阅读说明：本技术 一种5g超薄型刚挠结合板制备方法 (Preparation method of 5G ultrathin rigid-flex printed circuit board ) 是由 王康兵 曾祥福 周刚 于 2021-09-15 设计创作，主要内容包括：本发明公开了一种5G超薄型刚挠结合板制备方法,包括以下步骤：S1、叠构设计：对刚挠结合板进行叠构设计,其中叠构设计时所采用的半固化片包括1017半固化片；S3、制作刚挠结合板：根据所述叠构设计进行制作刚挠结合板。在所述步骤S1与所述步骤S3之间设有以下步骤：S2、新物料测试评估：对所述1017半固化片进行投产前验证。本发明的方法步骤设计合理,通过采用1017半固化片,此类半固化片采用1017玻璃布,因此其压合后的厚度在30μm左右,从而有效减小了刚挠结合板的板厚,比如当需要制作10层、板厚0.5mm、任意层互连的刚挠结合板时,通过采用1017半固化片,就可以满足10层硬板压后厚度在0.5mm以内的要求,从而有效提升了刚挠结合板的现场制程能力。(The invention discloses a preparation method of a 5G ultrathin rigid-flex printed circuit board, which comprises the following steps: s1, stacking design: stacking the rigid-flex printed circuit board, wherein prepregs used in stacking design comprise 1017 prepregs; s3, manufacturing a rigid-flex printed circuit board: and manufacturing the rigid-flex printed circuit board according to the stack design. Between the step S1 and the step S3, there are provided the steps of: s2, new material test evaluation: and verifying the 1017 prepreg before production. The method has reasonable step design, and the 1017 prepreg is adopted, and the prepreg adopts 1017 glass cloth, so the thickness of the laminated rigid-flex board is about 30 mu m, thereby the board thickness of the rigid-flex board is effectively reduced, for example, when 10 layers of rigid-flex boards with the board thickness of 0.5mm and any layers of interconnected rigid-flex boards need to be manufactured, the 1017 prepreg can meet the requirement that the thickness of the 10 layers of rigid-flex boards is within 0.5mm after being laminated, and the field processing capability of the rigid-flex board is effectively improved.)

1. A preparation method of a 5G ultrathin rigid-flex printed circuit board is characterized by comprising the following steps: the method comprises the following steps:

s1, stacking design: stacking the rigid-flex printed circuit board, wherein prepregs used in stacking design comprise 1017 prepregs;

s3, manufacturing a rigid-flex printed circuit board: and manufacturing the rigid-flex printed circuit board according to the stack design.

2. The method for preparing a 5G ultra-thin rigid-flex printed circuit board according to claim 1, wherein the method comprises the following steps: the 1017 prepreg is a stage gloss EM 3901017 PP material.

3. The method for preparing a 5G ultra-thin rigid-flex printed circuit board according to claim 2, wherein the method comprises the following steps: the model of the 1017 prepreg is EM-39B 1017R 79.

4. The method for manufacturing a 5G ultra-thin type rigid-flex printed circuit board according to any one of claims 1 to 3, wherein: between the step S1 and the step S3, there are provided the steps of:

s2, new material test evaluation: verifying the 1017 prepreg before production;

the new material test evaluation of the step S2 includes the following steps:

s2.1, new materials: selecting the 1017 prepreg;

s2.2, testing the physical properties of the raw materials: carrying out physical property test on the 1017 prepreg;

s2.3, testing pressing parameters: carrying out pressing parameter test on the 1017 prepreg;

s2.4, testing drilling parameters: carrying out drilling parameter test on the 1017 prepreg;

s2.5, removing glue amount and mass loss: performing a glue removing amount and quality loss test on the 1017 prepreg;

s2.6, testing degumming parameters: carrying out a degumming parameter test on the 1017 prepreg;

s2.7, material evaluation: performing material evaluation on the 1017 prepreg;

s2.8, release test: carrying out a release test on the 1017 prepreg;

s2.9, standardization: the 1017 prepreg was standardized.

5. The method for preparing a 5G ultra-thin rigid-flex printed circuit board according to claim 4, wherein the method comprises the following steps: the physical property test of the raw material in the step S2.2 comprises the following steps:

s2.2.1, TMA Tg test: performing TMA Tg testing on the 1017 prepreg;

s2.2.2, Td test: performing a Td test on the 1017 prepreg;

s2.2.3, Dk/Df test: carrying out Dk/Df test on the 1017 prepreg;

s2.2.4, CTE test: performing a CTE test on the 1017 prepreg;

s2.2.5, Modulus test: carrying out Module test on the 1017 prepreg;

s2.2.6, TGA Filler ratio test: performing TGA Filler ratio test on the 1017 prepreg;

s2.2.7, Filler EDS elemental analysis: performing Filler EDS elemental analysis on the 1017 prepreg;

s2.2.8, DMA T260 test: performing a DMA T260 test on the 1017 prepreg;

s2.2.9, DMA T288 test: performing a DMA T288 test on the 1017 prepreg;

s2.2.10, DMA T300 test: performing a DMA T300 test on the 1017 prepreg;

s2.2.11, TGA 260 test: TGA 260 testing was performed on the 1017 prepreg.

6. The method for preparing a 5G ultra-thin rigid-flex printed circuit board according to claim 5, wherein the method comprises the following steps:

the pressing parameter test of the step S2.3 comprises the following steps:

after the 1017 prepreg is pressed, sequentially carrying out a formula material temperature test, a Tg test, an IR tin floating test, a Pelel Strength test, a glue filling condition test and a dielectric layer uniformity test on the 1017 prepreg;

the drilling parameter test of step S2.4 includes the following steps:

after the 1017 prepreg is drilled, sequentially carrying out hole wall quality test, roughnesstest, upper hole and lower hole aperture test on the drilled holes on the 1017 prepreg;

the glue removing parameter test of the step S2.6 comprises the following steps:

after the glue of the 1017 prepreg is removed, sequentially carrying out hole wall test, roughnesss test, PI test and glass fiber protruding electroplating quality test on the drilled holes on the 1017 prepreg;

the step S2.8 of the discharge test comprises the steps of:

and sequentially carrying out an FA reliability test and an FA dimension test expansion and contraction test on the 1017 prepreg.

7. The method for preparing a 5G ultra-thin type rigid-flex printed circuit board according to any one of claims 1 to 3 and 5 to 6, wherein: the manufacturing of the rigid-flex printed circuit board of the step S3 includes the following steps:

s3.1, pressing: pressing the 1017 prepreg and a soft board substrate;

s3.2, drilling: drilling the soft board base material;

s3.3, laser drilling: performing laser drilling on the soft board base material, and forming blind holes on the soft board base material;

s3.4, removing glue: removing glue from the blind holes on the soft board base material;

s3.5, electroplating: and carrying out selective plating on the blind holes on the soft board base material.

8. The method for preparing a 5G ultra-thin rigid-flex printed circuit board according to claim 7, wherein the method comprises the following steps:

in the pressing of step S3.1: the 1017 prepreg is pressed with a high-temperature buffer material and a soft board substrate, the 1017 prepreg is pre-glued by a double person and a jig, and the maximum temperature of the pressed part is 200 ℃;

in the drilling of said step S3.2: the feeding speed of the tool is 70IPM, the drilling speed of the tool is 180Krpm, the returning speed of the tool is 800IPM, the service life of the tool is 1500Hit, and the number of stacked plates is 4;

in the laser drilling of step S3.3: the pulse width of the laser is 11/2us, the excitation frequency of the laser is 1+1shot, the size of the laser mask is 1.5mm, and the energy of the laser is 8.5 mj;

in the horizontal degumming of step S3.4: removing glue by using plasma glue removal and horizontal glue removal;

in the electroplating of step S3.5: the forward and reverse pulse plating is adopted, the short side of the chuck is clamped, a high-copper low-acid system is adopted, the large current is short, and the reverse current is one tenth of the forward current time.

9. The method for preparing a 5G ultra-thin type rigid-flex printed circuit board according to any one of claims 1 to 3, 5 to 6 and 8, wherein: the manufacturing of the rigid-flex printed circuit board of the step S3 further includes the steps of:

s3.6, copper deposition of the whole plate: carrying out whole-board copper deposition on the soft board base material;

s3.7, super-roughening and micro-etching: carrying out super-roughening and micro-etching on the soft board base material;

s3.8, film pasting: sticking a dry film on the soft board base material by using a film sticking machine;

s3.9, exposure: exposing a dry film on the soft board base material by using the LDI exposure machine;

before the exposure of step S3.9, the following steps are also provided:

reverse compensation of engineering data: and adjusting the number of pixels of the line width of the line of the scalar format image according to the LDI exposure machine resolution, the line width/line distance of the line of the vector format image and the number of pixels of the line width of the line of the scalar format image converted from the vector format image.

10. The method for manufacturing a 5G ultra-thin type rigid-flex printed circuit board according to any one of claims 9, wherein:

in the step of engineering data inverse compensation: the resolution of the LDI exposure machine is 2.1 mu m, the line width/line distance of the lines of the vector format image is 30/30 mu m, the number of pixels of the line width of the lines of the scalar format image converted from the vector format image is 15, and then 14 pixels are obtained after one pixel of the scalar format image is subtracted.

Technical Field

The invention relates to the technical field of preparation of rigid-flex boards, in particular to a preparation method of a 5G ultrathin rigid-flex board.

Background

With the rapid development of electronic information, in order to meet the intelligent wearing requirements, Printed Circuit Boards (PCBs) are also gradually developing in the directions of being small, thin, fine in wiring and the like. And with the upgrade of the board thickness, namely, the printed circuit board with the thickness of less than 0.1mm per unit layer number can be defined as an ultra-thin board. Conventional production processes for such printed circuit boards have been unable to meet product requirements.

Therefore, the invention systematically improves the field processing capability from the technical schemes of stacking design, new material evaluation, analysis degree accumulated error inverse compensation optimization engineering data aiming at the LDI exposure machine and the like, and perfects the manufacture of the 5G intelligent wearable rigid-flex printed circuit board, namely products with 10 layers, the thickness of 0.5mm and any layer of interconnection.

Aiming at products with 10 layers, plate thickness of 0.5mm and any layer of interconnection, common materials and conventional processes can not meet the product requirements, and when the product is manufactured by a simple negative film process, because the stacking design is unreasonable, the copper reduction is not uniform and the circuit compensation is unreasonable, the product abnormalities such as circuit dog teeth, short circuit and circuit breaking can be caused, the production efficiency of the product is directly influenced, and meanwhile, the rework rate is high and the quality loss risk exists.

Disclosure of Invention

The invention aims to provide a preparation method of a 5G ultrathin rigid-flex printed circuit board, which is used for improving the field processing capability of the rigid-flex printed circuit board.

In order to achieve the purpose, the technical scheme of the invention provides a preparation method of a 5G ultrathin rigid-flex printed circuit board, which comprises the following steps:

s1, stacking design: stacking the rigid-flex printed circuit board, wherein prepregs used in stacking design comprise 1017 prepregs;

s3, manufacturing a rigid-flex printed circuit board: and manufacturing the rigid-flex printed circuit board according to the stack design.

Further, the 1017 prepreg is a table light EM 3901017 PP material.

Further, the model of the 1017 prepreg is EM-39B 1017R 79.

Further, the following steps are provided between the step S1 and the step S3:

s2, new material test evaluation: verifying the 1017 prepreg before production;

the new material test evaluation of the step S2 includes the following steps:

s2.1, new materials: selecting the 1017 prepreg;

s2.2, testing the physical properties of the raw materials: carrying out physical property test on the 1017 prepreg;

s2.3, testing pressing parameters: carrying out pressing parameter test on the 1017 prepreg;

s2.4, testing drilling parameters: carrying out drilling parameter test on the 1017 prepreg;

s2.5, removing glue amount and mass loss: performing a glue removing amount and quality loss test on the 1017 prepreg; s2.6, testing degumming parameters: carrying out a degumming parameter test on the 1017 prepreg;

s2.7, material evaluation: performing material evaluation on the 1017 prepreg;

s2.8, release test: carrying out a release test on the 1017 prepreg;

s2.9, standardization: the 1017 prepreg was standardized.

Further, the raw material physical property test of the step S2.2 comprises the following steps:

s2.2.1, TMATG test: performing TMA Tg testing on the 1017 prepreg;

s2.2.2, Td test: performing a Td test on the 1017 prepreg;

s2.2.3, Dk/Df test: carrying out Dk/Df test on the 1017 prepreg;

s2.2.4, CTE test: performing a CTE test on the 1017 prepreg;

s2.2.5, Modulus test: carrying out Module test on the 1017 prepreg;

s2.2.6, TGA Filler ratio test: performing TGA Filler ratio test on the 1017 prepreg;

s2.2.7, Filler EDS elemental analysis: performing Filler EDS elemental analysis on the 1017 prepreg;

s2.2.8, DMA T260 test: performing a DMA T260 test on the 1017 prepreg;

s2.2.9, DMA T288 test: performing a DMA T288 test on the 1017 prepreg;

s2.2.10, DMA T300 test: performing a DMA T300 test on the 1017 prepreg;

s2.2.11, TGA 260 test: TGA 260 testing was performed on the 1017 prepreg.

Further, the pressing parameter test of step S2.3 includes the following steps:

after the 1017 prepreg is pressed, sequentially carrying out a formula material temperature test, a Tg test, an IR tin floating test, a Pelel Strength test, a glue filling condition test and a dielectric layer uniformity test on the 1017 prepreg;

the drilling parameter test of step S2.4 includes the following steps:

after the 1017 prepreg is drilled, sequentially carrying out hole wall quality test, roughnesstest, upper hole and lower hole aperture test on the drilled holes on the 1017 prepreg;

the glue removing parameter test of the step S2.6 comprises the following steps:

after the glue of the 1017 prepreg is removed, sequentially carrying out hole wall test, roughnesss test, PI test and glass fiber protruding electroplating quality test on the drilled holes on the 1017 prepreg;

the step S2.8 of the discharge test comprises the steps of:

and sequentially carrying out an FA reliability test and an FA dimension test expansion and contraction test on the 1017 prepreg.

Further, the manufacturing of the rigid-flex printed circuit board in step S3 includes the following steps:

s3.1, pressing: pressing the 1017 prepreg and a soft board substrate;

s3.2, drilling: drilling the soft board base material;

s3.3, laser drilling: performing laser drilling on the soft board base material, and forming blind holes on the soft board base material;

s3.4, removing glue: removing glue from the blind holes on the soft board base material;

s3.5, electroplating: and carrying out selective plating on the blind holes on the soft board base material.

Further, in the pressing of step S3.1: the 1017 prepreg is pressed with a high-temperature buffer material and a soft board substrate, the 1017 prepreg is pre-glued by a double person and a jig, and the maximum temperature of the pressed part is 200 ℃;

in the drilling of said step S3.2: the feeding speed of the tool is 70IPM, the drilling speed of the tool is 180Krpm, the returning speed of the tool is 800IPM, the service life of the tool is 1500Hit, and the number of stacked plates is 4;

in the laser drilling of step S3.3: the pulse width of the laser is 11/2us, the excitation frequency of the laser is 1+1shot, the size of the laser mask is 1.5mm, and the energy of the laser is 8.5 mj;

in the horizontal degumming of step S3.4: removing glue by using plasma glue removal and horizontal glue removal;

in the electroplating of step S3.5: the forward and reverse pulse plating is adopted, the short side of the chuck is clamped, a high-copper low-acid system is adopted, the large current is short, and the reverse current is one tenth of the forward current time.

Further, the manufacturing of the rigid-flex printed circuit board in step S3 further includes the following steps:

s3.6, copper deposition of the whole plate: carrying out whole-board copper deposition on the soft board base material;

s3.7, super-roughening and micro-etching: carrying out super-roughening and micro-etching on the soft board base material;

s3.8, film pasting: sticking a dry film on the soft board base material by using a film sticking machine;

s3.9, exposure: exposing a dry film on the soft board base material by using the LDI exposure machine;

before the exposure of step S3.9, the following steps are also provided:

reverse compensation of engineering data: and adjusting the number of pixels of the line width of the line of the scalar format image according to the LDI exposure machine resolution, the line width/line distance of the line of the vector format image and the number of pixels of the line width of the line of the scalar format image converted from the vector format image.

Further, in the step of engineering data inverse compensation: the resolution of the LDI exposure machine is 2.1 mu m, the line width/line distance of the lines of the vector format image is 30/30 mu m, the number of pixels of the line width of the lines of the scalar format image converted from the vector format image is 15, and then 14 pixels are obtained after one pixel of the scalar format image is subtracted.

In summary, the technical scheme of the invention has the following beneficial effects: the method has reasonable step design, and the 1017 prepreg is adopted, and the prepreg adopts 1017 glass cloth, so the thickness of the laminated rigid-flex board is about 30 mu m, thereby the board thickness of the rigid-flex board is effectively reduced, for example, when 10 layers of rigid-flex boards with the board thickness of 0.5mm and any layers of interconnected rigid-flex boards need to be manufactured, the 1017 prepreg can meet the requirement that the thickness of the 10 layers of rigid-flex boards is within 0.5mm after being laminated, and the field processing capability of the rigid-flex board is effectively improved.

Drawings

FIG. 1 is a schematic flow diagram of the present invention;

FIG. 2 is a flowchart illustrating step S2 of the present invention;

FIG. 3 is a schematic flow chart of step S2.2 of the present invention;

FIG. 4 is a flowchart illustrating step S3 of the present invention;

FIG. 5 is a graph showing the results of step S2.2 of the present invention;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, but the technical solutions in the embodiments of the present invention are not limited to the scope of the present invention.

Referring to fig. 1, the embodiment provides a method for manufacturing a 5G ultra-thin rigid-flex printed circuit board, which includes the following steps:

s1, stacking design: stacking the rigid-flex printed circuit board, wherein prepregs used in stacking design comprise 1017 prepregs; in actual operation: the thick demand of rigid-flex combined board is mainly dressed to the close mechanism design according to guest's end 5G intelligence, carries out the close mechanism design to rigid-flex combined board, because the thick demand of different customers is different, consequently the rigid-flex combined board that obtains after the close mechanism design can be 10 layers, 11 layers, 12 layers and so on the number of piles, consequently final thick also can be different, nevertheless, it all is the ultrathin slab that every unit number of piles thickness is less than 0.1 mm.

S3, manufacturing a rigid-flex printed circuit board: and manufacturing the rigid-flex printed circuit board according to the stack design. In actual operation: since step S1 is a design stage, step S3 is a stage of actually manufacturing the rigid-flex printed circuit board, and since the prior art for actually manufacturing the rigid-flex printed circuit board already exists, a person skilled in the art can manufacture the rigid-flex printed circuit board by referring to a conventional manufacturing process, and thus details are not described here.

The function is as follows: by adopting the 1017 prepreg, the prepreg adopts 1017 glass cloth, so the thickness of the laminated rigid-flex board is about 30 microns, the board thickness of the rigid-flex board is effectively reduced, for example, when 10 layers of rigid-flex boards which are interconnected with each other and have the board thickness of 0.5mm need to be manufactured, the requirement that the thickness of the laminated rigid-flex board is within 0.5mm can be met by adopting the 1017 prepreg, and the field manufacturing capability of the rigid-flex board is effectively improved.

Specifically, the 1017 prepreg is a matted EM 3901017 PP material, wherein the matted refers to a matted optoelectronic materials (kunshan) limited company, i.e., the 1017 prepreg herein is produced by the company, and those skilled in the art can directly purchase the 1017 prepreg when the 1017 prepreg is needed.

Specifically, the 1017 prepreg is model number EM-39B 1017R79, Normal Flow, whereas this model is a product model number in the taiwan opto-electronic materials (kunshan) limited.

Specifically, the following steps are provided between step S1 and step S3:

s2, new material test evaluation: verifying before production of 1017 prepreg;

in actual operation: step S2 is a testing stage, and after the stack design is completed, since the prepreg used includes a new material 1017 prepreg, necessary performance test evaluation needs to be performed on the 1017 prepreg in order to facilitate the subsequent actual manufacturing of the rigid-flex printed circuit board.

Referring to fig. 2, the new material test evaluation of step S2 includes the following steps:

s2.1, new materials: selecting 1017 prepregs;

s2.2, testing the physical properties of the raw materials: carrying out physical property test on the 1017 prepreg;

s2.3, testing pressing parameters: carrying out pressing parameter test on the 1017 prepreg;

s2.4, testing drilling parameters: carrying out drilling parameter test on the 1017 prepreg;

s2.5, removing glue amount and mass loss: performing a glue removing amount and quality loss test on the 1017 prepreg;

s2.6, testing degumming parameters: performing a degumming parameter test on the 1017 prepreg;

s2.7, material evaluation: performing material evaluation on 1017 prepregs;

s2.8, release test: carrying out a release test on 1017 prepregs;

s2.9, standardization: the 1017 prepreg was standardized.

The function is as follows: through these tests, the performance of the 1017 prepreg can be effectively grasped, so that the actual manufacturing of the subsequent step S3 is facilitated, and of course, after a person skilled in the art knows the test results from the technical content of the present application, retesting may not be performed any more under the condition that retesting is deemed unnecessary, and the test may be performed according to actual selection.

Specifically, referring to fig. 3, the physical property test of the raw material in step S2.2 includes the following steps:

s2.2.1, TMA Tg test: conducting a TMA Tg test on 1017 prepregs;

s2.2.2, Td test: performing a Td test on the 1017 prepreg;

s2.2.3, Dk/Df test: carrying out Dk/Df test on the 1017 prepreg;

s2.2.4, CTE test: performing a CTE test on 1017 prepreg;

s2.2.5, Modulus test: performing Module test on 1017 prepregs;

s2.2.6, TGA Filler ratio test: performing TGA Filler proportion test on 1017 prepreg;

s2.2.7, Filler EDS elemental analysis: performing Filler EDS elemental analysis on the 1017 prepreg;

s2.2.8, DMA T260 test: performing DMA T260 test on 1017 prepreg;

s2.2.9, DMA T288 test: performing a DMA T288 test on the 1017 prepreg;

s2.2.10, DMA T300 test: performing a DMA T300 test on the 1017 prepreg;

s2.2.11, TGA 260 test: TGA 260 testing was performed on 1017 prepregs.

The test effect of step S2.2 can be seen in fig. 5, and as can be seen from fig. 5, each item of test data of the 1017 prepreg meets the requirements, and subsequent production can be performed.

Specifically, the pressing parameter test of step S2.3 includes the following steps:

after the 1017 prepreg is pressed, sequentially carrying out a formula material temperature test, a Tg test, an IR floating tin test, a Pelel Strength test, a glue filling condition test and a dielectric layer uniformity test on the 1017 prepreg;

the drilling parameter test of step S2.4 comprises the steps of:

after the 1017 prepreg is drilled, hole wall quality test, roughnesstest, upper hole and lower hole aperture test are sequentially carried out on the drilled holes on the 1017 prepreg;

the glue removal parameter test of step S2.6 comprises the following steps:

after the glue of the 1017 prepreg is removed, hole wall testing, roughnesss testing, PI testing and glass fiber protruding electroplating quality testing are sequentially carried out on holes drilled on the 1017 prepreg;

the step S2.8 of the shot size test comprises the following steps:

and sequentially carrying out an FA reliability test and an FA dimension test expansion and shrinkage test on the 1017 prepreg.

These tests are also performance tests on 1017 prepregs to gain a better understanding of their performance.

Specifically, referring to fig. 4, the manufacturing of the rigid-flex printed circuit board of step S3 includes the following steps:

s3.1, pressing: pressing the 1017 prepreg and the soft board base material; the pressing may be direct or indirect pressing, and the pressing is selected according to the actual structure of the rigid-flex printed circuit board, so that the 1017 prepreg and the flexible printed circuit board substrate are pressed into a whole.

S3.2, drilling: drilling the soft board base material; the drilling here means drilling with a tool.

S3.3, laser drilling: performing laser drilling on the soft board base material to form blind holes on the soft board base material; therefore, the blind holes are formed in the soft board base material through the cutter drilling and the laser drilling, and the 1017 prepreg and the soft board base material form a whole, so that the blind holes can also penetrate through the 1017 prepreg when the soft board base material is drilled and drilled by the laser.

S3.4, removing glue: removing glue from the blind holes on the soft board substrate, thereby removing residues on the blind holes, wherein the residues comprise carbide formed after the substrate is burnt by laser;

s3.5, electroplating: and (4) selectively plating the blind holes on the soft board base material.

The function is as follows: the inner layer soft board base material directly walks the selective plating blind hole after laser drilling to satisfy accurate circuit etching ability when reducing the thick, this is because the selective plating blind hole increases copper thickness only locally here, and if copper is plated to the blind hole through the mode of whole board heavy copper when subsequent circuit preparation, will increase the thickness of whole rigid-flex combined plate, thereby reduce accurate circuit etching ability.

Specifically, in the stitching of step S3.1: the 1017 prepreg is pressed with a high-temperature buffer material and a soft board substrate, the double and the jig are adopted for pre-sticking the 1017 prepreg, and the maximum temperature of the pressed process is 200 ℃;

in the drilling of step S3.2: the feeding speed of the tool is 70IPM, the drilling speed of the tool is 180Krpm, the returning speed of the tool is 800IPM, the service life of the tool is 1500Hit, and the number of stacked plates is 4;

in the laser drilling of step S3.3: the pulse width of the laser is 11/2us, the excitation frequency of the laser is 1+1shot, the size of the laser mask is 1.5mm, and the energy of the laser is 8.5 mj;

in the horizontal degumming of step S3.4: removing the glue (glass fiber biting agent containing HF acid) by using plasma glue removal and horizontal glue removal;

in the electroplating of step S3.5: the forward and reverse pulse plating is adopted, the short side of the chuck is clamped, a high-copper low-acid system is adopted, the large current is short, and the reverse current is one tenth of the forward current time.

Specifically, the manufacturing of the rigid-flex printed circuit board in step S3 further includes the following steps:

s3.6, copper deposition of the whole plate: carrying out whole-board copper deposition on the soft board base material;

s3.7, super-roughening and micro-etching: carrying out super-roughening and micro-etching on the soft board base material; to enhance the dry film adhesion.

S3.8, film pasting: sticking a dry film on the soft board base material by using a film sticking machine; a common laminator or vacuum laminator may be used.

S3.9, exposure: exposing a dry film on the soft board base material by using the LDI exposure machine;

before the exposure of step S3.9, the following steps are also provided:

reverse compensation of engineering data: and adjusting the number of pixels of the line width of the line of the scalar format image according to the LDI exposure machine resolution, the line width/line distance of the line of the vector format image and the number of pixels of the line width of the line of the scalar format image converted from the vector format image.

More specifically, the following steps are provided after step S3.9:

and (3) developing: developing away the dry film not exposed;

etching: removing the copper foil which is not covered by the dry film;

removing the film: removing all dry films; thus, the required wiring can be obtained.

Specifically, in the step engineering data inverse compensation: the LDI exposure machine resolution is 2.1 μm, the line width/line distance of the lines of the vector format image is 30/30 μm, the number of pixels of the line width of the lines of the scalar format image into which the vector format image is converted is 15, and then 14 pixels are obtained by subtracting one pixel of the scalar format image. The function is as follows: in the step S3.6 to S3.9, which are the steps of manufacturing the circuit, since the line width of the circuit obtained before one pixel is not subtracted is 31.5um, and the line width of the circuit obtained after the subtraction is 29.4um, it can be seen by comparison that the deviation between 39.4 and 30um is smaller than the deviation between 31.5 and 30um, the pitch of the circuit can be relatively larger, so that the resolution of the dry film can be achieved, and the circuit yield can be improved.

The principle of the resolution accumulated error of the LDI exposure machine is as follows: the data of the CAM/Genesis design is in vector format, i.e., a graphics file, describing the location, orientation, and length of the graphics. The LDI exposure machine, as a digital scanning imaging device, must employ a picture file in a scalar format. The vector file can be converted into a scalar file for the LDI exposure machine, and the conversion principle is that the graph is divided into pictures with pixel units, and each pixel has only 0 or 1 attribute (namely loss/existence). Different line widths/spacings during the conversion process, there are situations where the two formats are not exactly equal, which is what would be expected to result in partial picture loss. And pixel is the minimum resolution of the LDI exposure machine.

The anti-compensation requirement of engineering data: when the resolution of the LDI exposure machine is 2.1 μm, when the 30/30 μm line level is designed, the line width is 1 attribute, so the originally designed 30 μm line is changed into 31.5 μm in the conversion process, and when the 5 μm is additionally compensated according to the copper thickness/etching factor, the line width is converted into 36.5 μm from the original 35 μm. The pitch is thus smaller and the resolution of the dry film is not achieved, resulting in poor line yield. At this time, the circuit can be inversely compensated according to the resolution of the exposure machine, namely, one pixel is reduced, and the requirement can be met. Therefore, the step engineering data inverse compensation can be performed before the exposure, and the specific steps can be selected according to the needs.

In summary, the invention has the following beneficial effects:

(1) quality: the manufacturing process capability is improved, and the quality of the 5G intelligent wearable rigid-flex printed circuit board meets the requirements of customers;

(2) efficiency: the flow is optimized, and the production efficiency is improved.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.