阅读说明：本技术 柔性导电薄膜的生产加工系统及制备工艺 (Production and processing system and preparation process of flexible conductive film ) 是由 贾孟 于 2020-09-05 设计创作，主要内容包括：本发明公开了柔性导电薄膜的生产加工系统及制备工艺,涉及基材镀膜领域；该生产加工系统包括薄膜贴合装置,用于将产品薄膜基材与衬底薄膜基材贴合形成复合薄膜,第一真空镀膜装置,用于在复合薄膜基材表面形成磁控溅射镀膜；第二真空镀膜装置,位于第一真空镀膜装置后方,用于在磁控溅射镀膜上形成第一金属镀层；第一水镀装置,位于第二真空镀膜装置后方,采用碱性水镀设备,在第一金属镀层上形成过渡金属镀层；第二水镀装置,位于第三真空镀膜装置后方,采用酸性水镀设备,在第一金属镀层上形成增厚金属镀层,剥离装置,用于将产品薄膜基材与衬底薄膜基材进行剥离；本发明的有益效果是：能够避免蒸镀工艺的高温因素对膜面串泡和孔洞的影响,可以有效的解决串泡问题,同时解决原蒸镀工艺的高温金属微粒将基膜击穿的孔洞问题。(The invention discloses a production processing system and a preparation process of a flexible conductive film, and relates to the field of substrate coating; the production processing system comprises a film attaching device, a first vacuum coating device and a second vacuum coating device, wherein the film attaching device is used for attaching a product film substrate and a substrate film substrate to form a composite film; the second vacuum coating device is positioned behind the first vacuum coating device and is used for forming a first metal coating on the magnetron sputtering coating; the first water plating device is positioned behind the second vacuum plating device, and a transition metal plating layer is formed on the first metal plating layer by adopting alkaline water plating equipment; the second water plating device is positioned behind the third vacuum coating device, a thickened metal coating is formed on the first metal coating by adopting acid water plating equipment, and the stripping device is used for stripping the product film base material and the substrate film base material; the invention has the beneficial effects that: the influence of high-temperature factors of the evaporation process on film surface bubble bunching and holes can be avoided, the problem of bubble bunching can be effectively solved, and the problem of the holes of the base film punctured by high-temperature metal particles of the original evaporation process is solved.)

1. A production and processing system for a flexible conductive film, comprising:

the film laminating device is used for laminating the product film base material and the substrate film base material to form a composite film base material;

the first vacuum coating device is used for forming a magnetron sputtering coating on the surface of the composite film substrate;

the second vacuum coating device is positioned behind the first vacuum coating device and is used for forming a first metal coating on the magnetron sputtering coating;

the first water plating device is positioned behind the second vacuum plating device and is used for forming a transition metal plating layer on the first metal plating layer;

and the second water plating device is positioned behind the first water plating device and is used for forming a thickened metal plating layer on the transition metal plating layer.

And the film stripping device is used for stripping the product film base material and the substrate film base material.

2. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the film laminating device is a film laminating machine, and the stripping device is a stripping machine.

3. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acidic water plating equipment; or the first water plating device and the second water plating device both adopt acid water plating equipment.

4. The system for manufacturing and processing a flexible conductive film according to claim 3, wherein: and a third vacuum coating device is arranged between the first water plating device and the second water plating device and is used for forming a second metal coating on the transition metal coating, and the thickened metal coating is formed on the second metal coating.

5. The production and processing system of a flexible conductive film according to claim 4, wherein: the metal plated on the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickening metal plating layer are all copper, namely, the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickening metal plating layer are all copper plated layers.

6. The production and processing system of a flexible conductive film according to claim 4, wherein: the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all adopt magnetron sputtering coating equipment, and the thicknesses of the first metal coating and the second metal coating are 8-15 nm.

7. The production and processing system of a flexible conductive film according to claim 6, wherein: the first vacuum coating device, the second vacuum coating device and the third vacuum coating device can be the same magnetron sputtering coating equipment.

8. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the magnetron sputtering coating is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.

9. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the thickness of the magnetron sputtering coating is 2-10 nm.

10. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the thickness of the transition metal coating is 50-250 nm.

11. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the thickness of the thickened metal coating is 600-950 nm.

12. The system for manufacturing and processing a flexible conductive film according to claim 1, wherein: the backing film substrate includes, but is not limited to, a PP film, a PE film, or a PET film.

13. The system for manufacturing and processing flexible conductive film according to claim 1, wherein said product film substrate includes but is not limited to PP film, PE film or PET film.

14. A preparation process of a flexible conductive film is used for plating a metal film on the surface of a film substrate and is characterized by comprising the following steps:

s1, coating a layer of release agent on each of the two surfaces of the substrate film base material to form a release layer with the thickness of 0.3-1 um.

And S2, adhering a layer of product film base material on the surfaces of the two release layers respectively to form a first composite film base material.

S3, coating a film on the surface of the first composite film substrate by adopting a vacuum coating device to form a magnetron sputtering alloy layer with the thickness of 2-10 nm;

s4, forming a first metal plating layer with the thickness of 8-15nm on the magnetron sputtering alloy layer through a vacuum coating device;

s5, forming a transition metal plating layer of 50-250nm on the first metal plating layer through a first water plating device;

and S6, forming a thickened metal plating layer with the thickness of 600-950nm on the transition metal plating layer through a second water plating device.

And S7, peeling the substrate film base material and the two layers of product base materials from the release layer, thereby simultaneously obtaining two rolls of product films with single surfaces plated with metal.

And S8, the two rolls of product films plated with the metal on the single side in the S7 pass through the steps from S1 to S2, the metal plated side is attached to the release layer in the step from S2, and then the two rolls of product films plated with the metal on the double sides are obtained through S3-S7.

15. The process for preparing a flexible conductive film according to claim 14, wherein: between the steps S5 and S6, there is a step S51: forming a second metal coating with the thickness of 8-15nm on the transition metal coating by a vacuum coating device;

step S6 is: and forming a thickened metal coating with the thickness of 600-950nm on the second metal coating by using a second water plating device.

16. The process for preparing a flexible conductive film according to claim 15, wherein: in the step S51, the second metal plating layer is formed to compensate the uniformity and compactness of the overall plating layer of the flexible conductive film, so that the elongation of the film coil is not less than 3%.

17. The process for preparing a flexible conductive film according to claim 14, wherein: in the step S5, the sheet resistance of the metal plating film formed on the outer surface of the flexible conductive film is reduced to 800m Ω or less by forming the transition metal plating layer.

18. The process for preparing a flexible conductive film according to claim 14, wherein: the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acidic water plating equipment; or the first water plating device and the second water plating device both adopt acid water plating equipment; or the first water plating device and the second water plating device both adopt alkaline water plating equipment.

19. The process for preparing a flexible conductive film according to claim 14, wherein: the first water plating device and the second water plating device adopt the same acidic water plating equipment.

Technical Field

The invention relates to the field of flexible coiled material processing, in particular to a production processing system and a preparation process of a flexible conductive film coiled material.

Background

Vacuum coating mainly refers to a type of coating which needs to be carried out under a higher vacuum degree, and specifically comprises various types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and the like. Mainly divided into evaporation and sputtering. The evaporation coating is generally to heat a target material to evaporate surface components in the form of atomic groups or ions, and deposit the surface components on a substrate to form a thin film through a film forming process (scattering-island structure-labyrinth structure-layer growth). In the sputtering type coating, it can be simply understood that electrons or high-energy laser is utilized to bombard a target material, and surface components are sputtered out in the form of atomic groups or ions and finally deposited on the surface of a substrate, and subjected to a film forming process to finally form a thin film.

Chinese patent document CN108531876A discloses a coating process, which specifically discloses the following: the process flow is that a metal film is plated on an ultrathin substrate to obtain a plated film product with improved adhesive force, wherein the process flow comprises the steps of firstly adopting a magnetron plating film of 5-50nm on the surface of the ultrathin substrate, and then plating a plating film of 600-1000nm in water; or the process flow is as follows, firstly adopting magnetic control coating film 5-50nm on the surface of the ultrathin substrate, then evaporating the coating film 100-700nm, and finally water coating the coating film 100-800 nm. In the application of the specific lithium battery current collector, the properties of the substrate and the coating (metal coating) and the thickness range of the coating are a better selection combination, and on the basis, the bonding force of the film layer between the magnetic control coating film and the water coating film is better reflected.

The process route of combining evaporation coating with water plating coating has the following two outstanding technical problems when producing flexible conductive film coiled materials: firstly, the problem of bubble bunching: the base film adopted by the flexible conductive film coiled material product is a stretching process, local deformation is easy to occur in the process, and when the evaporation coating process is carried out, the deformation of the base film is deteriorated due to the higher temperature of the evaporation coating process, so that a series of deformation in the film moving direction is generated, namely string bubbles. Two problems can appear in the industrial chain processing use after adopting this flexible conductive film coiled material product to carry out: firstly, in the film moving process, as the film surface has bubbles, folds are easy to generate in the bubble area, and the product yield is influenced. Secondly, in the post-processing process of users, the bubble area on the film surface ensures that the evenness of the tape-out and various surface treatments of the post-process cannot be ensured, thereby influencing the consistency of products. In response to the problem, the current process route cannot meet the requirements of product consistency and goodness, and from the practical estimation, the bubble-string will cause about 30% loss of goodness to the product. Secondly, the problem of holes: when a base film of a flexible conductive film coiled material product is subjected to an evaporation coating process, due to the fact that the temperature of the evaporation coating process is high and has small fluctuation, high-temperature metal particles caused by uneven evaporation in the film moving process are prone to breakdown the base film to form holes, and the size of the holes can reach the millimeter level to the maximum. And the product yield of the flexible conductive film usually requires that the holes are not more than 500 um. This defect can cause the surface treatment in-process to leak material phenomenon in the industry chain processing use after to have certain probability can cause very big safety risk to the terminal product.

Disclosure of Invention

In order to solve the above problems, an object of the present invention is to provide a flexible conductive film production system and a flexible conductive film production process, so as to solve the problems of bubble formation and holes in the flexible conductive film during the production process, and the problem of low overall product quality after the production is finished.

In order to achieve the above object, there is provided a production processing system of a flexible conductive film, comprising:

the film laminating device is used for laminating the product film base material and the substrate film base material to form a composite film;

the first vacuum coating device is used for forming a magnetron sputtering coating on the surface of the composite film substrate;

the second vacuum coating device is positioned behind the first vacuum coating device and is used for forming a first metal coating on the magnetron sputtering coating;

the first water plating device is positioned behind the second vacuum plating device and is used for forming a transition metal plating layer on the first metal plating layer;

and a second water plating device which is positioned behind the first water plating device and is used for forming a thickened metal plating layer on the transition metal plating layer;

and the film stripping device is used for stripping the substrate film base material and the product film base material from the release layer.

Preferably, in the present invention, the film laminating apparatus is a film laminating machine, and the film peeling apparatus is a peeling machine.

Preferably, in the present invention, the first water plating apparatus may employ one of an alkaline water plating device and an acidic water plating device, and the second water plating apparatus employs an acidic water plating device.

Preferably, in the present invention, a third vacuum plating device is further disposed between the first water plating device and the second water plating device, the third vacuum plating device is configured to form a second metal plating layer on the transition metal plating layer, and the thickened metal plating layer is formed on the second metal plating layer.

Preferably, in the present invention, the metal layers of the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickened metal plating layer are all copper, that is, the first metal plating layer, the transition metal plating layer, the second metal plating layer and the thickened metal plating layer are all copper plating layers.

Preferably, in the invention, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all adopt magnetron sputtering coating equipment, and the thicknesses of the first metal coating and the second metal coating are 8-15 nm.

Preferably, in the present invention, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device may be the same magnetron sputtering coating apparatus.

Preferably, in the present invention, the magnetron sputtering coating film is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.

Preferably, in the invention, the thickness of the magnetron sputtering coating is 2-10 nm.

Preferably, in the present invention, the thickness of the transition metal plating layer is 50 to 250 nm.

Preferably, in the present invention, the thickness of the thickened metal plating layer is 600-950 nm.

Preferably, in the present invention, the backing film base material includes, but is not limited to, a PP film, a PE film or a PET film.

Preferably, in the present invention, the product film substrate includes, but is not limited to, a PP film, a PE film or a PET film.

The invention also provides a preparation process of the flexible conductive film, which comprises the following steps:

s1, coating a layer of release agent on each of the two surfaces of the substrate film base material to form a release layer with the thickness of 0.3-1 um.

And S2, adhering a layer of product film base material on the surfaces of the two release layers respectively to form a first composite film base material.

S3, coating films on both surfaces of the first composite film substrate by adopting a vacuum coating device to form a magnetron sputtering alloy layer with the thickness of 2-10 nm;

s4, forming a first metal plating layer with the thickness of 8-15nm on the magnetron sputtering alloy layer through a vacuum coating device;

s5, forming a transition metal plating layer of 50-250nm on the first metal plating layer through a first water plating device;

and S6, forming a thickened metal plating layer with the thickness of 600-950nm on the transition metal plating layer through a second water plating device.

And S7, peeling the substrate film base material and the two layers of product film base materials from the release layer, thereby simultaneously obtaining two rolls of product films with single surfaces plated with metal.

And S8, the two rolls of product films plated with the metal on the single side in the S7 pass through the steps from S1 to S2, the metal plated side is attached to the release layer in the step from S2, and then the two rolls of product films plated with the metal on the double sides are obtained through S3-S7.

Wherein, between the step S5 and the step S6, there is a step S51: forming a second metal coating with the thickness of 8-15nm on the transition metal coating by a vacuum coating device;

step S6 is: and forming a thickened metal coating with the thickness of 600-950nm on the second metal coating by using a second water plating device.

In step S51, the second metal plating layer is formed to compensate the uniformity and compactness of the overall plating layer of the flexible conductive film, so that the elongation of the film coil is not less than 3%.

In step S5, the sheet resistance of the metal plating film formed on the outer surface of the flexible conductive film is reduced to 800m Ω or less by the formation of the transition metal plating layer.

Wherein the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acidic water plating equipment; or the first water plating device and the second water plating device both adopt acid water plating equipment; or the first water plating device and the second water plating device both adopt alkaline water plating equipment.

The invention has the beneficial effects that: because the water plating equipment is adopted to replace the vacuum evaporation equipment, the transition metal coating can avoid the influence of high-temperature factors of the evaporation process on film surface serial bubbles and holes, and can effectively solve the problem of serial bubbles; meanwhile, the problem of holes formed by breaking down the base film by high-temperature metal particles in the original evaporation process is solved, and the product goodness can be doubled.

Drawings

FIG. 1 is a flow chart of an embodiment of a process for preparing a flexible conductive film according to the present invention;

fig. 2 is a flow chart of another embodiment of the process for preparing the flexible conductive film of the present invention.

Detailed Description

The invention is further illustrated with reference to the following figures and examples.

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.

In addition, the apparatuses appearing in the present invention, such as the film laminating machine, the vacuum double-sided coating apparatus, the water-coating apparatus, and the peeling machine, are prior art, and therefore, will not be described in the following description.