinder kenel, and the perficial helical of each connecting column has one to flow into each via hole conducive to tin plating Diversion trench.

9. the production method of transformer lines plate according to claim 1, which is characterized in that the multi-layer intercrossed overlapping In the metal circuit board, the external insulation layer and the inner insulating layer, the metal circuit board of each layer is equidistantly spread in the horizontal direction If quantity is multiple, and the multiple metal circuit board stacking aligned with each other of adjacent layer, multiple transformer wires are once made Road plate.

10. a kind of transformer, it includes the obtained transformations of production method using transformer lines plate as described in claim 1 Device wiring board.

Technical field

The present invention relates to the production methods and its transformer of a kind of transformer lines plate.

Background technique

In general, the processing procedure of transformer is according to required power, voltage, electric current, sensibility reciprocal, leakage inductance, magnetic saturation efficiency etc. Characteristic and configuration demand, and then copper wire diameter, circuit diagram number and the multiple and different windings that design uses.

However, in the prior art, a kind of transformer lines plate is to make route with camera technique in route production, Route manufacturing process is then to be exposed, develop on copper foil, etching, drilling, being electroplated and produce each interlayer and need route, so Each interlayer route is being become a complete printed circuit board to press technology pressing afterwards, is being assembled with magnetic core；But route Manufacturing process in, be etched on surfaces of the copper foil using chemical liquid, and etching when be easy to appear lateral erosion effect, That is the upper layer of route bottom time due to the time corroded is longer is shorter, thus route be easy to appear it is up-narrow and down-wide Phenomenon, wherein the route of copper foil is because lateral erosion effect leads to the variation of line footpath and then influences the characteristic of transformer.

Specifically, the lateral erosion effect of copper foil surface will lead to pressure programming and be easy to appear flow adhesive non-uniform phenomenon, into And the copper foil of each interlayer is caused to have recess, and serious person's interlayer has bubble or fitting bad, and it even results in interlaminar separation and scraps, nothing Method achievees the effect that stable processing procedure.

Moreover, the route processing procedure of copper foil is cumbersome, and need to will increase processing procedure ring instead with a variety of different chemical agents The risk in border；Furthermore being made for route can not be effectively controlled with chemical agent etching, or even will cause and generate side on copper foil Effect is lost, influence transformer lines plate instead is made efficiency and yield.

Summary of the invention

In order to solve the problems, such as that transformer lines plate is lacked in processing procedure in the prior art, the present invention provides a kind of transformer wire The production method of road plate, the route on copper foil are formed by mould punching, are exposed, develop, etch without chemical agent And etc., it solves the problems, such as that copper foil generates lateral erosion effect, improves the yield of transformer lines plate processing procedure.

The present invention provides a kind of production method of transformer lines plate, and it includes template punching press, first stacking, first pressures Conjunction, secondary stacking and second pressing.Template punching press, multiple metal circuit boards pass through a mould punching respectively and are formed, each described Metallic circuit layer is coaxially provided with an axis hole, and the shape of each metal circuit board can be identical or different；It is first to stack, two It is superimposed with metal circuit board between a external insulation layer, and set each axis hole is aligned, and two adjacent metal circuit boards Between respectively again be provided with an inner insulating layer, to be formed with the metal circuit board and inner insulating layer of multi-layer intercrossed overlapping；First pressing, Adjacent each external insulation layer and the hot melt of each inner insulating layer are closed with hot pressing mode, and metal circuit board is made to be fixed on two Between external insulation layer；Secondary stacking, after pressing step for the first time, in the outside of each external insulation layer in each metallic circuit of inside The axis hole alignment position of plate stacks a metal circuit board again；Second pressing equally uses hot pressing mode, will be located at outside two Metal circuit board on insulating layer is combined closely, and carries out screen painting after hot pressing on each external insulation layer, forms one Anti-welding green paint layer finally cuts one transformer lines plate of forming.

In one of the embodiments, in the first stacking procedure and the secondary stacking procedure, each layer it is described Multiple metal circuit board stackings aligned with each other, and with X-ray correction position the metal circuit board of each interlayer relative position and Whether route deviates.

In one of the embodiments, in the first stacking procedure, the metal circuit board of each layer has tack And stacked by manual type, the relative position of required laying is incident upon correspondence by infrared ray with circuit image 1:1 It is positioned on each inner insulating layer, then is fitted in each metal circuit board for having tack respectively by manually aligning On the designated position of a inner insulating layer, each external insulation layer is finally re-layed.

In one of the embodiments, in the secondary stacking procedure, will have each of tack with artificial alignment mode A metal circuit board is fitted on the designated position of each external insulation layer, and is aligned in each external insulation layer The relative position of the metal circuit board of side；Wherein, the multiple metal circuit board includes one first metal circuit board, one second gold medal Belong to wiring board, a third metal circuit board and one the 4th metal circuit board, first metal circuit board and the 4th metal Wiring board is located on the outside of described two external insulation layers, and second metal circuit board and the third metallic circuit Plate is then located at the inside of described two external insulation layers, and sequentially folds and be located between described two external insulation layers, and the inner insulating layer is set Between second metal circuit board and the third metal circuit board；In the metal circuit board and the external insulation layer and institute When stating inner insulating layer and staggeredly overlapping, the iterative structure of first metal circuit board and the 4th metal circuit board phase each other Instead, and second metal circuit board and the iterative structure of the third metal circuit board are opposite each other.

In one of the embodiments, in the first stacking procedure, the multiple metal circuit board tool of each layer is certainly It viscosity and is stacked by automation equipment mode, passes through each institute of manipulator in automation equipment clamping tool tack Metal circuit board is stated, and places and is pasted onto the corresponding relative position for being set in each inner insulating layer, is finally re-layed each The external insulation layer.

In one of the embodiments, in the secondary stacking procedure, by each metal circuit board of tack It is placed on the corresponding relative position for being set in each external insulation layer, and is directed at the metal wire on the inside of each external insulation layer The relative position of road plate；Wherein, which includes one first metal circuit board, one second metal circuit board, one the Three metal circuit boards and one the 4th metal circuit board, first metal circuit board are located at the 4th metal circuit board On the outside of described two external insulation layers, and second metal circuit board and the third metal circuit board are then located at described two The inside of a external insulation layer, and sequentially fold and be located between described two external insulation layers, the inner insulating layer is located at second metal Between wiring board and the third metal circuit board；Interlock in the metal circuit board and the external insulation layer and the inner insulating layer When overlapping, the iterative structure of first metal circuit board and the 4th metal circuit board is each other on the contrary, and second gold medal Belong to wiring board and the iterative structure of the third metal circuit board is opposite each other.

It also include a drill process in one of the embodiments, after the second pressing step: to each described The line construction of metal circuit board drills through the via hole of a circuit transmission, and prints on each external insulation layer described anti- Green paint layer is welded, the subsequent each via hole scolding tin of correspondence has a connecting column, to be fixedly connected with each metal circuit board.

Each connecting column is in up-narrow and down-wide cylinder kenel, and each connection in one of the embodiments, The perficial helical of column has one to be conducive to the tin plating diversion trench for flowing into each via hole.

The metal circuit board, the external insulation layer of the multi-layer intercrossed overlapping and institute in one of the embodiments, It states in inner insulating layer, it is multiple, and the metallic circuit of adjacent layer that the metal circuit board of each layer is equidistantly laid with quantity in the horizontal direction Plate stacking aligned with each other, multiple transformer lines plates are once made.

Another embodiment of the present invention provides a kind of transformers, and it includes the production methods using above-mentioned transformer lines plate Obtained transformer lines plate.

Therefore, metal circuit board of the invention is formed by corresponding mould punching, instead of using in the prior art Chemical agent is exposed, develops, etching, and has achieved the purpose that prevent copper foil from generating lateral erosion effect, has improved transformation The yield of device wiring board processing procedure, and the line coherency on each metal circuit board is higher, can also further promote whole life Produce efficiency.

Furthermore the present invention aligns in stacking process by accurate correction, so that the metal circuit board of each interlayer is mutual Alignment, to prevent the position of metal circuit board from generating offset, in addition, the processing procedure mode of metal circuit board effectively excludes lateral erosion effect The problem of, in this way, more can clearly promote the stability of processing procedure transformer lines plate.

Detailed description of the invention

Fig. 1 is implementation steps flow chart of the invention.

Fig. 2 is single transformer lines plate schematic diagram of the invention.

Fig. 3 is the structural schematic diagram of each layer metal circuit board of the invention.

Fig. 4 is the implementation action diagram of the first stacking procedure of the present invention, indicates the second metal circuit board and third metallic circuit Plate is superimposed on the two sides of inner insulating layer.

Fig. 5 is the implementation action diagram of the first stacking procedure of the present invention, indicates that two external insulation layers are laid on the second gold medal respectively Belong on wiring board and third metal circuit board.

Fig. 6 is the implementation action diagram of the first pressing step of the present invention.

Fig. 7 is the molding sectional view after the first pressing step of the present invention.

Fig. 8 is the implementation action diagram of the secondary stacking procedure of the present invention, indicates the first metal circuit board and the 4th metallic circuit Plate is superimposed on external insulation layer respectively.

Fig. 9 is the implementation action diagram of second pressing step of the present invention.

Figure 10 is the implementation action diagram of drill process of the present invention.

Symbol description:

Metal circuit board 10

Axis hole 101

First metal circuit board 11

Second metal circuit board 12

Third metal circuit board 13

4th metal circuit board 14

External insulation layer 20

Inner insulating layer 21

Anti-welding green paint layer 30

Hot press 40

Connecting column 50

Diversion trench 51

Transformer lines plate 100

Template punching press S1

It is first to stack S2

First pressing S3

Secondary stacking S4

Second pressing S5

Drill S6

Specific embodiment

In order to which the objects, technical solutions and advantages of the application are more clearly understood, by the following examples, and combine attached Figure, is further elaborated the production method and its transformer of the transformer lines plate of the application.It should be appreciated that herein Described specific embodiment only to explain the application, is not used to limit the application.It should be noted that in embodiment, Various difference objects are described in the ratio, size, deflection or the displacement that are suitable for explanation, not in accordance with actual component Ratio be described.

Referring to Figure 1 to shown in Figure 10, the present invention provides the production method and its transformer of a kind of transformer lines plate, Production method includes template punching press S1, stacks S2 for the first time, presses S3, secondary stacking S4, second pressing S5 and the S6 etc. that drills for the first time Multinomial step.

Template punching press S1: as shown in Figure 1 to Figure 3, multiple metal circuit boards 10 are formed by a mould punching respectively, each The shape of metal circuit board 10 can be to be identical or different, in the present embodiment, and each metal circuit board 10 is the copper foil of tack, And the mold for being used to each metal circuit board 10 of punching press is via CNC lathe or laser carved designed to form, wherein each metal The central coaxial of wiring board 10 is equipped with an axis hole 101, and different metal circuit boards 10, internal wiring can be according to stacking orders And it is different.

It is first to stack S2: as shown in Figures 1 to 5, the metal circuit board 10 of each layer be equidistantly equipped in the horizontal direction it is multiple, And the stacking aligned with each other of metal circuit board 10 of any two adjacent layer, so that multiple transformer lines plates 100 are made in single, such as This one, whole process efficiency can be substantially improved, but the present embodiment is only to prepare the pattern of single transformer lines plate 100 It is illustrated.Wherein, the first stacking S2 step of transformer lines plate 100 is described as follows: firstly, will be in two external insulation layers 20 Between be longitudinally superimposed with multiple metal circuit boards 10, and each metal circuit board 10 with the set alignment of each axis hole 101 each other, and It is provided with an inner insulating layer 21 again respectively between the adjacent metal circuit board 10 of any two, to be formed with the gold of multi-layer intercrossed overlapping Belong to wiring board 10 and inner insulating layer 21；In the present embodiment, the metal circuit board 10 between two external insulation layers 20 is stacked with two Layer, and single inner insulating layer 21 is provided between two metal circuit boards 10, however, the present invention is not limited thereto, two external insulation layers 20 Between metal circuit board 10 can also design and be stacked with two layers or more on demand, and external insulation layer 20 and inner insulating layer 21 are face Long-pending and thickness consistent glass fiber resin film each other.

It is worth noting that because the contraposition up and down of each interlayer metal wiring board 10 is extremely important, if there is deviation that will lead It causes not being connected between route, so the metal circuit board 10 of each layer tool tack is by manual type or automation equipment mode It stacks, wherein manual type stacking is that the relative position that will need to be laid with is incident upon correspondence by infrared ray with circuit image 1:1 Positioned on the two sides of inner insulating layer 21, then by manually align each metal circuit board 10 for having tack is fitted in it is each On the designated position of inner insulating layer 21, it is distinctly finally laid with external insulation layer 20 on each metal circuit board 10, so that each metal Wiring board 10 is sequentially folded and is located between two external insulation layers 20；Automation equipment stack manner is by the machinery in automation equipment Each metal circuit board 10 of hand clamping tool tack, and place and be pasted onto the corresponding opposite position for being set in each inner insulating layer 21 It sets, allows two metal circuit boards 10 that can precisely align overlapping, finally again by manipulator on each 10 upper berth of metal circuit board If external insulation layer 20.

First pressing S3: as shown in figures 1 to 6, then, the metal circuit board 10 being superimposed between two external insulation layers 20 The hot melt in gap of adjacent external insulation layer 20 and inner insulating layer 21 is closed with hot pressing mode by a hot press 40, and makes metal Wiring board 10 is fixed between two external insulation layers 20, and ensures that the external insulation layer 20 that hot melt is closed is distributed with inner insulating layer 21 It is even.

Secondary stacking S4: as shown in figs. 1,7 and 8, after pressing S3 step for the first time, above-mentioned manual type is continued through Or automation equipment mode is directed at the axis hole of each metal circuit board 10 of inside on the lateral surface of two external insulation layers 20 101 fold set a metal circuit board 10 again, and do not have to be laid with insulating layer again, so that metal circuit board 10, which stacks, forms four layers Structure, the present embodiment is the accuracy for further promoting 10 folded position of metal circuit board of each layer, can be with X after stacking Light correction positions the stacked position of the metal circuit board 10 of each interlayer and whether route deviates, and then precisely promotes each interlayer metal The stacked position of wiring board 10.

It further explains, metal circuit board 10 of the invention includes one first metal circuit board 11, one second metal wire Road plate 12, a third metal circuit board 13 and one the 4th metal circuit board 14, the first metal circuit board 11 and the 4th metallic circuit Plate 14 is located on the outside of two external insulation layers 20, and the second metal circuit board 12 is then sequentially set with third metal circuit board 13 In the inside of two external insulation layers 20, and it is located on 21 two sides of inner insulating layer, so that inner insulating layer 21 is located at the second metal Between wiring board 12 and third metal circuit board 13, wherein the route of the first metal circuit board 11 is distributed in the 4th metal circuit board 14 route distribution is identical, and the route of the second metal circuit board 12 is distributed in the route distribution phase of third metal circuit board 13 Together, but the distribution of the route of the first metal circuit board 11 and the route distribution of the second metal circuit board 12 are different；Such as Fig. 2, Fig. 3 And shown in Fig. 8, and when metal circuit board 10 and each external insulation layer 20 and each inner insulating layer 21 staggeredly overlap, because first Metal circuit board 11 is symmetrical for mirror surface in the horizontal direction with the 4th metal circuit board 14, the second metal circuit board 12 and third metal Wiring board 13 is symmetrical for mirror surface in the horizontal direction, so when longitudinally coinciding, the first metal circuit board 11 and the 4th metallic circuit The structure presentation of plate 14 is reversed, and the structure presentation of the second metal circuit board 12 and third metal circuit board 13 is reversed.

Second pressing S5: as shown in Fig. 1 and Fig. 9, same to ensure the first metal circuit board 11 using the processing of hot press 40 It is closely pasted on two external insulation layers 20 respectively with the 4th metal circuit board 14.

The drilling S6 step of the via hole of multiple circuit transmissions is designed in interlayer on demand: as shown in Figure 10, by automatic Drilling machine has drilled through via hole to the line construction of each metal circuit board 10, and using horizontal electroplating device to each layer metal wire The via hole of road plate 10 is electroplated, and subsequent anti-solder ink of coating on the lateral surface of each external insulation layer 20 is to carry out halftone print Brush is exposed on the outside of external insulation layer 20 so that forming an anti-welding green paint layer 30 on each external insulation layer 20 with protection Metal circuit board 10, to avoid because of short circuit, breaking phenomena caused by scratch and anti-welding function is reached；It then, can be further anti-welding Anti oxidation layer is plated on green paint layer 30, to prevent exposed anti-welding green paint layer 30 and via hole from being aoxidized, this is conducive to weld Operation；Come again, cuts out a transformer lines plate of designed size to whole 10 plate of metal circuit board via molding machine 100。

Later, to one connecting column 50 of each via hole scolding tin, for fixing the structural relation of transformer lines plate 100, In In the present embodiment, it is in up-narrow and down-wide cylinder kenel that each connecting column 50, which uses, and the perficial helical setting of each connecting column 50 is conducive to A tin plating diversion trench 51 for flowing into each via hole.

Finally, forming one using a magnetic core of the transformer lines plate 100 and Corresponding matching with adhesive means Transformer, then by the transformer by every testing instruments test inductance, circle number ratio, leakage inductance, voltage value, high pressure resistant etc. Characteristic, to obtain the transformer of low drain sense, high electromagnetic interference shield.

Therefore, the present invention has effects that following:

1. metal circuit board 10 of the invention is to be formed by corresponding mould punching, and then replace and use in the prior art Chemical agent is exposed, develops, etching, and has achieved the purpose that prevent copper foil from generating lateral erosion effect, has improved transformation The yield of 100 processing procedure of device wiring board, and the line coherency on each metal circuit board 10 is higher, can also further promote entirety Production efficiency.

2. in addition, the present invention aligns in stacking process by accurate correction, so that the metal circuit board 10 of each interlayer It is mutually aligned, to prevent the position of metal circuit board 10 from generating offset, moreover, the route processing procedure mode of metal circuit board 10 is effective The problem of excluding lateral erosion effect, more can clearly promote the stability of processing procedure transformer lines plate 100, and the transformer wire Road plate 100 forms transformer with corresponding magnetic core, the characteristic with low drain sense and high electromagnetic interference shield.

Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.

The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.