阅读说明：本技术 一种焊盘的加工方法以及led显示灯 (Processing method of bonding pad and LED display lamp ) 是由 田舒韵 张礼冠 田雨洪 于 2020-05-25 设计创作，主要内容包括：本申请公开了一种焊盘的加工方法以及LED显示灯,焊盘包括基板与正导电线路以及负导电线路,加工方法包括在正导电线路与负导电线路的背离基板的表面沿第一方向涂附可受热收缩的热收缩涂料,热收缩涂料形成焊盘初体,焊盘初体具有连接正导电线路与负导电线路的部分,其中,第一方向为与正导电线路和负导电线路交叉的方向,对正导电线路以及负导电线路通电,以使连接正导电线路和负导电线路的之间的焊盘初体形成由正导电线路至负导电线路的电流通路,从而使焊盘初体受热后收缩,并分离成与正导电线路连接的正极连接焊盘以及与负导电线路连接的负极连接焊盘。热收缩涂料受热收缩,避免了借助工具对热收缩涂料进行加热,简化了LED显示灯的加工流程。(The application discloses a processing method of a bonding pad and an LED display lamp, wherein the bonding pad comprises a substrate, a positive conducting circuit and a negative conducting circuit, the processing method comprises the steps of coating a heat shrinkable coating which can be shrunk by heating on the surfaces of the positive conducting circuit and the negative conducting circuit, which are deviated from the substrate, along a first direction, the heat shrinkable coating forms a bonding pad primary body, the bonding pad primary body is provided with a part for connecting the positive conducting circuit and the negative conducting circuit, wherein the first direction is a direction intersecting the positive conductive line and the negative conductive line, and the positive conductive line and the negative conductive line are energized, so that the pad between the positive conductive circuit and the negative conductive circuit forms a current path from the positive conductive circuit to the negative conductive circuit, therefore, the bonding pad is heated and contracted, and is separated into an anode connecting bonding pad connected with the positive conducting circuit and a cathode connecting bonding pad connected with the negative conducting circuit. The thermal shrinkage coating is heated to shrink, so that the thermal shrinkage coating is prevented from being heated by means of tools, and the processing flow of the LED display lamp is simplified.)

1. A processing method of a bonding pad is characterized in that the bonding pad comprises a substrate and a plurality of conductive circuits arranged on the surface of the substrate, and the conductive circuits comprise positive conductive circuits and negative conductive circuits, and the processing method comprises the following steps:

coating a heat-shrinkable paint which can be shrunk by heating on the surfaces, away from the substrate, of the positive conducting circuit and the negative conducting circuit along a first direction, wherein the heat-shrinkable paint forms a primary pad body which is provided with a part for connecting the positive conducting circuit and the negative conducting circuit, and the first direction is a direction crossing the positive conducting circuit and the negative conducting circuit;

and electrifying the positive conductive circuit and the negative conductive circuit so that the pad body connected between the positive conductive circuit and the negative conductive circuit forms a current path from the positive conductive circuit to the negative conductive circuit, thereby enabling the pad body to shrink after being heated and be separated into a positive electrode connecting pad connected with the positive conductive circuit and a negative electrode connecting pad connected with the negative conductive circuit.

2. The process of claim 1, comprising:

coating a plurality of heat shrinkage coatings on the surfaces, away from the substrate, of the positive conducting circuit and the negative conducting circuit so as to form a plurality of primary bonding pad bodies between the positive conducting circuit and the negative conducting circuit, wherein each primary bonding pad body connected between the positive conducting circuit and the negative conducting circuit forms a parallel passage with the positive conducting circuit and the negative conducting circuit.

3. The process of claim 1, comprising:

and arranging a plurality of conductive circuits in parallel, enabling the polarity of each conductive circuit to be staggered, and coating the heat-shrinkable coating along the direction crossing each conductive circuit so that the heat-shrinkable coating forms the primary bonding pad body.

4. The process of claim 3 wherein,

the conductive lines are arranged on the surface of the substrate at equal intervals.

5. The process of claim 3, comprising:

and continuously coating the heat-shrinkable paint in the direction crossing the conductive circuit, so that the heat-shrinkable paint forms the primary pad body extending along the direction crossing the conductive circuit.

6. The process of claim 3 wherein,

the extending direction of the primary bonding pad body at each position is perpendicular to each conductive line.

7. The process of claim 5 wherein,

the pad originals are parallel to each other.

8. The process of claim 7 wherein,

and the primary bonding pads are arranged at equal intervals along the direction parallel to the conducting circuit.

9. An LED display lamp, characterized by comprising a bonding pad processed by the processing method of any one of claims 1 to 8;

and an LED chip disposed on the pad.

10. The LED display lamp of claim 9, wherein a single LED chip is disposed on at least one positive connection pad and at least one negative connection pad, the LED chip including a positive connection antenna electrically connected to the positive connection pad and a negative connection pad, the negative connection antenna electrically connected to the negative connection pad.

Technical Field

The application relates to the field of surface display, in particular to a processing method of a bonding pad and an LED display lamp.

Background

The existing LED light source structure comprises a substrate, a conductive circuit which is laid on the substrate and is provided with a tin plate, and a heat-shrinkable paint which is placed on the tin plate and can be melted by heating. Make heating heat shrink coating shrink and gather on the conducting circuit through the heating to on with LED chip is fixed with the tin dish through heating heat shrink coating, can all adopt corresponding firing equipment to heat heating heat shrink coating at present, or practical spray gun heating, the heating process is loaded down with trivial details, and can't control the distance between two adjacent LED chips, consequently can prolong production cycle.

Disclosure of Invention

The embodiment of the application provides a processing method of a bonding pad and an LED display lamp, which can reduce the relative distance between two adjacent positive electrode connecting bonding pads on the same positive conductive circuit or two adjacent negative electrode connecting bonding pads on the same negative conductive circuit, and simplify the processing flow of the bonding pad.

In a first aspect, the embodiment of the present application provides a method for processing a pad, where the pad includes a substrate and a plurality of conductive traces disposed on a surface of the substrate, and the conductive traces include a positive conductive trace and a negative conductive trace, the method includes applying a heat-shrinkable paint capable of shrinking by heat to surfaces, facing away from the substrate, of the positive conductive trace and the negative conductive trace along a first direction, the heat-shrinkable paint forming a primary pad body, and the primary pad body has a portion connecting the positive conductive trace and the negative conductive trace, wherein the first direction is a direction intersecting the positive conductive line and the negative conductive line, and the positive conductive line and the negative conductive line are energized, so that the pad between the positive conductive circuit and the negative conductive circuit forms a current path from the positive conductive circuit to the negative conductive circuit, therefore, the bonding pad is heated and contracted, and is separated into an anode connecting bonding pad connected with the positive conducting circuit and a cathode connecting bonding pad connected with the negative conducting circuit.

Based on the processing method of the embodiment of the application, the surface of the positive conducting circuit and the negative conducting circuit, which is far away from the substrate, is coated with the heat shrinkage coating, so that a pad initial body is formed between the positive conducting circuit and the negative conducting circuit, the positive conducting circuit and the negative conducting circuit are electrically connected through the pad initial body, the positive conducting circuit and the negative conducting circuit are electrified, the positive conducting circuit and the negative conducting circuit are short-circuited, and high temperature can be generated due to circuit short circuit, so that the heat shrinkage coating is heated and shrunk, compared with the technology of heating the heat shrinkage coating by heating equipment in the prior art, on one hand, the heat shrinkage coating is prevented from being heated by an external tool, the processing flow of heating the heat shrinkage coating is simplified, on the other hand, the relative distance between two adjacent pad initial bodies can be effectively controlled, so that the distance between two adjacent positive electrode connecting pads or two adjacent negative electrode connecting pads reaches 60um, the control of the relative distance between two adjacent positive electrode connecting pads on the same positive conducting circuit or two adjacent negative electrode connecting pads on the same negative conducting circuit is facilitated, and the processing difficulty of small-sized fine and compact luminous products is reduced.

In some embodiments, a plurality of heat-shrinkable coatings are coated on the surfaces of the positive conductive circuit and the negative conductive circuit, which face away from the substrate, so that a plurality of pad primary bodies are formed between the positive conductive circuit and the negative conductive circuit, and each pad primary body connected between the positive conductive circuit and the negative conductive circuit and the positive conductive circuit and the negative conductive circuit form a parallel path.

Based on above-mentioned embodiment, set up many places heat shrink coating, make form many places pad body just between positive conducting wire and negative conducting wire, after positive conducting wire and negative conducting wire circular telegram, the pad body just can be heated because the high temperature that the short circuit produced, the pad body fracture just after the heating, and form anodal connection pad and negative pole connection pad to positive conducting wire and negative conducting wire shrink, just body through setting up many places pad, make and form many places anodal connection pad on same positive conducting wire, form many places negative pole connection pad on same negative conducting wire, thereby the quantity of anodal connection pad and negative pole connection pad on whole pad has been increased, can paste a plurality of circular telegram luminous objects between positive conducting wire and negative conducting wire, increase the demonstration luminance of miniature fine and close type luminous product.

In some embodiments, the plurality of conductive traces are arranged in parallel, the polarities of the conductive traces are staggered, and a heat-shrinkable paint is coated along a direction intersecting the conductive traces, so that the heat-shrinkable paint forms a primary pad body.

Based on above-mentioned embodiment for a plurality of conducting circuits are parallel, and the polarity crisscross setting of each conducting circuit, make the luminous object of circular telegram arrange more neatly, are favorable to improving the quality of whole miniature fine and close type luminous product.

In some of these embodiments, a plurality of conductive traces are arranged at equal intervals on the surface of the substrate.

Based on the embodiment, the conductive circuits are arranged on the surface of the substrate at equal intervals, so that the conductive circuits are beneficial to orderly arrangement of the electrified luminous objects, and the uniformity of the brightness of the small-sized and fine luminous product is effectively improved.

In some of the embodiments, the heat-shrinkable paint is continuously applied in a direction crossing the conductive line, so that the heat-shrinkable paint forms a pad primary extending in the direction crossing the conductive line.

Based on above-mentioned embodiment, along the direction coating many places heat shrink coating with the conducting wire is criss-cross, heat shrink coating forms the pad and just physically, and inject each pad and just physically connect a conducting wire simultaneously, and after each conducting wire circular telegram, the pad is just physically broken, forms the pad that is the array arrangement to make each circular telegram luminous object be the array arrangement, be favorable to designing the miniature fine and close type luminescence product of different display areas.

In some embodiments, the extending direction of the primary bonding pad body is perpendicular to each conductive line.

Based on the embodiment, the coating direction of the thermal contraction coating is conveniently determined, so that all electrified luminous objects are arranged neatly.

In some of these embodiments, the pad precursors are parallel to each other.

Based on the above embodiment, the thermal contraction coating is conveniently coated, the position where each bonding pad is coated is conveniently determined, and the distance between two adjacent electrified luminous objects is further conveniently controlled.

In some of these embodiments, the pad precursors are equally spaced in a direction parallel to the conductive traces.

Based on the above embodiment, the pad bodies are arranged at intervals, and after the pad bodies are subjected to thermal fracture to form the pad, the distances between every two adjacent positive electrode connecting pads or every two adjacent negative electrode connecting pads on each conducting circuit along the direction parallel to the conducting circuit are equal.

In a second aspect, an embodiment of the present application provides an LED display lamp, including: the bonding pad and the LED chip are processed by the processing method, and the LED chip is arranged on the bonding pad.

Based on this application embodiment's LED display lamp, the relative distance between the adjacent two heat shrink coatings of effectual control of ability further is favorable to controlling the interval between the adjacent two LED chips, increases the density of arranging of LED chip, has reduced the processing degree of difficulty of the luminous product of miniature fine and close type.

In some of these embodiments, a single LED chip is disposed on at least one positive connection pad and at least one negative connection pad, the LED chip including a positive connection antenna electrically connected on the positive connection pad and a negative connection pad, the negative connection antenna electrically connected on the negative connection pad.

Based on the embodiment, the single LED chip is arranged on the positive electrode connecting pad and the negative electrode connecting pad, the mounting position of the LED chip is limited, and workers can conveniently mount the LED chip on the pads.

The processing method of the LED display lamp and the LED display lamp based on the embodiment of the application have the beneficial effects that: coating heat shrinkage paint on the positive conductive circuit and the negative conductive circuit to form a pad primary body between the positive conductive circuit and the negative conductive circuit, electrically connecting the positive conductive circuit and the negative conductive circuit through the pad primary body, under the action of the primary body of the bonding pad, the positive conductive circuit and the negative conductive circuit are short-circuited after being electrified, high temperature is generated at the short-circuited part, thereby leading the bonding pad to be heated and broken, avoiding heating the thermal contraction coating by an external tool, simplifying the processing flow of heating the thermal contraction coating, and the distance between two adjacent positive electrode connection pads or two adjacent negative electrode connection pads is made to be 60um, and then can effectual control two adjacent pad relative distance between the body just, further be favorable to controlling the interval between two adjacent LED chips, reduced the processing degree of difficulty of miniature fine and close type luminous product.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a flow chart of a method of processing a bonding pad in an embodiment of the present application, wherein a short circuit is formed between a positive conductive trace and a negative conductive trace in the process to heat a heat shrinkable coating;

FIG. 2 is a flow chart of a method for processing a bonding pad according to an embodiment of the present application;

FIG. 3 is a front view of a bond pad in one embodiment of the present application;

FIG. 4 is a schematic view in full section at A-A in FIG. 3;

FIG. 5 is a front view of a substrate with positive and negative conductive traces disposed thereon, wherein a pad is initially connected to the positive and negative conductive traces;

FIG. 6 is a schematic diagram of the structure of FIG. 5 after the positive and negative conductive traces are energized, showing the positive and negative connection pads;

FIG. 7 is a schematic diagram of the structure of the LED chip disposed on the positive and negative connection pads formed in FIG. 6;

FIG. 8 is a front view of a bonding pad in a third embodiment of the present application;

FIG. 9 is a front view of an LED display lamp in a third embodiment of the present application;

FIG. 10 is a front view of an LED display lamp in a fourth embodiment of the present application;

fig. 11 is a front view of an LED display lamp in a fifth embodiment of the present application.

Reference numerals: 100-pads; 110-a substrate; 120-conductive traces; 121-positive conductive lines; 122-negative conductive trace; 130-primary pad body; 140-positive connection pad; 150-negative connection pad; 160-LED chips; 170-groups of conductive lines; 200-LED display lamp.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the prior art, a bonding pad comprises a substrate, a positive conductive circuit and a negative conductive circuit are paved on the surface of the substrate, the surfaces of the positive conductive circuit and the negative conductive circuit, which are far away from the substrate, are coated with a heat shrinkable coating which can be melted and shrunk after being heated, wherein in the process of processing the heat shrinkable coating, heating equipment is generally required to heat the heat shrinkable coating, so that the processing flow of the whole bonding pad is relatively troublesome, and when the heating equipment is used for heating the heat shrinkable coating, the heating equipment only heats an area with the heat shrinkable coating, so that a method for heating the heat shrinkable coating by adopting the heating equipment has a requirement on the relative distance between two adjacent heat shrinkable coatings on the same conductive circuit, and if the relative distance between two adjacent heat shrinkable coatings on the same conductive circuit is smaller, the phenomenon that the heat shrinkable coatings are gathered together can occur, if the relative distance between two adjacent heat-shrinkable coatings on the same conductive circuit is large, the arrangement density of the LED chips is small, and the display brightness of the whole LED display lamp is affected.

Referring to fig. 1 to 4, in order to solve the above technical problem, the present application provides a method for processing a bonding pad 100, wherein the bonding pad 100 includes a substrate 110 and a plurality of conductive traces 120. The conductive traces 120 have different polarities, i.e., the conductive traces 120 include a positive conductive trace 121 and a negative conductive trace 122. The processing method of the bonding pad 100 comprises the following steps:

s102, coating a thermal shrinkage coating on the surfaces of the positive conductive trace 121 and the negative conductive trace 122 away from the substrate 110 along a first direction, where the thermal shrinkage coating is a conductive material and can be shrunk by heating, and the thermal shrinkage coating is coated in a strip shape so as to form a pad initial body 130 formed by the thermal shrinkage coating, and the pad initial body 130 has a portion connecting the positive conductive trace 121 and the negative conductive trace 122, where the first direction is a direction intersecting the positive conductive trace 121 and the negative conductive trace 122, so that one end of the pad initial body 130 is electrically connected to the positive conductive trace 121, and the other end is electrically connected to the negative conductive trace 122, thereby further forming a current loop from a line of the positive conductive trace to a line of the negative conductive trace. Specifically, the heat-shrinkable paint may preferably be a mixture of epoxy resin and solder.

And S104, electrifying the positive conductive line 121 and the negative conductive line 122 arranged in the step S102, so that a current path from the positive conductive line 121 to the negative conductive line 122 is formed at the position of the primary pad body 130 connecting the positive conductive line 121 and the negative conductive line 122, thereby a short circuit is formed between the positive conductive line 121 and the negative conductive line 122, high temperature is generated after the short circuit, the temperature at the position of the primary pad body 130 is increased, after the temperature at the position of the primary pad body 130 is increased to over 160 ℃, the strip-shaped primary pad body 130 is heated and then is broken, and is shrunk and gathered to the positions of the positive conductive line 121 and the negative conductive line 122, and the primary pad body 130 after being heated and broken is separated into a positive connecting pad 140 connected with the positive conductive line 121 and a negative connecting pad 150 connected with the negative conductive line 122.

Through the above arrangement, the surfaces of the positive conductive line 121 and the negative conductive line 122, which are away from the substrate 110, are coated with the heat-shrinkable paint, the heat-shrinkable paint forms the primary pad body 130, the positive conductive line 121 is electrically connected with the negative conductive line 122 through the primary pad body 130, and then the current path formed by the primary pad body 100 connecting the positive conductive line 121 and the negative conductive line 122 and from the positive conductive line 121 to the negative conductive line 122 is short-circuited by electrifying the positive conductive line 121 and the negative conductive line 122. The short circuit of the circuit generates high temperature, so that the heat shrinkable coating is broken by heating and then shrinks toward the positive conductive traces 121 and the negative conductive traces 122. Compared with the technology of heating the thermal shrinkage coating by means of heating equipment in the prior art, on one hand, the heating of the bonding pad initial body 130 by means of an external tool is avoided, the method of directly heating the bonding pad initial body 130 by using high temperature generated by short circuit of the positive conductive circuit 121 and the negative conductive circuit 122 saves production time, and simplifies the processing flow of heating the bonding pad initial body 130. On the other hand, the high temperature generated by directly utilizing the short circuit of the positive conductive circuit 121 and the negative conductive circuit 122 is only to heat the initial body 130 of the welding disc, so that the phenomenon of heat loss is avoided, the working efficiency of heating the initial body 130 of the welding disc can be improved, when a plurality of heat shrinkage coatings are coated, the heat shrinkage coatings are not interfered with each other, the distance between two adjacent positive electrode connecting welding discs 140 or two adjacent negative electrode connecting welding discs 150 reaches 60um, the relative distance between two adjacent heat shrinkage coatings can be effectively controlled, the control of the distance between two adjacent positive electrode connecting welding discs 140 or two adjacent negative electrode connecting welding discs 150 on the same conductive circuit is further facilitated, and the processing difficulty of small-sized fine-type luminous products is reduced.

The initial body 130 of the bonding pad formed by the thermal contraction coating is strip-shaped, the thickness of the initial body 130 of the bonding pad influences the appearance of the whole bonding pad 100 and the assembling difficulty of the bonding pad 100, if the thickness of the initial body 130 of the bonding pad is too small, the welding strength of an object to be welded which needs to be connected to the bonding pad is low, and the object to be welded has poor conduction or is loosened and falls. If the thickness of the primary pad body 130 is too thick, the volume of the whole pad 100 is too large, which affects the appearance of the pad 100, and therefore, the thickness of the primary pad body 130 needs to be further limited, and the thickness of the primary pad body 130 is generally limited to 0.05 mm.

Referring to fig. 5 and 6, in the process of applying the heat shrink coating on the surfaces of the positive conductive trace 121 and the negative conductive trace 122 facing away from the substrate 110 in S102, applying a plurality of heat shrink coatings on the surfaces of the positive conductive trace 121 and the negative conductive trace 122 facing away from the substrate 110, so that a plurality of pad precursors 130 are formed between the positive conductive trace 121 and the negative conductive trace 122, and each pad precursor 130 connected between the positive conductive trace 121 and the negative conductive trace 122 forms a parallel connection path with the positive conductive trace 121 and the negative conductive trace 122. When the positive conductive trace 121 and the negative conductive trace 122 are energized, the plurality of pad bodies 130 are all in a short-circuited state, and therefore, the plurality of pad bodies 130 are heated at the same time, so that the plurality of heat-shrinkable coatings are broken and shrunk at the same time. For example, when the bonding pad in this example is used to manufacture an LED display lamp, the bonding pad 100 having a plurality of bonding pad bodies 130 is provided, and a plurality of positive connection bonding pads 140 and negative connection bonding pads 150 are formed on the positive conductive traces 121 and the negative conductive traces 122 in a one-to-one correspondence manner, so that a plurality of LED chips can be adhered between the positive conductive traces 121 and the negative conductive traces 122, thereby increasing the display brightness of the entire LED display lamp.

The process of coating the heat-shrinkable coating on the positive conductive trace 121 and the negative conductive trace 122 may be directly coating the positive conductive trace 121 and the negative conductive trace 122 which are not mounted on the substrate 110, or may be first coating the positive conductive trace 121 and the negative conductive trace 122 on the substrate 110, and then coating the heat-shrinkable coating, specifically, first manufacturing a substrate 110, determining the positions of the positive conductive trace 121 and the negative conductive trace 122 on the substrate 110, and then arranging the positive conductive trace 121 and the negative conductive trace 122. Therefore, before the step of applying the heat-shrinkable paint on the surfaces of the positive conductive traces 121 and the negative conductive traces 122 facing away from the substrate 110 in S102, the method further includes: s100, a substrate 110 is selected, and the substrate 110 is provided with a mounting surface. The shape of the substrate 110 may be any shape depending on the display area of the pad 100, but is preferably regular and easy-to-process patterns such as a rectangular shape and a circular shape, and the substrate 110 may be a flexible circuit board, a printed circuit board, a cermet, or the like.

Between the step of selecting the substrate 110 in S100 and the step of applying the heat shrink coating on the surfaces of the positive conductive traces 121 and the negative conductive traces 122 facing away from the substrate 110 in S102, the method further includes: the conductive line 120 is arranged on the mounting surface of the substrate 110 manufactured in S102, the conductive line 120 is divided into a positive conductive line 121 and a negative conductive line 122, the positive conductive line 121 and the negative conductive line 122 are arranged in parallel, and the distance between the positive conductive line 121 and the negative conductive line 122 is related to the model of an object to be welded to the pad 100, and the relative distance between the positive conductive line 121 and the negative conductive line 122 can be determined according to the model of the object to be welded to the pad 100.

Referring to fig. 8 and 9, the larger the number of conductive traces 120, the more fixed positions are available for an object to be soldered on the pad 100, and therefore, a plurality of conductive traces 120 are provided on the mounting surface of the substrate 110, and theoretically, the plurality of conductive traces 120 do not intersect, but the conductive traces 120 are made parallel to each other in consideration of the neatness of the mounting surface of the substrate 110 and the neatness of the arrangement of the positive conductive traces 121 and the negative conductive traces 122 on the mounting surface of the substrate 110. In order to facilitate the installation of each object to be soldered on the pad 100, the polarities of the conductive traces 120 are staggered, and a heat-shrinkable paint is applied in a direction crossing the conductive traces 120, so that the heat-shrinkable paint is electrically connected to the conductive traces 120 at the same time.

Make a plurality of conducting circuits 120 parallel, the effectual clean and tidy nature that improves the installation face of base plate 110, and the regularity that each conducting circuit 120 was arranged, a plurality of conducting circuits 120 are parallel, be favorable to the coating of heat shrink coating, the polarity of each conducting circuit 120 is crisscross to be set up, the fixed object of treating that needs the welding on pad 100 of easy to assemble, make the object of treating that needs the welding on pad 100 arrange neatly more, be favorable to improving the quality of whole pad 100 equipment object and the apparent light degree of consistency of equipment object.

The light-showing uniformity of the small-sized fine-density light-emitting product is related to the models of the objects to be welded which need to be welded on the welding pad 100 and are powered on and can emit light, the more consistent the models of the objects to be welded, the higher the light-showing uniformity of the small-sized fine-density light-emitting product is, and for the convenience, the objects to be welded which are powered on and can emit light and are consistent in multiple models are fixed on the positive electrode connecting welding pad 140 and the negative electrode connecting pad 150, so that the multiple conducting wires 120 are arranged on the surface of the substrate 110 at equal intervals. The conductive circuits 120 are arranged on the surface of the substrate 110 at equal intervals, so that the objects to be welded which can emit light when electrified are arranged in order, and the uniformity of the brightness of the small and compact light-emitting product is effectively improved.

Referring to fig. 10 and 11, in order to increase the number of objects to be soldered, which need to be soldered to the pads 100 and are electrically energized to emit light, a heat-shrinkable paint is continuously applied in a direction crossing the respective conductive traces 120 so that the heat-shrinkable paint forms pad precursors 130 extending in a direction crossing the conductive traces 120, and each of the pad precursors 130 simultaneously electrically connects the respective conductive traces 120. Theoretically, only the primary bonding pad bodies 130 need not intersect, but the thermal shrinkage coatings are parallel to each other in consideration of the regularity of the arrangement of the objects to be bonded, which are electrified and can emit light. Coating a plurality of bonding pad initial bodies 130 extending in the direction crossing the conductive circuit 120, and limiting each bonding pad initial body 130 to be connected with each conductive circuit 120, after each conductive circuit 120 is electrified, the bonding pad initial bodies 130 form a plurality of parallel loops, each bonding pad initial body 130 is in a short circuit state, so that each bonding pad initial body 130 is heated and broken, because each bonding pad initial body 130 is parallel to each other, a connecting bonding pad arranged in an array is formed on the conductive circuit 120, and after an electrified and luminous object to be welded is welded on the bonding pad 100, each electrified and luminous object to be welded is arranged in an array, which is beneficial to designing and producing small and compact luminous products with different display areas.

In order to determine the coating direction of the thermal shrinkage coating conveniently, the extending direction of each bonding pad body 130 can be perpendicular to each conductive line 120, after the bonding pad bodies 130 are heated and broken, a plurality of rows and columns of positive electrode connecting bonding pads 140 and negative electrode connecting bonding pads 150 are formed, and objects to be welded which are electrified and can emit light and are welded on the bonding pads 100 are arranged on the positive electrode connecting bonding pads 140 and the negative electrode connecting bonding pads 150 and then are arranged in a square array, so that the objects to be welded which are electrified and can emit light are arranged orderly.

In order to control the arrangement density of the objects to be welded, which are electrically powered and can emit light, the pad precursors 130 are arranged at equal intervals along a direction parallel to the conductive traces 120. The bonding pad bodies 130 are arranged at intervals, and after the bonding pad bodies 130 are heated and broken to form the positive connection 140 bonding pad and the negative connection bonding pad 150, the distance between every two adjacent objects to be welded, which are electrified and can emit light, on each conductive line 120 is equal along the direction parallel to the conductive lines 120.

In this embodiment, the conducting wires 120 may be powered on by pairs of the multiple pairs of positive conducting wires 121 and the multiple pairs of negative conducting wires 122, or by pairs of the multiple pairs of positive conducting wires 121 and the multiple pairs of negative conducting wires 122 simultaneously.

In an embodiment of the present application, a method for processing a pad 100 may further include:

s201, preparing a substrate 110, wherein the substrate 110 has a mounting surface, and the shape of the substrate 110 is preferably a regular pattern such as a polygon or a circle.

S202, a positive conductive trace 121 and a negative conductive trace 122 are disposed on the mounting surface of the substrate 110, the positive conductive trace 121 and the negative conductive trace 122 are disposed in parallel and at an interval, or a plurality of conductive traces 120 that are parallel to each other are disposed on the mounting surface of the substrate 110, the polarities of the conductive traces 120 are staggered, and the conductive traces 120 are disposed at equal intervals.

S203, coating a thermal contraction coating on the surfaces of the positive conductive traces 121 and the negative conductive traces 122 away from the substrate 110, so that the thermal contraction coating forms the primary pad body 130, the primary pad body is simultaneously connected to the positive conductive traces 121 and the negative conductive traces 122, or coating the thermal contraction coating along the direction intersecting with the conductive traces 120, so that the thermal contraction coating forms the primary pad body 130, so that the primary pad body 130 is connected to each conductive trace 120, or coating a plurality of thermal contraction coatings extending in the direction intersecting with the conductive traces 120, so that the plurality of thermal contraction coatings form the primary pad body 130, each primary pad body 130 is connected to each conductive trace 120, and the primary pad bodies 130 are arranged in parallel and at equal intervals.

And S204, electrifying the positive conductive line 121 and the negative conductive line 122 arranged in the step S202, so that the pad primary body 130 connecting the positive conductive line 121 and the negative conductive line 122 forms a current path from the positive conductive line 121 to the negative conductive line 122, thereby enabling a short circuit to occur between the positive conductive line 121 and the negative conductive line 122, further enabling the heat shrinkable coating to break and shrink to the positive conductive line 121 and the negative conductive line 122, and forming a positive connection pad 140 connected with the positive conductive line 121 and a negative connection pad 150 connected with the negative conductive line 122.

Referring to fig. 1 to 4, in a second aspect, an embodiment of the present application further provides an LED display lamp 200, which includes a substrate 110, a conductive line group 170 fixed on the substrate 110, and an LED chip 160 disposed on the conductive line group 170.

The substrate 110 has a mounting surface, the shape of the substrate 110 may be any shape depending on the illumination display area of the LED display lamp 200, but it is generally preferable that the substrate 110 has a regular pattern such as a rectangular pattern or a circular pattern which is easy to process, so that the processing cost can be reduced, and the substrate 110 may be a flexible circuit board, a printed circuit board, a cermet, or the like.

The conductive line group 170 is disposed on the mounting surface of the substrate 110, and includes a positive conductive line 121 and a negative conductive line 122, the positive conductive line 121 and the negative conductive line 122 are both in a strip shape, theoretically, the positive conductive line 121 and the negative conductive line 122 do not intersect with each other, but for conveniently determining the positions of the positive conductive line 121 and the negative conductive line 122 and conveniently disposing the LED chip 160 on the positive conductive line 121 and the negative conductive line 122, the positive conductive line 121 and the negative conductive line 122 are preferably arranged in parallel and at an interval.

In order to enhance the connection strength between the LED chip 160 and the negative conductive trace 122, the surfaces of the positive conductive trace 121 and the negative conductive trace 122 facing away from the substrate 110 are coated with a thermal shrinkage coating, the thermal shrinkage coating is coated in a strip shape, the pad initial body 130 is formed by the thermal shrinkage coating coated in the strip shape, the pad initial body 130 is electrically connected with the positive conductive trace 121 and the negative conductive trace 122, after the positive conductive trace 121 and the negative conductive trace 122 are electrified, the pad initial body 130 forms a current path from the positive conductive trace 121 to the negative conductive trace 122, and the pad initial body 130 is short-circuited after the positive conductive trace 121 and the negative conductive trace 122 are electrified, so that the pad initial body 130 is broken by heating and is separated and aggregated into a positive connection pad 140 connected with the positive conductive trace 121 and a negative connection pad 150 connected with the negative conductive trace 122.

The positive connection pad 140 and the negative connection pad 150 are used for connecting the LED chip 160, the LED chip 160 has a positive antenna and a negative antenna, the positive antenna is welded to the positive connection pad 140, and the negative antenna is welded to the negative connection pad 150.

Referring to fig. 5 to 11, a plurality of LED chips 160 are generally disposed in the conventional LED display lamp 200, so that a plurality of heat-shrinkable coatings can be coated on the surfaces of the positive conductive traces 121 and the negative conductive traces 122 facing away from the substrate 110 to form the pad bodies 130. After the positive conductive trace 121 and the negative conductive trace 122 are powered on, in order to conveniently control the current direction at each primary pad body 130, the primary pad bodies 130 are made to be not intersected with each other, and each primary pad body 130 connected between the positive conductive trace 121 and the negative conductive trace 122 forms a parallel path with the positive conductive trace 121 and the negative conductive trace 122. After the positive conductive trace 121 and the negative conductive trace 122 are electrified, each primary pad body 130 forms a short circuit, so that each primary pad body 130 is broken by heating and forms a positive connection pad 140 and a negative connection pad 150, thereby realizing the connection of a plurality of LED chips 160 on a pair of conductive trace groups 170. The LED chip 160 has a positive electrode antenna welded to the positive electrode connection pad 140 and a negative electrode antenna welded to the negative electrode connection pad 150.

By coating a plurality of heat shrink coatings on the surfaces, away from the substrate 110, of the positive conductive line 121 and the negative conductive line 122 to form a plurality of primary pad bodies 130, the positive conductive line 121 is electrically connected with the negative conductive line 122 through the primary pad bodies 130, and then the positive conductive line 121 and the negative conductive line 122 are short-circuited by electrifying the positive conductive line 121 and the negative conductive line 122. The short circuit of the circuit can generate high temperature, so that the pad body 130 is heated and broken and then shrinks towards the positive conductive circuit 121 and the negative conductive circuit 122, the heating of the heat shrinkable coating by means of an external tool is avoided, and the method of directly heating the heat shrinkable coating by using the high temperature generated by the short circuit of the positive conductive circuit 121 and the negative conductive circuit 122 saves production time. The processing flow of heating the thermal contraction coating is simplified. When there are a plurality of pads for the first body 130, only heat the pad for the first body 130, can the effectual relative distance between two adjacent pads for the first body 130 of control, further be favorable to controlling the interval between two adjacent LED chips 160, make the clearance distance between two adjacent LED chips 160 reach 60um, reduced the processing degree of difficulty of miniature fine type luminous product.

Referring to fig. 5 to 9, since the LED display lamps 200 are used in different applications, the requirements for the light emitting areas of the LED display lamps 200 are different, and the area of the substrate 110, the number of the conductive line sets 170, the number of the pad precursors 130, and the lengths of the positive conductive lines 121 and the negative conductive lines 122 all have an influence on the light emitting areas of the LED display lamps 200. Therefore, a plurality of sets of conductive line groups 170 may be disposed on the mounting surface of the substrate 110, and in the embodiment, taking five sets of conductive line groups 170 as an example, the mounting area of the LED chip 160 is increased by increasing the number of the conductive line groups 170, thereby facilitating to control the light emitting area of the LED display lamp 200.

In order to reduce the crowding of the LED chips 160 on two adjacent sets of conductive line groups 170 during assembly, the sets of conductive line groups 170 are arranged at intervals, and the distance between two adjacent conductive lines 120 in different sets is equal to the distance between the positive conductive line 121 and the negative conductive line 122 in the same set of conductive line group 170, and the end portions of the conductive lines 120 on the same side of the mounting surface of the substrate 110 are disposed opposite to each other. Through the arrangement, the conductive circuits 120 are arranged on the mounting surface of the substrate 110 in order, so that the appearance of the whole LED display lamp 200 is tidier, and the positions of the conductive circuits 120 on the mounting surface of the substrate 110 are determined conveniently.

The more the number of the primary pad bodies 130 is, the more the positions for mounting the LED chips 160 are, and the primary pad bodies 130 are continuously coated in the direction crossing the conductive traces 120, so that the heat-shrinkable coating forms the primary pad bodies 130 extending in the direction crossing the conductive traces 120, and the primary pad bodies 130 do not cross, and one end of each primary pad body 130 on the same side of the substrate 110 is aligned, in this embodiment, six primary pad bodies 130 are taken as an example.

Through the arrangement, after the positive conductive lines 121 and the negative conductive lines 122 in each conductive line group 170 are electrified, the bonding pad bodies 130 at each position are heated, broken and shrunk to form a plurality of positive connection bonding pads 140 and negative connection bonding pads 150, and the installation positions of the LED chips 160 are effectively increased.

Theoretically, the position relationship of the strip-shaped primary bonding pad bodies 130 only needs to be disjoint, but the arrangement regularity of the LED chips 160 is considered, so that the plurality of primary bonding pad bodies 130 are parallel to each other. The plurality of bonding pads of the bonding pad initial body 130 extending in the direction crossing the conductive circuit 120 are coated, each bonding pad initial body 130 is limited to be connected with the conductive circuit 120 at the same time, after each conductive circuit 120 is electrified, the plurality of bonding pads initial bodies 130 form a plurality of parallel loops, each bonding pad initial body 130 is in a short circuit state, and therefore each bonding pad initial body 130 is heated and broken, and the bonding pads arranged in an array are formed on the conductive circuit 120 because each bonding pad initial body 130 is parallel to each other, so that each LED chip 160 is arranged in an array, and the design and the production of the LED display lamp 200 with different illumination display areas are facilitated.

The distance between the positive electrode connecting pad 140 and the negative electrode connecting pad 150 formed by the same pad body 130 is related to the distance between the positive electrode antenna and the negative electrode antenna of the LED chip 160, so that the extending direction of each pad body 130 is perpendicular to each conductive circuit 120, after the pad body 130 is heated and broken, the relative distance between the positive electrode connecting pad 140 and the negative electrode connecting pad 150 formed by the same pad body 130 is conveniently controlled, and after the LED chips 160 are mounted, a plurality of rows and columns of square-array LED chips 160 are formed, so that the LED chips 160 are arranged in order. A single LED chip 160 is disposed on the at least one positive connection pad 140 and the at least one negative connection pad 150, the LED chip 160 including a positive connection antenna electrically connected to the positive connection pad 140 and a negative connection pad electrically connected to the negative connection pad 150. That is, the positive connection antenna of the LED chip 160 may be connected to one or both of the positive connection pads 140, and the negative connection antenna of the LED chip 160 may be connected to one or both of the negative connection pads 150.

Through the arrangement, by utilizing the mode of electrifying the positive conductive circuit 121 and the negative conductive circuit 122, the current from the positive conductive circuit 121 to the negative conductive circuit 122 is generated at the pad initial body 130, the pad initial body 130 is further heated, so that the pad initial body 130 is heated, contracted and gathered, the positive connecting pad 140 and the negative connecting pad 150 are further formed, the positive antenna of the LED chip 160 is connected with the positive connecting pad 140, the negative antenna of the LED chip 160 is connected with the negative connecting pad 150, the assembly of the LED display lamp 200 is completed, the heat shrinkable coating is prevented from being heated by means of an external tool, the production time of the LED display lamp 200 is saved, and the processing flow of heating the heat shrinkable coating is simplified. The high temperature generated by directly utilizing the short circuit of the positive conductive circuit 121 and the negative conductive circuit 122 is only to heat the heat shrinkable coating, so that the phenomenon of heat loss can be avoided, the working efficiency of heating the heat shrinkable coating can be improved, when a plurality of heat shrinkable coatings are coated, the heat shrinkable coatings are not interfered with each other, the relative distance between two adjacent heat shrinkable coatings can be effectively controlled, the distance between two adjacent LED chips 160 can be further controlled, and the processing difficulty of a small-sized fine-type luminous product is reduced.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.