阅读说明：本技术 接合装置、用于制造接合装置的方法以及容纳接合装置的多层结构 (Joining device, method for producing a joining device and multilayer structure for accommodating a joining device ) 是由 托米·西穆拉 温斯基·布拉埃瑟 米科·海基宁 J-M·欣蒂卡 明纳·皮尔科宁 帕斯·拉帕纳 于 2019-08-27 设计创作，主要内容包括：接口装置(1300、1400、1500、1600、2000),可选地由基本上电气的或具体地电子的节点型部件组成或包括该部件,该部件用于在外部系统(46、200)与接口装置的主机结构(300)之间提供电或电磁连接,该接口装置包括第一基底膜(10),限定空腔；第一材料层(30),布置为至少部分地填充空腔,并且嵌入或至少部分地覆盖至少一个电气元件(12),该至少一个电气元件至少部分地布置在空腔中,其中该至少一个电气元件包括至少一个转换器元件,该至少一个转换器元件配置为用于适配要在所述外部系统与主机结构的电子器件之间传输的信号；以及第一连接元件(45),优选地至少部分地布置在空腔中,并且配置为用于连接到外部系统(46),其中第一连接元件进一步至少功能性地连接到转换器元件。呈现了相关的多层结构和制造方法。(An interface device (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising a substantially electrical or in particular electronic node-type component for providing an electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface device, the interface device comprising a first base film (10) defining a cavity; a first layer of material (30) arranged to at least partially fill the cavity and to embed or at least partially cover at least one electrical element (12) arranged at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and electronics of the host structure; and a first connection element (45), preferably at least partially arranged in the cavity, and configured for connection to an external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.)

1. An interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising substantially electrical or in particular electronic components for providing an electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, such as an IMSE device or part, comprising

-a first substrate film (10) defining a cavity;

-a first layer of material (30) arranged to at least partially fill the cavity and to embed or at least partially cover at least one electrical element (12) arranged at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and electronics of the host structure; and

-a first connection element (45), preferably at least partially arranged in the cavity, and configured for connection to the external system (46), wherein the first connection element is further at least functionally connected to the converter element.

2. Interface device according to claim 1, comprising at least one second connection element (16), preferably provided with several electrical conductors and/or contacts, arranged for connecting, preferably attaching, to the host structure and at least functionally connected to the converter element.

3. Interface device according to claim 1 or 2, comprising the at least one electrical element, which is at least partially printed, such as screen-printed or ink-jet printed, on the first substrate film and into the cavity.

4. The interface device according to any one of the preceding claims, wherein the adaptation comprises at least one element selected from the group consisting of: signal transformation, voltage transformation, current transformation, power conditioning, signal path adaptation, signal path migration, signal path connection, signal path separation, signal selection, signal amplification, signal attenuation, voltage limiting, current limiting, and signal filtering.

5. The interface device of any one of the preceding claims, wherein the signal comprises at least one element selected from the group consisting of: electrical, electromagnetic, optical, electrical current, voltage, power, analog, digital, control, and data signals.

6. Interface device according to any one of the preceding claims, comprising a second substrate, such as a printed circuit board, a ceramic electrical substrate, a printed film substrate or a patterned electrically conductive polymer substrate, comprising one or more electrical elements of the at least one electrical element, wherein the second substrate is arranged such that the one or more electrical elements of the at least one electrical element are positioned in the cavity and embedded in or at least partially covered by the first material layer.

7. Interface device according to any one of the preceding claims, comprising a second layer of material arranged on the at least one electrical element for reducing air pockets between the at least one electrical element and the first layer of material.

8. The interface device according to any one of the preceding claims, wherein the at least one electrical element, optionally containing only or at least the converter element therein, comprises at least one element selected from the group consisting of: signal filtering elements, protection circuit elements such as protection diodes or transient suppressor components, regulators, power supplies, SMPS power supplies, switches, power receiving coils, power transmitting coils, inductors, amplifiers, attenuators, integrated circuits, processing units, microcontrollers, microprocessors, signal processors, logic arrays, logic chips, programmable logic, capacitors, and input capacitors.

9. Interface device according to any one of the preceding claims, wherein the first connection element substantially comprises an electromechanical connector, optionally a male or female part of two mutually compatible electromechanical connectors.

10. An interface device according to any preceding claim, wherein the first connection element comprises a wireless connection element, such as a coil or a capacitive element.

11. The interface device of any one of the preceding claims, wherein the first connection element comprises:

a first part, optionally an electromechanical connector, at least partially located outside or extending outside the cavity so as to face and be connected with a compatible connecting member, such as an electromechanical connector, of the external system; and

a second part, such as several conductors, configured to establish said connection between said first part and said converter element at least functionally, preferably electrically or electromagnetically, wherein said second part is advantageously arranged or extending at least partially to said cavity.

12. The interface device according to any one of the preceding claims, wherein the converter element and/or the first connection element is adapted to provide a wired connection based on at least one wired connection or communication process or technology selected from the group consisting of: CAN, LIN, USB 3.0, USB 2.0, USB, HMI, SPI, UART or asynchronous serial communication, I2C, LAN, Ethernet and PoE.

13. The interface device according to any one of the preceding claims, wherein the converter element and/or the first connection element is adapted to provide a wireless connection based on at least one wireless connection or communication process or technology selected from the group consisting of: bluetooth, WLAN/WiFi, and NB-IoT.

14. The interface device according to any one of the preceding claims, wherein the first substrate film is a molded substrate film, such as thermoformed, or injection molded substrate film, defining the cavity.

15. Interface device according to any one of the preceding claims, comprising a thermal management element (35, 36), optionally a cooling or heating element, such as at least one selected from the group of: radiator, radiating block and heat well.

16. A method for manufacturing an interface device, optionally a substantially electrical or electronic component, for providing a connection between an external system and a host structure of the interface device, the method comprising:

-obtaining a first substrate film defining a cavity;

-arranging at least one electrical element at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and the electronics of the host structure;

-arranging a first connection element, optionally comprising a first electro-mechanical connector or a wireless connection element, configured for connection to the external system, preferably at least partially into the cavity, the first connection element further being at least functionally connected to the converter element; and

-providing a first layer of material by at least partially filling the cavity with a first material and embedding or at least partially covering the at least one electrical element arranged in the cavity.

17. A method according to claim 16, comprising arranging a second connection element for connection to the host structure in at least functional connection, preferably electrical connection, with the converter element.

18. A multilayer structure (300) comprising: a main substrate (60) configured to house an electronic device (55), optionally a number of electrical traces and electronic components, further optionally at least some of which are implemented as preferably electrically node-type components; and an interface arrangement (1300, 1400, 1500, 1600), optionally being a substantially electrical or in particular electronic component, arranged to provide a connection between an external system (200) and the electronics (55) of the multilayer structure,

the interface apparatus (1300, 1400, 1500, 1600) comprises:

-a first substrate film (10) defining a cavity;

-a first layer of material (30) arranged to at least partially fill the cavity and to embed or at least partially cover at least one electrical element (12) arranged at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and the multilayer structure; and

-a first connection element (45), preferably at least partially arranged in the cavity, and configured for connection to the external system, wherein the first connection element is at least functionally connected to the converter element; and is

Wherein the multilayer structure further comprises:

-a layer (90) of moulding or casting material at least partially embedding or covering the first base film arranged on the master substrate.

19. The multilayer structure according to claim 18, comprising a second connection element (16) attached to the primary substrate for providing a connection to the primary substrate and at least functionally connected to the converter element.

20. The multilayer structure according to any one of claims 18 to 19, wherein the electronic device comprises at least one electrical or electronic component (55) arranged on the main substrate, wherein the component is connected to the converter element at least functionally, preferably electrically or electromagnetically, preferably via a second connection element (16) of the interface means and optionally a number of conductive tracks, preferably printed, even more preferably printed by using printed electronics, on the main substrate (60).

Technical Field

The present invention generally relates to electronic assemblies. In particular, but not exclusively, the invention relates to an interface device, such as an electrical interface, for providing a connection between an external system and an electronic structure, in particular a structure comprising a layer of moulded or cast material.

Background

In the context of electronic devices and electronics, there are a variety of different stacked assemblies and structures. The motivation behind the integration of electronics and related products may be as diverse as the associated use environment. In contrast, size savings, weight savings, cost savings, or simply efficient integration of components are often sought when the resulting solution ultimately exhibits multi-layer properties. In turn, the relevant usage scenarios may relate to product packaging or food packaging, visual design of device housings, wearable electronics, personal electronics, displays, detectors or sensors, vehicle interiors, antennas, tags, vehicle electronics, and the like.

Electronic devices such as electronic components, ICs (integrated circuits) and conductors can often be provided on a base element by a number of different techniques. For example, off-the-shelf electronic devices such as various Surface Mount Devices (SMDs) may be mounted on a substrate surface that ultimately forms an internal or external interface layer of a multilayer structure. Additionally, the technology pertaining to the term "printed electronics" may be applied to the actual direct production of electronics and attachment to the relevant substrate. The term "printing" in this context refers to various printing techniques capable of producing electronic/electrical components from prints by substantially additional printing processes, including but not limited to screen printing, flexography and inkjet printing. The substrate used may be a flexible and printed organic material, but this is not always the case.

Furthermore, the concept of Injection Molded Structural Electronics (IMSE) actually involves building up functional devices and their parts in the form of a multilayer structure, which encapsulates electronic functions as seamlessly as possible. IMSE is also characterized in that electronic devices are typically fabricated in true 3D form based on three-dimensional (3D) (i.e., non-planar) models of the overall target product, part, or overall design. To achieve a desired 3D layout of electronic devices on a 3D substrate and in a related end product, a two-dimensional (2D) electronic device assembly method may be used, with the electronic devices still provided on an initially flat substrate (such as a film), whereupon the substrate already housing the electronic devices may be formed into a desired 3D shape and overmolded, for example, with a suitable plastic material that covers and embeds the underlying elements (such as electronic devices), thereby protecting and potentially hiding the elements from the environment.

In a typical solution, the circuits have been produced on a Printed Circuit Board (PCB) or a substrate film, after which they have been overmoulded from a plastics material. However, the known structures and methods have some drawbacks, which still depend on the relevant usage scenario. In order to produce electronic components having one or more functions, typically, rather complex circuitry for accomplishing these functions must be produced on a substrate by printing and/or with SMD, and then overmolded by a plastic material. However, in known solutions, the implementation of complex functions may face reliability risks and assembly yield problems, which are caused by the challenge of integrating very dense components and components with complex geometries. Furthermore, the electronic assembly may require the use of external control electronics, for example, which reduces the degree of integration and makes the structure less attractive. Directly integrating dense components and complex geometry components can be challenging and potentially very risky, as reliability is often affected by molding pressures, e.g., assembly yields at different production stages can be very low. Subassemblies mounted or arranged on a PCB and covered with a plastic layer may suffer from coefficient of thermal expansion mismatch, are difficult to overmold due to their complex structure, and exhibit stresses in the structure that may tear the subassembly away from its electrical contacts. Challenges in heat management also typically result in problems such as overheating.

Many IMSE designs have, for example, connected all electrical signals separately outside the IMSE part or device, most commonly with flexible circuit board tail ("flex") ACA (Anisotropic conductive adhesive) bonded to the IMSE substrate. The current generation of IMSE connections is actually removing all electrical connections from the part or device, and the part can easily remove ten or more signals. The electrical connection between the IMSE structure and the external system may generally involve or enable power transfer (voltage/current supply) and/or data transfer (control and/or other data) in either direction. Furthermore, the system-oriented connectivity varies widely, e.g. in some implementations only selected bus-type power connections are arranged, while in other implementations e.g. network connections.

For example, "flexible" type connections have proven challenging to implement in a reliable manner in various use environments, while still maintaining a small amount of production automation, as it has been found that manual labor is often required. On the other hand, many mechanically better (ruggedness, safety, etc.) and more automated connectors fail to achieve the connection density required to remove all electrical and power signals/connections from the part. Accordingly, there remains a need to develop solutions for interfacing various external systems with various IMSE parts or devices that are more automated in addition to being robust and versatile.

Disclosure of Invention

The present invention is realized by various embodiments of an interface device or a bonding device, a method for manufacturing an interface device, and a multilayer structure housing an interface device according to the principles of the present invention. In particular, these objects are achieved by an interface device, a manufacturing method and a multilayer structure as defined by the respective independent claims.

According to a first aspect, there is provided an interface device for providing a connection between an external system and a host structure of the interface device, the interface device optionally being or comprising a substantially electrical or electronic component, such as an embodiment of an electrical node discussed below. The interface device advantageously comprises: a first base film defining a cavity; a first layer of material arranged to at least partially fill the cavity and to embed or at least partially cover at least one electrical element arranged at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals transmitted between the external system and the electronics of the host structure, such as power, control and/or (other than strictly controlled) data signals; and a first connection element, preferably at least partially arranged in the cavity, and configured for connection to an external system, wherein the first connection element is at least functionally connected to the converter element.

In various embodiments, the cavity may define or exhibit a shape, for example, in view of its cross-section, and/or overall shape, substantially rectangular, dome-shaped, circular, hemispherical, truncated conical, and/or other preferred shapes.

In various preferred embodiments, the interface device may be implemented or considered as a component or (smart) connector type element that is physically disposed on a side of the host structure and configured to interface electrical or electronic features of an external system (including, for example, one or more external devices and/or structures) with electrical or electronic features of the host structure. In many embodiments, this will be discussed in further detail below, allowing for two connection sides (external system to host device/IMSE architecture) or relying on wireless connectivity on at least one interface side. Still depending on the embodiment, connectivity (external to the host structure) with either system may at least selectively, if not completely, comply with a selected communication interface standard with respect to, for example, mechanical aspects, taking into account, for example, mechanical connector types and further, for example, pin/signal partitioning therein, and/or electrical aspects thereof (e.g., power signal, control (data) signal, and/or (other) data signal specifications).

In various embodiments, a substrate film, such as the first substrate film, refers herein to a substrate in which one of the three dimensions (e.g., z, such as "thickness") is significantly shorter relative to the other two (e.g., x and y) dimensions. The film substrate may be, at least initially, a substantially flat or planar-like substrate. However, as described below, it may be formed to establish a substantially three-dimensional or at least more three-dimensional shape.

In various preferred embodiments, a transducer element may refer substantially to a single element, such as a component comprising, for example, an integrated circuit, or a system of several elements including, for example, a plurality of components and/or elements that are functionally connected together, at least using, for example, electrical conductors, to functionally establish a transducer element as described herein. Preferably, at least one component of the transducer element, for example one or more elements or parts thereof, or a part of a single element or part, is arranged in the cavity. However, the filler material may be embedded in or cover the cavity.

In various preferred embodiments, the device comprises at least one second connection element, preferably provided with several electrical conductors and/or contacts, arranged for connection, preferably attachment, to the host structure and at least functionally connected to the converter element. The second connection element enables power, control or (other) data transfer using, for example, electrical signals between the interface (particularly the converter element therein) and at least selected remaining electronics of the host structure, in accordance with a selected communication and/or power transfer scheme and related specifications (specifying, for example, the number and type of signals transferred, such as voltage, pulse length, modulation, etc.).

In various embodiments, the interface may comprise at least one electrical element at least partially printed, such as screen printed or ink jet printed, on the first substrate film and into the cavity. Instead of or in addition to printing, the attachment of at least part of the ready-made elements, such as the mounting of electronic components, may be performed.

In various embodiments, as described above, adaptation may refer to, for example, signal transformation, voltage transformation, current transformation, power adjustment, signal path adaptation, signal path migration, signal path connection, signal path separation, signal selection, signal amplification, signal attenuation, voltage limiting, current limiting, and/or signal filtering. The adaptation may be performed by the converter element and optionally also by several further elements comprised in the interface device. For example, the first and/or second connection element may contain at least limited functionality for adaptation purposes.

In various embodiments, the signal comprises at least one element selected from the group consisting of: electrical, electromagnetic, optical, electrical, voltage, power, digital, analog electrical, digital electrical, control, and (other) data signals.

In various embodiments, the device comprises a second substrate, such as a printed circuit board, a ceramic electrical substrate, a (printed) film substrate or a patterned electrically conductive polymer substrate, comprising one or more electrical elements of the at least one electrical element, wherein the second substrate is further optionally arranged such that the one or more electrical elements of the at least one electrical element are positioned in the cavity and embedded in or at least partially covered by the first material layer.

In various embodiments, the device includes a second layer of material disposed over the at least one electrical element for reducing undesired air pockets between the at least one electrical element and the first layer of material (e.g., to minimize size or virtually completely eliminate air pockets).

In various embodiments, the at least one electrical element (optionally containing only or at least said converter element) comprises at least one element selected from the group consisting of: signal filtering elements, protection circuit elements such as protection diodes or transient suppressor components, regulators, power supplies, Switched Mode Power Supplies (SMPS), power receiving coils, power transmitting coils, inductors, amplifiers, attenuators, integrated circuits, processing units, microcontrollers, microprocessors, signal processors, logic arrays, logic chips, programmable logic, capacitors, and input capacitors.

In various embodiments, the first connection element substantially comprises an electromechanical connector, optionally comprising male or female parts of two mutually compatible electromechanical connectors. The connector may be known in the art, for example, following a selected interface standard, or a proprietary interface standard.

In various embodiments, the first connection element comprises a wireless connection element, such as a coil or a capacitive element.

In various embodiments, the first connection element may comprise a first part or portion, optionally an electromechanical connector (computer bus connector, vehicle harness connector, automation bus connector, etc.), which is at least partially located outside the cavity or extends outside the cavity so as to face and connect with a compatible connection member of an external system, such as an electromechanical connector; and a second portion, such as a number of conductors, configured to establish, at least functionally, preferably electrically or electromagnetically, a connection between the first portion and the converter element.

In various embodiments, the converter element and/or the first connection element, i.e. both, may work together, adapted to provide a wired connection based on at least one wired connection or communication process, technology or related standard selected from the group consisting of: CAN (controller area network), LIN (local interconnect network), USB (universal serial bus) 3.0, USB 2.0, USB, HMI (human machine interface), SPI (serial peripheral interface), UART (universal asynchronous receiver transmitter) or asynchronous serial communication, vehicle bus communication, automated bus communication, computer bus communication, serial communication, parallel communication, I2C (inter-integrated circuit), LAN (local area network), ethernet, and PoE (power over ethernet). For example, the first connection element may be configured to employ at least selected mechanical (e.g. connector specifications) aspects of the target technology, e.g. as defined by a selected standard, while the converter element may be configured to comply with the signalling/signal aspects and then be responsible for the signal processing, or specifically the adaptation aspects, between the external system and the host.

In various embodiments, the converter element and/or the first connection element may be adapted to provide the wireless connection based on at least one wireless connection process, technology or related standard selected from the group consisting of: bluetooth, WLAN/WiFi, and NB-IoT (narrowband IoT). For example, the first connection element may comprise, for example, a transducer, such as a coil controlled by a transducer element.

In various embodiments, the first substrate film is a molded substrate film, such as a thermoformed substrate film, or an injection molded substrate film, that defines a cavity. Initially, the membrane may be, for example, substantially planar (2D), but at least the cavity may have been established therein by (3D) molding and/or other suitable processing. At least a portion of the component, such as an electrical component of the at least one electrical component, may be provided to the film before or after formation.

In various embodiments, the interface device may include at least one thermal management element for cooling or heating, for example, optionally including at least one of: radiator, radiating block and heat well. The thermal management element may be a substantially unitary element, a multi-part element (which parts may be removably or fixedly connected), and/or integral with some other element, such as a connector or electrical element.

In various embodiments, the thermal management element may be configured to at least thermally, if not physically, connect or contact an interface device, a feature such as an electrical element, a filler, a substrate, a conductor, a contact, and/or a connector thereof, other elements external thereto, and/or an e.g. (electronic) component of a multilayer structure containing the interface, which multilayer structure is considered in more detail below. For example, the associated thermal connection may be based on convection, conduction, and/or radiation.

In various embodiments, the thermal management element may be disposed within the cavity or at least partially outside the cavity, e.g., on the first substrate film or extending from a substantially open side of the cavity to outside the cavity. Additionally or alternatively, the thermal management element may be arranged through the first base film, for example via cuts or through holes. Further, the thermal management element, if any, may be arranged to extend through the second substrate.

In some embodiments, such as the aforementioned multilayer structure, the at least one thermal management element may be located substantially outside the interface, optionally integrated or connected with elements such as electronic components, which allows for example high power LEDs which are prone to (over) heating under certain conditions.

In various embodiments, the thermal management element may include a heat spreader that may, for example, be disposed substantially or at least partially within the cavity.

In various embodiments, elements such as the first and/or second connection elements, as part of, connected to, or integral with the thermal management element, may comprise a material having a high thermal conductivity, such as a thick copper conductor.

In various embodiments, one or more thermal management elements, such as heat pipes, may be arranged in connection with a suitable element, such as a first connection element, for operating as a heat sink or conducting heat into or out of the interface device.

According to one aspect, there is provided a method for manufacturing an interface device for providing a connection, such as an electrical or electromagnetic connection, between an external system and a host structure of the interface device, the method comprising:

-obtaining a first substrate film defining a cavity;

-arranging at least one electrical element at least partially in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and electronics of the host structure;

-arranging a first connection element, optionally comprising a first electro-mechanical connector or a wireless connection element, configured for connection to an external system, preferably at least partially into the cavity, said first connection element being at least functionally connected to the converter element; and

-providing a first material layer by at least partially filling the cavity with a first material and embedding or at least partially covering the at least one electrical element arranged in the cavity.

In various embodiments, a second connection element for connection to a host structure is provided, which is at least functionally connected, preferably electrically connected, with the converter element.

In various embodiments, a multilayer structure for housing, for example, an electronic device or an electronic component, includes: a primary substrate configured to house, for example, an electronic device, optionally a number of electrical traces and/or electronic components, further optionally at least some of which are implemented as components of, preferably, an electrical node type; and interface means, optionally an essentially electrical or in particular electronic component, preferably of the electrical node type, arranged to provide a connection between an external system and the electronic device of the multilayer structure,

the interface device includes:

-a first substrate film defining a cavity;

-a first layer of material arranged to at least partially fill the cavity and to embed or at least partially cover at least one electrical element arranged in the cavity, wherein the at least one electrical element comprises at least one converter element configured for adapting signals to be transmitted between the external system and the multilayer structure; and

-a first connection element, preferably at least partially arranged in the cavity, and configured for connection to the external system, wherein the first connection element is at least functionally connected to the converter element; and

wherein the multilayer structure further comprises:

-a layer of moulded or cast material at least partially embedding or covering the first substrate film and thus preferably arranged on the interface means on the main substrate.

In various embodiments, the multilayer structure comprises a second connection element attached to the primary substrate for providing a connection to the primary substrate and at least functionally connected to the converter element.

In various embodiments, the electronic device comprises at least one electrical or electronic component arranged on the main substrate, wherein the component is connected at least functionally, preferably electrically or electromagnetically, to the converter element, preferably via the second connection elements of the interface means and optionally several conductive tracks, which are preferably printed, even more preferably printed by using printed electronics technology, on the main substrate.

In various embodiments, the converter element may comprise several first and second terminals or similar connection features for functionally connecting the converter element to an external system, preferably via the first and second connection elements.

In various embodiments, the multilayer structure may include at least one thermal management element, as described below.

In view of its utility, the present invention, according to an embodiment, provides various advantages over known solutions such that an interface device utilizing electrical nodes reduces the complexity of integrating functions (e.g., circuits forming a switch-mode power supply and a dense-pitch microcontroller) into a multi-layer structure. In many cases, the number of wirings is also reduced. The number of functions that can be easily embedded into an electrical node according to the present invention greatly increases the value obtained by implementing the structure and its functions using IMSE rather than using any available conventional techniques. For example, an electrical node has a structure that may be optimized for efficiency, low electromagnetic interference (EMI), or other parameters. For example, the switch mode circuitry may be customized to meet emission limits, greatly reducing the risk of electromagnetic compatibility (EMC) test failures. From a software development perspective, the effort required to implement the IMSE architecture may also be greatly reduced, since the pre-selected and pre-fabricated electrical nodes will have known structure and functionality. These functions can be implemented by providing the driver with the possibility to automatically generate driver code based on a pre-configured functional model.

Furthermore, the electrical node method for producing an interface or interface device enables the use of a larger proportion of the currently available electrical components: most new components released to the market are packaged in very dense micro-packages with potentially very high power densities that are very difficult to integrate directly into the IMSE structure due to physical limitations (printing resolution, adhesive diffusion and splashing, reliable filling and air removal). For designers less familiar with the challenge of directly embedding complex circuitry and many components in plastic, the electrical node approach is a safer approach to integrating functionality. As the degree of integration of IMSE parts increases (more and more functions are integrated inside the plastic), there are fewer and fewer connections to the outside world. The present invention provides some very potential interfaces that can greatly simplify system design, simplify supply chain, and facilitate assembly and maintenance by creating assets that can be shared among a large number of parts.

For example, the different interface circuitry and e.g. protection circuitry required to enable power transfer and/or communication (control and/or other data) between an external system, such as a vehicle electronic system (providing e.g. a CAN/LIN bus connection), an automation system or other electronic system, and a host structure of the interface device, such as an IMSE structure, may be cleverly employed in the interface device, which in turn may even be reduced to a single component, preferably of the electrical node type, which may be prepared and verified (e.g. tested) in advance and then provided on the host substrate of the host structure as required. The interface device may then be manufactured and/or authenticated by one party (e.g., a company) while the device is provided in the host structure by another party, for example.

Thus, outsourcing of the electronic device manufacturing and verification processes becomes easier, component selection is wider, customization is easier, and the like. However, while the side facing the external system, e.g. containing relevant aspects (processing, required hardware, etc.) of e.g. the first connection element and the converter element, may be process or case specific or be platformized, the side facing the host structure, containing relevant aspects of e.g. the second connection element and the converter element, may be kept unchanged by various applications and use cases, which will reduce the production costs of the (IMSE) host structure by simplifying and streamlining the relevant design, manufacturing and test/verification processes.

By including a thermal management element in the interface or in a multilayer structure containing an interface as described herein, many potential thermal management related issues, such as overheating of electronic components, may be reduced or avoided.

Various other advantages will become apparent to the skilled artisan based on the detailed description below.

The expression "a number of" may refer herein to any positive integer starting from one (1).

The expression "plurality" may refer to any positive integer starting from two (2), respectively.

The terms "first," "second," and "third" are used herein to distinguish one element from another, and do not specifically prioritize or order them, if not explicitly stated otherwise.

The exemplary embodiments of the invention presented herein should not be construed as limiting the applicability of the appended claims. The verb "to comprise" is used herein as an open limitation, not excluding the presence of features not yet recited. The features described in the various embodiments and in the dependent claims are freely combinable with each other, unless explicitly stated otherwise. However, as is readily appreciated by those skilled in the art, the various embodiments of the interface device disclosed herein may be flexibly adopted (mutatis mutandis) in desired embodiments of a multilayer structure or a manufacturing method, and vice versa.

The novel features believed characteristic of the invention are set forth with particularity in the appended claims. The invention itself, however, both as to its construction and its method of operation, together with additional objects and advantages thereof, will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.

Drawings

In the drawings, some embodiments of the invention are shown by way of example and not by way of limitation.

FIG. 1 schematically illustrates an electrical node according to an embodiment of the invention.

FIG. 2 schematically illustrates an electrical node according to an embodiment of the invention.

FIG. 3 schematically illustrates an electrical node according to an embodiment of the invention.

Fig. 4A to 4D schematically show an electrical node according to an embodiment of the invention.

Fig. 5A and 5B schematically illustrate subcomponents that may be used in an electrical node according to an embodiment of the invention.

Fig. 6A-6C schematically illustrate electrical nodes according to some embodiments of the invention.

FIG. 7 schematically illustrates an electrical node strip according to an embodiment of the invention.

Fig. 8A and 8B schematically illustrate an electrical node pad according to an embodiment of the invention.

FIG. 9 schematically illustrates an electrical node according to an embodiment of the invention.

FIG. 10 schematically illustrates a multilayer structure according to an embodiment of the invention.

FIG. 11 shows a flow diagram of a method according to an embodiment of the invention.

Fig. 12A and 12B illustrate various stages in the manufacture of an electrical node according to an embodiment of the present invention.

Fig. 13 shows an interface according to an embodiment of the invention.

Fig. 14 shows an interface according to another embodiment of the invention.

Fig. 15 shows an interface according to a further embodiment of the invention.

Fig. 16 shows an interface according to a further embodiment of the invention.

FIG. 17 shows a flow diagram of a method according to an embodiment of the invention.

Fig. 18 schematically illustrates a further embodiment of an electrical node provided with several applicable thermal management features.

Fig. 19 schematically illustrates a further embodiment of an electrical node provided with several related thermal management features.

FIG. 20 illustrates various applicable aspects of thermal management associated with embodiments of interfaces in accordance with the invention.

Detailed Description

The various examples or embodiments of electrical nodes discussed herein, optionally also flexibly and/or selectively combinable as required by a person skilled in the art, are suitable for use in various applications, such as forming at least part of an interface arrangement between systems, i.e. as an interface node or similar, for example as contemplated herein. The interface nodes may advantageously be arranged on the host structure or the multilayer structure in a similar way as the electronic components. Thus, the interface node may preferably provide an interface for external systems in an at least component-like unit, and may additionally include other components, at least a portion of which may be protected by the electrical node type structure presented herein.

Fig. 1 schematically illustrates an electrical node 100 according to an embodiment of the invention. The electrical node 100 in fig. 1 comprises a first substrate film 10, such as Polycarbonate (PC) or a first substrate film comprising PC, which defines a cavity 15 (e.g. a concave or convex shape depending on the angle of examination) and a first material layer 30 or volume arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15. In fig. 1, at least one electrical element 12, such as a capacitive sensing element or conductor or printed electronic element, such as a light emitting diode, has been printed (such as screen printed or ink jet printed) and/or otherwise disposed on the first substrate film 10 and into the cavity 15. For example, the element 12 may be disposed at the bottom of the cavity 15 (e.g., substantially centered or disposed near a sidewall thereof). There may be only one element 12, or advantageously a plurality of electrical elements 12, forming for example an electric circuit capable of providing at least one function, such as lighting. Furthermore, there may be at least one electrical contact element or generally connecting element 16 arranged to the electrical node 100 and configured for providing an electrical connection, such as a galvanic connection, a capacitive connection or an inductive connection, for example, generally to the node 100, in particular generally from the outside of the node 100, for example from an element located on and/or from the outside of the common main surface, structure or generally substrate having the node 100. The electrical contact element 16 may be electrically connected with the at least one electrical element 12 or the circuitry thereof via an intermediate electrical connection element 14, such as an electrical conductor 14, such as a printed conductor, for which purpose the element 12 may comprise several connection features, such as terminals or contacts, if not directly connected therewith.

According to various embodiments, first material layer 30 may be or include a polymer, plastic, and/or silicone, for example. According to various advantageous embodiments, the first material layer 30 may be elastic, providing for example mechanical protection for one or more electrical elements 12 embedded therein or at least partially covered by the first material layer 10.

In some embodiments, first material layer 30 may be composed of multiple materials or material layers.

Fig. 2 schematically illustrates an electrical node 100 according to an embodiment of the invention. The electrical node 100 in fig. 2 comprises a first substrate film 10 defining a cavity 15 and a first material layer 30 arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15. In fig. 2, the electrical node 100 further comprises a second substrate 20, such as a printed circuit board or a part thereof, or a further film comprising at least one electrical element 12. Furthermore, the second substrate 20 is arranged such that the at least one electrical element 12 is positioned in the cavity 15 and embedded in or at least partially covered by the first material layer 30. On the second substrate 20, only one element 12 or advantageously a plurality of electronic elements 12 may form a circuit capable of providing a function (such as lighting). Furthermore, there may be an electrical contact element 16 arranged to the electrical node 100 and configured for providing an electrical connection, such as a galvanic, capacitive or inductive connection, to the node 100. As envisaged above with reference to fig. 1, the electrical contact element 16 may optionally be electrically connected with the at least one electrical element 12 or the circuitry thereof via the electrical connection element 14. On either side of the first film 10 (depicted as the side facing the cavity 15 in the figures), there may also be several features 25, such as electrical components.

Fig. 3 schematically illustrates an electrical node 100 according to an embodiment of the invention. The electrical node 100 in fig. 3 comprises a first substrate film 10 defining a cavity 15 and a first material layer 30 arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15. In this case, however, at least two electrical components 12 are arranged in the cavity 15, at least one of which is arranged as shown in fig. 1 and at least one of which is arranged as shown in fig. 2.

Further, the same applies to fig. 1 and 2, there may be at least one second electrical element 26 disposed on the first base film 10 on the opposite side of the first base film 10 with respect to the cavity 15. In fig. 3, the second electrical elements 26, such as the capacitive sensing elements 26, are arranged in corresponding positions with respect to the cavities 15, however, the second electrical elements 26 may alternatively or additionally be arranged in other parts of the first substrate film 10 (see e.g. item 25 of fig. 2). As a still further option, the second electrical element 26 may be connected by a second electrical connection element 27 and/or via a feedthrough 28 to a feature, such as an electrical contact element 16, which is the same or different with respect to the electrical contact element 16 to which the electrical element 12 is connected.

According to various embodiments, such as any of the embodiments shown in fig. 1-3, the node 100 may include several thermal management features or elements 35, such as a heat sink for cooling the node, in particular the electrical element 12 or elements 12 thereof. Heat sinks and/or other thermal management features may be embedded in, for example, the first material layer 30 and/or disposed at least partially outside of the node 100 (e.g., with vias/holes disposed in an external component such as the film 10, optionally before or after providing a covering plastic thereon, e.g., using, for example, molding), for example, to provide cooling. Still further, a heat sink or similar functionality may be arranged in conjunction with an external device or heat exchanging element such as a circuit board (considering e.g. a metal core or a thermal PCB). Typically, the thermal management elements or features may have a high thermal conductivity and e.g. heat dissipation properties, provided by the included materials, size, shape and/or (surface) area thereof. The material may comprise many metals (e.g., copper, silver, aluminum) and alloys thereof, in addition to or instead of, for example, thermally conductive polymers, pastes, molding materials. In some embodiments, thermal management elements that are thermal insulators in nature may be used in addition to or in place of thermal conductors.

The thermal management element 35 may advantageously be configured to distribute, transfer or spread thermal energy/heat within and/or outside the node 100 or interface device. Thermal energy or heat may be transferred to selected or entire areas of the node 100 or the arrangement and then external to the node 100 or the arrangement, e.g., through the second substrate 20 (if present) or the primary substrate 60, thus resulting in more efficient cooling of the node 100 or the arrangement, e.g., relative to providing cooling at a single point. This may be particularly beneficial if the node 100 or device comprises compact high power components, such as high power LEDs or LED drivers, to avoid hot spots.

In various embodiments, the thermal conductivity of such a thermal management element 35, or at least a portion thereof, for conducting heat may preferably be at least 2W/mK, or preferably at least 10W/mK, or more preferably at least 50W/mK, or most preferably at least 100W/mK. As will be appreciated by those skilled in the art, various materials having lower thermal conductivities may be considered thermal insulators, while materials having higher thermal conductivities may generally be more effectively used as thermal conductors, for example for cooling/heat transfer purposes. For example, the desired thermal conductivity may be achieved by suitable material selection for the thermal management element 35. In some embodiments, a plastic material having a thermal conductivity of at least 10W/mK may be used. In various embodiments, metallic materials, such as copper, aluminum, zinc, or tin-silver-copper (SnAgCu) compositions, such as Sn-Ag3.5-Cu9.0, may be used for the thermal management element 35 or at least a portion thereof. Each such metal has a thermal conductivity of at least about 60W/mK. Thus, considerable metal provides better thermal conductivity than typical plastic materials that may be used for thermal management in various embodiments of the present invention.

In various embodiments, a thermal management element 35, such as a thermal well, heat slug, or thermal pad, may be implemented at least in part by, for example, a lead frame of an electrical or electronic component, such as comprising copper or a copper alloy. Further, for example, the thermal wells may be implemented by a matrix of inlets through a substrate (such as a PCB). Thermal wells may be particularly advantageously used with multilayer substrates. Examples of heatsinks or pads may include thermally conductive material disposed on a Thin Shrink Small Outline Package (TSSOP) or quad flat no lead (QFN) package.

According to various embodiments, the electrical node 100 may actually comprise a circuit board, such as the second substrate 20, or an electrical component 12 having a metal core or based on multilayer ceramic technology, such as a high temperature co-fired ceramic (HTCC) or a low temperature co-fired ceramic (LTCC), which may further provide cooling and/or heating by thermal conduction.

According to an embodiment, the thermal management element 35 may be integrated with several elements and/or components of the electrical node 100 or the interface device of an embodiment preferably comprising the node 100, in addition to or instead of comprising dedicated elements. For example, this may entail utilizing electrical conductors designed with properties such as size so that they function as the thermal management element 35 or at least a portion thereof, such as a heat sink or thermally conductive element.

In various embodiments, the electrical node 100 or interface device (described in more detail below) may include a thermal management element 35, such as at least one of: radiator, radiating block, hot-well. The thermal management element 35 may be disposed within the cavity 15 or at least partially outside the cavity 15, for example, on the first substrate film 10 or extending from an open side of the cavity 15 to outside the cavity. The thermal management element 35 may additionally or alternatively be disposed through the first substrate film 10, for example via a cut or a through hole. Further, the thermal management element 35 may be arranged to extend through the second substrate 20, if any. Additionally or alternatively, the thermal management element 35 may comprise a heat sink arranged completely or at least partially inside the cavity 15. In some embodiments, as part of the thermal management element 35, the first connection element 45 (shown, for example, in fig. 13-16) and/or the second connection element 16 may be composed of or include a material having a high thermal conductivity, such as a thick copper conductor. A thermal management element 35 or element 35, such as a heat pipe, may alternatively or additionally be arranged in connection with the first connection element 45 for acting as a heat sink, either for conducting heat into or from the electrical node 100 or the interface device.

In various embodiments, the electrical node 100 or interface device may comprise a thermally conductive first material layer 30, such as provided in the cavity 15, which, in addition to e.g. a protective layer, also serves e.g. as a thermal management element 35. Still further, the first material layer 30 may be only partially provided by using a thermally conductive material, such as a heating member provided at a corresponding position, such as a processing unit or a resistor, while the rest of the first material layer 30 may be other materials.

According to various embodiments, where the electrical node 100 or interface device is already disposed on the primary substrate 60 or structure, the thermal management element 35 may be thermally connected with the thermal management element 35 of the primary substrate 60. For example, there may be graphite or copper, such as a sheet of graphite or copper tape, disposed on the primary substrate 60 with locations corresponding to the disposed electrical nodes 100 or cavities 15. Still further, these thermally conductive elements may extend along the primary substrate 60 to conduct heat away from, for example, the node 100 or device.

In various embodiments including an electrical node 100 or interface device disposed on a primary substrate 60 or structure, and including a molded or cast material layer 90 on the node 100 or device, the at least partially molded or cast material layer 90 may be a thermally conductive material, if not completely, such as at least partially covering or embedding portions of the first base film 10.

Fig. 4A-4D schematically illustrate an electrical node 100 according to an embodiment of the invention. Fig. 4A-4D illustrate electrical node 100 in cross-sectional side views of a top view, a bottom view, and a perspective view, respectively. Electrical elements 12, such as printed or mounted components, are preferably arranged therein, for example at the bottom of the cavity 15, and optionally conductors 14 connecting the electrical elements 12 to the electrical contact elements 16 are arranged at a peripheral portion of the first base film 10.

Fig. 4B-4D further illustrate functional and/or decorative elements 41 disposed on the first substrate film 10. The functional element 41 in fig. 4B to 4D is or comprises a window of, for example, a transparent material, which passes light emitted by a light source, such as by a Light Emitting Diode (LED) -type element 12, arranged in the cavity 15. For example, it may be used as a visual or optical indicator, and/or for illumination purposes.

Fig. 5A and 5B schematically illustrate subcomponents that may be used in the electrical node 100, according to embodiments of the invention, at 500 and 502. The subassembly may include a plurality of electrical components 12, preferably interconnect components 12, forming the electrical circuit of the subassembly. The circuit of this example case includes the elements of a dual channel LED driver, which may be provided as a sub-assembly on a substrate 20, such as a PCB. The sub-assembly (e.g., at a peripheral portion thereof) may include inputs and/or outputs in the form of electrical contact elements 16, such as for power, ground, two PWM (pulse width modulation) inputs, two LED string anodes, and two LED string cathodes, on large, easily mounted contact pads, rather than complex chaotic circuitry between power supply capacitors, inductors, timing resistors, sense resistors, and tiny, power-intensive driver ICs. The subassembly may then be disposed into the cavity 15 and at least partially embedded by or at least partially covered by the first material layer 30, according to one embodiment of the invention. However, it may also be produced directly on the first substrate film 10 and enter the cavity 15, or a region of the cavity 15 is later established and then arranged to be at least partially embedded by or at least partially covered by the first material layer 30. It should be further noted, however, that various different kinds of subcomponents or circuits having and/or configured to perform one or several functions may be arranged into electrical node 100 in accordance with embodiments of the present invention, and are not limited to the circuits described above.

Fig. 6A-6C schematically illustrate an electrical node 100 according to some embodiments of the invention. The electrical node 100 in fig. 6A comprises a first substrate film 10 defining a cavity 15 and a first material layer 30 arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15. In fig. 2, the electrical node 100 includes a second substrate 20, such as a printed circuit board or a portion thereof, including at least one electrical component 12. Furthermore, the second substrate 20 is arranged such that the at least one electrical element 12 is positioned in the cavity 15 and embedded in or at least partially covered by the first material layer 30. On the second substrate 20, only one element 12 or advantageously a plurality of electronic elements 12 may form a circuit capable of providing a function (such as lighting). Furthermore, there may be an electrical contact element 16 arranged on the opposite side of the second substrate 20 with respect to the at least one electrical element 12 for providing an electrical connection to the node 100.

Fig. 6A further illustrates a host substrate 60, such as a PCB or thin film type substrate, e.g., plastic and/or organic material, upon which the electrical node 100 is disposed. The main substrate 60 preferably includes an electrical contact area 61 to which the electrical node 100 may be attached, for example, by using a conductive adhesive. Thus, the electrical node 100 is an entity of similar components configured to perform one or several functions. The electrical connection between node 100 and primary substrate 60, although shown as an electrical connection, may also be arranged as a capacitive or inductive connection. Furthermore, the first base film 10 of the electrical node 100 advantageously protects the components in the cavity 15, e.g. when overmoulded by plastic and/or generally covered by a further material.

The electrical node 100 in fig. 6B is similar to the electrical node shown in fig. 6A, except that a second material layer 65 has been disposed therein, e.g., on the at least one electrical component 12, for reducing air pockets, e.g., formed between the at least one electrical component 12 and the first material layer 30. The second material layer 65 may be different from the material of the main filler (first layer) 30. The second material layer 65 may cover the at least one electrical element 12, or at least some, if many, of them, and optionally also at least a portion of the second substrate 20. The second material layer 65 may comprise or be made of, for example, a very flowable and fully wettable material, such as a liquid resin. The second material layer 65 may advantageously be used as a pre-fill material that flows into small gaps between electronic components 12 (such as electronic components) and/or partial structures, thus simplifying the geometry and/or "smoothing" the surface to facilitate application of the first material layer 30.

Second material layer 65 may be or include a material commonly used for capillary underfill of integrated circuit components or the like. Thus, the material layer 65 may be a mixture of a liquid organic resin binder and an inorganic filler. The organic binder may include, for example, epoxy resin mixtures or cyanate esters. The inorganic filler may comprise, for example, silica.

Alternatively or additionally, the second material layer 65 may be used in embodiments where at least one electrical element 12 is disposed on the first substrate film 10 and into the cavity 15 to reduce air pockets.

The electrical node 100 in fig. 6C is similar to the electrical node shown in fig. 6A, except that a layer such as the protective layer 67 has been disposed on the first base film 10. The protective layer 67 may also comprise functional elements, such as capacitive sensing elements or lighting devices or optical elements, on one or any of its surfaces. The protective layer 67 may comprise, for example, a protective film, a coating, a housing structure, and/or a molded (plastic) layer, as described in more detail with reference to fig. 10, for example. The protective layer 67 may cover one or more entities, such as the nodes 100 and/or other features, such as electronic components disposed on the primary substrate 60.

Figure 7 schematically illustrates an electrical node stripe type embodiment of an assembly 200 according to the present invention. The strip 200 comprises, for example, an elongate first substrate film 10 defining a plurality of cavities 15, in this case two, and at least a corresponding number of first material layers 30 relative to the number of the plurality of cavities 15. Each of the first material layers 30 at least partially fills a respective one of the cavities 15 and embeds at least one electronic component 12 therein. There may be electrical contact elements 16 arranged on the first substrate film 10 which may be further connected to the electrical elements 12 in one or both cavities 15.

Further, at least two of the corresponding number of first material layers 30 may form a common first material layer 30. This may require that the first material layer 30 extends substantially between the two cavities 15, thereby forming a continuous material layer.

Fig. 8A and 8B in turn schematically illustrate an electrical node wafer 200 according to an embodiment of the invention. In fig. 8A, the sheet 200 is shown in a perspective view from above the sheet 200. In fig. 8B, the sheet 200 is shown in a perspective view from below the sheet 200. The sheet 200 comprises a first substrate film 10 defining a plurality of cavities 15, in this case four, and at least a corresponding number of first material layers 30 relative to the number of several of the plurality of cavities 15. Each of the first material layers 30 at least partially fills a respective one of the cavities 15 and embeds at least one electronic component 12 therein. There may be electrical contact elements 16 arranged on the first substrate film 10 which may be further connected to the electrical elements 12 in one, some or each cavity 15. Further, at least two of the corresponding number of first material layers 30 may form a common first material layer 30. This may require that the first material layer 30 extends substantially between the two cavities 15, thereby forming a continuous material layer.

Fig. 7, 8A and 8B further show the functional elements 41 arranged on the first base film 10. As previously mentioned, the functional element 41 may comprise a window, for example of a transparent material, which passes through the light emitted by the light source, such as an LED, arranged in the cavity 15.

In fig. 8B, it is further shown that more than one electrical component 12 may be arranged in one cavity 15. In this case, the left lower chamber 15, depicting "on" and "off", may comprise, for example, two LEDs configured to illuminate one functional element 41, i.e., "on" and "off", respectively. There may be further a structure that prevents light of one LED from penetrating a portion of another LED.

Fig. 9 schematically illustrates an electrical node 100 according to an embodiment of the invention. The electrical node 100 in fig. 9 includes a pocket, such as the air pocket 85, within the first material layer 30. The pockets 85 may contain any selected gas, such as air and/or one or more inert gases, or substantially any type of gas or combination thereof.

According to one embodiment, the pocket 85 may be used to enable operation of, for example, a micro-electromechanical system (MEMS) component 80, such as a switch, which requires some free space or volume for a portion of the component 80 to move sufficiently, for example, to operate properly. The component 80 is herein one type of electrical element 12.

Fig. 10 schematically illustrates a multilayer structure 300 according to an embodiment of the invention. The multilayer structure 300 may include at least one electrical node 100 comprising: a first substrate film 10 defining a cavity 15, and a first material layer 30 arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15; or at least one electrical node strip or sheet 200 comprising a first substrate film 10 defining a plurality of cavities 15, and at least a corresponding number of first material layers 30 relative to the number of the plurality of cavities 15, wherein each of the first material layers 30 at least partially fills a respective one of the cavities 15 and embeds at least one electronic component 12 therein.

Multilayer structure 300 may further include a host substrate 60, wherein the at least one electrical node 100 or the at least one electrical node strip or sheet 200 is disposed on host substrate 60.

Further, structure 300 may include a molded or cast material layer 90, for example, covering the at least one electrical node 100 or, for example, the at least one electrical node strip or sheet 200 on primary substrate 60.

In some embodiments, there may be at least one further element, such as a second substrate film 95 disposed on the opposite side of the layer of molded or cast material 90. The layer of molded or cast material 90 may be at least partially transparent so light can pass through the layer 90.

Further, for example, the second substrate film 95 (if present) may also contain several decorative and/or functional elements 41, such as windows for passing light emitted by the LEDs in the cavities 15.

However, for example, the structure 300 may accommodate several elements, such as electrical components or in particular the electrical components 55, provided (mounted, printed, etc.) on the primary substrate 60 and/or at least partially embedded in the layer 90. At least some of these elements 55 may be functionally electrically coupled, such as via suitable connection elements such as contacts and/or conductor traces, to node 100 and, for example, element 12 therein, optionally defining at least a portion of a larger circuit design, for example, on primary substrate 60.

According to one embodiment, the at least one electrical node 100 or the at least one electrical node strip or sheet assembly 200 may be arranged on the main substrate 60 such that the at least one electrical element 12 or the plurality of elements 12 are between the first base film 10 and the main substrate 60.

According to one embodiment, the multilayer structure 300 may include at least one second electrical element disposed on the first substrate film 10 on an opposite side of the first substrate film 10 with respect to the cavity 15.

FIG. 11 shows a flow diagram of a method according to an embodiment of the invention. At the beginning of the method of manufacturing the electrical node 100, the start-up phase 900 may be performed, for example for interface purposes. During start-up, necessary tasks may be performed, such as material (e.g., substrate), component and tool selection, acquisition, calibration, and other configuration tasks. Special attention must be paid to the cooperation of the individual components and material selections and to the survival of the selected manufacturing and installation processes, which are naturally preferably pre-checked against manufacturing process specifications and component data sheets, or prototypes produced, for example, by investigation and testing. The equipment used, such as moulding/IMD (in-mould decoration), laminating, gluing, (thermo) forming, electronic assembly, cutting, drilling and/or printing equipment, and other equipment, can thus be brought up to the operating state at this stage.

At 910, a first substrate film 10 defining a cavity 15 may be obtained. According to one embodiment, the first substrate film 10 may be obtained by forming (such as thermoforming, cold forming or using vacuum or high pressure) an initial substrate film to define the cavities 15. According to another alternative or additional embodiment, the first substrate film 10 may be obtained by molding (such as injection molding), optionally directly in a target three-dimensional shape containing the cavity 15.

At 920, at least a first material layer may be provided by at least partially filling (e.g., by casting, dispensing, and/or (low pressure) molding) the cavity with a first material. In this step, the at least one electrical element 12 arranged in the cavity may be embedded in or at least partially covered by the first material layer. At least one component of the electrical component 12 may be arranged on a target surface or material, for example on the film 10, optionally before or after said forming, by for example mounting and/or printing.

In some embodiments, the method may include providing at least one electrical contact or connection element 16 to the electrical node 100. The at least one electrical contact element 16 may be electrically connected to the at least one electrical element 12. The at least one electrical contact element 16 may be configured for providing an electrical connection into the node 100, such as a galvanic connection, a capacitive connection or an inductive connection, in particular from outside the node 100. This may entail, for example, having electrical contact pads 16 that may optionally be attached to electrical contact elements, such as by soldering or using a conductive adhesive, for example, of a primary substrate 60 (such as a PCB). According to various embodiments, one or several at least one electrical contact element 16 may be arranged at a peripheral portion of the first base film 10 for providing an electrical connection to the node 100.

In some embodiments, as described above, the method may include printing, such as screen printing or ink jet printing, or other form of printed electronics, at least one electrical element 12 on the first substrate film 10 and into the cavity 15, i.e., on a portion of the first substrate film 10 that forms an inner surface of the cavity 15. Alternatively or additionally, several further features, such as the contact elements 16, may be obtained by printed electronics.

In some embodiments, the method may include obtaining a second substrate 20, such as a printed circuit board, including at least one electrical component 12, and arranging the second substrate 20 such that the at least one electrical component 12 is positioned in the cavity 15 such that the at least one electrical component 12 is embedded or at least partially covered by the first material layer 30.

In various embodiments, several conductive areas defining, for example, conductor lines (traces) and/or contact pads and/or electrodes to construct a circuit design are provided on either or both sides of the membrane, preferably by one or more additional techniques of printed electronics. For example, screen printing, ink jet printing, flexographic printing, gravure printing, or offset printing may be used. Further action of the culture membrane may be performed here, involving, for example, printing or, in general, providing graphics, visual indicators, optical elements, etc. thereon. Thus, several non-conductive or insulating features may also be provided, preferably by printed electronics in the relevant structure.

In various embodiments, several thermal management elements (mounted, printed, preferably using printed electronics, etc.) may be provided, for example in combination with (optionally integral with) other elements such as element 12, as described below. In some embodiments, one or more thermal management elements, or portions thereof, may be disposed on the primary substrate 60 of the multi-layer structure, for example, outside of the electrical node. In some embodiments, a feature such as a connector or conductor may have a thermal management function in addition to its other or potential "primary" function, which may take into account, for example, material selection (e.g., electrically and thermally conductive materials such as suitable metals may be used) and shape/size in the design of the feature.

In various embodiments, one or more nodes may then be provided in or utilized with the system to build the system, or in particular the overall multi-layer structure as described herein, e.g. in addition to the nodes, the system or in particular the multi-layer structure comprising several further features, optionally further devices.

At 999, method execution ends.

Fig. 12A and 12B illustrate various possible stages of fabricating an electrical node according to an embodiment of the present invention. In general, aspects described with respect to FIG. 11, for example, are also applicable here.

In fig. 12A, at 121, a first base film 10 defining a cavity 15 may be obtained. According to one embodiment, the first substrate film 10 may be obtained by forming (such as thermoforming, cold forming or using vacuum or high pressure) the substrate film (optionally initially planar) to define the cavity 15. According to another alternative or additional embodiment, the first substrate film 10 may be obtained by molding, such as injection molding. At 122, at least one electrical element 12 may be disposed on the first base film 12 and into the cavity 15. Alternatively, the electrical connection member 14 and the electrical contact member 16 may also be provided on the first base film 10. At 123, a first material layer 30 may be provided to at least partially fill the cavity 15 and embed or at least partially cover the at least one electrical element 12. In various embodiments, the first material layer 30 and potentially further material layers may optionally be at least partially cured, or cured, and/or otherwise altered in properties such as softness or elasticity, using selected treatments that may be combined, for example, with exposure to heat, cold, temperature and/or pressure, and/or in response to the passage of time, for example, in suitable circumstances with respect to the above and/or other parameters.

In fig. 12B, at 221, the first base film 10 defining the cavity 15 may be obtained. According to one embodiment, the first substrate film 10 may be obtained by molding (such as thermoforming, cold forming or using vacuum or high pressure) the substrate film to define the cavity 15. According to another alternative or additional embodiment, the first substrate film 10 may be obtained by molding, such as injection molding. At 122, a first material layer 30 may be provided to at least partially fill the cavity 15. At 123, at least one electrical element 12 may be disposed in the cavity 15, preferably on the second substrate 20, for embedding or at least partially covering the at least one electrical element 12. Alternatively, the electrical connection elements 14 and the electrical contact elements 16 may also be provided on the second substrate 20, or on the first substrate film 10, or on the first material layer 30, or on two or more of said elements, for example after curing of the first material layer 30. According to another embodiment, the second substrate 20 comprising the electrical element 12 may first be arranged such that the electrical element 12 is in the cavity, or preferably also at least a part of the substrate 20, and only thereafter the first material layer 30 is provided into the cavity 15 to embed or at least partially cover the electrical element 12.

A system may be provided that includes at least one electrical node as described herein (the included nodes may be similar or different from each other in structure, material, included elements, and/or related functions). In the system, the at least one node may optionally be removably attached, for example, to a host device, material and/or structure, for example, to a selected target or host surface or substrate thereof, which may be provided with connection features, such as mechanical and/or electrical connection elements for the node.

For a host device or structure (e.g., an IMSE structure, part, or device) and/or other devices or structures of a system, at least one node may provide desired functionality, such as sensing functionality, processing functionality, power transmission functionality, data storage functionality, indication, communication, and/or User Interface (UI) functionality. The at least one node and, for example, at least one electrical element therein (such as an electronic component) may be functionally (such as electrically, electromagnetically, thermally or optically) connected to an electronic component such as a host and/or some external device or structure, such as via one or more connecting elements, including, for example, several electrically conductive traces, pins, connectors, wiring and/or cables. Additional or alternative wireless (e.g., radio frequency) coupling is also possible by implementing selected wireless transmission techniques and associated elements (transmitters, receivers, transceivers). At least one node and element of a host/external device or fabric may be configured to work in concert to establish a desired federated entity.

In some embodiments, the system may be implemented as a preferably unitary multi-layer structure, a few possible embodiments of which have been discussed above. The structure may contain one or more electrical nodes, optionally functionally such as electrically connected together. However, the structure may comprise a host substrate, optionally comprising a formable, such as thermoformable, material which may be or has been used to establish the desired three-dimensional shape by forming. The primary substrate may be configured to receive an electrical node. The master substrate may be formed into a desired 3D shape before and/or after providing features, such as electrical nodes and/or other features, on the master substrate.

In various embodiments of the system or multilayer structure implemented as one thereof, a layer of molded or cast material, e.g., comprising a thermoplastic material, may be disposed on a host substrate so as to embed at least a portion of at least one of the one or more electrical nodes and/or other features, such as further electrical elements (e.g., electronic devices containing, e.g., electronic components) disposed thereon. The multi-layer structure may in fact include several additional features, such as electrical elements and/or thermal management elements provided to the main substrate and/or other layers of the structure, and further optionally functionally, such as electrically and/or thermally, connected with at least one of the one or more electrical nodes to establish a desired connection therebetween for purposes of, for example, control, power, heat or data transfer.

According to one embodiment, the electrical element 12 may comprise a processing unit, such as a microcontroller, a signal processor or a processor. By arranging the processing units in the node 100, access to the processing units at least directly via their pins can be prevented. Further components may be arranged in the node 100 through which access is possible and which may contain proprietary software and selected protocols for controlled access.

According to one embodiment, electrical node 100 or related system/multi-layer structure 300 may be used in a security tag for apparel. However, it may easily find application, for example, with vehicles (e.g., in-vehicle electronics), lighting devices, wearable electronics, computing or communication devices, consumer electronics, measurement devices, and various other products.

In various embodiments, one or more, typically off-the-shelf components or elements, containing electronic components, such as electronic components, e.g., various SMDs, may be attached or provided on a film or (other) substrate, e.g., by solder and/or adhesive. Alternatively or additionally, printed electronics technology may be applied to actually fabricate at least part of the components, such as OLEDs, directly on the film or substrate.

As also discussed herein, the electrical component 12 may be disposed on the film 10 using any feasible positioning or mounting technique, such as standard pick and place methods/equipment (as applicable). Suitable adhesives (e.g., using adhesives or other adhesive substances), gluing, and/or further securing techniques may additionally be used. Furthermore, the electrical component 12 may be printed, injection molded or dip molded.

In various embodiments, the electrical element 12 and/or the node 100, the multilayer structure 300, or other features of the foregoing systems may include at least one element selected from the group consisting of: electronic component, electromechanical component, electro-optical component, radiation emitting component, light emitting component, LED (light emitting diode), OLED (organic light emitting diode), side-emitting LED or other light source, top-emitting LED or other light source, bottom-emitting LED or other light source, radiation detecting component, light detecting or light sensitive component, photodiode, phototransistor, photovoltaic device, sensor, micromechanical component, switch, touch panel, proximity switch, touch sensor, air sensor, temperature sensor, pressure sensor, humidity sensor, gas sensor, proximity sensor, capacitive switch, capacitive sensor, projected capacitive sensor or switch, single-electrode capacitive switch or sensor, capacitive button, multi-electrode capacitive switch or sensor, self-capacitive sensor, mutual capacitive sensor, inductive sensor, sensor electrode, micromechanical (MEMS) component, light source, light emitting diode, light emitting, A UI element, a user input element, a vibration element, a sound emitting element, a communication element, a transmitter, a receiver, a transceiver, an antenna, a resonator, an Infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a data storage or memory element, an electronic sub-assembly, a light directing element, a light guide, a lens, and a reflector. In case the sensor requiring a functional connection with the environment is arranged within e.g. the node 100, it may further be provided with a connection (e.g. a fluidic connection, an optical connection and/or an electrical connection, as envisaged above).

The node 100 or the multilayer structure 300 may thus incorporate electronic devices such as ICs and/or various components. At least a portion of the electronics of multilayer structure 300 may be provided via electrical node 100. Alternatively, the nodes and/or one or more other elements of structure 300, such as an electronic component or a thermal management element, may be at least partially overmolded by a protective plastic layer as discussed above. For example, adhesives, pressure, mechanical fastening features, and/or heat may be used to mechanically bond, for example, the node 100 to the membrane 10 or substrate 20. Solder, wiring, and conductive ink are examples of suitable options for providing electrical connections between the nodes 100 and/or elements of the structure 300, and with the remaining electrical elements (such as electronic components) in the structure 300.

With respect to the resulting overall thickness of the resulting electrical node 100, components such as the strip or sheet 200, and/or the multi-layer structure 300, it depends on, for example, the material used and the associated minimum material thickness that provides the necessary strength in view of fabrication and subsequent use. These aspects must be considered case by case. For example, the total thickness of the structure may be about 1mm or a few millimeters, but rather thick or thin embodiments are also possible.

In particular, further layers may be added to the structure 300 by lamination or a suitable coating (e.g., deposition) process. These layers may have protective, indicative and/or aesthetic value (graphics, colors, figures, text, numerical data, etc.) and contain, for example, tex-tile, leather or rubber material instead of or in addition to further plastic. Additional components, such as electronics, may be mounted to an exterior surface of the structure 300, such as an exterior surface of the substrate. Connector elements for making, for example, electrical connections, may be provided to the node 10 or structure 300 and connected to desired external connection elements, such as external connectors and/or connector cables of an external device, system or structure. For example, the two connectors may together form a plug-and-socket type connection.

In various additional or complementary embodiments, for example, the film 10 may comprise or consist of materials such as plastics, for example thermoplastic polymers, and/or organic or biological materials, for example wood, leather or textiles, or combinations of these materials with each other or with plastics or polymers or metals. The film 10 may comprise or consist of a thermoplastic material. The film 10 may be substantially flexible or bendable. In some embodiments, the film 10 may also be substantially rigid. The thickness of the film may vary depending on the embodiment; for example, it may be only a few tens or hundreds of millimeters, or rather thick, on the order of a millimeter or a few millimeters.

The film 10 may, for example, comprise at least one material selected from the group consisting of: polymers, thermoplastic materials, electrical insulation materials, PMMA (polymethylmethacrylate), Polycarbonate (PC), copolyesters, copolyester resins, polyimides, copolymers of methyl methacrylate and styrene (MS resins), glass, polyethylene terephthalate (PET), carbon fibers, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneers, plywood, bark crepe, bark, birch bark, cork, natural leather, natural textiles or fabric materials, natural growth materials, cotton, wool, flax, silk and any combination thereof.

As previously described, in various embodiments, the material of film 10 and/or further layers (such as second material layer 65) may be at least partially optically opaque or at least translucent, taking into account a predetermined wavelength (e.g., a wavelength in the visible spectrum). This also applies to the layer of molded or cast material 90 and the second substrate film 95, if present. The film 10 may be provided with visually distinguishable, decorative/aesthetic and/or informational features, such as graphic patterns and/or colors thereon or therein. These features may be provided on the same side of the film with the electrical elements 12 so that they are also at least partially sealed, or on the opposite side, and may or may not be sealed by a plastic material, such as by an associated overmolding process of the electrical node 100. Therefore, the IML (in-mold labeling)/IMD (in-mold decoration) technique is applicable. The material used may be at least partially, i.e. at least in places, substantially optically transparent to radiation, such as visible light emitted by the electronic devices thereon. For example, the transmittance may be about 80%, 85%, 90%, 95%, or higher.

The molding material may include thermoplastic and/or thermoset materials. The thickness of the molded or otherwise produced layer may vary depending on the embodiment. For example, it may be on the order of less than one, several or several tens of millimeters. For example, the molding material may be, for example, electrically insulating.

In more detail, the included layers (such as second material layer 65 and/or, for example, layer 90) may include at least one material selected from the group consisting of: elastomeric resins, thermosets, thermoplastics, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylons (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and MS resins.

In various additional or supplemental embodiments, the number of electrical elements 12, electrical connection elements 14, and/or electrical contact elements 16, such as solder pads, comprise a material selected from at least one of the group consisting of: conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, alloy, silver alloy, zinc, brass, titanium, solder, and any component thereof. The conductive material used may be optically opaque, translucent, and/or transparent at a desired wavelength (such as visible light), for example, to shield or allow radiation such as visible light to reflect, absorb, or pass therethrough.

In various embodiments, selected features including, for example, graphics, color, or other visual features may be provided on the inner surface or layer, such as on the side of the (base) film 10 facing the cavity 15, such that these features remain isolated, thereby protecting these features from potentially harmful environmental effects, at least by the thickness of the film 10 and the thickness of the surrounding protective layers 67, 90 of, for example, the molded plastic 10. Thus, different impacts, friction, chemicals, etc., that could easily damage, for example, painted, printed or mounted surface features, do not affect or reach the features. The film can be readily manufactured or processed, optionally cut into a desired shape with the necessary characteristics, such as holes or recesses for exposing underlying features (such as a layer of material or, for example, electronic components).

Fig. 13 illustrates, at 1300, an interface device according to an embodiment of the invention. The interface device may optionally be or comprise substantially electrical or in particular electronic means, for example for providing a connection between an external system 200 (e.g. comprising one or more external devices and/or structures) and a host structure 300 of the interface device, preferably an IMSE structure, component or device, and for example various further, preferably electrical or electronic, elements (circuits, components, etc.) 55 therein. The interface device may comprise a first substrate film 10 defining a cavity 15, a first material layer 30, which may be arranged to at least partially fill the cavity 15 and to embed or at least partially cover at least one electrical element 12 arranged in the cavity 15, wherein the at least one electrical element 12 may comprise at least one converter element configured for adapting signals to be transmitted between said external system 200 and the electronics of the host structure 300. Furthermore, the interface may comprise a first connection element 45, which is preferably at least partially arranged in the cavity and configured for connection to the external system 200, wherein the first connection element 45 is advantageously further at least functionally connected to the converter element.

In various embodiments, a connecting element, such as first connecting element 45, may comprise multiple portions or pieces that are at least functionally, such as electrically, if not physically, connected together. In this case, for example, the first connecting element 45 may comprise one part or portion (e.g., at least a portion of a mechanical connector) disposed largely, if not entirely, outside the cavity, and at least one other part or portion, for example, located at least partially in the cavity 15 to connect the elements 12. A part or portion of the connecting element 45 that is at least partially, if not entirely, external to the cavity 15 may be, for example, a connector portion that defines, for example, a male or female part of a USB, such as a USB 2.0 or 3.0 compatible connector, while a portion internal to the cavity 15 may contain electrical contacts to which the USB connector is connected and which are configured, for example, to contain an appropriate number of conductors or conductive paths for receiving signals from or transmitting signals to the USB connector.

As can be easily inferred from fig. 13, the interface means may preferably be realized by using the embodiments of the electrical node 100 described above with respect to and/or shown in any of fig. 1 to 10 and 18 to 19, for example. Additionally, when the electrical node 100 is used as or in an interface device, it may comprise at least the aforementioned first connection element 45, which is preferably at least partially arranged in the cavity and configured for connection to an external system 200, wherein the first connection element 45 may further be at least functionally (e.g. electrically) connected to the element 12, e.g. a converter element therein, if not integrated therewith. Such internal connections may be implemented using several conductive features, such as conductor traces, pins, and/or contacts.

In various embodiments, the first connector element 45 may generally comprise or define an electrical (electro-mechanical) connector, which may have, for example, a body or housing, and a number of connecting members, such as pins or sockets, containing electrically conductive material (e.g., sockets provided with holes, whose walls and/or bottom are provided with electrically conductive material, e.g., in the form of a coating). In some embodiments, the body/housing may be omitted.

In particular, in the embodiment shown in fig. 13, the first connector element 45 comprises a male part of the connector, which male part is arranged to be connected at least with the converter element. The male portion may be at least partially inside the cavity 15 or represent a portion of the first connection element 45 completely outside the cavity 15, as envisaged above. In fig. 13, the male portion extends through the main substrate 60 of the host structure, such as through an off-the-shelf hole, or it may be disposed by piercing the portion through the main substrate 60 and making contact with at least some of the electrical or electronic components (such as the converter elements) of the interface device.

A second connection element 16 may be provided and comprise, for example, several electrical contacts, as discussed above with respect to various embodiments of an electrical node for connecting to an electronic device of host structure 300. Furthermore, the second connection element 16 may be functionally (e.g. electrically) connected to the element 12, and for example the converter element therein, further using suitable conductive features as described above. Alternatively or additionally, the second connection element 16 may comprise a selected electrical connector provided with, for example, a body and several electrically conductive connection members, such as pins or sockets.

Item 46 refers to a connector or other connecting element of external system 200 that is compatible with one 45 of the interface devices (e.g., a plug-socket or male-female relationship, and/or communication related compatibility).

The second connection element 16 may be connected to further electrical or electronic elements 55 arranged on the host structure or multilayer structure 300, such as on the main substrate 60. The second connection element 16 may typically comprise or define an electrical (electro-mechanical) connector, which may have, for example, a body or housing, and several connection members, such as pins or sockets, containing electrically conductive material (e.g. sockets provided with holes, whose walls and/or bottom are provided with electrically conductive material, for example in the form of a coating). In some embodiments, the body/housing may be omitted.

Fig. 13 also illustrates several thermal management elements 35 that may be used in an interface device such as described above with respect to fig. 3. The thermal management element 35 may be arranged to substantially any electrical node 100 or arrangement as described herein, although not shown in all of the figures for clarity.

The various embodiments of the engagement means can be used in a variety of different technical fields. For example, for automotive applications, a connection interface with surge arresters and CAN or LIN may be used. In this case, at least three software configurable control signals may be provided for universal compatibility (open drain, pull up/pull down, etc.). The first connection element 45 of the interface device may then for example be configured to comprise about ten wires or conductors and a suitable physical connector interface. Another example is that with a USB, e.g. USB 2.0, the compatible first connection element 45 comprises four wires which contain power in addition to data transmission. Yet another example of HMI and similar subsystem usage may be a software configurable serial data interface: the SPI comprises four wires and the UART and I2C comprise two wires, although a single wire solution is also possible. According to one embodiment, the first connection element 45 comprises a connector comprising ten pins. Further, a PoE based interface can be implemented.

According to various embodiments, the interface device may be configured to include a processing unit and preferably other necessary components, such as memory and the like, to run, for example, the Transmission Control Protocol (TCP) or other suitable protocols for communication related functions. Alternatively or additionally, the connection may be based on a wireless technology selected in the scenario, such as for arranging power delivery and/or communication connections. Wireless communication technologies may be used in various embodiments of the arrangement, such as bluetooth, 802.11(WLAN/WiFi), or NB-IoT.

The second communication element 16 may be very simple, such as comprising at least one or two conductors or pins. If a UART is used, the number of conductors or pins may be six.

Fig. 14 illustrates an interface device according to an embodiment of the invention at 1400. Fig. 14 shows the corresponding elements of the interface device already described with reference to fig. 13, but the first connection element 45 essentially comprises the female part of the connector (or the connector may be of a hybrid male/female type). In this case, the first connection element 45 may preferably be arranged completely inside the cavity 15, but the female part may also extend at least partially outside the cavity 15. The external system 200 (not shown, but see fig. 13) may be connected to the multilayer structure 300 by a corresponding male part of the connector, either by piercing said part through the hole or by penetrating the main substrate 60, and making contact with at least some of the electrical or electronic components of the interface device, such as the converter element. Furthermore, the interface device 1400 may comprise a converter element and a second connection element 16, such as shown and described in connection with fig. 13, which may be further connected to further electrical or electronic elements 55 arranged on the host structure or multilayer structure 300, such as on the main substrate 60.

FIG. 15 illustrates, at 1500, an interface device according to an embodiment of the invention. Fig. 15 shows the corresponding elements of the interface device already described with reference to, for example, fig. 13, but the first connection element 45 comprises a coil. For example, the coil may preferably be configured to establish an electromagnetic connection with another coil or magnetic element of the external system 200. Thus, the first connection element 45 may enable it to wirelessly transmit power and/or establish a communication connection to and/or from the external system 200. In this case, the first connection element 45 may preferably be arranged completely within the cavity 15, but it may alternatively be arranged at least partially outside the cavity 15, such as on a side of the second substrate 20 facing away from the first material layer 30. The coil may be connected to a converter element for converting the induced voltage and/or current into one or more suitable signals for use in a host structure or multilayer structure 300, such as in a further electrical or electronic element 55. The external system 200 (not shown, but see fig. 13) may thus be connected to the multilayer structure 300 by means of a corresponding coil or other magnetic element, for example by means of the main substrate 60.

FIG. 16 illustrates, at 1600, an interface device according to an embodiment of the invention. Fig. 16 shows the corresponding elements of the interface device already described with reference to, for example, fig. 13. However, in addition to the interface device, the multilayer structure 300 may comprise an electrical node 100, which is preferably connected to an interface device, such as the second connection element 16. Still further, further electrical or electronic components 55 may (but need not) be arranged inside the embodiment of the electrical node 100.

FIG. 17 shows a flow diagram of a method according to an embodiment of the invention. This embodiment may be considered to address particularly the splicing application, as compared to the more general embodiment of fig. 11. However, various details and applicable design principles contemplated in connection with the description of fig. 11 are also applicable herein, and vice versa. The startup phase 900 may be performed at the beginning of a method for manufacturing the bonded (i.e., interface) device 1300, 1400, 1500, 1600. During start-up, necessary tasks may be performed, such as material (e.g., substrate), component and tool selection, acquisition, calibration, and other configuration tasks. Special attention must be paid to the cooperation of the individual components and material selections and to the survival of the selected manufacturing and installation processes, which are naturally preferably pre-checked against manufacturing process specifications and component data sheets, or prototypes produced, for example, by investigation and testing. The equipment used, such as moulding/IMD (in-mould decoration), laminating, gluing, (thermo) forming, electronic assembly, cutting, drilling and/or printing equipment, and other equipment, can thus be brought up to the operating state at this stage.

At 910, a first substrate film 10 defining a cavity 15 may be obtained. According to one embodiment, the first substrate film 10 may be obtained by forming (such as thermoforming, cold forming or using vacuum or high pressure) an initial substrate film to define the cavities 15. According to another alternative or additional embodiment, the first substrate film 10 may be obtained by molding (such as injection molding), optionally directly in a target three-dimensional shape containing the cavity 15.

At 930, at least one electrical element can be at least partially disposed in the cavity, wherein the at least one electrical element includes at least one converter element configured to adapt signals to be transmitted between the external system and electronics of the host structure.

At 940, a first connection element may be arranged, optionally comprising a first electromechanical connector or a wireless connection element, configured for connection to an external system, preferably at least partially into the cavity, said first connection element further being at least functionally connected to the converter element; and

at 950, a first material layer may be provided by at least partially filling the cavity with a first material and embedding or at least partially covering at least one electrical element disposed in the cavity.

In some embodiments, the method may include arranging the second connection element 16 to the interface device. The second connection element 16 may be at least functionally and optionally physically connected to the converter element. The second connection element 16 may be configured or adapted to attach to a host structure, such as to the host substrate 60. According to various embodiments, one or several second connecting members 16 may be disposed at a peripheral portion of the first base film 10.

In some embodiments, the method may include printing, such as screen printing or ink jet printing, or other form of printed electronics, at least part of the at least one electrical element 12 on the first substrate film 10 and into the cavity 15, i.e. on a portion of the first substrate film 10 forming an inner surface of the cavity 15. Alternatively or additionally, several further features, such as the second connection element 16, may be obtained by printed electronics.

In some embodiments, the method may include obtaining a second substrate 20, such as a printed circuit board, that includes a portion or portions of at least one electrical component 12, such as a converter component or other electrical component, and arranging the second substrate 20 such that the at least one electrical component 12 is positioned in the cavity 15 such that the at least one electrical component 12 is embedded or at least partially covered by the first material layer 30.

In various embodiments, several conductive areas defining, for example, conductor lines (traces) and/or contact pads and/or electrodes to construct a circuit design are provided on either or both sides of the membrane, preferably by one or more additional techniques of printed electronics. For example, screen printing, ink jet printing, flexographic printing, gravure printing, or offset printing may be used. Further action of the culture membrane may be performed here, involving, for example, printing or, in general, providing graphics, visual indicators, optical elements, etc. thereon. Thus, several non-conductive or insulating features may also be provided, preferably by printed electronics in the relevant structure.

At 999, method execution ends.

Fig. 18 schematically illustrates a further embodiment of an electrical node 100 provided with several applicable thermal management features, such as element 35. In fig. 18, the thermal management element 35 may include a heat sink that may be disposed at least partially outside the cavity 15 and/or the electrical node 100, such as having a fraction thereof, or about or more than fifty, sixty, seventy, eighty, or ninety percent (e.g., volume, area, and/or weight) of the element. However, in various embodiments according to the embodiment schematically illustrated in fig. 18, the heat sink may be at least partially inside the node 100 and/or specifically inside the cavity 15. Preferably, there may be a thermally conductive path between the thermal management element 35 and an electrical element, such as at least one electrical element 12 or transducer element, such as through an opening in the primary substrate 60 and/or the secondary substrate 20 (if any), the electrical element being disposed in the cavity 15 and generating heat. The thermally conductive path may additionally or alternatively comprise a thermally conductive paste and/or a thermally conductive portion or layer which are arranged substantially in contact with each other to form the path. In various embodiments, the thermally and electrically conductive paths may be arranged, at least in part, by at least one common element, such as a connector or conductor comprising, for example, selected metals and/or other materials, in addition to or instead of dedicated elements.

In various embodiments, the thermal management element 35 may be disposed on an opposite side of the cavity 15 relative to the closed or top side of the cavity 15 when viewing fig. 18. In other words, the thermal management element 15 may preferably be arranged at the open side of the cavity 15, such as shown in fig. 18. Portions of the thermally conductive path may be located in the node 100 or the cavity 15, such as for conducting heat along the second substrate 20, if any. In addition, a thermally conductive material, such as graphite or copper, such as graphite flakes or copper tape, may be disposed on the primary substrate 60 and/or on the outer surface of the node 100. The strip may be arranged, for example, on the same side of the node 100 or on the same interface means as the open side of the cavity 15 of the first substrate film 10.

Fig. 19 schematically illustrates a further embodiment of an electrical node 100 provided with several related thermal management features, such as element 35.

In fig. 19, the thermal management element 35 may be arranged by injection molding from a thermally conductive material. Such a thermal management element 35 may be provided by a two-shot injection molding technique. Preferably, there may be openings, such as cuts or holes or through holes, in the primary substrate 60 and/or the secondary substrate 20 (if any) so that the material of the thermal management element 35 (such as the material of the heat spreader or heat pipe) becomes molded near the heat generating elements of the node 100.

Fig. 20 illustrates various applicable aspects of thermal management at 2000 in relation to an embodiment of an interface device in accordance with the present invention. The interface device or node 100 of fig. 20 may include a first connection element 45 and a connector 46 or other connection element of an external system 200, compatible with one of the interface devices 45. The device may further comprise several thermal management elements 35, 36, such as heat sinks and heat pipes, at least in thermal connection (if not physical connection) with the heat sink, which may further be considered to at least functionally establish a multi-part thermal management element. The heat pipe may preferably be disposed through host 60 and/or second substrate 20, if present. In fig. 20, the heat sink is located outside of the node 100 (i.e., the interface node), and the heat pipe is at least partially disposed in the node.

In some embodiments, the thermal management element 35 may include a heat sink that has been disposed, for example, in the housing 150 of any one or more of the connectors 45, 46. This is shown in fig. 20. The heat sink may be connected to the node 100 and/or the electrical components in the cavity 15, preferably by a thermally conductive path, such as including a heat pipe. This may be an advantageous arrangement for cooling high power components inside the node 100, such as amplifier or laser components. The heat sink or other thermal management element may be further cooled by a cooling fluid, such as air or a liquid, such as water. Thus, at least one connector 45 of the interface device may be a hybrid thermal/electrical connector.

The scope of the invention is to be determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments are constructed for illustrative purposes only, and that many other arrangements applying the principles described above may be readily prepared to best suit each potential use scenario. For example, instead of or in addition to molding the plastic directly onto the substrate 60, a plastic layer may be prepared in advance and then attached to the substrate by applying suitable lamination techniques such as adhesives, mechanical attachment means (screws, bolts, nails, etc.), pressure and/or heat. Finally, in some cases, instead of molding or casting, a suitable deposition or further alternative method may be used to produce a plastic or other layer on the target substrate. However, instead of printed (electrically) conductive tracks, tracks may be produced/provided in other ways. For example, a conductor film manufactured using etching or transfer lamination may be applied, among other options.