阅读说明：本技术 沉积处理设备 (Deposition processing apparatus ) 是由 李俊永 于 2021-05-12 设计创作，主要内容包括：提供了沉积处理设备。沉积处理设备包括装载有衬底固定装置的第一室、限定执行沉积处理的沉积处理空间的第二室以及包括将衬底固定装置从第一室传输到第二室的传输模块的第三室。衬底固定装置包括第一支承件和第二支承件,第一支承件支承至少一个衬底,第二支承件连接到第一支承件,在第一方向上与至少一个衬底的第一表面和第二表面接触,并且竖直地固定至少一个衬底以使得第三表面面对第一支承件的法线方向。第二支承件在至少一个衬底中限定包括第三表面、第一表面的与第三表面相邻的部分以及第二表面的与第三表面相邻的部分的沉积表面,并且将限定的沉积表面暴露于沉积处理空间。(Deposition processing apparatus are provided. The deposition process apparatus includes a first chamber loaded with a substrate fixture, a second chamber defining a deposition process space in which a deposition process is performed, and a third chamber including a transfer module that transfers the substrate fixture from the first chamber to the second chamber. The substrate fixing apparatus includes a first support supporting at least one substrate, and a second support connected to the first support, contacting first and second surfaces of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that a third surface faces a normal direction of the first support. The second support defines a deposition surface in the at least one substrate including a third surface, a portion of the first surface adjacent the third surface, and a portion of the second surface adjacent the third surface, and exposes the defined deposition surface to a deposition process space.)

1. A deposition processing apparatus comprising:

a first chamber into which a substrate fixture is loaded, wherein at least one substrate is loaded on the substrate fixture and comprises:

a first surface;

a second surface opposite the first surface; and

a third surface as a side surface between the first surface and the second surface;

a second chamber defining a deposition process space in which a deposition process is performed on the at least one substrate loaded on the substrate fixture; and

a third chamber comprising a transfer module that transfers the substrate fixture from the first chamber to the second chamber, the substrate fixture comprising:

a first support supporting the at least one substrate; and

a second support connected to the first support, contacting the first surface and the second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that the third surface faces a normal direction of the first support,

wherein the second support defines a deposition surface in the at least one substrate and exposes the defined deposition surface to the deposition process space, and

the deposition surface includes the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface.

2. The deposition processing apparatus of claim 1, wherein said second chamber comprises a deposition source emitting a deposition material to be deposited on said at least one substrate, and said deposition source is arranged to face said third surface.

3. The deposition processing apparatus of claim 2, wherein the second chamber comprises a stationary module that moves the deposition source in a direction toward or away from the at least one substrate.

4. The deposition treatment apparatus of claim 1 wherein the first support comprises:

a base member;

a first support member that is disposed on the base member, defines a space into which the transfer module is inserted with the base member, and supports the at least one substrate; and

a connecting member connecting the base member, the first support member and the second support to each other.

5. The deposition treatment apparatus of claim 4, wherein the second support is connected to the connection member to move in a direction toward or away from the first support.

6. The deposition treatment apparatus of claim 5 wherein the area of the deposition surface with the second support moving in the direction away from the first support is less than the area of the deposition surface with the second support moving in the direction closer to the first support.

7. The deposition processing apparatus of claim 1 wherein said second support comprises:

a plurality of securing members in contact with the first surface and the second surface of the at least one substrate; and

a second support member connecting the plurality of fixing members to each other and to the first support.

8. The deposition processing apparatus of claim 7, wherein the plurality of securing members do not overlap the portion of the first surface in the first direction and do not overlap the portion of the second surface in the first direction.

9. The deposition processing apparatus of claim 7, wherein the plurality of fixing members are connected to the second support member such that the plurality of fixing members move in a direction to approach or move away from each other.

10. The deposition processing apparatus of claim 1 wherein said substrate fixture further comprises:

a cushioning member disposed on the first support to support the at least one substrate.

Technical Field

The present disclosure relates to a substrate fixing device capable of improving mass productivity of three-sided deposition, a deposition processing apparatus including the substrate fixing device, and a deposition processing method using the deposition processing apparatus.

Background

Various types of substrates are used in a manufacturing process of a display substrate, and in recent years, deposition apparatuses that perform various organic and/or inorganic depositions on various substrates are also being diversified. Accordingly, there is an increasing demand for a cost-effective deposition processing apparatus capable of performing multi-sided deposition as well as single-sided deposition and capable of processing a plurality of substrates at once.

Disclosure of Invention

The present disclosure provides a substrate fixture implemented to perform three-sided deposition on a plurality of substrates.

The present disclosure provides a deposition processing apparatus including a substrate fixture implemented to perform three-sided deposition on a plurality of substrates and to improve mass productivity through a plurality of chambers.

The present disclosure provides a deposition treatment method using a deposition treatment apparatus.

Embodiments of the inventive concept provide a deposition processing apparatus, and the deposition processing apparatus may include a first chamber loaded with a substrate fixture, wherein at least one substrate is loaded on the substrate fixture, and includes a first surface, a second surface opposite to the first surface, and a third surface that is a side surface between the first surface and the second surface. The deposition processing apparatus may include a second chamber defining a deposition processing space in which a deposition process is performed on at least one substrate loaded on the substrate holder, and a third chamber including a transfer module that transfers the substrate holder from the first chamber to the second chamber. The substrate fixing apparatus may include a first support supporting at least one substrate, and a second support connected to the first support, contacting the first and second surfaces of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that the third surface faces a normal direction of the first support. The second support may define a deposition surface in the at least one substrate and expose the defined deposition surface to the deposition process space. The deposition surface may include a third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface.

The second chamber may include a deposition source emitting a deposition material to be deposited on the at least one substrate, and the deposition source may be disposed to face the third surface.

The second chamber may include a stationary module that moves the deposition source in a direction toward or away from the at least one substrate.

The first support may include a base member, a first support member disposed on the base member, defining a space in which the transfer module is inserted with the base member, and supporting at least one substrate, and a connection member connecting the base member, the first support member, and the second support to each other.

The second support may be connected to the connecting member to move in a direction toward or away from the first support.

The area of the deposition surface in the case where the second support moves in a direction away from the first support may be smaller than the area of the deposition surface in the case where the second support moves in a direction close to the first support.

The second support may include a fixing member contacting the first surface and the second surface of the at least one substrate, and a second support member connecting the fixing members to each other and to the first support.

The fixing member may not overlap with a portion of the first surface in the first direction and may not overlap with a portion of the second surface in the first direction.

The plurality of fixing members may be connected to the second support member such that the plurality of fixing members move in a direction to approach or separate from each other.

The substrate fixing apparatus may further include a buffer member disposed on the first support to support at least one substrate.

Embodiments of the inventive concept provide a substrate fixing device, which may include a first support supporting at least one substrate including a first surface, a second surface opposite to the first surface, and a third surface that is a side surface between the first surface and the second surface, and a second support connected to the first support, contacting the first surface and the second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that the third surface faces a normal direction of the first support. The second support may define a deposition surface, and the defined deposition surface may be exposed to the deposition process space. The deposition surface may include a third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface.

The second support may include a fixing member contacting the first surface and the second surface of the at least one substrate. The fixing member may not overlap with the portion of the first surface in the first direction and may not overlap with the portion of the second surface in the first direction.

The second support may be connected to the first support to move in a direction toward or away from the first support.

Embodiments of the inventive concept provide a deposition process. The method can comprise the following steps: preparing at least one substrate including a first surface, a second surface opposite to the first surface, and a third surface that is a side surface between the first surface and the second surface; loading at least one substrate into a substrate holding apparatus including a first support that supports the at least one substrate and a second support that is connected to the first support and holds the at least one substrate vertically; loading a substrate fixture loaded with at least one substrate into a first chamber of a deposition processing apparatus from the outside; transferring the substrate holder to a second chamber defining a deposition process space using a transfer module disposed in the third chamber; and performing a deposition process on the at least one substrate in the second chamber. The performing of the deposition process may include: the second support is allowed to define a deposition surface in the at least one substrate, and the deposition surface includes a third surface, a portion of the first surface adjacent the third surface, and a portion of the second surface adjacent the third surface and exposes the defined deposition surface to the deposition process space.

The performing of the deposition process may include: the deposition material is sputtered using a deposition source that moves in a direction toward or away from the at least one substrate.

The first support may include a base member, a first support member disposed on the base member, defining a space in which the transfer module is inserted with the base member, and supporting at least one substrate, and a connection member connecting the base member, the first support member, and the second support to each other.

The second support is movable in a direction toward or away from the first support.

The second support may include a plurality of fixing members in contact with the first and second surfaces of the at least one substrate, and a second support member connecting the plurality of fixing members to each other and to the first support.

The fixing member may not overlap with the portion of the first surface in the first direction and may not overlap with the portion of the second surface in the first direction.

The plurality of fixing members may be connected to the second support member such that the plurality of fixing members move in a direction to approach or separate from each other.

According to the above, a large number of substrates can be loaded at one time using a specially manufactured substrate fixture, and a plurality of chambers can be used to reduce a process time. It is possible to deposit on three sides of the substrate at once, and thus material costs can be reduced. Accordingly, the mass productivity can be improved by the deposition processing apparatus and the deposition processing method.

Drawings

The above and other advantages of the present disclosure will become readily apparent by reference to the following detailed description when considered in connection with the accompanying drawings wherein:

fig. 1A and 1B are schematic views illustrating a deposition treatment apparatus according to an embodiment of the present disclosure;

fig. 2 is a schematic view illustrating a second chamber according to an embodiment of the present disclosure;

fig. 3 is a schematic view illustrating a substrate holding apparatus according to an embodiment of the present disclosure;

fig. 4A and 4B are schematic views illustrating a substrate fixing apparatus according to an embodiment of the present disclosure;

FIG. 5 is a schematic view illustrating a second support according to an embodiment of the present disclosure; and

fig. 6A and 6B are schematic views illustrating a deposition processing method according to an embodiment of the present disclosure.

Detailed Description

In the present disclosure, it will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer, or intervening elements or layers may be present.

Like reference numerals refer to like elements throughout the specification. In the drawings, the thickness, proportion, and size of components may be exaggerated for effective description of technical contents.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. For example, "a and/or B" can be understood to mean "A, B, or a and B". The words "and" or "may be used in conjunction or separately and are to be understood to be equivalent to" and/or ".

It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Spatially relative terms, such as "below", "lower", "above" and "upper", and the like, may be used herein for convenience of description to describe one element or feature's relationship to another element or feature as illustrated in the figures.

It will be further understood that terms, such as "comprising," "including," "having," "containing," and/or "containing," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

Fig. 1A and 1B are schematic views illustrating a deposition treatment apparatus 1000 according to an embodiment of the present disclosure.

Fig. 1A illustrates a deposition processing apparatus 1000 including a second chamber 200 according to an embodiment of the present disclosure. Fig. 1B shows a deposition processing apparatus 1000.

Referring to fig. 1A, the deposition processing apparatus 1000 may include a first chamber 100, a second chamber 200, and a third chamber 300. The second chamber 200 of the deposition processing apparatus 1000 may be provided in plurality. Four second chambers 200 are shown in the figure. However, the number of second chambers 200 should not be limited to this or thereby. The number of the second chambers 200 included in the deposition processing apparatus 1000 may be more or less than four. According to an embodiment, the first chamber 100 of the deposition processing apparatus 1000 may be provided in plurality.

The first chamber 100 may externally load at least one substrate into the deposition processing apparatus 1000, and may externally unload the at least one substrate after the deposition process is completed. The first chamber 100 may load or unload at least one substrate. The first chamber 100 may load or unload at least one substrate for a unit by one substrate holding device that may include a plurality of substrates. The first chamber 100 may be provided in plurality to externally load the substrate into the apparatus in a vacuum state. Although not shown in the drawings, the loading and unloading of the substrate in the first chamber 100 may be performed by a dedicated robot.

The second chamber 200 may define a space in which a deposition process operation required for a substrate is performed in a vacuum state. The second chamber 200 may be provided in plurality. Accordingly, various types of layers can be deposited on a substrate in one deposition processing apparatus 1000, and the processing time can be reduced. The deposition processing apparatus 1000 according to the embodiment may be provided as a multi-type system including a plurality of second chambers 200. Accordingly, a plurality of chambers can be managed separately from each other, process management can be easy, and process reliability can be improved.

The third chamber 300 may transfer the substrate fixture including at least one substrate loaded from the first chamber 100 into the second chamber 200 defining a deposition process space. The third chamber 300 may include a transfer module 310 corresponding to a robot that transfers the substrate holder. The transfer module 310 may transfer not only the substrate fixture from the first chamber 100 to the second chamber 200 but also the substrate processed in the second chamber 200 to another second chamber 200 or the first chamber 100.

The third chamber 300 including the transfer module 310 may be disposed at the center in the deposition processing apparatus 1000 according to the embodiment, and the first and second chambers 100 and 200 may be arranged at positions corresponding to the edges of a circular shape in a cluster type.

In fig. 1B, the substrate fixture 210 loaded into the first chamber 100 may be transferred to the second chamber 200 through the transfer module 310 of the third chamber 300. Fig. 1B shows a deposition processing apparatus 1000 including a substrate holder 210 disposed in a second chamber 200. The substrate fixture 210 transferred to one of the plurality of second chambers 200 may provide at least one substrate loaded thereon to a deposition process space in the second chamber 200.

Fig. 2 is a schematic view illustrating a second chamber 200 according to an embodiment of the present disclosure. Fig. 2 shows a second chamber 200 including a substrate fixture 210.

Referring to fig. 2, the second chamber 200 may include a substrate fixture 210, a deposition source 220, and a fixture module 230. In fig. 2, a deposition process space 250 may be defined in the second chamber 200. The deposition process space 250 may correspond to a space or region in which the deposition material emitted from the deposition source 220 is deposited on the substrate SUB fixed to the substrate fixture 210.

The substrate fixing device 210 may include at least one substrate SUB, a first support 10, and a second support 20. The first and second supports 10 and 20 may allow at least one substrate SUB to be vertically placed in the substrate fixture 210. At least one substrate SUB may be disposed on the first support 10 and may be vertically fixed by the second support 20.

The at least one substrate SUB may include a first surface 1S, a second surface 2S, and a third surface 3S. The first surface 1S and the second surface 2S may be defined as surfaces opposite to each other, and the third surface 3S may be defined as a side surface connecting the first surface 1S and the second surface 2S. At least one substrate SUB may be vertically placed such that the third surface 3S faces the normal direction of the first support 10.

According to an embodiment, the substrate fixing device 210 may include a buffer member 50 disposed on the first support 10 to support at least one substrate SUB. The cushioning member 50 may be disposed under at least one substrate SUB and may protect the at least one substrate SUB from impact.

The deposition source 220 may emit deposition material required for at least one substrate SUB. The deposition source 220 may be disposed to face at least one substrate SUB. The deposition source 220 may include a target 31 and a deposition module 33. The target 31 may be a plate containing a deposition material. One surface of the target 31 may face the third surface 3S of the at least one substrate SUB. The target 31 may include a deposition material required according to the type of deposition process performed in the second chamber 200. The other surface of the target 31 may be in contact with the deposition module 33. The deposition module 33 may sputter deposition material from the target 31 in contact therewith onto at least one substrate SUB.

The fixing module 230 may fix the deposition source 220 to the second chamber 200. The fixing module 230 may be a robot arm whose length is variably adjusted. The fixing module 230 may move the deposition source 220 in a direction close to or away from at least one substrate SUB. For example, when the length of the fixed module 230 is increased, the deposition source 220 becomes closer to at least one substrate SUB that is a deposition object, and when the length of the fixed module 230 is decreased, the deposition source 220 becomes farther from the at least one substrate SUB. Accordingly, the limitation of the size and length in the second direction DR2 of the at least one substrate SUB loaded into the second chamber 200 may be reduced.

Fig. 3 is a schematic view illustrating a substrate fixture 210 according to an embodiment of the present disclosure. Fig. 4A and 4B are schematic views illustrating a substrate fixing apparatus 210 according to an embodiment of the present disclosure.

Referring to fig. 3, 4A and 4B, the substrate fixing device 210 may include a first support 10 and a second support 20. The first support 10 may include a base member 11, a first support member 13, and a connection member 15. The second support 20 may include a second support member 21 and a fixing member 23.

The first support 10 may support at least one substrate SUB. The second support 20 may vertically fix at least one substrate SUB. The first support 10 may support a surface opposite to the third surface 3S (refer to fig. 2) of the at least one substrate SUB. The second support 20 may be connected to the first support 10, and may support the first surface 1S and the second surface 2S of the at least one substrate SUB in the first direction DR1, and thus may fix the at least one substrate SUB such that the third surface 3S faces the second direction DR 2.

The second support 20 may define a deposition surface CS on at least one substrate SUB. Referring to fig. 2, the deposition surface CS may include three surfaces, such as a third surface 3S, a portion 1SP of the first surface 1S adjacent to the third surface 3S, and a portion 2SP of the second surface 2S adjacent to the third surface 3S. For example, the fixing member 23 may not overlap with the portion 1SP of the first surface 1S in the first direction DR1, and the fixing member 23 may not overlap with the portion 2SP of the second surface 2S in the first direction DR 1. The deposition surface CS may be defined in a side surface portion of the at least one substrate SUB. The deposition surface CS defined by the second support 20 may be exposed to a deposition process space 250 (refer to fig. 2) defined in the second chamber 200. The deposition surface CS may be a surface of at least one substrate SUB exposed to the deposition process space 250 and not covered by the second support 20.

The base member 11 of the first support 10 may be placed on the second chamber 200. The first support member 13 may be arranged above the base member 11. The first support member 13 and the base member 11 may define a space therebetween, and the transmission module 310 is inserted into the space. The first support member 13 may support at least one substrate SUB. The connection member 15 may connect the base member 11 and the first support member 13. Connecting member 15 may extend in second direction DR2, and may be coupled to a side surface of base member 11 and a side surface of first support member 13, each extending in first direction DR 1. The connection member 15 may connect the first support 10 to the second support 20. The connection member 15 extending in the second direction DR2 may be coupled to a side surface of the second support member 21.

The fixing member 23 may be coupled to the second support member 21. The plurality of fixing members 23 may extend in the second direction DR2 and may be aligned along the first direction DR1 in which the second support member 21 extends. At least one substrate SUB may be disposed between the plurality of fixing members 23. The fixing member 23 may be in contact with the first surface 1S and the second surface 2S of the at least one substrate SUB. The fixing member 23 may not be in contact with the deposition surface CS of the at least one substrate SUB. The fixing member 23 may be in contact with another portion of the first surface 1S and another portion of the second surface 2S of the at least one substrate SUB except the third surface 3S, the portion 1SP of the first surface 1S adjacent to the third surface 3S, and the portion 2SP of the second surface 2S adjacent to the third surface 3S, and thus may vertically fix the at least one substrate SUB in the second direction DR 2.

Fig. 4A shows a state in which the second support 20 moves in a direction away from the first support 10, and fig. 4B shows a state in which the second support 20 moves in a direction close to the first support 10.

In fig. 4A and 4B, the second support 20 may be coupled to the connection member 15 to be movable in a direction away from or close to the first support 10. The second support member 21 is movable in a second direction DR 2. The fixing member 23 coupled to the second support member 21 may move as the second support member 21 moves. The plurality of fixing members 23 may define a deposition surface CS on at least one substrate SUB in contact with each fixing member 23. If the fixing member 23 moves in a direction approaching the first support 10, the area of the deposition surface CS may gradually increase. The area of the deposition surface CS may be gradually reduced if the fixing member 23 is moved in a direction away from the first support 10. The area WD1 of the deposition surface CS in fig. 4A may be smaller than the area WD2 of the deposition surface CS in fig. 4B.

Fig. 5 is a schematic view illustrating the second support 20 according to an embodiment of the present disclosure.

Referring to fig. 5, the second support 20 may include two second support members 21 and a fixing member 23.

The fixing member 23 may be coupled to the second support members 21 disposed at opposite sides of the fixing member 23. The fixing member 23 may be coupled to the two second support members 21 at opposite sides thereof so as to be movable by the two second support members 21. For example, the fixing members 23 may move in a direction to approach or move away from each other. Accordingly, the width between the fixing members 23 may have a width WD3 when the fixing members 23 are distant from each other, and the width between the fixing members 23 may have a width WD4 when the fixing members 23 are close to each other. Accordingly, the second support member 20 can fix substrates of various thicknesses or sizes regardless of the thickness of at least one substrate SUB.

Fig. 6A and 6B are schematic views illustrating a deposition processing method according to an embodiment of the present disclosure.

Fig. 6A shows the deposition material PC sputtered from the deposition source 220 onto the deposition surface CS of at least one substrate SUB loaded into the substrate fixture 210, and fig. 6B shows the deposition material PC deposited on the deposition surface CS of at least one substrate SUB.

Referring to fig. 6A and 6B, the deposition processing method may include: preparing at least one substrate SUB; loading at least one substrate SUB on the substrate fixture 210; loading the substrate fixture 210 loaded with at least one substrate SUB into the first chamber 100 from the outside; transferring the substrate fixture 210 to the second chamber 200; and performing a deposition process.

In the preparation of the substrate SUB, at least one substrate SUB including a first surface 1S (refer to fig. 2), a second surface 2S (refer to fig. 2) opposite to the first surface 1S, and a third surface 3S (refer to fig. 2) between the first surface 1S and the second surface 2S is prepared.

In the loading of the substrates SUB, at least one substrate SUB may be loaded on the substrate fixture 210 including the first support 10 supporting the at least one substrate SUB and the second support 20 connected to the first support 10 so as to be in contact with the first surface 1S and the second surface 2S of the at least one substrate SUB in the first direction DR1, and vertically loaded such that the third surface 3S faces the normal direction of the first support 10.

In the loading operation, the substrate fixture 210 may be loaded into the first chamber 100.

In the transfer operation, the substrate fixture 210 loaded into the first chamber 100 may be transferred to the second chamber 200 through the transfer module 310 of the third chamber 300.

In the performance of the deposition process, the deposition process may be performed on at least one substrate SUB in the deposition process space 250 defined in the second chamber 200.

In an embodiment, performing a deposition process may include: the deposition surface CS defined in at least one substrate SUB is exposed to the deposition process space 250 by the substrate fixture 210. The deposition surface CS may be defined by the second support 20 of the substrate fixture 210. The fixing member 23 of the second support 20 may be in contact with the first surface 1S and the second surface 2S of the at least one substrate SUB to cover the contact portion, and a portion 1SP of the first surface 1S, a portion 2SP of the second surface 2S, and a third surface 3S, which may not be in contact with the fixing member 23, of the at least one substrate SUB, may be exposed to the deposition process space 250. Accordingly, a surface exposed to the deposition process space 250 without contacting the fixing member 23 may be defined as the deposition surface CS.

In an embodiment, the performing of the deposition process may include: the deposition material PC is sputtered from the deposition source 220 to the exposed deposition surface CS. The deposition material PC sputtered from the deposition source 220 may be deposited on the deposition surface CS of the at least one substrate SUB. Hereinafter, when a deposition processing method is described, details regarding the same elements as those of the deposition processing apparatus 1000 in fig. 1 to 5 will be omitted.

The substrate fixture according to the embodiment of the present disclosure may be designed to be suitable for loading a large number of substrates at a time and three-sided deposition, and thus three sides including at least one side surface of the substrate may be exposed to the deposition process space. The deposition processing method performed by the deposition processing apparatus including the substrate fixing device can reduce the processing time. Accordingly, material costs may be reduced, and thus mass productivity may be improved.

Although embodiments of the present disclosure have been described, it is to be understood that the present disclosure should not be limited to those embodiments, but various changes and modifications can be made by one of ordinary skill in the art within the spirit and scope of the present disclosure as hereinafter claimed. Accordingly, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the inventive concept should be determined from the following claims.