阅读说明：本技术 一种生产高密度双面和多层印制电路板的方法 (Method for producing high-density double-sided and multilayer printed circuit board ) 是由 李子考 于 2020-12-12 设计创作，主要内容包括：本发明公开了一种生产高密度双面和多层印制电路板的方法,包括雕刻法和酸洗法,其特征在于所述雕刻法和酸洗法可用于同一块印制电路板,将铜箔层覆盖住整张基材板,雕刻法包括以下几个步骤：将铜箔层和基材板通过胶水粘合,将其放进烘烤箱中烘烤30秒,所述烘烤箱温度设定为280摄氏度,取出电路板,并利用CNC机床对电路板雕刻,酸洗法包括以下几个步骤：将导电线路层与电路板螺丝连接；将浓度为20％-45％的三氯化铁水溶液冲洗电路板,时间为30分钟；用清水对电路板进行冲洗,时间为2分钟；将酸洗后的铜箔层与基材板通过胶水粘合,本发明,具有实用性强和可以根据电路板不同需求选择不同制作方法的特点。(The invention discloses a method for producing high-density double-sided and multilayer printed circuit boards, which comprises a carving method and an acid pickling method, and is characterized in that the carving method and the acid pickling method can be used for the same printed circuit board, and a copper foil layer covers the whole substrate board, and the carving method comprises the following steps: the copper foil layer and the substrate plate are bonded through glue, the copper foil layer and the substrate plate are placed into a baking oven to be baked for 30 seconds, the temperature of the baking oven is set to be 280 ℃, the circuit board is taken out, a CNC machine tool is utilized to carve the circuit board, and the acid cleaning method comprises the following steps: connecting the conductive circuit layer with a circuit board screw; washing the circuit board with 20-45% ferric trichloride aqueous solution for 30 minutes; washing the circuit board with clear water for 2 minutes; the copper foil layer after being pickled is bonded with the base material plate through glue, and the invention has the characteristics of strong practicability and capability of selecting different manufacturing methods according to different requirements of the circuit board.)

1. A method for producing high density double-sided and multilayer printed circuit boards comprising engraving and pickling processes, characterized in that the engraving and pickling processes can be applied to the same printed circuit board.

2. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 1 wherein: the copper foil layer covers the entire substrate sheet.

3. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 2, characterized in that: the engraving method comprises the following steps:

a. bonding the copper foil layer and the substrate plate through glue;

b. putting the mixture into a baking oven to be baked for 30 seconds, wherein the temperature of the baking oven is set to be 280 ℃;

c. and taking out the circuit board, and engraving the circuit board by using a CNC machine tool.

4. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 2, characterized in that: the acid washing method comprises the following steps:

d. connecting the conductive circuit layer with a circuit board screw;

e. washing the circuit board with 20-45% ferric trichloride aqueous solution for 30 minutes;

f. washing the circuit board with clear water for 2 minutes;

g. bonding the copper foil layer after acid washing with the substrate plate through glue;

h. putting the mixture into a baking oven to be baked for 20 seconds, wherein the temperature of the baking oven is set to be 280 ℃;

i. and drilling holes at the mounting positions of the components of the circuit board by using a bench drill.

5. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 4, characterized in that: after the steps e and f, reducing the heavy metal content of the cleaned sewage by using Fe3+ solution, recycling useful substances such as copper and the like, and then discharging the treated sewage to a position meeting the requirement.

6. A method for producing high-density double-sided and multilayer printed circuit boards according to claims 3 to 4, characterized in that: and sealing the upper insulating layer and the character layer on the surface of the circuit board.

7. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 6, characterized in that: the required components are fixedly mounted to the circuit board.

8. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 7, characterized in that: a layer of substrate plate is adhered to the surface of the circuit board and placed in a baking oven to be baked for 60 seconds, and the temperature of the baking oven is set to be 280 ℃.

9. A method of producing high-density double-sided and multilayer printed circuit boards according to claim 8 wherein: selecting a carving method or an acid washing method according to the requirements of the next layer of circuit board, wherein the specific judgment method comprises the following steps:

1) the minimum interval of each component of the layer of circuit board is less than 2mm, a carving method is used, and otherwise, an acid washing method is used;

2) the narrowest line of the conductive circuit of the layer of circuit board is less than 0.8mm by using a carving method, otherwise, a pickling method is used;

3) the thickness of the circuit board layer is less than 3mm by using an acid washing method, and conversely, a carving method is used;

4) the minimum aperture of the circuit board layer is smaller than 0.5mm by using an engraving method, and conversely, an acid washing method is used.

Technical Field

The invention relates to the technical field of methods for producing high-density double-sided and multilayer printed circuit boards, in particular to a method for producing high-density double-sided and multilayer printed circuit boards.

Background

Printed circuit boards (Printed circuit boards), also known as Printed circuit boards, are providers of electrical connections for electronic components, and are generally referred to as "PCBs", and their development has been over 100 years; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, improving automation level and production labor rate, and can be divided into single-layer boards, double-layer boards, four-layer boards, six-layer boards and other multilayer circuit boards according to the number of layers of the circuit board, before the occurrence of the printed circuit board, the interconnection among electronic components is directly connected by wires to form a complete circuit, in the present generation, the circuit board only exists as an effective experimental tool, while the printed circuit board has already become a position of absolute dominance in the electronic industry, in the early 20 th century, people reduce the wiring among electronic parts and reduce the manufacturing cost in order to simplify the manufacturing of electronic machines, so a method of replacing the wiring by a printing mode is researched, in the thirty years, engineers continuously propose to add metal conductors on an insulated substrate for wiring, and in the most successful 1925 years, charles Ducas in the united states prints a circuit pattern on an insulating substrate, and then successfully establishes a conductor as a wiring in an electroplating manner, but the existing printed circuit board manufacturing method is relatively fixed, so that a method for producing a high-density double-sided and multi-layer printed circuit board, which has strong design practicability and can select different manufacturing methods according to different requirements of the circuit board, is necessary.

Disclosure of Invention

The present invention is directed to a method of producing high density double-sided and multi-layer printed circuit boards to solve the problems set forth in the background art described above.

In order to solve the technical problems, the invention provides the following technical scheme: a method for producing high-density double-sided and multilayer printed circuit board includes carving method and acid washing method, and features that said carving method and acid washing method can be used for same printed circuit board, the carving method includes making carving tool rotate quickly by CNC machine tool, cutting off material at corresponding position after rotary tool contacts with circuit board according to line program, making conductive circuit of circuit board meet use requirement, the method has high processing precision and can process circuit board with high size requirement, the acid washing method includes making conductive circuit through mould, connecting mould with circuit board when in use, then washing circuit board with acid liquid, the acid liquid can melt and take copper foil away in washing process, and the part of mould contacting with circuit board can be retained, so saving time by acid washing method in mass production, in the manufacture of the multilayer printed circuit board, different types of manufacturing methods can be selected according to different requirements of each layer of circuit board, so that the product quality can be improved, and the production efficiency can also be improved.

According to the technical scheme, the copper foil layer covers the whole base material plate, and the copper foil covers the whole base material plate and then can ensure that the conducting circuit cannot be broken in the subsequent processing process, so that the product percent of pass is improved.

According to the technical scheme, the engraving method comprises the following steps:

a. bonding the copper foil layer and the substrate board through glue, and integrating the substrate board and the copper foil layer into a whole after bonding;

b. the copper foil is placed into a baking oven to be baked for 30 seconds, the temperature of the baking oven is set to 280 ℃, the baking of the baking oven can enable the glue to be quickly solidified, and the glue can be firmer in the glue solidification process, so that the copper foil cannot fall off in the subsequent processing and using processes, and the situation of wire breakage occurs;

c. the method has the advantages that the method has higher processing precision, can process the circuit board with higher size requirement, can meet the processing of circuits with various shapes, but simultaneously because the tool is used for processing, the distance between the narrowest conducting wires of the processed circuit board cannot be smaller than the diameter of the minimum tool;

according to the technical scheme, the pickling method comprises the following steps:

d. the conductive circuit layer is connected with the circuit board through screws, the conductive circuit layer is a die layer manufactured according to required conductive circuits, and after the conductive circuit layer is connected with the circuit board, the die can be tightly attached to the circuit board, so that the copper foil is attached to the circuit board, and the part, which is in contact with the die, cannot be affected in the subsequent processing process;

e. the method comprises the following steps of flushing the circuit board with 20% -45% ferric trichloride aqueous solution for 30 minutes, flushing the circuit board with the ferric trichloride aqueous solution after the conductive circuit board and the circuit board are connected, wherein in the flushing process, the ferric trichloride aqueous solution can dissolve and flush away redundant copper foils on the circuit board, so that only copper foils with the same texture as a mold are left on the circuit board, and the copper foils can conduct electricity for each component in the subsequent work and play a role of a conductive circuit;

f. the circuit board is washed by clean water for 2 minutes, and after the ferric trichloride aqueous solution is dissolved and washed, the circuit board is washed by the clean water, so that the residual ferric trichloride aqueous solution can be washed down and recovered, and unnecessary loss caused by corrosion of the residual ferric trichloride aqueous solution to a conducting circuit in the later working process can be prevented;

g. the copper foil layer after acid washing is bonded with the base material plate through glue, and the copper foil and the circuit board can be bonded into a whole at the moment, so that the copper foil layer and the circuit board cannot fall off to influence the use in the subsequent processing and using processes;

h. the copper foil is placed into a baking oven to be baked for 20 seconds, the temperature of the baking oven is set to 280 ℃, the baking of the baking oven can enable the glue to be quickly solidified, and the glue can be firmer in the glue solidification process, so that the copper foil cannot fall off in the subsequent processing and using processes, and the situation of wire breakage occurs;

i. drilling holes on the mounting positions of the components of the circuit board by using a bench drill, drilling holes on the connecting positions of the components at the connecting positions of the components to ensure that pins of the components can be connected to the circuit board, then soldering the pins on the circuit board by using tin soldering to fix the components, arranging fixed connecting holes on the periphery of the circuit board to ensure that the circuit board can be mounted on a required circuit,

according to the technical scheme, after the steps e and f, the heavy metal content of the cleaned sewage is reduced through the Fe3+ solution, useful substances such as copper and the like are recycled, the treated sewage is discharged to a position meeting the requirements, the sewage contains heavy metals such as copper and the like after acid liquor washing and clear water washing, if the heavy metals are directly discharged, the environment is seriously polluted, and the Fe3+ solution and the sewage are subjected to chemical reaction, so that the pollution of the sewage to the environment can be reduced, the copper in the sewage can be recycled, and the cost is reduced.

According to the technical scheme, the insulating layer and the character layer are sealed on the surface of the circuit board, the insulating layer can isolate the conducting circuit of the processed circuit board from air, the circuit board can not be influenced by external factors in the using process to cause short circuit, disconnection and other consequences, the subsequent using process is more stable, the character layer can enable the character layer to quickly know the position relation of each component when the subsequent worker installs the component, the component installing process is smoother, more time can be saved, and the operation is more convenient.

According to the technical scheme, the required components are fixedly arranged on the circuit board, the conducting circuits of the printed circuit board layer are processed in the steps, and then all components can be sequentially arranged on the circuit board according to the display of the character layer, so that the printed circuit board layer can be manufactured.

According to the technical scheme, the one-layer base material plate is adhered to the surface of the circuit board, and the circuit board is placed into the baking oven to be baked for 60 seconds, the temperature of the baking oven is set to 280 ℃, the one-layer circuit board surface which is manufactured is adhered to a new circuit board, the baking oven can enable glue to be solidified quickly, the glue can be firmer in the glue solidification process, the base material plate can not fall off in the subsequent processing and using processes, and then all the steps are repeated, and the manufacturing of the multilayer circuit board can be completed.

According to the technical scheme, the engraving method or the acid washing method is selected according to the requirements of the next layer of circuit board, and the specific judgment method is as follows:

1) when the minimum spacing of each component of the layer of circuit board is smaller than 2mm, a carving method is used, otherwise, a pickling method is used, and after the minimum spacing of each component is smaller than 2mm, if the pickling method is used, acid liquor cannot enter gaps possibly due to too small gaps, so that copper foils between the components are connected, and after the circuit board is electrified, the two components are short-circuited, thereby causing safety accidents;

2) when the narrowest line of the conductive circuit of the layer of circuit board is smaller than 0.8mm, a carving method is used, otherwise, after the narrowest part of the conductive circuit is smaller than 0.8mm, if the pickling method is used, acid liquor can not enter a gap due to too small gap, so that copper foils between components are connected, and after the circuit is electrified, two components are short-circuited, thereby causing safety accidents;

3) when the thickness of the layer of circuit board is less than 3mm, an acid pickling method is used, otherwise, a carving method is used, when the total thickness of the circuit board is less than 3mm, if the carving method is used, a cutter of a numerical control machine tool has adhesive force on the circuit board in the processing process, and if the adhesive force is too large, the cutter possibly mills the circuit board through, so that the circuit board is scrapped, and the production cost is increased;

4) if the minimum aperture of the circuit board is smaller than 0.5mm, a carving method is used, otherwise, an acid washing method is used, and if the minimum aperture of the circuit board is smaller than 0.5mm, a required hole cannot be accurately drilled on a drilling machine, and the precision requirement of the hole is difficult to meet, so that a carving method which is higher in precision and capable of automatically drilling is selected;

compared with the prior art, the invention has the following beneficial effects: different manufacturing methods can be selected according to different requirements of the circuit board, and the invention,

(1) the engraving method is characterized in that an engraving cutter is led to rotate rapidly through a CNC (computer numerical control) machine tool, and materials at corresponding positions can be cut off after the rotating cutter is contacted with a circuit board according to a circuit programming program, so that each conductive circuit of the circuit board meets the use requirement;

(2) the pickling method is characterized in that the conductive circuit is manufactured through a die, the die is connected with the circuit board when the circuit board is used, then the circuit board is washed by acid liquor, the acid liquor can melt and take away copper foil in the washing process, and the part of the die, which is in contact with the circuit board, can be reserved, so that much time can be saved in the pickling method during mass manufacturing;

(3) after acid liquor washing and clear water washing, the sewage contains heavy metals such as copper and the like, if the heavy metals are directly discharged, the environment is seriously polluted, and the Fe3+ solution and the sewage undergo chemical reaction, so that the pollution of the sewage to the environment can be reduced, the copper in the sewage can be recycled, and the cost is reduced;

(4) in the manufacture of the multilayer printed circuit board, different types of manufacturing methods can be selected according to different requirements of each layer of circuit board, so that the product quality can be improved, and the production efficiency can also be improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic diagram of a manufacturing process of the present invention;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: a method for producing high-density double-sided and multilayer printed circuit board includes carving method and acid washing method, and features that said carving method and acid washing method can be used for same printed circuit board, the carving method includes making carving tool rotate quickly by CNC machine tool, cutting off material at corresponding position after rotary tool contacts with circuit board according to line program, making conductive circuit of circuit board meet use requirement, the method has high processing precision and can process circuit board with high size requirement, the acid washing method includes making conductive circuit through mould, connecting mould with circuit board when in use, then washing circuit board with acid liquid, the acid liquid can melt and take copper foil away in washing process, and the part of mould contacting with circuit board can be retained, so saving time by acid washing method in mass production, in the manufacture of the multilayer printed circuit board, different types of manufacturing methods can be selected according to different requirements of each layer of circuit board, so that the product quality can be improved, and the production efficiency can also be improved;

the copper foil layer covers the whole base material plate, and the copper foil covers the whole base material plate, so that the condition that the conducting circuit is not broken in the subsequent processing process can be ensured, and the product percent of pass can be improved;

the engraving method comprises the following steps:

a. bonding the copper foil layer and the substrate board through glue, and integrating the substrate board and the copper foil layer into a whole after bonding;

b. the copper foil is placed into a baking oven to be baked for 30 seconds, the temperature of the baking oven is set to 280 ℃, the baking of the baking oven can enable the glue to be quickly solidified, and the glue can be firmer in the glue solidification process, so that the copper foil cannot fall off in the subsequent processing and using processes, and the situation of wire breakage occurs;

c. the method has the advantages that the method has higher processing precision, can process the circuit board with higher size requirement, can meet the processing of circuits with various shapes, but simultaneously because the tool is used for processing, the distance between the narrowest conducting wires of the processed circuit board cannot be smaller than the diameter of the minimum tool;

the acid washing method comprises the following steps:

d. the conductive circuit layer is connected with the circuit board through screws, the conductive circuit layer is a die layer manufactured according to required conductive circuits, and after the conductive circuit layer is connected with the circuit board, the die can be tightly attached to the circuit board, so that the copper foil is attached to the circuit board, and the part, which is in contact with the die, cannot be affected in the subsequent processing process;

e. the method comprises the following steps of flushing the circuit board with 20% -45% ferric trichloride aqueous solution for 30 minutes, flushing the circuit board with the ferric trichloride aqueous solution after the conductive circuit board and the circuit board are connected, wherein in the flushing process, the ferric trichloride aqueous solution can dissolve and flush away redundant copper foils on the circuit board, so that only copper foils with the same texture as a mold are left on the circuit board, and the copper foils can conduct electricity for each component in the subsequent work and play a role of a conductive circuit;

f. the circuit board is washed by clean water for 2 minutes, and after the ferric trichloride aqueous solution is dissolved and washed, the circuit board is washed by the clean water, so that the residual ferric trichloride aqueous solution can be washed down and recovered, and unnecessary loss caused by corrosion of the residual ferric trichloride aqueous solution to a conducting circuit in the later working process can be prevented;

g. the copper foil layer after acid washing is bonded with the base material plate through glue, and the copper foil and the circuit board can be bonded into a whole at the moment, so that the copper foil layer and the circuit board cannot fall off to influence the use in the subsequent processing and using processes;

h. the copper foil is placed into a baking oven to be baked for 20 seconds, the temperature of the baking oven is set to 280 ℃, the baking of the baking oven can enable the glue to be quickly solidified, and the glue can be firmer in the glue solidification process, so that the copper foil cannot fall off in the subsequent processing and using processes, and the situation of wire breakage occurs;

i. drilling holes at the mounting positions of the components of the circuit board by using a bench drill, drilling holes at the connecting positions of the components to ensure that pins of the components can be connected to the circuit board, and then welding the pins on the circuit board by using tin soldering to fix the components, wherein fixed connecting holes are required to be formed in the periphery of the circuit board to ensure that the circuit board can be mounted on a required circuit;

after the steps e and f, reducing the heavy metal content of the cleaned sewage by using Fe3+ solution, recycling useful substances such as copper and the like, then discharging the treated sewage to a position meeting the requirement, wherein after acid solution washing and clear water washing, the sewage contains heavy metals such as copper and the like, and if the heavy metals are directly discharged, the environment is seriously polluted, and the Fe3+ solution and the sewage are subjected to chemical reaction, so that the pollution of the sewage to the environment can be reduced, the copper in the sewage can be recycled, and the cost is reduced;

the surface of the circuit board is sealed with the insulating layer and the character layer, the insulating layer can isolate the conducting circuit of the processed circuit board from air, and can also prevent the circuit board from being influenced by external factors to cause short circuit, disconnection and other consequences in the using process, so that the circuit board is more stable in the subsequent using process, and the character layer can enable a worker to quickly know the position relation of each component when the worker installs the component in the subsequent process, so that the component can be installed more smoothly, more time can be saved, and the circuit board is more convenient;

the required components are fixedly arranged on the circuit board, the conductive circuit of the printed circuit board layer is processed in the steps, and then all components can be sequentially arranged on the circuit board according to the display of the character layer, so that the manufacture of the printed circuit board layer can be completed;

adhering a layer of substrate plate on the surface of the circuit board, placing the circuit board in a baking oven for baking for 60 seconds, setting the temperature of the baking oven to be 280 ℃, adhering a new circuit board on the surface of the manufactured layer of circuit board, baking the circuit board by the baking oven to enable the glue to be quickly solidified, and enabling the glue to be firmer in the glue solidification process, so that the substrate plate cannot fall off in the subsequent processing and using processes, and then repeating all the steps to finish the manufacturing of the multilayer circuit board;

selecting a carving method or an acid washing method according to the requirements of the next layer of circuit board, wherein the specific judgment method comprises the following steps:

1) when the minimum spacing of each component of the layer of circuit board is smaller than 2mm, a carving method is used, otherwise, a pickling method is used, and after the minimum spacing of each component is smaller than 2mm, if the pickling method is used, acid liquor cannot enter gaps possibly due to too small gaps, so that copper foils between the components are connected, and after the circuit board is electrified, the two components are short-circuited, thereby causing safety accidents;

2) when the narrowest line of the conducting circuit of the layer of circuit board is smaller than 0.8mm, an engraving method is used, otherwise, after the narrowest part of the conducting circuit is smaller than 0.8mm, if the pickling method is used, acid liquor can not enter a gap due to too small gap, so that copper foils between components are connected, two components are short-circuited after being electrified, and safety accidents are caused

3) When the thickness of the layer of circuit board is less than 3mm, an acid pickling method is used, otherwise, a carving method is used, when the total thickness of the circuit board is less than 3mm, if the carving method is used, a cutter of a numerical control machine tool has adhesive force on the circuit board in the processing process, and if the adhesive force is too large, the cutter possibly mills the circuit board through, so that the circuit board is scrapped, and the production cost is increased;

4) the minimum aperture of the circuit board of the layer is smaller than 0.5mm by using a carving method, otherwise, by using an acid washing method, if the minimum aperture of the circuit board is smaller than 0.5mm, a required hole cannot be accurately drilled on a drilling machine, and the precision requirement of the hole is difficult to meet, so that the carving method which is higher in precision and capable of automatically drilling is selected.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.