阅读说明：本技术 电子部件的安装结构的制造方法、电子部件的安装结构电子模块、配线片 (Method for manufacturing electronic component mounting structure, electronic module having electronic component mounting structure, and wiring sheet ) 是由 三井亮介 佐藤隼也 田中敦史 松尾幸祐 于 2019-08-30 设计创作，主要内容包括：在配线板安装有电子部件的安装结构中,通过在自电子部件到配线板之间经由具有粘接剂层的配线片,将电子部件间接地安装在配线板上。电子部件直接安装在配线片的粘接剂层上,配线片的粘接剂层直接安装在配线板上。电子部件与配线板的导通通过电子部件与配线片的导通以及配线片与配线板的导通来实现。(In a mounting structure in which an electronic component is mounted on a wiring board, the electronic component is indirectly mounted on the wiring board through a wiring sheet having an adhesive layer between the electronic component and the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet, and the adhesive layer of the wiring sheet is directly mounted on the wiring board. The electrical connection between the electronic component and the wiring board is achieved by the electrical connection between the electronic component and the wiring sheet and the electrical connection between the wiring sheet and the wiring board.)

1. A method of manufacturing a mounting structure of an electronic component including the electronic component including a terminal and a wiring board including a first base and a first conductor pattern formed on the first base, in which mounting structure the electronic component is indirectly mounted on the wiring board, wherein,

the manufacturing method comprises:

a first step of manufacturing an electronic module by directly mounting the electronic component onto a wiring sheet, the wiring sheet comprising: a second base, an insulating adhesive layer formed on the second base, and a second conductor pattern formed on the adhesive layer, wherein in the electronic module, the terminals of the electronic component are in contact with the second conductor pattern, and at least a part of a surface of the electronic component other than a portion where the terminals are formed is adhered to at least a part of a surface of the adhesive layer other than a portion where the second conductor pattern is formed;

a second step of manufacturing the mounting structure in which the second conductor pattern is brought into contact with the first conductor pattern and at least a part of a surface of the adhesive layer exposed in the electronic module is adhered to at least a part of a surface of the wiring board by directly mounting the electronic module on the wiring board.

2. The method of claim 1, wherein,

one or both of the first base and the second base is made of a flexible film base.

3. The method of claim 1 or 2,

the second conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

4. A mounting structure of an electronic component, comprising:

the electronic component including a terminal;

a wiring board including a first base and a first conductor pattern formed on the first base;

a wiring sheet comprising: a second base, an insulating adhesive layer formed on the second base, and a second conductor pattern formed on the adhesive layer,

the terminals of the electronic component are in contact with the second conductor pattern,

at least a part of a surface of the electronic component other than the portion where the terminal is formed is adhered to at least a part of a surface of the adhesive layer other than the portion where the second conductor pattern is formed,

the second conductor pattern is in contact with the first conductor pattern,

at least a part of the surface of the adhesive layer other than the portion where the second conductor pattern is formed and the portion where the electronic component is bonded to at least a part of the surface of the wiring board.

5. The structure of claim 4, wherein,

one or both of the first base and the second base is made of a flexible film base.

6. The structure of claim 4 or 5, wherein,

the second conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

7. The structure according to any one of claims 4 to 6,

the electronic component is sandwiched by the wiring sheet and the wiring board which are bonded to each other.

8. An electronic module, comprising:

an electronic component, the electronic component comprising a terminal,

a wiring sheet comprising: a base, an insulating adhesive layer formed on the base, and a conductor pattern formed on the adhesive layer,

the terminals of the electronic component are in contact with the conductor pattern,

at least a part of the surface of the electronic component other than the portion where the terminal is formed is bonded to at least a part of the surface of the adhesive layer other than the portion where the conductor pattern is formed.

9. The electronic module of claim 8, wherein,

the base is made of a flexible film base.

10. The electronic module of claim 8 or 9,

the conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

11. A wiring sheet comprising:

a base;

an insulating adhesive layer formed on the base;

a conductor pattern formed on the adhesive layer,

the conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

12. The wiring sheet according to claim 11,

the base is made of a flexible film base.

Technical Field

The present invention relates to an electronic component mounting technique for mounting an electronic component on a wiring board.

Background

As an example of a method of mounting an electronic component to a wiring board without using heat (e.g., solder), a method using an adhesive is known. Patent document 1 discloses a mounting structure using an adhesive.

Fig. 1A, 1B, and 1C show a mounting structure disclosed in patent document 1. In this example, a microphone 20 as an electronic component is mounted on a wiring board (referred to as a wired substrate in patent document 1) 10. The microphone 20 is a MEMS microphone manufactured by using a MEMS (micro Electro Mechanical system) technology.

The wiring board 10 has a structure in which an insulating adhesive layer 12 is formed on one surface 11a of the film 11, and four conductor patterns 13 are further formed on the adhesive layer 12. The adhesive layer 12 is formed on the entire surface of the one surface 11a of the film 11. A pad 13a is formed at one end of each of the four conductor patterns 13, and a pad 13b is formed at the other end thereof.

Microphone 20 is attached to adhesive layer 12 by pressing microphone 20 against adhesive layer 12. In this state, the terminal 21 of the microphone 20 is in contact with the land 13a of the conductor pattern 13. The bottom surface 20a of microphone 20 is bonded to adhesive layer 12 at a portion where terminal 21 is not formed. Therefore, microphone 20 and adhesive layer 12 are mechanically bonded to each other. Since the elastic restoring force of the adhesive layer 12 acts as a load in the direction in which the terminal 21 and the land 13a are pressed against each other, a good and continuous electrical connection state between the terminal 21 and the land 13a can be obtained.

The surface of the wiring board 10 on which the conductor pattern 13 is formed, except for the portion where the microphone 20 is located and the portions where the four pads 13b are located, is covered with a protective film 30. In other words, the window 31 and the slit 32 are formed on the protective film 30.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 6293938

Patent document 1 discloses forming a conductor pattern by printing. However, it is not easy to form the conductor pattern on the adhesive layer, and it is troublesome and expensive to form the wiring board. This problem is more pronounced when it is desired to form a plurality of conductor patterns on the adhesive layer.

Disclosure of Invention

The invention aims to provide an electronic component mounting technique which can avoid the increase of the cost of a wiring board even if an adhesive is used.

The technical contents described herein are not intended to be explicitly or implicitly defined in the claims, and furthermore, do not indicate that persons other than the persons who benefit from the present invention (for example, applicants and patentees) can make such a definition of the invention in the claims, but merely explain for easy understanding of the gist of the present invention.

According to the present invention, the electronic component is indirectly mounted on the wiring board through the wiring sheet having the adhesive layer between the electronic component and the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet, and the adhesive layer of the wiring sheet is directly mounted on the wiring board. The electrical connection between the electronic component and the wiring board is achieved in a stepwise manner by the electrical connection between the electronic component and the wiring sheet and the electrical connection between the wiring sheet and the wiring board.

According to the present invention, since the electronic component is locally mounted on the wiring board using the wiring sheet on which the adhesive layer is formed, an increase in cost of the wiring board can be avoided even if the adhesive is used.

Drawings

Fig. 1A is a plan view of a prior art mounting structure.

Fig. 1B is a front view of a prior art mounting structure.

Fig. 1C is a partially enlarged sectional view of a prior art mounting structure.

Fig. 2A is a plan view of the mounting structure of the first embodiment.

Fig. 2B is a sectional view of the mounting structure of the first embodiment.

Fig. 3A is a front view of the electronic component.

Fig. 3B is a bottom view of the electronic component.

Fig. 4A is a plan view of the wiring sheet.

Fig. 4B is a sectional view of the wiring sheet.

Fig. 5A is a plan view of the electronic module.

Fig. 5B is a cross-sectional view of the electronic module.

Fig. 6 is a plan view (a part thereof is a perspective view) of the mounting structure of the second embodiment.

Fig. 7A is a front view of the electronic component.

Fig. 7B is a bottom view of the electronic component.

Fig. 8A is a plan view of the wiring sheet.

Fig. 8B is a front view of the wiring sheet.

Fig. 9 is a plan view (a part thereof is a perspective view) of the electronic module.

Fig. 10 is a plan view of the wiring board.

Fig. 11 is a sectional view of the mounting structure of the third embodiment.

Fig. 12 is a process flow of the manufacturing method.

Detailed Description

Embodiments of the present invention are explained with reference to the drawings.

(first embodiment)

Fig. 2A and 2B show a first embodiment of a mounting structure of electronic components. In this embodiment, first, the electronic module 50 is produced, and then the electronic module 50 is mounted on the wiring board 40 using an adhesive.

The electronic module 50 includes a wiring sheet 60 and an electronic component 70 mounted with the wiring sheet 60. The electronic component 70 has a cubic shape in this example, and has four terminals 71 on a bottom surface 70a of the electronic component 70 (see fig. 3A and 3B).

The wiring sheet 60 has a structure in which an elastically deformable insulating adhesive layer 62 is formed on one surface 61a of the base 61, and a conductor pattern 63 is further formed on the adhesive layer 62 (see fig. 4A and 4B). The adhesive layer 62 is formed on the entire surface of the one surface 61a of the base 61.

In this embodiment, the conductor pattern 63 includes four conductive wires 63 a. Two lead wires 63a are disposed in the right half of the rectangular wiring sheet 60, and the remaining two lead wires 63a are disposed in the left half. The inner ends of the four wires 63a are portions that are in direct contact with the four terminals 71 of the electronic component 70. The four lead wires 63a extend in a direction parallel to the long sides of the wiring sheet 60. The outer end of each lead 63a extends toward the short side of the wiring piece 60 and is separated from the short side by a predetermined distance.

In the wiring sheet 60, the base portion 61 is a flexible film base material. Examples of the material of the film base include PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and PI (polyimide).

Examples of the adhesive for the adhesive layer 62 include polyester, polyurethane, acrylic, epoxy, phenol, silicone, polyolefin, polyimide, vinyl, and natural polymer polymers. The polymer may be a polymer composed of one monomer or a polymer composed of two monomers.

For improving the adhesiveness and mechanical properties, a monomer or oligomer of, for example, polyester, polyurethane, acrylic, epoxy, phenol, silicone, polyolefin, polyimide, or ethylene may be mixed with the polymer.

The conductor pattern 63 is formed by printing using silver paste (silver ink), for example. The conductor pattern 63 may be formed by plating.

Fig. 5A and 5B show the electronic module 50. The electronic component 70 is directly mounted on the wiring sheet 60 by pressing the electronic component 70 on the adhesive layer 62 (step S1). The four terminals 71 are in direct contact with the inner ends of the four wires 63 a.

The terminals 71 of the electronic component 70 are electrically connected to the conductor patterns 63 by directly contacting the conductor patterns 63. The portions of the bottom surface 70a of the electronic component 70 where the terminals 71 are not formed are mechanically bonded to the adhesive layer 62 by adhering to the adhesive layer 62 (see fig. 5B). That is, a part of the surface of the electronic component 70 is bonded to a part of the surface of the adhesive layer 62, whereby the adhesive layer 62 and the electronic component 70 are mechanically bonded to each other.

Since the elastic restoring force of the adhesive layer 62 acts as a load in a direction in which the terminal 71 of the electronic component 70 and the conductor pattern 63 are pressed against each other, the terminal 71 can be electrically connected to the conductor pattern 63 in a satisfactory manner.

In this embodiment, the electronic component mounting structure in which the electronic component 70 is mounted to the wiring board 40 is produced by mounting the electronic module 50 to the wiring board 40.

The wiring board 40 is a general wiring board having a conductor pattern formed on a base 41. In this embodiment, the wiring board 40 is a flexible printed wiring board, and the material of the base 41 is a film base material. In fig. 2A and 2B, only a part of the wiring board 40 on which the electronic component 70 is mounted is shown, and details of the overall shape and structure of the wiring board 40 are omitted. A conductor pattern 42 including four wires 42a is formed on a part of the wiring board 40 on which the electronic component 70 is mounted. The four conductors 42a are in direct contact with the four conductors 63a of the electronic module 50.

The mounting of the electronic module 50 to the wiring board 40 is performed as follows.

The mounting structure is manufactured by directly mounting the electronic module on the wiring board (step S2). The electronic component 70 of the electronic module 50 is opposed to the surface of the wiring board 40 on which the conductor pattern 42 is formed. The four wires 63a of the conductor pattern 63 are made to face the four wires 42a of the conductor pattern 42 of the wiring board 40. By pressing the entire electronic module 50, the electronic module 50 is pressed against the wiring board 40. The portion of the wiring sheet 60 located around the electronic component 70 is deformed, and the outer ends of the four leads 63a of the conductor pattern 63 are in direct contact with the leads 42a of the conductor pattern 42 of the wiring board 40. As a result, the wiring sheet 60 is electrically connected to the wiring board 40. The upper surface 70b of the electronic component 70 is in direct contact with the base 41 of the wiring board 40.

The adhesive layer 62 that is in direct contact with the surface of the wiring board 40 due to the deformation of the wiring sheet 60 is adhered to the wiring board 40, and the adhesive layer 62 and the wiring board 40 are mechanically bonded to each other. That is, the mechanical bonding between the adhesive layer 62 and the wiring board 40 is achieved by a part of the adhesive layer 62 (specifically, a part of the surface on which the conductor pattern 63 is not formed and the electronic component 70 is not mounted) adhering to at least one of the surface of the conductor pattern 42 of the wiring board 40 and the surface of the base 41 on which the conductor pattern 42 is not formed. The mechanical bonding portion between the adhesive layer 62 and the wiring board 40 surrounds the electronic component 70.

Since the elastic restoring force of the adhesive layer 62 acts as a load in a direction in which the conductor pattern 63 and the conductor pattern 42 of the wiring board 40 are pressed against each other, the conductor pattern 63 and the conductor pattern 42 can be electrically connected well.

The first embodiment of the mounting structure of the electronic component is described together with the manufacturing method of the mounting structure, but the following effects can be obtained according to the first embodiment.

(1) Since an adhesive is used, the electronic component can be easily mounted on the wiring board. In this embodiment, first, the electronic module 50 is manufactured by mounting the electronic component 70 on the adhesive layer 62 of the wiring sheet 60, and then, the adhesive layer 62 of the electronic module 50 is locally mounted on the mounting portion of the wiring board 40. Therefore, it is not necessary to form an adhesive layer on the entire surface of the wiring board, that is, a general wiring board without an adhesive layer may be used. Therefore, an increase in the cost of the wiring board can be avoided.

(2) An electronic module including electronic components may be manufactured as a module common to various types of wiring boards or a general-purpose module. Therefore, improvement in production efficiency can be expected.

(3) The mounting structure of the present embodiment is sandwiched by the wiring board and the wiring sheet that are bonded to each other. In particular, since the electronic component is covered with the wiring board and the wiring sheet, more specifically, the electronic component is located inside the closed space formed by the closed-loop adhesive section between the adhesive layer and the wiring board, the electronic component is not exposed to the outside. That is, the waterproofness of the electronic component can be ensured.

(4) According to the mounting structure of the related art (see fig. 1A to 1C), the adhesion area between the electronic component 20 and the adhesive layer 12 is small. If the wiring board 10 is bent so that the surface on which the electronic component is mounted is on the outside, the terminals 21 of the electronic component 20 may be displaced from the conductor patterns 13 or the electronic component 20 may be detached. However, in the present embodiment, the electronic component 70 is sandwiched between the wiring sheet 60 and the wiring board 40, and the area of adhesion between the adhesive layer 62 of the wiring sheet 60 and the wiring board 40 is significantly increased, thereby preventing the above-described problems from occurring. Therefore, a mounting structure strong against bending and high in reliability is realized.

(second embodiment)

The conductor pattern of the wiring sheet functions to connect the terminals of the electronic component and the conductor pattern of the wiring board. In the first embodiment, two conductive wires 63a of the conductor pattern 63 extend in parallel at a prescribed arrangement interval on the right side of the electronic component 70, and the remaining two conductive wires 63a of the conductor pattern 63 extend in parallel at a prescribed arrangement interval on the left side of the electronic component 70 (see fig. 4A). However, in the second embodiment, the conductor pattern of the wiring sheet includes two or more lead wires whose pitch varies in the extending direction of the adjacent two lead wires. Fig. 6 shows a mounting structure of an electronic component according to a second embodiment. In each drawing, only a part of the wiring board 110 on which the electronic component 80 is mounted is shown.

The electronic component 80 is a microcomputer chip that can be mounted on the surface of a substrate or the like. In each of four sides of the square bottom surface 80a of the electronic component 80, 12 terminals 81 are arranged (see fig. 7A and 7B).

As with the wiring sheet 60, an adhesive layer 92 is formed on the entire surface 91a of the base portion 91 of the wiring sheet 90 (see fig. 8B). A conductor pattern 93 is formed on the adhesive layer 92. Since the conductor pattern 93 is very thin compared to the base portion 91 and the adhesive layer 92, illustration of the conductor pattern 93 is omitted in fig. 8B. The conductor pattern 93 includes 48 wires 93 a. The 12 lead wires 93a extend from each of the four sides of the square wiring piece 90 toward the center of the wiring piece 90. The inner ends of the 48 wires 93a are in direct contact with the 48 terminals 81 of the electronic component 80. The outer ends of the 48 leads 93a are spaced apart from the edge of the wiring piece 90 by a predetermined distance. The constituent materials of the base 91 and the adhesive layer 92 are the same as those of the base 61 and the adhesive layer 62 in the first embodiment, respectively.

Regarding the 48 conductive wires 93a, the pitch between two adjacent conductive wires 93a changes along the extending direction of the two adjacent conductive wires 93a (see fig. 8A). The pitch of the inner ends of the two adjacent conductive wires 93a is narrower than the pitch of the outer ends of the 12 conductive wires 93a extending from the upper side of the wiring sheet 90, and similarly, the pitch of the inner ends of the two adjacent conductive wires 93a is narrower than the pitch of the outer ends of the 12 conductive wires 93a extending from the lower side of the wiring sheet 90. The pitch of the inner ends of the two adjacent wires 93a is wider than the pitch of the outer ends of the 12 wires 93a extending from the right side of the wiring sheet 90, and similarly, the pitch of the inner ends of the two adjacent wires 93a of the 12 wires 93a extending from the left side of the wiring sheet 90 is wider than the pitch of the outer ends.

By mounting the electronic component 80 on the wiring sheet 90, the electronic module 100 shown in fig. 9 is produced.

The wiring board 110 is a flexible printed wiring board, as in the wiring board 40 in the first embodiment. A predetermined conductor pattern 112 is formed on the base portion 111. The conductor pattern 112 includes 48 wires 112 a. The 48 wires 112a of the conductor pattern 112 are in direct contact with the 48 wires 93a of the conductor pattern 93.

By mounting the electronic module 100 to the wiring board 110, thereby producing a mounting structure of electronic components in which the electronic components 80 are mounted to the wiring board 110. The mechanical bonding of the adhesive layer 92 to the electronic component 80 and the mechanical bonding of the adhesive layer 92 to the wiring board 110 are the same as in the first embodiment.

(third embodiment)

In the first and second embodiments, the wiring boards 40 and 110 are flexible printed wiring boards, and the base 41 and the base 111 are made of a flexible film base material. However, the base portion 41 and the base portion 111 may be made of a hard base material having no flexibility.

If the conditions such as the thickness of the adhesive layer are sufficient and mechanical bonding by adhesion is achieved, the material of either or both of the base portion of the wiring board and the base portion of the wiring sheet may be a hard base material.

Fig. 11 shows a mounting structure of an electronic component 150 in which the base portion 121 of the wiring board 120 and the base portion 141 of the wiring sheet 140 of the electronic module 130 are each made of a hard base material, as a third embodiment.

For example, if the adhesive layer 142 is formed thicker than the electronic component 150, which is a sufficiently small and thin chip resistor, the electronic component mounting structure shown in fig. 11 can be realized even if the base portion 121 and the base portion 141 are hard. In fig. 11, reference numeral 143 denotes a conductor pattern of the wiring sheet 140, reference numeral 122 denotes a conductor pattern of the wiring board 120, and reference numeral 151 denotes a terminal of the electronic component 150.

(fourth embodiment)

Although not shown, in the case where the electronic component 150 extending from the bottom surface facing the base 141 to the terminals 151 facing the wiring board 120 is formed, the conductor pattern 122 of the wiring board 120 may be in direct contact with not only the conductor pattern 143 but also the portions facing the terminals 151 of the wiring board 120. That is, in the case of mounting an electronic component of a type having terminals extending on both the front and back surfaces, a mounting structure in which the terminals of the electronic component are sandwiched by the conductor pattern of the wiring board and the conductor pattern of the wiring sheet can also be realized. Of course, such a mounting structure can be realized regardless of the material of the base of the wiring board or the material of the base of the wiring sheet.

In the present specification and claims, ordinal numbers (for example, "the first" to which a combination of a Chinese character, a number, or an operator number is added to a prefix "the second") are not particularly limited, and the meaning of elements modified by or combined with ordinal numbers is not limited by the order of the elements or the number of the elements, regardless of the ordinal number definition. The use of ordinal numbers is not particularly limited, and two or more elements are simply represented by convenient expression methods for distinguishing one element from another. Thus, for example, the word "first X" and the word "second X" are expressions used to distinguish two Xs, and do not necessarily indicate that the total number of Xs is 2, or, alternatively, do not necessarily mean that the first X must precede the second X.

Within the scope of this specification and claims, the term "comprise" and its conjugations are used as non-exclusive expressions. For example, the statement "X contains A and B" does not deny that X contains other components (e.g., C) than A and B. Similarly, if a sentence in the scope of the specification and the request includes a sentence combined with the term "include" or a part of speech thereof changed to a negative word, the sentence refers to only the subject sentence. Thus, for example, the sentence "X does not include a and B" assumes that there is a possibility that X includes other components than a and B. Further, the term "or" as used in the specification or claims is not intended to have an exclusive logical sum meaning.

In the present disclosure, where an article or word similar to the article is added by translation, such as "a," "an," and "the" in english, the disclosure may also include nouns following the word in plural forms.

The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. Various changes and modifications can be made without departing from the spirit of the present invention. The embodiments were chosen and described in order to explain the principles of the invention and its practical application. The present invention is used as various embodiments of various modifications and variations, and is determined by the intended use of the various modifications and variations. All such variations and modifications are intended to be included within the scope of the invention as defined in the appended claims, and the same protection is afforded in the light of the breadth to which they are entitled in light of the foregoing disclosure of fairness, legality, and equity.

The claims (modification according to treaty clause 19)

1. A method of manufacturing a mounting structure of an electronic component including the electronic component including a terminal and a wiring board including a first base and a first conductor pattern formed on the first base, in which mounting structure the electronic component is indirectly mounted on the wiring board, wherein,

the manufacturing method comprises:

a first step of manufacturing an electronic module by directly mounting the electronic component onto a wiring sheet, the wiring sheet comprising: a second base, an insulating adhesive layer formed on the second base, and a second conductor pattern formed on the adhesive layer, wherein in the electronic module, the terminals of the electronic component are in contact with the second conductor pattern, and at least a part of a surface of the electronic component other than a portion where the terminals are formed is adhered to at least a part of a surface of the adhesive layer other than a portion where the second conductor pattern is formed;

a second step of manufacturing the mounting structure in which the second conductor pattern is brought into contact with the first conductor pattern and at least a part of a surface of the adhesive layer exposed in the electronic module is adhered to at least a part of a surface of the wiring board by directly mounting the electronic module on the wiring board.

2. The method of claim 1, wherein,

one or both of the first base and the second base is made of a flexible film base.

3. The method of claim 1 or 2,

the second conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

4. A mounting structure of an electronic component, comprising:

the electronic component having an upper surface and a bottom surface opposite to each other, the bottom surface having a terminal;

a wiring board including a first base and a first conductor pattern formed on the first base;

a wiring sheet comprising: a second base, an insulating adhesive layer formed on the second base, and a second conductor pattern formed on the adhesive layer,

the terminals of the electronic component are in contact with the second conductor pattern,

at least a part of the bottom surface of the electronic component other than the portion where the terminal is formed is bonded to at least a part of the surface of the adhesive layer other than the portion where the second conductor pattern is formed,

the second conductor pattern is in contact with the first conductor pattern,

the upper surface of the electronic component is in direct contact with the first base of the wiring board,

at least a part of the surface of the adhesive layer other than the portion where the second conductor pattern is formed and the portion where the electronic component is bonded to at least a part of the surface of the wiring board.

5. The structure of claim 4, wherein,

one or both of the first base and the second base is made of a flexible film base.

6. The structure of claim 4 or 5, wherein,

the second conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

7. The structure according to any one of claims 4 to 6,

the electronic component is sandwiched by the wiring sheet and the wiring board which are bonded to each other.

8. An electronic module, comprising:

an electronic component, the electronic component comprising a terminal,

a wiring sheet comprising: a base, an insulating adhesive layer formed on the base, and a conductor pattern formed on the adhesive layer,

the terminals of the electronic component are in contact with the conductor pattern,

at least a part of the surface of the electronic component other than the portion where the terminal is formed is bonded to at least a part of the surface of the adhesive layer other than the portion where the conductor pattern is formed.

9. The electronic module of claim 8, wherein,

the base is made of a flexible film base.

10. The electronic module of claim 8 or 9,

the conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

11. A wiring sheet comprising:

a base;

an insulating adhesive layer formed on the base;

a conductor pattern formed on the adhesive layer,

the conductor pattern comprises a plurality of conductive lines,

the pitch of two adjacent wires of the plurality of wires varies along the extending direction of the two adjacent wires.

12. The wiring sheet according to claim 11,

the base is made of a flexible film base.