阅读说明：本技术 电路板加工方法 (Circuit board processing method ) 是由 袁绪彬 彭荣章 黄广新 于 2021-07-30 设计创作，主要内容包括：本发明涉及一种电路板加工方法,用于在电路板上贴装元器件及附着补强片。其中,电路板加工方法包括如下步骤：S1,制作包括主体部分和第一边框的电路板；S2,制作补强载板,补强载板包括底板和设置在底板上的支撑部,底板含有补强片和第二边框；S3,采用粘结片连接第一边框和第二边框,并将补强片粘着到电路板主体部分的预定位置；S4,在电路板的主体部分上贴装元器件,贴装过程中利用补强载板的支撑部对电路板的主体部分进行支撑；S5,去除第一边框,并去除补强载板中除补强片之外的部分。本发明将在电路板上贴装元器件及附着补强片的流程结合在一起,在贴装元器件时利用补强载板作为电路板的支撑,具有流程简便且成本低的优点。(The invention relates to a circuit board processing method, which is used for mounting components and attaching reinforcing sheets on a circuit board. The circuit board processing method comprises the following steps: s1, manufacturing a circuit board comprising a main body part and a first frame; s2, manufacturing a reinforcing carrier plate, wherein the reinforcing carrier plate comprises a bottom plate and a supporting part arranged on the bottom plate, and the bottom plate comprises a reinforcing sheet and a second frame; s3, connecting the first frame and the second frame by using an adhesive sheet, and adhering the reinforcing sheet to a preset position of the circuit board main body part; s4, mounting components on the main body of the circuit board, and supporting the main body of the circuit board by the supporting part of the reinforced carrier plate in the mounting process; and S5, removing the first frame and removing the part except the reinforcing sheet in the reinforcing carrier plate. The invention combines the processes of mounting components and attaching the reinforcing sheet on the circuit board, utilizes the reinforcing carrier plate as the support of the circuit board when mounting the components and has the advantages of simple process and low cost.)

1. A circuit board processing method comprises the following steps:

s1, manufacturing a circuit board comprising a main body part and a first frame;

s2, manufacturing a reinforcing carrier plate, wherein the reinforcing carrier plate comprises a bottom plate containing a reinforcing sheet and a second frame and a supporting part arranged on the bottom plate, and the supporting part is used for supporting the main body part of the circuit board;

s3, connecting the first frame and the second frame by adopting an adhesive sheet, and adhering the reinforcing sheet to a preset position of the circuit board main body part;

s4, mounting components on the main body of the circuit board;

and S5, removing the first frame and removing the part except the reinforcing sheet in the reinforcing carrier plate.

2. The method for processing a circuit board according to claim 1, wherein the step S2 includes manufacturing a sub-board structure along an inner edge of the second frame and an outer edge of the reinforcing sheet.

3. The circuit board processing method according to claim 2, wherein the board dividing structure is a board dividing groove and/or a stamp hole.

4. The processing method of the circuit board according to claim 1, wherein the reinforcing carrier is a copper-clad plate, and step S2 includes etching a copper foil layer of the copper-clad plate to form the supporting portion.

5. The circuit board processing method according to claim 4, wherein the thickness of the copper foil layer is 15 to 50 μm.

6. The processing method of circuit board according to claim 4, wherein step S2 includes forming a protection layer on the surface of the copper foil layer after etching.

7. The circuit board processing method according to claim 1, wherein a difference in thickness between the supporting portion and the adhesive sheet is less than 20 μm.

8. The circuit board processing method according to claim 1, wherein a space is left between the supporting portion and each of the second frame and the reinforcing sheet.

9. The circuit board processing method according to claim 1, wherein the bonding sheet is a prepreg; in step S3, the prepreg is disposed between the first frame and the second frame and between the stiffener and the main portion of the circuit board, and is pressed.

10. The circuit board processing method according to claim 1, wherein the circuit board is a flexible circuit board.

Technical Field

The invention relates to a circuit board processing method, which is used for mounting components and attaching reinforcing sheets on a circuit board.

Background

The Flexible Printed Circuit (FPC) has the characteristics of high wiring density, thin thickness and good bending property. In the prior art, when a component is mounted on a flexible printed circuit board, a mounting carrier plate is usually required to be attached to support the flexible printed circuit board in order to ensure the flatness of the flexible printed circuit board. In addition, a reinforcing sheet is generally attached to a predetermined region of the surface of the flexible circuit board to compensate for the lack of rigidity of the flexible circuit board itself, thereby facilitating assembly.

That is to say, in the prior art, the processes of attaching the reinforcing sheet to the flexible circuit board and mounting the component are performed separately and independently, and there are disadvantages of complicated flow and high cost.

Disclosure of Invention

The present invention is directed to a method for manufacturing a circuit board, in which the processes of mounting components on the circuit board and attaching a reinforcing sheet are combined together to simplify the manufacturing process and reduce the manufacturing cost.

In order to achieve the above main object, the present invention provides a circuit board processing method, including the steps of:

s1, manufacturing a circuit board comprising a main body part and a first frame;

s2, manufacturing a reinforcing carrier plate, wherein the reinforcing carrier plate comprises a bottom plate containing a reinforcing sheet and a second frame and a supporting part arranged on the bottom plate, and the supporting part is used for supporting the main body part of the circuit board;

s3, connecting the first frame and the second frame by adopting an adhesive sheet, and adhering the reinforcing sheet to a preset position of the circuit board main body part;

s4, mounting components on the main body of the circuit board;

and S5, removing the first frame and removing the part except the reinforcing sheet in the reinforcing carrier plate.

According to the technical scheme, the circuit board processing method skillfully combines the processes of mounting the components and attaching the reinforcing sheet on the circuit board, utilizes the reinforcing carrier plate as the support of the circuit board when mounting the components, and has the advantages of simple process and low cost.

According to an embodiment of the present invention, step S2 includes manufacturing a sub-plate structure along the inner edge of the second frame and the outer edge of the reinforcing plate.

Further, the plate dividing structure is a plate dividing groove and/or a stamp hole.

In the above technical solution, the board dividing structure, such as the board dividing groove and/or the stamp hole, is manufactured along the inner edge of the second frame and the outer edge of the reinforcing sheet, so that the parts of the reinforcing carrier plate except the reinforcing sheet can be removed after the components are mounted.

Further, a board dividing structure, such as a board dividing groove and/or a stamp hole, may also be formed between the main portion of the circuit board and the first bezel to facilitate separation of the main portion of the circuit board and the first bezel.

According to a specific embodiment of the present invention, the reinforcing carrier is a copper-clad plate, and step S2 includes etching the copper foil layer of the copper-clad plate to form the supporting portion.

In the technical scheme, the copper-clad plate is used as the reinforcing carrier plate, and the supporting part is formed by etching the copper foil layer of the copper-clad plate, so that the copper-clad plate has the advantages of simple process and low cost.

Further, the thickness of the copper foil layer is 15-50 μm.

Further, step S2 includes fabricating a protection layer on the surface of the copper foil layer after etching. The protective layer can avoid the defects of oxidation, dirt and the like of the copper foil supporting part.

According to an embodiment of the present invention, a thickness difference between the supporting portion and the bonding sheet is less than 20 μm, so that a main portion of the circuit board carried on the supporting portion has better flatness.

According to an embodiment of the present invention, a space is left between the supporting portion and the second frame and between the supporting portion and the reinforcing sheet, so as to remove a portion of the reinforcing carrier plate except for the reinforcing sheet.

According to a specific embodiment of the present invention, the bonding sheet is a prepreg; in step S3, the prepreg is disposed between the first frame and the second frame and between the stiffener and the main portion of the circuit board, and is pressed.

In the technical scheme, the prepreg and the pressing process are utilized to realize the bonding connection of the circuit board and the reinforcing carrier plate, and the method has the advantages of simple process and low cost. Wherein, can adopt PIN nail to counterpoint during the pressfitting, realize the mutual location between circuit board, prepreg and the reinforcement support plate to improve the pressfitting precision.

According to a specific embodiment of the present invention, the circuit board is a flexible circuit board.

To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.

Drawings

FIG. 1 is a flow chart of an embodiment of a circuit board processing method of the present invention;

FIG. 2 is a front view of an embodiment of a circuit board;

FIG. 3 is a side view of an embodiment of a circuit board;

FIG. 4 is a cross-sectional view of an embodiment of a reinforcing carrier;

FIG. 5 is a front view of an embodiment of a reinforcing carrier;

FIG. 6 is a front view of the reinforcing carrier after the bonding sheet has been superimposed thereon;

FIG. 7 is a schematic structural view of a circuit board and a reinforcing carrier connected by an adhesive sheet;

fig. 8 is a schematic structural diagram of a finished circuit board.

It is to be noted that the structures shown in the drawings are merely schematic depictions for the purpose of facilitating an understanding of the invention, and that the various parts of the drawings are not necessarily drawn to scale, shape and position in reality of the product.

Detailed Description

The embodiment of the invention relates to a circuit board processing method, which combines the processes of mounting components and attaching reinforcing sheets on a circuit board, and utilizes a reinforcing carrier plate containing the reinforcing sheets as a support of the circuit board when the components are mounted.

Specifically, as shown in fig. 1, the circuit board processing method according to the embodiment of the present invention includes step S1: a circuit board including a main body portion and a first frame is manufactured. The structure of the circuit board 10 prepared in step S1 is shown in fig. 2 and 3, and includes a main body portion 11 and a first frame 12; wherein the first rim 12 is configured to surround the body portion 11, and a plate dividing structure (not shown) such as a plate dividing groove and/or a stamp hole may be formed therebetween. The manufacturing method of the circuit board 10 may be the same as the prior art, and is not described herein.

As shown in fig. 1, the circuit board processing method according to the embodiment of the present invention includes a further step S2: and manufacturing a reinforcing carrier plate comprising a second frame and a reinforcing sheet. As shown in fig. 4 and 5, the reinforced carrier 20 prepared in step S2 includes a bottom plate 21 including a reinforcing sheet 211 and a second frame 212, wherein the reinforcing sheet 211 is connected to an inner edge of the second frame 212; supporting portion 22 is disposed on bottom plate 21, and supporting portion 22 is located within the inner contour of second rim 212 and is spaced apart from second rim 212 and reinforcing sheet 211.

Further, step S2 includes forming a sub-plate structure along the inner edge of the second rim 212 and the outer edge of the reinforcing plate 211, wherein the sub-plate structure may be a sub-plate groove and/or a stamp hole. As shown in fig. 4 and 5, as an alternative embodiment, V-shaped board dividing grooves 213 are processed on both main surfaces of the reinforcing carrier 20 as a board dividing structure, and the board dividing grooves 213 include a first board dividing groove 2131 disposed along the inner edge of the second rim 212 and a second board dividing groove 2132 disposed along the outer edge of the reinforcing sheet 211.

In an alternative embodiment, the reinforcing carrier 20 is a copper clad laminate (e.g., FR-4 copper clad laminate), and includes an insulating substrate (e.g., FR-4 laminate) and a copper foil layer formed on the surface of the insulating substrate. Wherein, the insulating substrate constitutes the bottom plate 21, and the step S2 includes etching the copper foil layer of the copper-clad plate, and the etched copper foil layer forms the supporting portion 22. The thickness of the copper foil layer (i.e., the height of the support portion 22 protruding from the surface of the base plate 21) is preferably 15 μm to 50 μm.

Further, step S2 includes fabricating a passivation layer on the surface of the copper foil layer after etching to avoid the defects of oxidation and contamination of the copper foil support portion. For example, a solder resist material may be coated on the copper foil layer, or the copper foil layer may be subjected to surface treatment such as OSP (organic protective film) or electroless nickel gold (electroless nickel gold) to form a protective layer.

As shown in fig. 1. The circuit board processing method of the present invention further includes step S3: the first frame and the second frame are connected by an adhesive sheet, and the reinforcing sheet is adhered to a predetermined position of the circuit board main body portion. In the embodiment of the present invention, the bonding sheet is preferably a low-flow prepreg 30, such as an acrylic-series low-temperature-curing thermoplastic resin sheet.

As shown in fig. 6, the prepreg 30 has a first bonding portion 31 corresponding to the second frame 212 and a second bonding portion 32 corresponding to the reinforcing sheet 211; in consideration of the flowability of the prepreg, a compensation space S1 is provided between the first bonding portion 31 and the second frame 212, and a compensation space S2 is provided between the second bonding portion 32 and the reinforcing sheet 211, wherein S2 may be smaller than S1.

In step S3, the reinforcing carrier 20, the prepreg 30, and the circuit board 10 are stacked and pressed together. During pressing, the PIN nails can be used for alignment, so that the circuit board 10, the prepreg 30 and the reinforcing carrier plate 20 can be positioned with each other, and the pressing precision is improved. The pressing is preferably performed by rapid pressing.

As shown in fig. 7, the prepreg 30 is disposed only between the first frame 12 and the second frame 212 and between the reinforcing sheet 211 and the finished part 11 of the circuit board 10, and a gap 42 is left between the supporting portion 22 and the second frame 212 and between the supporting portion 22 and the reinforcing sheet 211, so as to facilitate the board dividing process. Wherein, the inner edge of the second frame 212 is aligned with the inner edge of the first frame 12, and the supporting portion 22 protrudes from the main surface of the bottom plate 21 to support the main body portion 11 of the circuit board 10; preferably, the difference in thickness between the support portion 22 and the cured prepreg 30 is less than 20 μm to improve the flatness of the main body portion 11 of the circuit board 10.

As shown in fig. 1, the circuit board processing method of the present invention includes the further step S4: components (not shown) are mounted on the main body portion 11 of the board 10. The components may be mounted on the main body 11 by SMT (surface mount technology), and the support portions 22 may support the main body 11 of the circuit board 10 during the mounting of the components, so that the main body 11 has a better flatness.

As shown in fig. 1, the circuit board processing method of the present invention further includes step S5: and removing the first frame of the circuit board, and removing the part except the reinforcing sheet in the reinforcing carrier plate. In the embodiment of the present invention, the reinforcing carrier 20 and the circuit board 10 may be mechanically cut along the first board dividing groove 2131 disposed on the inner edge of the second frame 212; then, the reinforcing carrier 20 is mechanically cut along the second board dividing groove 2132 on the outer edge of the reinforcing sheet 211 to remove the first frame 12 of the circuit board 10 and the portion of the reinforcing carrier 20 except for the reinforcing sheet 211, and finally the circuit board product shown in fig. 8 is obtained.

It should be noted that, in the above embodiments, the invention is described by taking a flexible circuit board as an example, but the technical solution of the invention is also applicable to processing a light and thin rigid circuit board, for example, a rigid circuit board with a board thickness of less than 0.35 mm.

Although the present invention has been described with reference to particular embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.