阅读说明：本技术 沉积装置 (Deposition apparatus ) 是由 文炳竣 金宣基 崔虔熏 曹永秀 于 2020-01-21 设计创作，主要内容包括：本发明的目的是提供一种沉积装置,其能够最小化用于加热坩埚的热量到达衬底的情况,并且还能够有效地缓解堵塞。该沉积装置包括：坩埚；布置在坩埚外部以加热坩埚的加热器部分；用于将从沉积原料蒸发的沉积材料供应到沉积进行制品的多个喷嘴；以及布置在加热器部分外部的冷却部分,并且该沉积装置还可以包括屏蔽部分、热电模块和喷嘴块中的至少一者。(An object of the present invention is to provide a deposition apparatus which can minimize the amount of heat for heating a crucible from reaching a substrate and also can effectively alleviate clogging. The deposition apparatus includes: a crucible; a heater portion disposed outside the crucible to heat the crucible; a plurality of nozzles for supplying the deposition material evaporated from the deposition raw material to the deposition proceeding article; and a cooling portion disposed outside the heater portion, and the deposition apparatus may further include at least one of a shielding portion, a thermoelectric module, and a nozzle block.)

1. A deposition apparatus, comprising:

a crucible containing a deposition material therein;

a heater disposed outside the crucible to heat the crucible;

a plurality of nozzles configured to supply a deposition material evaporated from the deposition raw material to a deposition target;

a cooler disposed outside the heater; and

a shield having a high temperature portion heated by the plurality of nozzles and a low temperature portion connected to the high temperature portion through a connector and supported on the cooler.

2. The deposition apparatus according to claim 1, wherein a refrigerant space in which a refrigerant flows is formed inside the shield.

3. The deposition apparatus according to claim 1,

wherein the shield is a plate-type heat pipe, and

wherein at least one plate type heat pipe is provided on an upper surface of the cooler.

4. The deposition apparatus according to claim 1, wherein the shield has a rectangular parallelepiped or cylindrical shape and has a deposition material passage formed at a center thereof.

5. The deposition apparatus of claim 1 wherein the shield is a vapor chamber.

6. The deposition apparatus of claim 1, further comprising a thermoelectric module disposed between the cooler and the shield.

7. The deposition apparatus according to claim 6,

wherein at least one groove provided with the thermoelectric module is formed in an upper surface of the cooler, and

wherein the shield is supported by at least one of the cooler and the thermoelectric module.

8. The deposition apparatus according to claim 6, further comprising a temperature sensor configured to detect a temperature of the high-temperature portion,

wherein the thermoelectric module operates when the temperature of the high temperature part is equal to or greater than a predetermined reference temperature.

9. The deposition apparatus of claim 6, wherein the thermoelectric module comprises:

a heat sink portion in contact with the low temperature portion;

a heat dissipating portion in contact with the cooler; and

a thermoelectric element connected to the heat absorbing portion and the heat dissipating portion.

10. The deposition apparatus of claim 9 wherein the first and second deposition chambers are arranged in a substantially parallel arrangement,

wherein the thermoelectric element includes a low temperature region and a high temperature region, and

wherein a temperature difference between the low temperature region and the high temperature region is determined according to a voltage applied to the thermoelectric element.

11. The deposition apparatus according to claim 1, further comprising a plurality of nozzle passages through which the plurality of nozzles pass, and a nozzle block in which a space for the working fluid to flow is formed.

12. The deposition apparatus of claim 11, wherein the nozzle block is mounted around the plurality of nozzles and includes an evaporation portion in thermal contact with an upper surface of the crucible and a condensation portion in thermal contact with the plurality of nozzles.

13. The deposition apparatus according to claim 12, wherein a flow space in which a fluid flows is formed in the nozzle block by coupling the evaporation portion and the condensation portion.

14. The deposition apparatus according to claim 13, wherein a guide is formed in the flow space, the guide extending in a vertical direction to guide a fluid circulating between the evaporation portion and the condensation portion.

15. The deposition apparatus according to claim 1,

wherein the heater comprises:

a heater unit configured to emit heat to heat the crucible; and

a heater frame in which the heater unit is mounted,

wherein the heater frame includes a reflector for reflecting heat emitted from the heater unit.

Technical Field

The present disclosure relates to a deposition apparatus, and more particularly, to a deposition apparatus for depositing a deposition material on a deposition target.

Background

Deposition is a method of spraying gaseous particles on the surface of an object such as metal or glass to form a thin film.

Recently, as the use of Organic Light Emitting Diode (OLED) display panels for electronic devices such as TVs or mobile phones increases, research into devices and processes for OLED display panels is actively conducted. In particular, a method of manufacturing an OLED display panel includes a process of depositing an organic material on a glass substrate.

Specifically, the deposition process includes a process of heating a crucible containing an organic/inorganic material therein to evaporate the deposition material into a gaseous state and a process of depositing the gaseous deposition material on the substrate through a nozzle.

In this case, when the heat of heating the crucible to evaporate the material is not shielded or the thermal diffusivity of the shielding plate is not high so that the shielding plate becomes a heat source, the deposition performance may be deteriorated due to the thermal expansion of the substrate and the mask.

In addition, even when the organic material in a gaseous state may be deposited around the nozzle to form a film without moving to the substrate or a blocking phenomenon blocking the hole of the nozzle may occur, the organic material may be unevenly deposited on the glass substrate. In this case, the deposition process needs to be stopped to clean the nozzles.

Therefore, when the heat of heating the crucible to evaporate the deposition material is not shielded or the thermal diffusivity of the shielding plate is not high during the deposition process so that the shielding plate becomes a heat source, there may be a need for a deposition apparatus capable of minimizing the influence on the substrate and minimizing the occurrence of a clogging phenomenon in which the organic material clogs the periphery of the nozzle.

Disclosure of Invention

Technical problem

The present invention is directed to solving the above problems and other problems.

An object of the present disclosure is to provide a deposition apparatus capable of minimizing an influence on a substrate when heat of heating a crucible to evaporate a material is not shielded or a thermal diffusivity of a shield plate is not high so that the shield plate becomes a heat source.

An object of the present invention is to provide a deposition apparatus capable of minimizing the occurrence of a clogging phenomenon.

Technical scheme

The deposition apparatus according to an embodiment of the present disclosure may include: a crucible containing a deposition material therein; a heater disposed outside the crucible to heat the crucible; a plurality of nozzles configured to supply a deposition material evaporated from the deposition raw material to a deposition target; a cooler disposed outside the heater; and a shield having a high temperature portion heated by the plurality of nozzles and a low temperature portion connected to the high temperature portion through a connector and supported on the cooler.

The shield may be a plate-type heat pipe, and at least one plate-type heat pipe may be disposed on an upper surface of the cooler.

The shield may have a rectangular parallelepiped or cylindrical shape, and may have a deposition material passage formed at the center thereof.

The deposition apparatus may further include a thermoelectric module disposed between the cooler and the shield.

At least one groove provided with the thermoelectric module may be formed in an upper surface of the cooler, and the shield may be supported by at least one of the cooler and the thermoelectric module.

The deposition apparatus may further include a temperature sensor configured to detect a temperature of the high temperature part, and the thermoelectric module may operate when the temperature of the high temperature part is equal to or greater than a predetermined reference temperature.

The thermoelectric module may include: a heat sink portion in contact with the low temperature portion; a heat dissipating portion in contact with the cooler; and a thermoelectric element connected between the heat absorbing portion and the heat dissipating portion.

The deposition apparatus may further include a plurality of nozzle passages through which the plurality of nozzles pass, and a nozzle block in which a space for the working fluid to flow is formed.

The nozzle block is a structure to which a plurality of nozzles are fastened, and includes a lower evaporation portion and a side evaporation portion directly receiving radiant heat from the upper heater, and an upper condensation portion for the plurality of nozzles and the nozzle block to radiate the radiant heat toward the substrate. The nozzle block may be partially in contact with the cooling water block so that the refrigerant circulates according to the design of the shield plate and the temperature region of the heater.

Effects of the invention

According to the embodiments of the present disclosure, in the case of a shield plate using circulation of a phase-change refrigerant, since a temperature increase of a shield is reduced using a higher thermal diffusivity than a conventional shield simply made of metal, it is possible to minimize thermal effects to a substrate and improve deposition performance.

In addition, if necessary, the initial temperature of the shield can be lowered to 0 degree or less by further using the thermoelectric module.

Further, when the thermoelectric module is used, the thermoelectric module can be driven only under a specific condition by using the temperature sensor, if necessary.

Further, when the heat pipe type nozzle block is used, the height of the nozzle block and the distance from the heater can be adjusted more easily using a higher thermal diffusivity than a conventional metal material. For example, in the case of a nozzle block having a conventional metal structure, a temperature gradient may occur in which the temperature decreases toward the substrate, and therefore the position of the upper heater, i.e., the heat source, is inevitably kept high, and it is necessary to keep the high heater temperature to prevent clogging. However, in current heat pipe type nozzle blocks, the system is configured more efficiently using higher heat diffusion characteristics than a metal structure.

Drawings

Fig. 1 is a cross-sectional view of a deposition system according to an embodiment of the present disclosure.

Fig. 2 is a perspective view of a deposition apparatus according to an embodiment of the present disclosure.

Fig. 3 is a cross-sectional view of a deposition apparatus including a shield according to an embodiment of the present disclosure.

Fig. 4 is a perspective view of a deposition apparatus including a shield according to an embodiment of the present disclosure.

Figure 5 is a cross-sectional view of a deposition apparatus including a thermoelectric module according to an embodiment of the present disclosure.

Fig. 6 is a cross-sectional view of a deposition apparatus including a nozzle block according to an embodiment of the present disclosure.

FIG. 7 is a perspective view of a nozzle block according to an embodiment of the present disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Fig. 1 is a sectional view of a deposition system according to an embodiment of the present disclosure, and fig. 2 is a perspective view of a deposition apparatus according to an embodiment of the present disclosure.

A deposition system according to an embodiment of the present disclosure may include a chamber 1, a substrate 2, a driving module 5, and a deposition apparatus 100. Meanwhile, the deposition system shown in fig. 1 is only an example, and the deposition system may include other components in addition to the components shown in fig. 1 or may omit some of the components shown in fig. 1.

A deposition space for deposition may be formed in the chamber 1. In the chamber 1, at least one of the substrate 2, the driving module 5, and the deposition apparatus 100 may be disposed.

The substrate 2 may be mounted above the deposition apparatus 100. For example, the substrate 2 may be directly connected to the upper plate of the chamber 1, or may be connected through a connection member mounted on the upper plate of the chamber 1.

The substrate 2 may be a deposition target on which the deposition material evaporated in the crucible 110 is deposited. For example, the substrate 2 may be a glass substrate, but is merely an example for convenience of description, and the present disclosure is not limited thereto.

The driving module 5 may be provided on a lower plate of the chamber 1 to move the deposition apparatus 100 in a horizontal direction. For example, the driving module 5 may include a linear motor (not shown) and a guide rail (not shown). The deposition apparatus 100 located on the guide rail may be moved by driving a linear motor (not shown).

Although the deposition system is of a cluster type in the above description, this is merely for convenience of description, and the present disclosure is applicable to an inline type in which the deposition apparatus 100 is fixed and the substrate 2 is moved. That is, the deposition system may not include the driving module 5. In this case, when the deposition process is performed, the position of the deposition apparatus 100 is fixed, and the substrate 2 may be moved in the horizontal direction. For example, a driving roller (not shown) may be installed on an upper plate of the chamber 1, and the substrate 2 may be moved by a motor.

Referring to fig. 2, the deposition apparatus 100 may include a crucible 110, a nozzle 120, a heater 130, and a cooler 140.

Meanwhile, the deposition apparatus 100 may include other components in addition to those shown in fig. 2, or at least some of the components shown in fig. 2 may be omitted.

A space for receiving the deposition source material may be formed in the crucible 110. The crucible 110 may be heated by heat supplied from the outside, and when the crucible 110 is heated, at least a portion of the deposition raw material may be evaporated into a deposition material.

Here, the deposition source material is a material contained in the crucible 110 to be deposited on at least one substrate 2, and means a material before being evaporated into a deposition material. The deposition material may be in a solid or liquid state, and the deposition material may be in a gaseous state. That is, the deposition material may be a gaseous material evaporated from a deposition raw material, and means a material to be deposited on the at least one substrate 2. For ease of description, these terms are only used to distinguish solid/liquid materials from gaseous materials and are not intended to be limiting.

At least one nozzle 120, through which the deposition material may pass, may be provided on the crucible 110. The deposition material evaporated in the crucible 110 may be deposited on the substrate 2 after passing through the nozzle 120.

The nozzle 120 may be a passage through which the deposition material moves. The nozzles 120 may be disposed on the crucible 110 to be spaced apart from each other in a horizontal direction. The nozzle 120 may have an elongated shape in the height direction.

The heater 130 may emit heat for heating the crucible 110. The heater 130 may include a heater unit 132 and a heater frame 134. The heater unit 132 may be accommodated in the heater frame 124, and the crucible 110 may be accommodated in the heater unit 132.

The heater unit 132 may be a heat source that radiates heat to the outside. The heat emitted from the heater unit 132 may heat the crucible 110.

The heater frame 134 may support at least one of the heater unit 132 and the crucible 110.

Meanwhile, the heater frame 134 may include a reflector for reflecting heat emitted from the heater unit 132. A reflector is disposed along the outer circumference of the heater unit 132 to reflect heat emitted from the heater unit 132 toward the crucible 110. In this case, power consumption for radiating heat from the heater unit 132 and affecting the temperature distribution of the crucible can be minimized.

In the cooler 140, the crucible 110, the nozzle 120, and the heater 130 may be accommodated.

A cooling water passage through which cooling water flows may be formed in the cooler 140. The cooler 140 may minimize the movement of heat emitted from the heater 130 to the outside of the deposition apparatus 100.

When at least a portion of the heat emitted from the heater 130 moves to the outside of the deposition apparatus 100 to reach the substrate 2, thermal expansion of the deposition substrate and the pattern mask and a temperature increase of each member may be caused, thereby degrading deposition performance.

Meanwhile, when the heat emitted from the heater is insufficient and thus the nozzle 120 is not maintained at an appropriate temperature, the deposition material evaporated in the crucible 110 may not pass through the nozzle 120 and its phase may be changed, thereby causing a clogging phenomenon in which the nozzle 120 is clogged.

The present disclosure provides a nozzle block capable of maintaining a nozzle at an appropriate temperature so that clogging does not occur, and a deposition apparatus capable of minimizing transfer of heat generated by a deposition unit to a substrate 2.

Fig. 3 is a cross-sectional view of a deposition apparatus including a shield according to an embodiment of the present disclosure.

The deposition apparatus 100 according to an embodiment of the present disclosure may include at least some or all of the crucible 110, the plurality of nozzles 120, the heater 130, the cooler 140, and the shield 150.

The crucible 110, the nozzle 120, the heater 130, and the cooler 140 are described with reference to fig. 1 and 2, and thus detailed descriptions thereof are omitted.

The shield 150 serves to minimize the movement of heat generated by the heater unit 130 to the outside of the deposition apparatus 100, more particularly, to the substrate 2.

The shield 150 may be positioned on the cooler 140 and supported on the cooler 140.

A cryogen space S1 for flow of the refrigerant may be formed within the shield 150, and a core 158 may be formed around the cryogen space S1. The wick 158 may direct liquid cryogen through capillary action within the shield 150. The refrigerant may be a heat transfer fluid.

The shield 150 may include a plurality of nozzles 20, a nozzle block, a high temperature part 152 formed by heat transferred from the upper heater, a low temperature part 156 supported by the cooler 140, and a connector 154 connecting the high temperature part 152 and the low temperature part 156.

The high temperature portion 152 may be disposed proximate to at least one nozzle 20. The high temperature portion 152 may face the at least one nozzle 120, and heat of the nozzle 120 may be transferred to the high temperature portion 152 in a radiation manner.

The high temperature part 152 may be an evaporation part in which the refrigerant is evaporated by radiant heat from the nozzle 120.

The low temperature part 156 may be disposed on an upper surface of the cooler 140.

The low temperature part 156 may be a condensation part in which the refrigerant is condensed by cooling water flowing in the cooler 140. The refrigerant moving to the low temperature part 156 through the connector 154 after being evaporated in the high temperature part 152 may be condensed in the low temperature part 156.

When the deposition apparatus 100 includes the shield 150 using the phase change energy of the refrigerant, it is relatively light in weight and easy to maintain. In addition, since the thermal diffusivity of the shield 150 is high, the heat emitted to the substrate 2 can be reduced by lowering the temperature of the shield.

Fig. 4 is a perspective view of a deposition apparatus including a shield according to an embodiment of the present disclosure.

According to an embodiment of the present disclosure, as shown in fig. 4, the shield 150 may have a rectangular parallelepiped or cylindrical shape and have a deposition material passage S2 formed at the center thereof. The shield 150 according to another embodiment of the present disclosure may be a vapor chamber 150 b.

Meanwhile, the deposition apparatus 100 according to an embodiment of the present disclosure may further include a thermoelectric module 150 (see fig. 5).

Figure 5 is a cross-sectional view of a deposition apparatus including a thermoelectric module according to an embodiment of the present disclosure.

The deposition apparatus 100 according to an embodiment of the present disclosure may include at least some or all of a crucible 110, a plurality of nozzles 120, a heater 130, a cooler 140, a shield 150, and a thermoelectric module 160.

The crucible 110, the nozzle 120, the heater 130, the cooler 140, and the shield 150 are described with reference to fig. 1 to 4, and thus detailed descriptions thereof are omitted.

The thermoelectric module 160 may be disposed between the cooler 140 and the shield 150, as shown in fig. 5. At least one groove in which the thermoelectric module 160 is disposed may be formed in the upper surface 141 of the cooler 140, and the thermoelectric module 160 may be disposed in the groove formed in the upper surface 141 of the cooler 140.

The shield 150 may be supported on at least one of the cooler 140 and the thermoelectric module 160.

The thermoelectric module 160 may include a heat absorbing portion 161, a thermoelectric element 162, and a heat dissipating portion 163.

The thermoelectric element 162 may be disposed between the heat absorbing part 161 and the heat dissipating part 163, and the thermoelectric element 162 absorbs or radiates heat using the heat of the peltier effect, and uses a phenomenon in which a temperature difference occurs on both cross sections of different metals when the different metals are coupled and current flows in the metals.

The thermoelectric element 162 may include a low temperature region and a high temperature region, and a temperature difference between the low temperature region and the high temperature region may be determined according to a voltage applied to the thermoelectric element 162.

The heat sink portion 161 may be disposed in contact with the low temperature portion 156 of the shield 150 and absorb and transfer heat of the low temperature portion 156 to a low temperature region of the thermoelectric element 162.

The heat radiating portion 163 may radiate heat absorbed by the heat absorbing portion 161 to the outside, more specifically, to the cooler 140. The heat radiating portion 163 may be in contact with the cooler 140.

The heat radiating portion 163 may serve as a heat sink that transfers heat received from the heat absorbing portion 161 to the cooler 140.

The cooler 140 may be disposed in contact with the high temperature region of the thermoelectric element 162 and radiate heat received from the high temperature region of the thermoelectric element 162 to the outside.

When the deposition apparatus 100 includes the thermoelectric module 160, the low temperature part 156 may be cooled to 0 degree or less. That is, although it varies according to the type of cooling water, it is relatively difficult to reduce the temperature of the low temperature part 156 passing through the cooler 140 to 0 degree or less. However, when the thermoelectric module 160 is used, the low temperature part 156 can be easily cooled to 0 degree or less.

Meanwhile, the deposition apparatus 100 may further include a temperature sensor (not shown) and a thermoelectric module 160. The temperature sensor may detect a temperature of at least one of the nozzle 120, the deposition space in the chamber 1, and the shield 150.

The thermoelectric module 160 may operate when the temperature detected by the temperature sensor (e.g., the temperature of the high temperature portion 152 of the shield 150) is equal to or greater than a predetermined reference temperature. In this case, power consumption can be reduced as compared with the case where the thermoelectric module 160 is continuously operated.

That is, if the thermoelectric module 160 is operated only when a specific temperature (e.g., the temperature of the high temperature portion 152 of the shield 150) is equal to or greater than a predetermined reference temperature, it is possible to minimize heat transfer to the substrate 2 and reduce power consumption, as compared to the case where the thermoelectric module 160 is continuously operated.

When the heat transfer to the substrate 2 is minimized, the pattern defect due to the thermal expansion of the substrate 2 may be minimized to minimize the alignment accuracy degradation and improve the quality and yield.

Meanwhile, as described above, when heat transfer to the substrate 2 is minimized, the temperature of the upper side of the nozzle 120 may be less than the temperature of the lower side of the nozzle 120. That is, a temperature gradient may occur at the top and bottom of the nozzle 120. In this case, the deposition material evaporated in the crucible 110 may be evaporated at the top of the nozzle 120 after passing through the bottom of the nozzle 120, and clogging occurs in this case.

Therefore, the deposition apparatus 100 according to an embodiment of the present disclosure may further include a nozzle block 170 for minimizing a temperature difference between the top and bottom of the nozzle 2 (see fig. 6).

Fig. 6 is a sectional view of a deposition apparatus including a nozzle block according to an embodiment of the present disclosure, and fig. 7 is a perspective view of the nozzle block according to an embodiment of the present disclosure.

Specifically, (a) of fig. 7 is a perspective view illustrating an upper condensing portion and a lower evaporating portion of a nozzle block, and (b) of fig. 7 is a perspective view illustrating only a lower evaporating portion when the upper condensing portion and the lower evaporating portion of the nozzle block are separated. When the upper condensing portion and the lower evaporating portion of the nozzle block are separated, the upper condensing portion may have the same shape as the lower evaporating portion, being inverted as shown in (b) of fig. 7.

The nozzle block is a structure to which a plurality of nozzles are fastened, and may include a lower evaporation portion and a side evaporation portion directly receiving radiant heat from the upper heater, and an upper condensation portion for the plurality of nozzles and the nozzle block to radiate the radiant heat toward the substrate. The nozzle block may be partially in contact with the cooling water block to facilitate the circulation of the refrigerant according to the design of the shield and the temperature region of the heater.

The nozzle block 170 may be mounted around the plurality of nozzles 120.

The nozzle block 170 may include a lower evaporation portion 180 in thermal contact with the upper surface of the crucible 110 and an upper condensation portion 190 in thermal contact with the plurality of nozzles 120.

A plurality of nozzle passages S3, through which a plurality of nozzles 120 pass and a space S4, in which a working fluid flows through S3, may be formed in the lower evaporation part 180 and the upper condensation part 190.

When the lower evaporation portion 180 and the upper condensation portion 190 are coupled, the space S4 in which the working fluid flows may be sealed. The working fluid is contained in the space S4 in which the working fluid flows, the working fluid may be evaporated in the lower evaporation portion and the side evaporation portion 180 while absorbing heat, and the evaporated working fluid may move upward and may be condensed in the upper condensation portion 190 while dissipating heat.

The lower evaporation part 180 may be in thermal contact with the crucible 110, and the working fluid may be evaporated by heat exchange with the side evaporation part and the lower evaporation part 180.

The upper condensing part 190 may be in thermal contact with the nozzle 120, and the working fluid may be condensed in the upper condensing part 190 while dissipating heat through heat exchange with the upper condensing part 190.

The space S4 in which the working fluid flows may be a space in which the working fluid evaporates/condenses while ascending and descending.

At least one guide 184 may be formed in the space S4 in which the working fluid flows. The guide 184 may be a working fluid guide for guiding a working fluid to rapidly transfer heat in the nozzle block 170.

The guide 184 may have a shape in which a vertical structure capable of causing a capillary phenomenon in a gravity direction is erected therein.

The shape of the guide 184 for facilitating the circulation of the fluid may have a rectangular, circular, or perforated structure.

The guide 184 may guide the working fluid vertically between the lower evaporation part 180 and the upper condensation part 190.

Meanwhile, in some embodiments, a wick (not shown) for guiding the liquid working fluid through a capillary phenomenon may be formed inside the nozzle block 170.

The nozzle block 170 may have a plurality of layers according to heater structure and arrangement, and may be basically constructed by using a wick or a porous structure as an auxiliary material to induce a capillary phenomenon when necessary.

When the deposition apparatus 100 includes the nozzle block 170, it is possible to minimize a temperature difference between the top and bottom of the nozzle 120, maintain the temperature of the top of the nozzle at a relatively high temperature, and minimize clogging. In addition, since the temperature of the top of the nozzle 120 can be raised by the nozzle block 170, a separate heater unit does not need to be further provided on the nozzle 120, thereby simplifying the system.

Further, in the case of the nozzle block 170, since the thermal diffusivity and the heat transfer rate are high and the temperature gradients of the top and bottom of the nozzle can be minimized as compared to the conventional nozzle block simply made of metal, the nozzle can be more effectively maintained at a high temperature.

The above description is merely illustrative of the technical idea of the present disclosure, and various modifications and changes can be made by those skilled in the art to which the present disclosure pertains without departing from the essential features of the present disclosure.

Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but are intended to explain the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments.

The scope of the present disclosure should be construed by the appended claims, and all technical ideas within the scope equivalent thereto should be construed to be included in the scope of the present disclosure.

Industrial applicability

According to the embodiments of the present disclosure, in the case of a shield plate using circulation of a phase-change refrigerant, since a temperature increase of a shield is reduced using a higher thermal diffusivity than a conventional shield simply made of metal, it is possible to minimize thermal effects to a substrate and improve deposition performance. Therefore, the commercial applicability is significant.

Further, if necessary, by further using the thermoelectric module, the initial temperature of the shield can be lowered to 0 degree or less, and thus the commercial utility is remarkable.

Further, when the heat pipe type nozzle block is used, the height of the nozzle block and the distance from the heater can be adjusted more easily using a higher thermal diffusivity than a conventional metal material. For example, in the case of a nozzle block having a conventional metal structure, a temperature gradient may occur in which the temperature decreases toward the substrate, and therefore the position of the upper heater, i.e., the heat source, is inevitably kept high, and it is necessary to keep the high heater temperature to prevent clogging. However, in the current heat pipe type nozzle block, the system is more efficiently configured using a higher heat diffusion characteristic than a metal structure, and thus commercial application is significant.