阅读说明：本技术 具有用于电子构件的安装位置的电路载体、电子电路和制造方法 (Circuit carrier with mounting locations for electronic components, electronic circuit and method of manufacture ) 是由 M.海曼 C.谢伦伯格 R.厄本 K.威尔克 于 2019-08-20 设计创作，主要内容包括：本发明涉及一种电路载体(12)或一种具有这种电路载体(12)的电子组件(11)以及用于制造电路载体(12)和电子组件(11)的方法。电路载体(12)和电子组件(11)具有用于电子构件(13)的安装位置(14),电子构件(13)通过连接部(16)、尤其烧结连接部被连接。按照本发明规定,设有凹空(22)和突出部(23),在对构件(13)和电路载体(12)之间的间隙(18)进行底部填充时,凹空(22)和突出部(23)导引底部填充材料(16)并且因此防止底部填充材料过早地合流。过早地合流即导致在底部填充材料中产生气泡,所述气泡降低底部填充的质量。这可以有利地被防止。(The invention relates to a circuit carrier (12) or an electronic component (11) having such a circuit carrier (12) and to a method for producing a circuit carrier (12) and an electronic component (11). The circuit carrier (12) and the electronic component (11) have mounting locations (14) for electronic components (13), the electronic components (13) being connected by a connection (16), in particular a sintered connection. According to the invention, recesses (22) and projections (23) are provided, which recesses (22) and projections (23) guide the underfill material (16) during the underfilling of the gap (18) between the component (13) and the circuit carrier (12) and thus prevent premature interflow of the underfill material. Premature confluence can result in the generation of bubbles in the underfill material that reduce the quality of the underfill. This can advantageously be prevented.)