阅读说明：本技术 具有导电性图案区域的结构体及其制造方法、层积体及其制造方法、以及铜布线 (Structure having conductive pattern region and method for manufacturing the same, laminate and method for manufacturing the same, and copper wiring ) 是由 斋藤正人 汤本彻 鹤田雅典 于 2018-07-18 设计创作，主要内容包括：本发明提供一种能够大大简化制造工序、导电性图案区域之间的电绝缘性优异、并且可靠性高的具有导电性图案区域的结构体。具有导电性图案区域的结构体(10)具备支撑体(11)、以及配置在支撑体所构成的面上的层(14),在层(14)中,包含氧化铜和含磷有机物的绝缘区域(12)与包含铜的导电性图案区域(13)相互邻接地配置。另外,层积体具备支撑体、配置在支撑体所构成的面上的包含氧化铜和磷的涂布层、以及按照覆盖涂布层的方式配置的树脂层。(The invention provides a structure having conductive pattern regions, which can greatly simplify the manufacturing process, has excellent electrical insulation between conductive pattern regions, and has high reliability. A structure (10) having a conductive pattern region is provided with a support (11) and a layer (14) arranged on the surface constituted by the support, wherein in the layer (14), an insulating region (12) containing copper oxide and a phosphorus-containing organic substance and a conductive pattern region (13) containing copper are arranged adjacent to each other. The laminate further comprises a support, a coating layer comprising copper oxide and phosphorus, which is disposed on the surface constituted by the support, and a resin layer disposed so as to cover the coating layer.)

1. A structure comprising a support and a layer disposed on a surface of the support, wherein a conductive pattern region containing copper and an insulating region containing copper oxide and phosphorus are adjacent to each other in the layer.

2. A structure comprising a support and a layer disposed on a surface of the support, wherein a conductive pattern region containing copper and an insulating region containing copper oxide and hydrazine or hydrazine hydrate are adjacent to each other in the layer.

3. A structure comprising a support and a layer disposed on a surface of the support, wherein a conductive pattern region containing copper and an insulating region containing copper oxide, phosphorus and hydrazine or hydrazine hydrate are adjacent to each other.

4. A structure comprising a support and a layer disposed on a surface of the support, wherein a conductive pattern region containing copper and phosphorus and an insulating region containing copper oxide and phosphorus are adjacent to each other in the layer.

5. The structure according to claim 1, claim 3, or claim 4, wherein the copper oxide in the insulating region is fine particles containing the copper oxide, the phosphorus is a phosphorus-containing organic substance, and a content of the phosphorus-containing organic substance is 5 parts by volume or more and 900 parts by volume or less when a total volume of the fine particles is 100 parts by volume.

6. The structure according to any one of claims 1 to 5, wherein a resin layer having an oxygen barrier property is disposed on the layer.

7. The structure according to claim 6, wherein an opening for electrically connecting to the conductive pattern region is provided in a part of the resin layer.

8. A structure as claimed in any of claims 1 to 7, wherein the layer is disposed on the support having a three-dimensional face.

9. The structure according to any one of claims 1 to 8, wherein the copper contained in the conductive pattern region is reduced copper obtained by reducing the copper oxide.

10. A laminate comprising a support, a coating layer comprising copper oxide and phosphorus and disposed on a surface of the support, and a resin layer disposed so as to cover the coating layer.

11. A laminate comprising a support, a coating layer comprising copper oxide and hydrazine or hydrazine hydrate and disposed on a surface constituted by the support, and a resin layer disposed so as to cover the coating layer.

12. A laminate comprising a support, a coating layer comprising copper oxide, phosphorus and hydrazine or hydrazine hydrate, the coating layer being disposed on a surface of the support, and a resin layer disposed so as to cover the coating layer.

13. The laminate according to any one of claims 10 to 12, wherein the copper oxide is fine particles containing the copper oxide, the phosphorus is a phosphorus-containing organic substance, and the content of the phosphorus-containing organic substance is 5 parts by volume or more and 900 parts by volume or less, when the total volume of the fine particles is 100 parts by volume.

14. The laminate of any one of claims 10 to 13, wherein the coating layer is disposed on the support having a three-dimensional surface.

15. A copper wiring including reduced copper in which copper oxide is reduced, phosphorus, and carbon, wherein the concentration ratio of phosphorus/copper element is 0.02 to 0.30, and the concentration ratio of carbon/copper element is 1.0 to 6.0.

16. The copper wiring according to claim 15, wherein an arithmetic mean roughness Ra of the surface of the copper wiring is 20nm or more and 500nm or less.

17. A method for manufacturing a structure, comprising the steps of:

a step of disposing a coating layer containing copper oxide and a phosphorus-containing organic substance on a surface constituted by a support; and

and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region including the copper oxide and phosphorus and a conductive pattern region including the copper are arranged adjacent to each other on a surface of the support.

18. A method for manufacturing a structure, comprising the steps of:

a step of disposing a coating layer containing copper oxide and hydrazine or hydrazine hydrate on a surface constituted by a support; and

and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region including the copper oxide and the hydrazine or hydrazine hydrate and a conductive pattern region including the copper are arranged adjacent to each other on a surface of the support.

19. A method for manufacturing a structure, comprising the steps of:

disposing a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate on the surface constituted by the support; and

and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region containing the copper oxide and phosphorus and containing the hydrazine or hydrazine hydrate and a conductive pattern region containing the copper are arranged adjacent to each other on a surface constituted by the support.

20. The method of manufacturing a structure according to any one of claims 17 to 19, further comprising a step of disposing a first resin layer so as to cover the coating layer.

21. The method of manufacturing a structure according to claim 20, wherein the light is selectively irradiated to the coating layer through either the first resin layer or the support.

22. The method of manufacturing a structure according to any one of claims 17 to 21, further comprising a step of removing the insulating region from the layer.

23. The method of manufacturing a structure according to claim 22, further comprising a step of disposing a second resin layer so as to cover at least the conductive pattern region.

24. The method for manufacturing a structure according to any one of claims 17 to 23, wherein the light beam is a laser beam having a central wavelength of 355nm to 532 nm.

25. A method for producing a laminate, comprising the steps of:

a step of disposing a coating layer containing copper oxide and a phosphorus-containing organic substance on a surface constituted by a support; and

and disposing a resin layer so as to cover the coating layer.

26. A method for producing a laminate, comprising the steps of:

a step of disposing a coating layer containing copper oxide and hydrazine or hydrazine hydrate on a surface constituted by a support; and

and disposing a resin layer so as to cover the coating layer.

27. A method for producing a laminate, comprising the steps of:

disposing a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate on the surface constituted by the support; and

and disposing a resin layer so as to cover the coating layer.

Technical Field

The present invention relates to a structure having a conductive pattern region and a method for manufacturing the same, a laminate and a method for manufacturing the same, and a copper wiring.

Background

The circuit board has a structure in which conductive wiring is provided on a substrate. The method of manufacturing the circuit board is generally as follows. First, a photoresist is applied to a substrate to which a metal foil is bonded. Next, the photoresist is exposed and developed to obtain a desired shape of a circuit pattern in a form of a bottom plate. Next, the metal foil in the portion not covered with the photoresist is removed by chemical etching to form a pattern. Thus, a high-performance conductive substrate can be manufactured.

However, the conventional method has disadvantages of a large number of steps, complexity, and the need for a photoresist material.

In contrast, a direct wiring printing technique for directly printing a desired wiring pattern on a substrate using a dispersion (hereinafter also referred to as "paste material") in which fine particles selected from the group consisting of metal fine particles and metal oxide fine particles are dispersed has received attention. This technique requires a small number of steps, does not require the use of a photoresist material, and has an extremely high productivity.

As an example of a direct printing wiring technique, a technique is known in which a paste material is printed on a support by screen printing or inkjet printing, and then the paste material is thermally fired to obtain a wiring pattern with low resistance (see, for example, patent document 1).

In addition, a method is known in which a paste material is applied to the entire surface of a substrate, and the paste material is selectively thermally fired by irradiating the paste material with a laser beam in a pattern shape, thereby obtaining a desired wiring pattern (see, for example, patent documents 1 and 2).

Further, a method of manufacturing a copper wiring by applying a dispersion liquid containing aggregate particles of cuprous oxide to a polyethylene terephthalate (PET) support to a thickness of 10 to 20 μm and firing the dispersion liquid with a laser is known (for example, see patent document 3). In this method, since the portion other than the laser irradiation portion is not heated, a low heat-resistant resin material such as a PET support can be used.

In addition, there is known a technique of using colloidal silica, which is silica particles, as an underlayer for improving adhesion between a support and a metallic copper-containing film obtained by firing a copper paste (see, for example, patent document 4).

Further, the following method for manufacturing a multilayer wiring board is known: a 1 st coating layer is formed on a substrate, a part of the 1 st coating layer is irradiated with light to form a 1 st conductive part, a 2 nd coating layer is formed on the 1 st coating layer, and light is irradiated from the 2 nd coating layer to the 1 st conductive part to form a 2 nd conductive part (see, for example, patent document 5).

In addition, a method is known in which a patterned coating film using copper or a copper oxide dispersion is formed on a substrate and a firing treatment is performed to obtain a conductive film (see, for example, patent document 6).

Disclosure of Invention

Problems to be solved by the invention

In the direct wiring printing techniques for forming a wiring pattern by irradiating a paste material with a laser beam described in patent documents 1 to 3, an unfired paste material remains in a region not irradiated with the laser beam. The unfired paste material has conductivity, and in this state, electrical insulation between the wiring patterns cannot be ensured. Therefore, the unfired paste material is removed and the space between the wiring patterns is filled with an insulating material such as a solder resist.

Therefore, in the conventional direct wiring printing technique, it is necessary to perform steps for removing the unburnt paste material and filling the insulating material, and the advantage of reducing the number of steps is reduced. In addition, it is necessary to prepare a solvent, a rinsing agent, and the like for removing the unburnt paste-like material, which leads to an increase in production cost.

When a conventional direct wiring printing technique is applied to the formation of a wiring pattern on a flexible base material, there is a problem that cracks are generated between a solder resist and a wiring when a thermal cycle test is performed in which the obtained circuit board enters and exits in a low-temperature environment and a high-temperature environment.

In addition, the colloidal silica used in the underlayer disclosed in patent document 4 has excellent adhesion to metals, but has poor adhesion to resins. Therefore, when the base material is a resin, peeling may occur between the foundation layer and the base, and the reliability is low.

In the method described in patent document 5, an unfired paste material composed of divalent copper oxide (CuO) particles and a resin binder remains in a region not irradiated with laser light, the divalent copper oxide particles are large, the resin binder and the particles are locally present, and in this state, electrical insulation between wiring patterns is insufficient.

In the structure described in patent document 6, the space between the wiring patterns is not filled, and in this state, the electrical insulation between the wiring patterns cannot be ensured. In addition, in an environment with high humidity, air containing moisture enters between the wiring patterns, and dielectric breakdown is likely to occur.

The present invention has been made in view of the above problems, and an object thereof is to provide a structure having conductive pattern regions, which can greatly simplify the manufacturing process, has excellent electrical insulation between the conductive pattern regions, and has excellent long-term reliability, and a manufacturing method thereof.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a laminate and a method for manufacturing the same, which can reduce the manufacturing cost of a structure having a conductive pattern region without requiring a facility for realizing a vacuum atmosphere or an inert gas atmosphere in the process of firing copper oxide.

It is another object of the present invention to provide a copper wiring which can improve the conductivity of the wiring.

Means for solving the problems

The present inventors have conducted extensive studies to solve the above problems, and as a result, the present invention has been completed.

That is, one aspect of the structure of the present invention is characterized by comprising a support and a layer disposed on a surface constituted by the support, wherein a conductive pattern region containing copper and an insulating region containing copper oxide and phosphorus are adjacent to each other in the layer.

In another aspect of the structure of the present invention, the structure includes a support and a layer disposed on a surface of the support, in which the layer includes a conductive pattern region containing copper and an insulating region containing copper oxide and hydrazine or hydrazine hydrate, which are adjacent to each other.

In another aspect of the structure of the present invention, the structure includes a support and a layer disposed on a surface of the support, in which the conductive pattern region containing copper and the insulating region containing copper oxide, phosphorus, and hydrazine or hydrazine hydrate are adjacent to each other.

In another aspect of the structure of the present invention, the structure includes a support and a layer disposed on a surface of the support, and the layer includes a conductive pattern region containing copper and phosphorus and an insulating region containing copper oxide and phosphorus adjacent to each other.

In addition, one aspect of the laminate of the present invention is characterized by comprising a support, a coating layer containing copper oxide and phosphorus, which is disposed on a surface constituted by the support, and a resin layer disposed so as to cover the coating layer.

In addition, one aspect of the laminate of the present invention is characterized by comprising a support, a coating layer containing copper oxide and hydrazine or hydrazine hydrate disposed on a surface constituted by the support, and a resin layer disposed so as to cover the coating layer.

In addition, one aspect of the laminate of the present invention is characterized by comprising a support, a coating layer containing copper oxide, phosphorus and hydrazine or hydrazine hydrate, which is disposed on a surface constituted by the support, and a resin layer disposed so as to cover the coating layer.

In addition, one embodiment of the copper wiring of the present invention is a copper wiring including reduced copper in which copper oxide is reduced, phosphorus, and carbon, and is characterized in that the phosphorus/copper element concentration ratio is 0.02 to 0.30, and the carbon/copper element concentration ratio is 1.0 to 6.0.

In addition, one aspect of the method for manufacturing a structure according to the present invention is characterized by including: a step of disposing a coating layer containing copper oxide and a phosphorus-containing organic substance on a surface constituted by a support; and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region including the copper oxide and phosphorus and a conductive pattern region including the copper are arranged adjacent to each other on a surface of the support.

In addition, one aspect of the method for manufacturing a structure according to the present invention is characterized by including: a step of disposing a coating layer containing copper oxide and hydrazine or hydrazine hydrate on a surface constituted by a support; and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region including the copper oxide and the hydrazine or hydrazine hydrate and a conductive pattern region including the copper are arranged adjacent to each other on a surface of the support.

In addition, one aspect of the method for manufacturing a structure according to the present invention is characterized by including: disposing a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate on the surface constituted by the support; and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining the support and a layer in which an insulating region containing the copper oxide and phosphorus and containing the hydrazine or hydrazine hydrate and a conductive pattern region containing the copper are arranged adjacent to each other on a surface of the support.

In addition, one aspect of the method for producing a laminate according to the present invention is a method for producing a laminate, including the steps of: a step of disposing a coating layer containing copper oxide and a phosphorus-containing organic substance on a surface constituted by a support; and disposing a resin layer so as to cover the coating layer.

In addition, one aspect of the method for producing a laminate according to the present invention is a method for producing a laminate, including the steps of: a step of disposing a coating layer containing copper oxide and hydrazine or hydrazine hydrate on a surface constituted by a support; and disposing a resin layer so as to cover the coating layer.

In addition, one aspect of the method for producing a laminate according to the present invention is a method for producing a laminate, including the steps of: disposing a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate on the surface constituted by the support; and disposing a resin layer so as to cover the coating layer.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to provide a structure having conductive pattern regions and a method for manufacturing the same, which can greatly simplify the manufacturing process, and which has excellent electrical insulation between the conductive pattern regions and excellent long-term reliability.

Further, according to the present invention, it is possible to provide a laminate and a method for manufacturing the same, which do not require a facility for realizing a vacuum atmosphere or an inert gas atmosphere in the process of firing copper oxide, and which can reduce the manufacturing cost of a structure having a conductive pattern region.

Further, according to the present invention, a copper wiring capable of improving the conductivity of the wiring can be provided.

Drawings

Fig. 1 is a schematic view showing the relationship between cuprous oxide microparticles and a phosphate salt contained in an insulating region in a structure having a conductive pattern region according to the present embodiment.

Fig. 2 is a schematic cross-sectional view showing a structure having a conductive pattern region according to embodiment 1.

Fig. 3 is a schematic cross-sectional view showing a structure having a conductive pattern region according to embodiment 2.

Fig. 4 is a schematic cross-sectional view showing a structure having a conductive pattern region, which is partially different from fig. 3.

Fig. 5 is a schematic cross-sectional view showing an example of the laminate according to the present embodiment.

Fig. 6 is a schematic cross-sectional view showing an example of a structure having a conductive pattern region manufactured using the laminate according to the present embodiment.

Fig. 7 is an explanatory view (an example) illustrating each step of the method for manufacturing a structure having a conductive pattern region according to embodiment 1.

Fig. 8 is an explanatory view (an example) illustrating each step of the method for manufacturing a structure having a conductive pattern region according to embodiment 2.

Fig. 9 is an electron micrograph illustrating the state of cracks in the coating layer of the example.

Fig. 10 is an electron micrograph illustrating the state of cracks in the coating layer of the example.

Fig. 11 is an electron micrograph showing a cross section of a layer formed on the support in the example.

Fig. 12A is a photograph showing a conductive pattern region formed on the glass surface.

Fig. 12B is a schematic diagram of fig. 12A.

Fig. 12C is a photograph of the insulating region removed from fig. 12A.

Detailed Description

One embodiment of the present invention (hereinafter simply referred to as "embodiment") is described in detail below.

< brief description of the structure having a conductive pattern region (structure having a conductive pattern region) of the present embodiment >

The present inventors have found that, when a coating layer containing copper oxide is disposed on the surface of a support, and the coating layer is selectively irradiated with light to reduce the copper oxide to copper and form conductive pattern regions, if the electrical insulation of the regions containing unreduced copper oxide is improved, insulation between the conductive pattern regions can be ensured by leaving the regions as they are without removing the regions, and a step of removing the regions is not required, and have completed the present invention.

That is, the structure having the conductive pattern region according to the present embodiment is characterized in that the coating layer including copper oxide disposed on the surface of the support contains phosphorus. Then, the coating layer is selectively irradiated with light to form conductive pattern regions, and insulating regions containing copper oxide and phosphorus are provided between the conductive pattern regions.

Fig. 1 is a schematic view showing the relationship between copper oxide microparticles and a phosphate salt contained in an insulating region in a structure having a conductive pattern region according to the present embodiment. As shown in fig. 1, in the insulating region 1, a phosphate 3, which is an example of a phosphorus-containing organic substance, surrounds the copper oxide fine particles 2, which is an example of copper oxide, so that the phosphorus 3a faces inward and the ester 3b faces outward. The phosphate 3 exhibits electrical insulation, and therefore, electrical conduction between adjacent copper oxide fine particles 2 is inhibited.

Therefore, although the copper oxide fine particles 2 are semiconductive and conductive, they are covered with the phosphate 3 exhibiting electrical insulation. Thus, the insulating region 1 exhibits electrical insulation, and in a cross-sectional view (a cross-section in the vertical direction shown in fig. 2), insulation between adjacent conductive pattern regions (described later) on both sides of the insulating region 1 can be ensured.

On the other hand, in the conductive pattern region, a partial region of the coating layer containing copper oxide and phosphorus is irradiated with light, and the copper oxide is reduced to copper in the partial region. The copper obtained by reducing the copper oxide in this manner is called reduced copper. In addition, in the partial region, the phosphorus-containing organic substance is modified into a phosphorus oxide. In the phosphorus oxide, an organic substance such as the ester salt 3b (see fig. 1) is decomposed by heat such as laser light, and does not exhibit electrical insulation.

In addition, as shown in fig. 1, when the copper oxide fine particles 2 are used, the copper oxide is changed into reduced copper by heat of laser light or the like and is simultaneously sintered, and the adjacent copper oxide fine particles 2 are integrated with each other. Thereby, a region having excellent electrical conductivity (hereinafter referred to as "conductive pattern region") can be formed.

In the conductive pattern region, phosphorus remains in the reduced copper. The phosphorus element exists in the form of at least 1 of phosphorus element simple substance, phosphorus oxide and phosphorus-containing organic matter. The phosphorus element remaining in this way segregates in the conductive pattern region, and there is no possibility that the resistance of the conductive pattern region increases.

< structure of structure having conductive pattern region: embodiment 1 >

Fig. 2 is a schematic cross-sectional view showing a structure having a conductive pattern region according to embodiment 1. As shown in fig. 2, the structure 10 includes a support 11 and a layer 14 disposed on a surface of the support 11. In the layer 14, the insulating region 12 containing copper oxide and phosphorus and the conductive pattern region 13 containing copper are adjacent to each other. The copper referred to herein is preferably the reduced copper described above. Further, the phosphorus contained in the insulating region 12 is preferably contained in the form of an organic substance containing phosphorus.

With this configuration, the insulating regions containing copper oxide and phosphorus can insulate the conductive pattern regions containing copper, and thus it is not necessary to remove the unfired portions of the layer 14 for manufacturing. Therefore, the manufacturing process can be reduced, and the manufacturing cost can be reduced because a solvent or the like is not required. In addition, by insulating the conductive pattern region with the insulating region, cracks are less likely to occur in the insulating region, and reliability can be improved.

Each constituent element of the structure having a conductive pattern region according to embodiment 1 will be described below.

< support >

The support 11 constitutes a surface for disposing the layer 14. The shape is not particularly limited.

The material of the support 11 is preferably an insulating material in order to ensure electrical insulation between the conductive pattern regions 13 partitioned by the insulating region 12. The support body 11 does not necessarily have to be made of an insulating material as a whole. Only the portion constituting the surface of the arrangement layer 14 may be made of an insulating material.

The support 11 may more specifically be a flat plate-like body, a membrane or a sheet. The flat plate-like body is a support (also referred to as a base material) used for a circuit board such as a printed circuit board. The film or sheet is, for example, a base film used for a flexible printed circuit board as a thin-film insulator.

The support 11 may be a three-dimensional object. The layer having the conductive pattern region may be disposed on a curved surface of a three-dimensional object or a surface including a slope or the like, that is, a three-dimensional surface.

Examples of the three-dimensional object include casings of electric appliances such as mobile phone terminals, smart phones, smart glasses, televisions, and personal computers. In addition, as another example of the three-dimensional object, a dash panel, an instrument panel, a steering wheel, a chassis, and the like are given in the automobile field.

The material of the three-dimensional object is not limited, and is preferably at least one selected from the group consisting of a polypropylene resin, a polyamide resin, an acrylonitrile butadiene styrene resin, a polyethylene resin, a polycarbonate resin, a polyacetal resin, a polybutylene terephthalate resin, a modified polyphenylene ether resin, and a polyphenylene sulfide resin, for example.

< layer disposed on surface of support (layer having conductive pattern region) >

In the present embodiment, the layer 14 can be said to be a mixture of the insulating region 12 and the conductive pattern region 13. Hereinafter, when simply referred to as "layer", the layer having the conductive pattern region and the layer disposed on the support may be referred to as "layer".

Layer 14 can be said to be an integrated layer. In addition, the layer 14 may also be said to be a single layer that is not a multilayer structure. The term "integrated" or "single" means that the insulating region 12 and the conductive pattern region 13 adjacent to each other in a cross-sectional view are continuous along the surface. "adjacent" means that no other layer is included between the insulating region 12 and the conductive pattern region 13. The term "continuous" means a state excluding, for example, a state in which a space between patterned wiring layers is filled with solder paste as one layer as observed in a printed board.

In the present embodiment, a slope may be generated between the surface of the insulating region 12 and the surface of the conductive pattern region 13. That is, in the reduction process from copper oxide to copper, the thickness becomes thin, and thus even in a continuous layer, there may be a difference in film thickness between the conductive region and the insulating region.

The insulating region 12 and the conductive pattern region 13 are adjacent to each other, and means that the electrical conductivity, the particle state (fired and unfired), and the like may gradually change within the layer along the surface of the support, and a boundary (interface) may exist between the insulating region 12 and the conductive pattern region 13.

In addition, the insulating region 12 and the conductive pattern region 13 are formed of a coating layer derived from the same composition. That is, since the conductive pattern region 13 is formed by irradiating a part of the coating layer with laser light, the insulating region 12 and the conductive pattern region 13 contain the same element such as copper element and phosphorus element.

< insulating region >

The insulating region 12 contains copper oxide and phosphorus, and exhibits electrical insulation. The insulating region 12 can be said to be an unirradiated region not subjected to light irradiation. The insulating region 12 may be an unreduced region in which copper oxide is not reduced by light irradiation. The insulating region 12 may be an unfired region which is not fired by light irradiation.

< conductive Pattern region >

The conductive pattern region 13 contains copper and exhibits electrical conductivity. The conductive pattern region 13 may be said to be an irradiated region or a laser irradiated region which is irradiated with light. The conductive pattern region 13 may be a reduced region containing reduced copper obtained by reducing copper oxide by light irradiation. The conductive pattern region 13 may be a fired region including a fired body obtained by firing the insulating region 12 by light irradiation.

The shape of the conductive pattern region 13 in a plan view, that is, the pattern may be any of a linear shape, a curved shape, a circular shape, a square shape, a curved shape, and the like, and is not particularly limited. The pattern is formed by light irradiation through a mask or by drawing with a laser, and thus is not easily limited in shape.

The boundary between the insulating region 12 and the conductive pattern region 13 is preferably a straight line extending in the thickness direction of the layer 14 (the vertical direction shown in fig. 2) in a cross-sectional view, but may have a taper angle and is not particularly limited. Wherein the boundary is not necessarily unambiguous. For example, when the composition ratio of copper is measured in the vicinity of the boundary, there may be a composition transition region gradually changing from the conductive pattern region 13 side toward the insulating region 12 side.

The conductive pattern region 13 is not necessarily completely reduced in cross-sectional view. For example, it is preferable that unreduced parts exist in the parts near the support 11. This improves the adhesion between the conductive pattern region 13 and the support 11.

As shown in fig. 2, in the present embodiment, the film thickness of the conductive pattern region 13 and the film thickness of the insulating region 12 may be different such that the film thickness of the insulating region 12 is thicker, for example. That is, in the reduction process of copper from copper oxide to copper by laser irradiation, the film thickness of the conductive pattern region 13 is easily thinner than that of the insulating region 12. Since the film thicknesses are different, the creepage distance between the conductive pattern region 13 and the conductive pattern region 13 facing each other with the insulating region 12 interposed therebetween can be increased, and thus the insulating property can be improved. The film thickness of the insulating region 12 is preferably 0.1 μm to 30 μm, more preferably 0.1 μm to 15 μm, and still more preferably 0.1 μm to 10 μm. In particular, when the film thickness is in the range of 1 μm to 10 μm, it is preferable because the insulating property as the insulating region 12 can be maintained and the conductive pattern region 13 having more excellent adhesion to the substrate and conductivity can be produced by light irradiation described later. The thickness of the conductive pattern region 13 is preferably 10% to 90%, more preferably 20% to 80%, and still more preferably 30% to 70%, relative to the thickness of the insulating region 12. In particular, it is preferably from 30% to 70%, because the adhesion to the substrate can be maintained and sufficient electrical conductivity for electrical wiring can be obtained.

< adhesion layer >

An adhesion layer (not shown) is preferably provided between the support 11 and the layer 14 having the conductive pattern region. The adhesion layer can improve the adhesion of the layer 14 to the support 11, prevent the peeling of the insulating region 12 and the conductive pattern region 13, and improve the long-term stability of the structure 10.

The adhesion layer includes, for example, (i) a layer obtained by roughening the surface of the support 11, and (ii) a layer in which a coating layer is disposed on the surface of the support 11. (i) Is illustrated as part of the support body 11 itself. In this case, another layer (e.g., a primer (base) layer) may be combined with the adhesion layer.

In the case of (ii), the adhesion layer may be a separate coating layer or laminated with other layers. In addition, the coating layer may comprise a primer material.

< detailed description of Structure having conductive Pattern region >

Each configuration of the structure 10 according to the present embodiment will be described in detail below. However, each configuration is not limited to the specific examples given below.

(support)

Specific examples of the support include a support made of an inorganic material (hereinafter referred to as "inorganic support") and a support made of a resin (hereinafter referred to as "resin support").

The inorganic support is made of, for example, glass, silicone, mica, sapphire, crystal, a clay film, a ceramic material, or the like. Ceramic materials are for example alumina, silicon nitride, silicon carbide, zirconia, yttria and aluminum nitride, and mixtures of at least 2 of these. As the inorganic support, a support made of glass, sapphire, crystal, or the like having high light transmittance can be used in particular.

As the resin support, for example, a support composed of polypropylene (PP), Polyimide (PI), polyethylene terephthalate (PET), Polyethersulfone (PES), polyethylene naphthalate (PEN), polyester, Polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), Polyacetal (POM), Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), polyphenylene ether (PPE), modified polyphenylene ether (m-PPE), Polyphenylene Sulfide (PPs), polyether ketone (PEK), polyphthalamide (PPA), polyether nitrile (PENt), Polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polytetrafluoroethylene, epoxy resin, phenol resin, melamine resin, urea resin, polymethylmethacrylate resin (PMMA), or the like can be used, Polybutylene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), Polystyrene (PS), styrene-butadiene copolymer, Polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), novolak, benzocyclobutene, polyvinyl phenol, polychloroprene, polyoxymethylene, Polysulfone (PSF), polyphenylsulfone resin (PPSU), cycloolefin polymer (COP), acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene resin (AS), nylon resin (PA6, PA66), polybutylene terephthalate resin (PBT), polyethersulfone resin (PESU), polytetrafluoroethylene resin (PTFE), Polychlorotrifluoroethylene (PCTFE), and a support made of a silicone resin.

Although not distinguished above, a resin sheet containing cellulose nanofibers may be used as the support.

In particular, at least one selected from the group consisting of PI, PET, and PEN is significant and preferable from an industrial point of view because it has excellent adhesion to the layer having the conductive pattern region and the adhesion layer, has good market availability, and can be obtained at low cost.

In particular, in the case of the case, at least one selected from the group consisting of PP, PA, ABS, PE, PC, POM, PBT, m-PPE, and PPs has excellent adhesion to the layer having the conductive pattern region and the adhesion layer, and also has excellent moldability and mechanical strength after molding. Further, they are also preferable because they have heat resistance that can sufficiently withstand laser irradiation and the like when forming the conductive pattern region.

The deformation temperature under load of the resin support is preferably 400 ℃ or lower, more preferably 280 ℃ or lower, and still more preferably 250 ℃ or lower. The support having a deformation temperature under load of 400 ℃ or less can be obtained at low cost, and is significant and preferable from the industrial viewpoint. The load deformation temperature is measured, for example, in accordance with JIS K7191.

The thickness of the support may be, for example, 1 μm to 100mm, preferably 25 μm to 10mm, and more preferably 25 μm to 250 μm. A thickness of the support of 250 μm or less is preferable because the electronic device to be manufactured can be reduced in weight, reduced in space, and flexible.

When the support is a case, the thickness thereof may be, for example, 1 μm to 1000mm, preferably 200 μm to 100mm, and 200 μm to 5 mm. The present inventors have clarified that by selecting the thickness in this range, mechanical strength and heat resistance after molding can be exhibited.

The support or the support including the adhesive layer when the support includes the adhesive layer has a light transmittance at a wavelength of 445nm of preferably 30% or more, more preferably 40% or more, and further preferably 50% or more. The upper limit of the light transmittance may be 98% or less. The wavelength may be selected from near ultraviolet to near infrared wavelengths such as 355nm, 405nm, 450nm, 532nm, and 1064nm, in addition to 445 nm. By increasing the light transmittance at such a wavelength, the coating layer can be fired by irradiating light from the support side to form a layer having a conductive pattern region.

(layer disposed on surface of support (layer having conductive pattern region))

The layer is formed by an insulating region containing copper oxide and a phosphorus-containing organic substance being adjacent to a conductive pattern region containing copper.

(copper oxide)

In the present embodiment, the copper oxide includes, for example, cuprous oxide and cupric oxide (CuO). Cuprous oxide is particularly preferable because it tends to be easily sintered at low temperature. Cuprous oxide and cupric oxide may be used alone or in combination.

The copper oxide fine particles have a core/shell structure, and either the core or the shell may be cuprous oxide or may contain cupric oxide.

The copper oxide contained in the insulating region is formed, for example, in a particulate shape. The average particle diameter of the fine particles containing copper oxide is 1nm to 100nm, more preferably 1nm to 50nm, and still more preferably 1nm to 20 nm. The smaller the particle diameter, the more excellent the electrical insulation of the insulating region, and thus is preferable.

Copper particles may be included in the insulating region. That is, copper may be added to the dispersion described later. The phosphorus-containing organic substance is also adsorbed on the surface of the copper particles, and can exhibit electrical insulation.

(phosphorus-containing organic substance)

The phosphorus contained in the insulating region is preferably a phosphorus-containing organic substance. The phosphorus-containing organic substance is a material that exhibits electrical insulation in the insulating region. The phosphorus-containing organic substance is preferably capable of fixing the copper oxide to the support or the adhesion layer. The phosphorus-containing organic substance may be a single molecule or a mixture of two or more molecules. In addition, the phosphorus-containing organic substance may be adsorbed to the fine particles of copper oxide.

The number average molecular weight of the phosphorus-containing organic substance is not particularly limited, but is preferably 300 to 300,000. When the molecular weight is 300 or more, the electrical insulation is excellent.

The phosphorus-containing organic substance is preferably easily decomposed or evaporated by the action of light or heat. By using an organic substance that is easily decomposed or evaporated by the action of light or heat, a residue of the organic substance is less likely to remain after firing, and a conductive pattern region having low resistivity can be obtained.

The decomposition temperature of the phosphorus-containing organic substance is not limited, but is preferably 600 ℃ or lower, more preferably 400 ℃ or lower, and still more preferably 200 ℃ or lower. The boiling point of the phosphorus-containing organic substance is not limited, but is preferably 300 ℃ or lower, more preferably 200 ℃ or lower, and still more preferably 150 ℃ or lower.

The absorption characteristics of the phosphorus-containing organic substance are not limited, and it is preferable that the phosphorus-containing organic substance can absorb light used for firing. For example, when a laser is used as a light source for firing, it is preferable to use a phosphorus-containing organic substance that absorbs light having a wavelength (central wavelength) of emitted light, for example, 355nm, 405nm, 445nm, 450nm, 532nm, 1064nm, and the like. When the support is a resin, the wavelength is particularly preferably 355nm, 405nm, 445nm or 450 nm.

Further, the structure may be a phosphate ester salt of a high molecular weight copolymer having a group having affinity with copper oxide. For example, the structure of formula (1) is preferable because copper oxide can be adsorbed and adhesion to the support is also excellent.

[ solution 1]

Chemical formula (1)

In the formula (1), R is an ester salt.

One example of the ester salt is a structure of formula (2).

[ solution 2]

Chemical formula (2)

In addition, as an example of the phosphorus-containing organic material, a structure of chemical formula (3) can be given.

[ solution 3]

Chemical formula (3)

In the chemical formula (3), l is an integer of 1 to 20, preferably an integer of 1 to 15, more preferably an integer of 1 to 10, m is an integer of 1 to 2, preferably an integer of 1 to 15, more preferably an integer of 1 to 10, n is an integer of 1 to 20, preferably an integer of 1 to 15, more preferably an integer of 1 to 10.

As the organic structure of the phosphorus-containing organic substance, polyethylene glycol (PEG), polypropylene glycol (PPG), polyimide, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), polyester, Polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), polyacetal, Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyphthalamide (PPA), polyether nitrile (PENt), Polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polytetrafluoroethylene, epoxy resin, phenol resin, melamine resin, urea resin, polymethylmethacrylate resin (PMMA), Polycarbonate (PA), Polyvinyl Acetate (PA), and the like can be used, Polybutylene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), Polystyrene (PS), styrene-butadiene copolymer, Polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), novolac, benzocyclobutene, polyvinyl phenol, polychloroprene, polyoxymethylene, Polysulfone (PSF), polysulfide, silicone resin, aldose, cellulose, amylose, pullulan, dextrin, dextran, fructose, chitin, and the like. Structures obtained by modifying functional groups of these structures, structures obtained by modifying these structures, and copolymers of these structures may be used. A phosphorus-containing organic substance having a skeleton selected from a polyethylene glycol structure, a polypropylene glycol structure, a polyacetal structure, a polybutene structure, and a polysulfide structure is preferable because it is easily decomposed and residue is not easily left in the conductive pattern region obtained after firing.

Specific examples of the phosphorus-containing organic substance include commercially available materials, specifically, DISPERBYK (registered trademark) -102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-118, DISPERBYK-140, DISPERBYK-145, DISPERBYK-168, DISPERBYK-180, DISPERBYK-182, DISPERBYK-187, DISPERBYK-190, DISPERBYK-191, DISPERBYK-193, DISPERBYK-194N, DISPERBYK-199, DISPERBYK-2000, DISPERBYK-2001, DISPERBYK-2008, DISPERBYK-2009, DISPERBYK-2010, DISPERYK-2013, DISPERBYK-2062092, DISPERBYK-2022, DISPERBYK-187, DISPERBYK-190, DISPERBYK-191, DISPERYK-2022, DISPERBYK-2065, DISPERBYPK-2022, DISPERBYP-2022, DISPERBYPYK-2022, DISPERBYP, DISPERBYPYK-2065, DISPER, DISPERBYK-2200, BYK (registered trademark) -405, BYK-607, BYK-9076, BYK-9077, BYK-P105, Plusturf (registered trademark) M208F manufactured by first Industrial pharmaceutical Co., Ltd., Plusturf DBS, and the like. These may be used alone or in combination of two or more.

In the insulating region, particles containing copper oxide (hereinafter referred to as "copper oxide particles") are present in a mixture with a phosphorus-containing organic substance, and the content of the phosphorus-containing organic substance may be 5 parts by volume or more and 900 parts by volume or less, assuming that the total volume of the copper oxide particles is 100 parts by volume. The lower limit is preferably 10 parts by volume or more, more preferably 30 parts by volume or more, and still more preferably 60 parts by volume or more. The upper limit value is preferably 480 parts by volume or less, and more preferably 240 parts by volume or less.

The content of the phosphorus-containing organic substance is preferably 1 part by weight or more and 150 parts by weight or less based on 100 parts by weight of the copper oxide fine particles. The lower limit is preferably 2 parts by weight or more, more preferably 5 parts by weight or more, and further preferably 10 parts by weight or more. The upper limit is preferably 80 parts by weight or less, and more preferably 40 parts by weight or less.

When the content of the phosphorus-containing organic substance relative to the copper oxide fine particles is 5 parts by volume or more or 1 part by weight or more, a submicron-thick film can be formed. When the content of the phosphorus-containing organic substance is 10 parts by volume or more or 5 parts by weight or more, a thick film having a thickness of several tens of micrometers can be formed as a layer. When the content of the phosphorus-containing organic substance is 30 parts by volume or more or 10 parts by weight or more, a highly flexible layer in which cracks are not easily generated even when the layer is bent can be obtained.

When the content of the phosphorus-containing organic substance is 900 parts by volume or less or 150 parts by weight or less with respect to the copper oxide fine particles, a good conductive pattern region can be obtained by firing.

(hydrazine or hydrazine hydrate)

The hydrazine or the hydrazine hydrate may be contained in the coating layer or may remain in the insulating region which is an unfired region. By containing hydrazine or hydrazine hydrate, the dispersion stability of copper oxide is further improved and the reduction of copper oxide in firing is facilitated, and the resistance of the conductive film is further reduced. The hydrazine content is preferably as follows.

0.0001 ≦ (hydrazine mass/copper oxide mass) ≦ 0.10(1)

When the content of the reducing agent is 0.0001 or more by mass of hydrazine, the resistance of the copper film decreases. When the mass ratio is 0.1 or less, the long-term stability of the copper oxide ink is improved, and therefore, the mass ratio is preferable.

(mass ratio of copper particles/copper oxide microparticles in insulating region)

In the insulating region, copper particles may be contained in addition to the copper oxide microparticles. In this case, the mass ratio of the copper particles to the copper oxide fine particles (hereinafter referred to as "copper particles/copper oxide fine particles") is preferably 1.0 to 7.0.

The copper particles/copper oxide fine particles are preferably set to 1.0 to 7.0, from the viewpoint of conductivity and prevention of cracking.

(average particle diameter of copper oxide Fine particles)

The average secondary particle diameter of the copper oxide fine particles is not particularly limited, but is preferably 500nm or less, more preferably 200nm or less, and further preferably 80nm or less. The average secondary particle diameter of the fine particles is preferably 5nm or more, more preferably 10nm or more, and still more preferably 15nm or more.

The average secondary particle diameter is an average particle diameter of an aggregate (secondary particle) formed by aggregating a plurality of primary particles. When the average secondary particle diameter is 500nm or less, a fine conductive pattern region tends to be easily formed on the support, and therefore, the average secondary particle diameter is preferable. An average secondary particle diameter of 5nm or more is preferable because the long-term storage stability of the dispersion is improved. The average secondary particle diameter of the fine particles can be measured by, for example, a transmission electron microscope or a scanning electron microscope.

The average primary particle diameter of the primary particles constituting the secondary particles is preferably 100nm or less, more preferably 50nm or less, and still more preferably 20nm or less. The average primary particle diameter is preferably 1nm or more, more preferably 2nm or more, and further preferably 5nm or more.

When the average primary particle diameter is 100nm or less, the firing temperature described later tends to be lowered. The reason why such low-temperature firing is possible is considered to be that the smaller the particle diameter of the particles, the larger the surface energy thereof, and the lower the melting point.

Further, an average primary particle diameter of 1nm or more is preferable because good dispersibility can be obtained. When a wiring pattern is formed on a support, the average primary particle diameter is preferably 2nm to 100nm, more preferably 5nm to 50nm, from the viewpoint of adhesion to a substrate and reduction in resistance. This tendency is remarkable when the substrate is a resin. The average primary particle diameter of the fine particles can be measured by a transmission electron microscope or a scanning electron microscope.

The content of the copper oxide fine particles in the layer disposed on the support is preferably 40 mass% or more, more preferably 55 mass% or more, and still more preferably 70 mass% or more, per unit mass of the region including the copper oxide and the phosphorus-containing organic substance. The content is preferably 98% by mass or less, more preferably 95% by mass or less, and still more preferably 90% by mass or less.

The content of the copper oxide fine particles in the layer disposed on the support is preferably 10 vol% or more, more preferably 15 vol% or more, and still more preferably 25 vol% or more per unit volume. The content is preferably 90% by volume or less, more preferably 76% by volume or less, and still more preferably 60% by volume or less.

When the content of the copper oxide fine particles in the insulating region is 40 mass% or more or 10 volume% or more, the fine particles are fused to each other by firing to exhibit conductivity, and the higher the concentration, the higher the conductivity can be obtained, which is preferable. When the content is 98% by mass or less or 90% by volume or less, the layer disposed on the support can be adhered to the support or the adhesive layer as a film, which is preferable. When the content is 95% by mass or less or 76% by volume or less, the adhesive layer can be more strongly adhered to the support body or the adhesive layer, which is preferable. When the content is 90 mass% or less or 60 volume% or less, the flexibility of the layer is increased, and cracks are less likely to occur during bending, resulting in high reliability. When the content of the copper oxide fine particles in the insulating region is 90 vol% or more, the insulating region preferably has a low insulation resistance value and excellent electrical insulation properties. As the copper oxide, cuprous oxide (Cu) is available₂O) and cupric oxide (CuO), cuprous oxide is preferable in view of reduction in resistance and absorbance.

The insulating region in this embodiment may be formed of a commercially available copper oxide or a composite copper oxide. Examples of commercially available products include cuprous oxide fine particles having an average primary particle size of 18nm sold by EM Japan.

Examples of the method for synthesizing fine particles containing cuprous oxide include the following methods.

(1) A method comprising adding water and a copper acetylacetonate complex to a polyol solvent, dissolving an organic copper compound by heating once, further adding water in an amount necessary for the reaction, and heating to a reduction temperature of the organic copper to reduce the organic copper.

(2) A method of heating an organic copper compound (copper-N-nitrosophenylhydroxylamine complex) at a high temperature of about 300 ℃ in an inert atmosphere in the presence of a protective agent such as hexadecylamine.

(3) A method for reducing a copper salt dissolved in an aqueous solution with hydrazine.

The method (1) can be carried out under the conditions described in Angewandte Chemi International Edition, No. 40, Vol.2, p.359,2001, for example.

The method (2) can be carried out under the conditions described in Journal of American Chemical Society,1999, volume 121, p.11595, for example.

In the method (3), a divalent copper salt can be suitably used as the copper salt, and examples thereof include copper (II) acetate, copper (II) nitrate, copper (II) carbonate, copper (II) chloride, copper (II) sulfate and the like. The amount of hydrazine used is preferably 0.2 to 2 moles, more preferably 0.25 to 1.5 moles, based on 1 mole of the copper salt.

The water-soluble organic substance may be added to the aqueous solution containing the copper salt dissolved therein. By adding a water-soluble organic substance to the aqueous solution, the melting point of the aqueous solution is lowered, and thus the reduction can be performed at a lower temperature. Examples of the water-soluble organic substance include alcohols and water-soluble polymers.

Examples of the alcohol include methanol, ethanol, propanol, butanol, hexanol, octanol, decanol, ethylene glycol, propylene glycol, and glycerol. Examples of the water-soluble polymer include polyethylene glycol, polypropylene glycol, and a polyethylene glycol-polypropylene glycol copolymer.

In the method (3), the temperature during the reduction may be, for example, -20 to 60 ℃, preferably, -10 to 30 ℃. The reduction temperature may be constant during the reaction, or may be increased or decreased in the course of the reaction. The reduction is preferably carried out at 10 ℃ or lower, more preferably at 0 ℃ or lower in the initial stage of the reaction in which the hydrazine activity is high. The reduction time is preferably 30 minutes to 300 minutes, more preferably 90 minutes to 200 minutes. The atmosphere during reduction is preferably an inert atmosphere such as nitrogen or argon.

Among the above methods (1) to (3), the method (3) is preferred because it is easy to handle and can give particles having a small particle diameter.

In the above-mentioned embodiments, the insulating region contains copper oxide and phosphorus. In contrast, as another embodiment, a mode in which copper oxide and hydrazine or hydrazine hydrate are contained in the insulating region or a mode in which copper oxide, hydrazine or hydrazine hydrate and phosphorus are contained in the insulating region can be described. That is, the layer is composed of a conductive pattern region containing copper and an insulating region containing copper oxide and hydrazine or hydrazine hydrate, which are adjacent to each other. Alternatively, the layer may be formed such that a conductive pattern region containing copper and an insulating region containing copper oxide, hydrazine or hydrazine hydrate, and phosphorus are adjacent to each other; or the conductive pattern region containing copper and phosphorus and the insulating region containing copper oxide, hydrazine or hydrazine hydrate and phosphorus are formed adjacent to each other.

As described above, in this embodiment mode, hydrazine or hydrazine hydrate may be contained in the insulating region. By including hydrazine or hydrazine hydrate in the coating layer, copper oxide is easily reduced to copper after exposure to light. By containing hydrazine or hydrazine hydrate, the resistance of the reduced copper can be reduced. Hydrazine or hydrazine hydrate remains in the insulating region not irradiated with light.

(conductive pattern region)

The copper in the conductive pattern region may exhibit, for example, a structure in which particles containing copper are welded to each other. Further, the shape may be free of fine particles, and the state may be such that all the particles are welded. Further, a part of the particles may have a shape of fine particles, and most of the particles may be welded. As mentioned above, the copper is preferably reduced copper. The conductive pattern region preferably includes a fired body obtained by firing the insulating region. This can improve the conductivity of the conductive pattern region. In addition, since the conductive pattern region can be formed by firing the insulating region, the conductive pattern region can be easily formed, and the "layer" in the present embodiment in which the conductive pattern region and the insulating region are mixed can be formed with high accuracy.

The conductive pattern region may contain at least one of copper oxide (cuprous oxide, cupric oxide, and cuprous oxide), phosphorus element, phosphorus oxide, and a phosphorus-containing organic substance, in addition to copper. For example, the portion on the front surface side of the conductive pattern region may have a structure in which fine particles containing copper are welded to each other, and the portion on the support side may have a structure containing copper oxide or a phosphorus-containing organic substance. Thus, copper oxide or a phosphorus-containing organic substance is preferable because the copper particles are strongly bonded to each other and the adhesion between the copper oxide or the phosphorus-containing organic substance and the support or the adhesion layer is improved.

The content of the phosphorus element in the conductive pattern region is preferably 0.02 to 0.30, more preferably 0.05 to 0.28, and still more preferably 0.1 to 0.25 in the element concentration ratio of phosphorus/copper. When the element concentration ratio of phosphorus/copper is 0.02 or more, oxidation of copper can be suppressed, and the reliability as a copper wiring circuit can be improved, which is preferable. Further, it is preferable that the element concentration ratio of phosphorus/copper is 0.30 or less to reduce the resistance value of the conductive pattern region.

As described above, the layer in this embodiment may have a structure in which the conductive pattern region containing copper and phosphorus and the insulating region containing copper oxide and phosphorus are adjacent to each other. This can improve both the conductivity in the conductive pattern region and the insulation in the insulating region. It is believed that in the conductive pattern region, since oxidation of phosphorus occurs before oxidation of copper in the manufacturing process, the resistance change of the conductive pattern region can be suppressed to be low.

The content of copper in the conductive pattern region is preferably 50% by volume or more, more preferably 60% by volume or more, further preferably 70% by volume or more, and may be 100% by volume per unit volume. The content of copper is preferably 50 vol% or more because the electrical conductivity is improved.

The surface of the conductive pattern region, which is in contact with a resin layer described later, may have a roughness of a predetermined level or more. Specifically, the surface roughness Ra is preferably 20nm to 500nm, more preferably 50nm to 300nm, and still more preferably 50nm to 200 nm. When the roughness is within this range, a part of the resin layer enters the uneven portion on the surface of the conductive pattern region, and adhesion can be improved, which is preferable.

(bonding layer)

In the structure with a wiring pattern region according to the present embodiment, it is preferable to provide an adhesive layer between the support and the layer having the conductive pattern region. That is, it is preferable that the adhesive layer is provided on the surface of the support, and the layer having the conductive pattern region is disposed on the surface of the adhesive layer.

The surface of the support is preferably roughened by an adhesion layer.

By roughening the surface of the support, the copper oxide, the phosphorus-containing organic substance, and the copper in the layer disposed on the surface of the support can be firmly adhered to the surface of the support.

The adhesion layer can be formed by roughening the surface of the support by rough grinding, sandblasting, chemical etching, reactive ion etching, plasma treatment, sputtering, UV ozone treatment, or the like. The adhesion layer may be formed by applying a coating material to the surface of the support to roughen the surface. The type of the support can be suitably selected depending on the material of the support.

(coating Material)

Examples of the coating material include organic materials, inorganic materials, and organic-inorganic composite materials.

The coating material preferably has a cohesive structure. Examples of the binding structure include a hydroxyl group (-OH group), an amino group, a mercapto group, a phosphoric acid group, a phosphonic acid group, a phosphonate group, a functional group having a succinimide skeleton, a functional group having a pyrrolidone skeleton, a selenol group, a polysulfide group, a polyselenide group, a carboxyl group, a functional group having an acid anhydride skeleton, a sulfonic acid group, a nitro group, a cyano group, an isocyanate group, an azide group, a silanol group, a silyl ether group, and a hydrosilyl group. The binding structure is preferably at least one group selected from the group consisting of a hydroxyl group (-OH group), an amino group, a phosphonic acid group, and a carboxylic acid group. the-OH groups are more preferably Ar-OH groups (Ar means aromatic) and/or Si-OH groups.

When the coating material has an Ar-O structure (Ar means an aromatic group) and/or an Si-O structure, it is also preferable from the viewpoint of adhesion.

The coating material may be an organic material represented by the following chemical formula group.

[ solution 4]

Chemical formula (4)

In the chemical formula group, n is an integer of 1 or more, X is a main skeleton of an organic material, and R is a functional group. Examples of the functional group represented by R in the above chemical formula group include hydrogen, halogen, alkyl (e.g., methyl, isopropyl, tert-butyl, etc.), aryl (e.g., phenyl, naphthyl, thienyl, etc.), haloaryl (e.g., pentafluorophenyl, 3-fluorophenyl, 3,4, 5-trifluorophenyl, etc.), alkenyl, alkynyl, amide, acyl, alkoxy (e.g., methoxy, etc.), aryloxy (e.g., phenoxy, naphthyl, etc.), haloalkyl (e.g., perfluoroalkyl, etc.), thiocyano, hydroxyl, an amino group, a mercapto group, a phosphonic acid group, a phosphonate group, a functional group having a succinimide skeleton, a functional group having a pyrrolidone skeleton, a selenol group, a polysulfide group, a polyselenide group, a carboxylic acid group, a functional group having an acid anhydride skeleton, a sulfonic acid group, a nitro group, a cyano group, and a structure in which these groups are combined. When the adhesion layer contains an organic material having such a bonding structure, adhesion to the support and the layer having the conductive pattern region tends to be good.

As the organic material, an organic material having an aromatic structure (Ar) can be suitably used. Since the organic material having an aromatic structure has a high softening temperature and a high decomposition temperature, the deformation of the support during firing can be suppressed, and the layer having the conductive pattern region disposed on the support is less likely to be damaged by the action of the decomposition gas of the support. Therefore, a conductive film with low resistance can be obtained by firing. As the aromatic structure, for example, aromatic hydrocarbons such as benzene, naphthalene, anthracene, tetracene, pentacene, phenanthrene, pyrene, perylene, and benzo [9,10] phenanthrene; and heteroaromatic compounds such as thiophene, thiazole, pyrrole, furan, pyridine, pyrazole, imidazole, pyridazine, pyrimidine, and pyrazine. The number of electrons contained in the pi-electron system of the aromatic structure is preferably 22 or less, more preferably 14 or less, and still more preferably 10 or less. When the number of electrons contained in the pi-electron system is 22 or less, the crystallinity is not excessively increased, and a soft and smooth sealing layer can be obtained. In these aromatic structures, a part of hydrogen bonded to the aromatic ring may be substituted with a functional group. Examples of the functional group include halogen, alkyl (e.g., methyl, isopropyl, tert-butyl, etc.), aryl (e.g., phenyl, naphthyl, thienyl, etc.), haloaryl (e.g., pentafluorophenyl, 3-fluorophenyl, 3,4, 5-trifluorophenyl, etc.), alkenyl, alkynyl, amide, acyl, alkoxy (e.g., methoxy, etc.), aryloxy (e.g., phenoxy, naphthyl, etc.), haloalkyl (e.g., perfluoroalkyl, etc.), thiocyano, and hydroxy. The organic material preferably has an aromatic hydroxyl group (Ar-OH group), and particularly preferably a phenolic hydroxyl group (Ph-OH group). Further, an organic material having an Ar — O structure in which an oxygen having an aromatic hydroxyl group is bonded to another structure tends not to be easily decomposed during firing, and is therefore preferable.

Examples of the organic material include polyimide, polyethylene terephthalate (PET), polyether sulfone (PES), polyethylene naphthalate (PEN), polyester, Polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), polyacetal, Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyphthalamide (PPA), polyether nitrile (PENt), Polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polytetrafluoroethylene, epoxy resin, phenol resin, melamine resin, urea resin, polymethylmethacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, polyethylene naphthalate, polyamide, polyphenylene ether, polyphenylene sulfide, Ethylene-butene-diene copolymer, polybutadiene, polyisoprene, polychloroprene, ethylene-propylene-diene copolymer, nitrile rubber, chlorosulfonated polyethylene, acrylic rubber, epichlorohydrin rubber, urethane rubber, butyl rubber, fluororubber, polymethylpentene (PMP), Polystyrene (PS), styrene-butadiene copolymer, Polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), novolak, benzocyclobutene, polyvinylphenol, polychloroprene, polyoxymethylene, Polysulfone (PSF), silicone resin, and the like. As the organic material, at least one selected from the group consisting of phenol resin, novolac, polyvinyl phenol, and polyimide is preferable.

Examples of the inorganic material include metals, alloys, metal oxides, metal nitrides, metal carbides, metal oxycarbides, and metal fluorides. Specific examples of the inorganic material include silicon oxide, silver oxide, copper oxide, aluminum oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, tin oxide, calcium oxide, cerium oxide, chromium oxide, cobalt oxide, holmium oxide, lanthanum oxide, magnesium oxide, manganese oxide, molybdenum oxide, nickel oxide, antimony oxide, samarium oxide, terbium oxide, tungsten oxide, yttrium oxide, zinc oxide, Indium Tin Oxide (ITO), silver fluoride, silicon fluoride, aluminum fluoride, zirconium fluoride, titanium fluoride, hafnium fluoride, tantalum fluoride, tin fluoride, calcium fluoride, cerium fluoride, cobalt fluoride, holmium fluoride, lanthanum fluoride, magnesium fluoride, manganese fluoride, molybdenum fluoride, nickel fluoride, antimony fluoride, samarium fluoride, terbium fluoride, tungsten fluoride, yttrium fluoride, zinc fluoride, lithium fluoride, lead zirconate titanate (PZT), barium titanate, strontium titanate, copper nitride, silicon nitride, aluminum nitride, titanium nitride, hafnium nitride, copper titanate, copper nitride, silicon nitride, and the like, Tantalum nitride, tin nitride, calcium nitride, cerium nitride, cobalt nitride, holmium nitride, lanthanum nitride, magnesium nitride, manganese nitride, molybdenum nitride, nickel nitride, antimony nitride, samarium nitride, terbium nitride, tungsten nitride, yttrium nitride, zinc nitride, lithium nitride, gallium nitride, SiC, SiCN, diamond-like carbon (DLC), and the like. The inorganic material having a hydroxyl group is preferable because it has excellent adhesion to the support and the layer having the conductive pattern region. In particular, a metal oxide is preferable because hydroxyl groups are present on the surface of the metal oxide. Among the metal oxides, particularly, inorganic materials having a Si — O structure are more preferable.

The inorganic material is more specifically preferably at least 1 selected from the group consisting of silicon oxide, titanium oxide, zirconium oxide, and indium tin oxide, aluminum oxide. Particularly preferred are silica and alumina.

The adhesive layer preferably contains fine particles having a particle diameter of 10nm to 500 nm. Specifically, the adhesion layer preferably contains fine particles of silicon oxide or aluminum oxide having a particle diameter of 10nm to 500 nm. This can increase the specific surface area after the layer having the conductive pattern region is formed, and can improve the adhesion to the layer having the conductive pattern region. The fine particles may be porous particles.

As the inorganic material, an inorganic semiconductor may also be used. Examples of the inorganic semiconductor material include a simple substance element semiconductor, an oxide semiconductor, a compound semiconductor, and a sulfide semiconductor. Examples of the simple substance element semiconductor include silicon and germanium. Examples of the oxide semiconductor include IGZO (indium-gallium-zinc oxide), IZO (indium-zinc oxide), zinc oxide, indium oxide, titanium oxide, tin oxide, tungsten oxide, niobium oxide, and cuprous oxide. Examples of the compound semiconductor include gallium arsenide (GaAs), gallium arsenic phosphide (GaAsP), gallium phosphide (GaP), cadmium selenide (CdSe), silicon carbide (SiC), indium antimonide (InSb), and gallium nitride (gan). Examples of the sulfide semiconductor include molybdenum sulfide and cadmium sulfide.

As the organic-inorganic composite material, for example, an organic material in which inorganic fine particles are dispersed and an organic metal compound can be used. As the inorganic fine particles, particles of the above inorganic material can be used. Examples of the organometallic compound include silicates, titanates, and aluminates. Examples of the silicate include methyl silicate and ethyl silicate.

The thickness of the adhesion layer is preferably 20 μm or less. Thereby, warpage of the support body can be prevented. The thickness of the adhesion layer is more preferably 10 μm or less, and still more preferably 1 μm or less, and from the viewpoint of adhesion, it is preferably 0.01 μm or more, more preferably 0.05 μm or more, and still more preferably 0.1 μm or more.

(priming Material)

The adhesion layer may be formed of a single material, or may be formed by mixing or laminating two or more materials. For example, the adhesion layer may comprise a primer material. Further, for example, a layer formed of an undercoat material may be disposed between the support and the layer formed of the coating material, or between the layer formed of the coating material and the layer having the conductive pattern region.

When the adhesion layer includes a layer made of a primer material, adhesion tends to be further improved. The layer composed of the undercoat material can be formed by, for example, an undercoat treatment in which a thin layer of the undercoat material is formed on the surface.

The primer preferably has a cohesive structure. Examples of the bonding structure include the bonding structures described in the item of "(coating material)" mentioned above. By providing the undercoat material with a bonding structure, the bonding structure is introduced into the adhesion layer, and high adhesion tends to be obtained.

The adhesion layer may be formed by disposing a layer made of a coating material on the support after the undercoating treatment. Alternatively, the adhesion layer may be formed by disposing a layer made of a coating material on the support and then performing an undercoating treatment on the layer. Alternatively, the adhesion layer may be formed by mixing the coating material and the undercoat material in advance and then disposing them on the support, or may be formed by disposing a layer made of the undercoat material on the support. When the undercoat treatment is performed on the layer made of the coating material, the density of the bonding structure on the surface can be increased, and therefore, higher adhesion can be obtained.

Examples of the primer material include a silane coupling agent, a phosphonic acid-based low-molecular material, and a thiol-based material.

Examples of the silane coupling agent include compounds having a functional group such as a vinyl group, an amino group, an epoxy group, a styryl group, a methacryloyl group, an acryloyl group, an isocyanurate group, a ureido group, a mercapto group, an isocyanate group, or a phosphonic acid group at a terminal. Specific examples of the silane coupling agent include vinylmethoxysilane, vinylethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-vinyltrimethoxysilane, p-vinyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1, 3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, tris- (trimethoxysilylpropyl) isocyanurate, 3-ureidopropyltrialkoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane and 3-isocyanatopropyltriethoxysilane.

Examples of the phosphonic acid-based material include compounds having a functional group such as a vinyl group, an amino group, an epoxy group, a styryl group, a methacryl group, an acryloyl group, an isocyanurate group, a ureido group, a mercapto group, an isocyanate group, a silyl group, a silanol group, or a silyl ether group at the terminal. Specific examples of the phosphonic acid-based material include aminomethylphosphonic acid, 2-aminoethylphosphonic acid, O-phosphorylethanolamine, 12-aminododecylphosphonic acid, 12-aminoundecylphosphonic acid hydrochloride, 6-aminohexylphosphonic acid hydrochloride, 12-azidododecylphosphonic acid, (12-dodecylphosphonic acid) N, N-dimethyl-N-octadecylammonium bromide, (12-dodecylphosphonic acid) N, N-dimethyl-N-octadecylammonium chloride, (12-dodecylphosphonic acid) pyridinium bromide, (12-dodecylphosphonic acid) triethylammonium chloride, 11-hydroxyundecylphosphonic acid, 12-mercaptododecylphosphonic acid, and mixtures thereof, 11-mercaptoundecylphosphonic acid, 11-methacryloxyundecylphosphonic acid, 4-nitrobenzylphosphonic acid, 12-phosphono-1-dodecanesulfonic acid, (6-phosphonohexyl) phosphonic acid, 11-phosphonoundecanoic acid, 11-phosphonoundecylacrylate, propylenephosphonic acid, 4-aminobenzylphosphonic acid, 1, 8-octane diphosphonic acid, 1, 10-decylphosphonic acid, 6-phosphonohexanoic acid, (1-amino-2-methylpropyl) phosphonic acid, (1-aminopropyl) phosphonic acid, (3-nitrophenyl) phosphonic acid, 1-hydroxyethane-1, 1, -diphosphonic acid, 3-aminopropylphosphonic acid, 4-aminobutylphosphonic acid, nitrilotris (methylene) triphosphonic acid, methylenediphosphonic acid, and the like.

As the thiol material, for example, a compound having a functional group such as a vinyl group, an amino group, an epoxy group, a styryl group, a methacryl group, an acryloyl group, an isocyanurate group, a ureido group, an isocyanate group, a silyl group, a silanol group, a silyl ether group, or a phosphonic acid group at a terminal thereof can be suitably used. Specific examples of the thiol material include 4-cyano-1-butanethiol, 1, 11-undecanedithiol, 1, 16-hexadecanedithiol, 1, 2-ethanedithiol, 1, 3-propanedithiol, 1, 4-butanedithiol, 1, 5-pentanedithiol, 1, 6-hexanedithiol, 1, 8-octanedithiol, 1, 9-nonanedithiol, 2 ' - (ethylenedioxy) diethylthiol, 2, 3-butanedithiol, 5 ' -bis (mercaptomethyl) -2,2 ' -bipyridine, hexa (ethyleneglycol) dithiol, tetra (ethyleneglycol) dithiol, benzene-1, 4-dithiol, (11-mercaptoundecyl) hexa (ethyleneglycol), (11-mercaptoundecyl) tetra (ethyleneglycol), 1-mercapto-2-propanol, 11-amino-1-undecanethiol hydrochloride, 11-azido-1-undecanethiol, 11-mercapto-1-undecanol, 11-mercaptoundecanamide, 11-mercaptoundecanoic acid, 11-mercaptoundecylhydroquinone, 11-mercaptoundecylphosphonic acid, 12-mercaptododecanoic acid, 16-amino-1-hexadecanethiol hydrochloride, 16-mercaptohexadecaneamide, 16-mercaptohexadecanethiol, 3-amino-1-propanethiol hydrochloride, 3-mercapto-1-propanol, and mixtures thereof, 3-mercaptopropionic acid, 4-mercapto-1-butanol, 6-amino-1-hexanethiol hydrochloride, 6-mercapto-1-hexanol, 6-mercaptohexanoic acid, 8-amino-1-octanethiol hydrochloride, 8-mercapto-1-octanol, 8-mercaptooctanoic acid, 9-mercapto-1-nonanol, 1, 4-benzenedimethanethiol, 4 '-bis (mercaptomethyl) biphenyl, 4' -dimercaptostilbene, 4-mercaptobenzoic acid, biphenyl-4, 4-dithiol, and the like.

Examples of the method for forming the layer made of the coating material include coating, vapor deposition, and a sol-gel method. The thickness of the layer made of the coating material is preferably 20 μm or less, more preferably 10 μm or less, and further preferably 1 μm or less, from the viewpoint of preventing warpage of the support; from the viewpoint of adhesion, the thickness is preferably 0.01 μm or more, more preferably 0.05 μm or more, and still more preferably 0.1 μm or more.

In the case where the support in the present embodiment includes the adhesion layer, the phosphorus-containing organic substance may have one or more kinds of binding structures. Examples of the bonding structure include the bonding structures described in the item of "(coating material)" mentioned above. The binding structure particularly preferably has at least one structure selected from the group consisting of a hydroxyl group, an amino group, a phosphonic acid group, a phosphonate group, and an isocyanate group. When the layer having the conductive pattern region contains a phosphorus-containing organic substance having such a bonding structure, the adhesion to the adhesion layer tends to be good.

< structure of structure having conductive pattern region: embodiment 2 >

Fig. 3 is a schematic cross-sectional view showing a structure having a conductive pattern region according to embodiment 2. As shown in fig. 3, the structure 20 having the conductive pattern region includes a support 21 and a layer 24 disposed on a surface of the support 21. In the layer 24, the insulating region 22 containing copper oxide and phosphorus and the conductive pattern region 23 containing reduced copper are disposed adjacent to each other. Further, an oxygen barrier layer 25 is provided as the cover layer 24. The oxygen barrier layer 25 is light-transmissive.

The insulating region 22 may be formed of copper oxide and hydrazine or hydrazine hydrate, or may be formed of copper oxide, phosphorus, and hydrazine or hydrazine hydrate. The conductive pattern region 23 may be formed to contain copper and phosphorus. The layer 24 in the present embodiment may have the following configuration: a conductive pattern region 23 containing copper and an insulating region 22 containing copper oxide and phosphorus are adjacent to each other; or a structure in which the conductive pattern region 23 containing copper and the insulating region 22 containing copper oxide and hydrazine or hydrazine hydrate are adjacent to each other; or a conductive pattern region 23 containing copper and phosphorus and an insulating region 22 containing copper oxide and phosphorus are adjacent to each other. Alternatively, layer 24 may be constructed as follows: a conductive pattern region 23 containing copper and an insulating region 22 containing copper oxide, hydrazine or hydrazine hydrate, and phosphorus are adjacent to each other; or a configuration in which the conductive pattern region 23 containing copper and phosphorus and the insulating region 22 containing copper oxide, hydrazine or hydrazine hydrate, and phosphorus are adjacent to each other.

The structure 20 in embodiment 2 is different from the structure 10 in embodiment 1 in that it has a resin layer (oxygen barrier layer 25).

With the configuration of embodiment 2, the insulating region including copper oxide and the phosphorus-containing organic substance can insulate the conductive pattern regions including copper, and therefore, it is not necessary to remove the unfired portion of the layer 24 for manufacturing. Therefore, the manufacturing process can be reduced, and the manufacturing cost can be reduced because a solvent or the like is not required. In addition, by insulating the conductive pattern region with the insulating region, cracks are less likely to occur in the insulating region, and reliability can be improved.

Further, since the layer 24 is covered with the resin layer (oxygen barrier layer 25), the conductive pattern region and the insulating region can be protected from external stress, and long-term reliability of the structure having the conductive pattern region can be improved.

The respective configurations of the support 21, the insulating region 22, the conductive pattern region 23, and the layer 24 constituting the structure 20 can be applied to the respective configurations of the support 11, the insulating region 12, the conductive pattern region 13, and the layer 14 described above. The structure 20 may include the above-described adhesion layer.

The resin layer will be described in detail.

< resin layer >

As shown in fig. 3, the resin layer is disposed so as to cover the surface of the layer 24.

(oxygen barrier layer)

An example of the resin layer is an oxygen barrier layer 25. In the method for producing the structure 20 described later, the oxygen barrier layer 25 prevents the coating layer (described later) from coming into contact with oxygen during light irradiation, and promotes reduction of copper oxide. This eliminates the need for a facility for realizing, for example, a vacuum atmosphere or an inert gas atmosphere for making the periphery of the coating layer oxygen-free or low-oxygen atmosphere at the time of light irradiation, and can reduce the production cost.

The oxygen barrier layer 25 can prevent the conductive pattern region 23 from peeling off or scattering due to heat of light irradiation or the like. This enables the structure 20 to be manufactured with high yield.

(sealing Material layer)

Another example of the resin layer is a sealing material layer. Fig. 4 is a schematic cross-sectional view showing another example of a structure body having a conductive pattern region, which is partially different from fig. 3. The structure 30 having a conductive pattern region shown in fig. 4 has the same configuration as the structure 20 shown in fig. 3 except that the sealing material layer 31 covers the surface of the layer 24 instead of the oxygen barrier layer 25 (see fig. 3).

The sealing material layer 31 is reconfigured after peeling off the oxygen barrier layer 25, for example.

The oxygen barrier layer 25 (see fig. 3) plays an important role mainly in manufacturing. In contrast, the sealing material layer 31 can protect the conductive pattern region 23 from external stress in the finished product after manufacture (the structure 30 itself having the conductive pattern region and a product including the structure) and can improve the long-term stability of the structure 30 having the conductive pattern region.

In this case, the sealing material layer 31, which is an example of the resin layer, preferably has a moisture permeability of 1.0g/m²And/day is less. This is to ensure long-term stability, sufficiently reduce moisture permeability, thereby preventing moisture from entering from the outside of the sealing material layer 31 and suppressing oxidation of the conductive pattern region 23.

The sealing material layer 31 is an example of a functional layer that provides a function to the structure 30 having the conductive pattern region after the oxygen barrier layer 25 is peeled off, and may be provided with scratch resistance when the structure 30 having the conductive pattern region is processed, stain resistance for preventing contamination from the outside, or rigidity by using a tough resin to provide the structure 20.

In the present specification, the functional layer such as the sealing material layer other than the oxygen barrier layer is simply referred to as "other resin layer".

The present embodiment will be described by taking the following cases as examples: in a method for producing a structure having a conductive pattern region (described later), an oxygen barrier layer 25 is disposed so as to cover the coating layer (see fig. 3), the oxygen barrier layer 25 is removed after the photo-firing treatment, and a sealing material layer 31 (see fig. 4) as an example of another resin layer is disposed so as to cover the coating layer 24. That is, the structure 20 (see fig. 3) can be said to be a precursor structure for obtaining a finished structure 30 (see fig. 4) having a conductive pattern region. However, the structure 20 (see fig. 2) in which the oxygen barrier layer 25 remains as it is may be used as a finished product.

The resin constituting the resin layer preferably has a melting point of 150 ℃ to 300 ℃. The use of such a resin is preferable because it can ensure a safety factor of 2 times or more of the actual use temperature range (maximum 75 ℃) and can be applied by hot-melting the resin layer at the time of forming the resin layer.

The resin layer is preferably provided with an opening. The opening is provided for electrical connection with the conductive pattern region from the outside, and an electrical contact portion may be attached to the opening by a method such as metal plating or soldering.

The resin layer will be described in more detail. First, the oxygen barrier layer will be explained. The oxygen barrier layer prevents oxygen from being mixed into the coating layer from the outside during irradiation of light. For example, the following materials can be used as the material of the oxygen barrier layer. There may be used a resin composition comprising polypropylene (PP), Polyimide (PI), polyethylene terephthalate (PET), Polyethersulfone (PES), polyethylene naphthalate (PEN), polyester, Polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), Polyacetal (POM), Polyarylate (PAR), Polyamide (PA), Polyamideimide (PAI), Polyetherimide (PEI), polyphenylene ether (PPE), modified polyphenylene ether (m-PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyphthalamide (PPA), polyether nitrile (PENt), Polybenzimidazole (PBI), polycarbodiimide, polysiloxane, polymethacrylamide, nitrile rubber, acrylic rubber, polytetrafluoroethylene, epoxy resin, phenol resin, melamine resin, urea resin, polymethylmethacrylate resin (PMMA), Polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), Polystyrene (PS), styrene-butadiene copolymer, Polyethylene (PE), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), novolak, benzocyclobutene, polyvinylphenol, polychloroprene, polyoxymethylene, Polysulfone (PSF), polyphenylsulfone resin (PPSU), cycloolefin polymer (COP), acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene resin (AS), nylon resin (PA6, PA66), polybutylphthalate resin (PBT), polyethersulfone resin (PESU), polytetrafluoroethylene resin (PTFE), Polychlorotrifluoroethylene (PCTFE), silicone resin, and the like.

In addition, an adhesive layer may be provided between the oxygen barrier layer and the coating layer to bond the oxygen barrier layer and the coating layer.

Next, the other resin layers will be described. The sealing material layer as an example of the other resin layer can secure long-term stability. The sealing material layer preferably has sufficiently low moisture permeability. This is to prevent moisture from entering from the outside of the sealing material layer and to suppress oxidation of the conductive pattern region. Moisture permeability of sealing material layerPreferably 1.0g/m²A value of not more than day, more preferably 0.5g/m²A value of not more than day, more preferably 0.1g/m²And/day is less. By using a sealing material layer having a moisture permeability in such a range, a change in resistance due to oxidation of the conductive pattern region can be suppressed in a long-term stability test under an environment of 85 ℃ and 85%, for example.

The material usable for the sealing material layer may be selected from the same materials as those for the oxygen barrier layer, for example, or fine particles made of silicon oxide or aluminum oxide may be further mixed in these materials, or a layer made of silicon oxide or aluminum oxide may be provided as a moisture barrier layer on the surface of these materials, thereby reducing the moisture permeability.

Further, the sealing material layer does not have to be made of a single material, and a plurality of the above materials may be used.

The structure having the conductive pattern region described above is produced using a laminate described below as an intermediate. That is, in order to obtain a desired structure having a conductive pattern region, it is necessary to optimize the structure of the laminate as an intermediate. Therefore, the structure of the laminate in the present embodiment will be described below.

< brief description of the layered product of the present embodiment >

The present inventors disposed a coating layer containing copper oxide on the surface of a support, and selectively irradiated the coating layer with light to reduce the copper oxide to copper, thereby forming a conductive pattern region. In this case, it was found that if the electrical insulation of the region containing unreduced copper oxide is improved, insulation between the conductive pattern regions can be ensured by leaving the region as it is without removing the region, and the step of removing the region is not required.

Further, it has been found that by providing a resin layer on the coating layer, when the copper oxide is subjected to a firing treatment by irradiation with light (hereinafter referred to as "photo-firing treatment"), a facility for realizing a vacuum atmosphere or an inert gas atmosphere is not required, and the manufacturing cost of the above-described structure having the conductive pattern region can be reduced, thereby completing the present invention.

That is, as shown in fig. 5, the laminate 40 of the present embodiment is characterized by including a support 41, a coating layer 44 containing copper oxide and phosphorus disposed on the surface constituted by the support 41, and an oxygen barrier layer 45 as an example of a resin layer disposed so as to cover the coating layer 44. The oxygen barrier layer 45 is light-transmissive.

As shown in fig. 5, an adhesive layer 46 is disposed between the coating layer 44 and the oxygen barrier layer 45 as necessary.

As shown in fig. 5, since the coating layer 44 is covered with the resin layer (oxygen barrier layer 45), the coating layer 44 is prevented from coming into contact with oxygen during the photo-firing, and the reduction of copper oxide is promoted. This eliminates the need for a facility for making the periphery of the coating layer 44 an oxygen-free or low-oxygen atmosphere during light irradiation, and can reduce the manufacturing cost. Therefore, by using the laminate of the present embodiment, a desired laminate with a conductive pattern region can be manufactured with high accuracy and at low cost.

The respective configurations of the support 11 and the resin layer (oxygen barrier layer 25) described above are applied to the support 41 and the resin layer (oxygen barrier layer 45 as an example in fig. 5) constituting the laminate 40. The laminate 40 may include the above-described adhesion layer between the support 41 and the coating layer 44.

The coating layer 44 and the adhesive layer 46 will be described in detail below.

< coating layer >

The coating layer 44 is formed by applying a dispersion in which copper oxide is dispersed in a dispersion medium using phosphorus, particularly an organic substance containing phosphorus, which also functions as a dispersant, to the surface constituted by the support 41.

Details regarding the phosphorus-containing organic substance, the dispersion medium, and the method for producing the dispersion are described below.

The coating layer 44 is formed to have substantially the same composition as the insulating region 22 of fig. 3.

In addition, in the coating layer 44, as in the insulating regions 12 and 22 shown in fig. 1 and 3, the fine particles including copper oxide are present in a mixture with the phosphorus-containing organic substance, and the content of the phosphorus-containing organic substance is preferably 5 parts by volume or more and 900 parts by volume or less, assuming that the total volume of the copper oxide fine particles is 100 parts by volume. This makes it possible to obtain the coating layer 44 which has high flexibility, is less likely to cause cracking even when bent, and can form a good conductive pattern region by firing.

The coating layer 44 preferably further contains copper particles, and the mass ratio of copper particles/copper oxide microparticles in the coating layer is preferably 1.0 to 7.0. This can suppress the occurrence of cracks and can form a good conductive pattern region by firing.

The content of the copper oxide fine particles in the coating layer 44 is preferably 10 vol% or more and 90 vol% or less. This makes it easy to fuse the fine particles to each other and to exhibit electrical conductivity when the coating layer 44 is fired. In addition, the coating layer 44 can be effectively attached to the support or the adhesion layer.

The average particle diameter (average primary particle diameter) of the copper oxide fine particles contained in the coating layer 44 is preferably 1nm to 50 nm. This can reduce the firing temperature for the coating layer 44 and improve the dispersibility of the copper oxide fine particles in the coating layer 44.

The coating layer 44 may be formed of copper oxide and hydrazine or hydrazine hydrate, or may be formed of copper oxide or a phosphorus-containing organic substance and hydrazine or hydrazine hydrate. By including hydrazine or hydrazine hydrate, copper oxide is readily reduced to copper after exposure to light.

< adhesion layer >

The adhesive layer 46 is disposed between the coating layer 44 and the oxygen barrier layer 45 as necessary, and the oxygen barrier layer 45 is bonded to the surface of the coating layer 44.

The adhesive force of the adhesive layer 46 is preferably 5mN/10mm or more and 10N/10mm or less. When the adhesive force is 5mN/10mm or more and less than 1N/10mm, the oxygen barrier layer 45 can be fixed to the coating layer 44 by the adhesive layer 46, and the oxygen barrier layer 45 can be easily peeled off in a subsequent step. Further, by setting the adhesive force to 1N/10mm or more and 10N/10mm or less, the oxygen barrier layer 45 can be firmly fixed to the coating layer 44 by the adhesive layer 46.

The adhesive layer 46 is an adhesive sheet, an adhesive film, or an adhesive material. The adhesive contained in the adhesive layer 46 is not particularly limited, and an acrylate resin, an epoxy resin, a silicone resin, and the like can be exemplified.

When the oxygen barrier layer 45 is a resin film including the adhesive layer 46, the oxygen barrier layer 45 can be easily formed by bonding the resin film to the surface of the coating layer 44, which is preferable. Further, by selecting the adhesive force as described above, the oxygen barrier layer 45 can be peeled off as needed. By peeling off the oxygen barrier layer 45 in this manner, the structure 10 having the structure shown in fig. 2 can be obtained.

When the oxygen barrier layer 45 is a layer formed of a cured resin or a layer formed by heating and pressing a thermoplastic resin, the adhesive layer may be omitted.

In the present embodiment, it is preferable to provide a layer containing silicon oxide or aluminum oxide between the coating layer 44 and the resin layer. The layer containing silicon oxide or aluminum oxide can function as a moisture barrier layer, and can reduce moisture permeability.

Fig. 6 is a cross-sectional view of a structure 50 having a conductive pattern region formed using the laminate shown in fig. 5. As shown in fig. 6, the structure 50 having the conductive pattern region includes: a support body 51; a layer 54 disposed on the surface of the support 51, the layer including an insulating region 52 containing copper oxide and a phosphorus-containing organic substance, and a conductive pattern region 53 containing reduced copper, the insulating region and the conductive pattern region being adjacent to each other; an oxygen barrier layer 55 as an example of a resin layer provided as the cover layer 54; and an adhesion layer 56 sandwiched between the layer 54 and the oxygen barrier layer 55.

The structure 50 having a conductive pattern region shown in fig. 6 is basically the same as the structure 20 shown in fig. 3, but differs from fig. 3 in that an adhesive layer 56 is interposed between a layer 54 and an oxygen barrier layer 55 in fig. 6. In fig. 6, the adhesive layer 56 improves adhesion between the oxygen barrier layer 55 and the layer 54, and the structure 50 having the conductive pattern region with excellent durability can be realized. Further, by interposing a layer containing silicon oxide or aluminum oxide between the oxygen barrier layer 55 and the layer 54, the moisture barrier property can be improved.

In fig. 6, the oxygen barrier layer 55 may be replaced with another resin layer as necessary. At this time, by using an adhesive having a weak adhesive force in advance for the adhesive layer 56, the oxygen barrier layer 55 can be easily peeled off from the layer 54. An adhesive layer 56 or a layer containing silicon oxide or aluminum oxide may be interposed between the other resin layer and the layer 54. A structure 50 having a conductive pattern region according to the structure shown in fig. 3 was obtained by directly bonding the other layers to the surface of the layer 54 without interposing the adhesive layer 56 or the layer containing silicon oxide or aluminum oxide.

< brief description of the copper wiring of the present embodiment >

In the above-described structure, the present inventors have developed a copper wiring composed of a conductive pattern region. That is, in the present embodiment, the conductive pattern region of the layer in which the conductive pattern region is adjacent to the insulating region is a copper wiring described below. In this embodiment, the insulating region may be removed to obtain a copper wiring.

The copper wiring in the present embodiment includes reduced copper in which copper oxide is reduced, phosphorus, and carbon. And is characterized in that the concentration ratio of phosphorus/copper element is 0.02-0.30, and the concentration ratio of carbon/copper element is 1.0-6.0. The arithmetic average roughness Ra of the surface of the copper wiring is preferably 20nm to 500 nm.

As described above, the content of the phosphorus element is preferably in the range of 0.02 to 0.30 inclusive relative to the element of copper. More preferably, it is in the range of 0.05 to 0.28, and still more preferably in the range of 0.1 to 0.25. When the element concentration of phosphorus/copper is 0.02 or more, oxidation of copper can be suppressed, and the reliability as a copper wiring circuit can be improved, which is preferable. Further, it is preferable that the element concentration of phosphorus/copper is 0.30 or less, because the resistance value of the wiring can be reduced.

As described above, the content of the carbon element is preferably in the range of 1.0 to 6.0 relative to the element of copper. More preferably 1.5 to 5.5, and still more preferably 2.0 to 5.0. By setting the element concentration of carbon/copper to 1.0 or more, the flexibility of the copper wiring can be borne. Further, it is preferable that the element concentration of carbon/copper is 6.0 or less, since the resistance value of the wiring can be reduced.

The carbon is derived from a residue generated when copper oxide is reduced by an organic component such as a phosphorus-containing organic substance or a glycol in the coating layer.

As described above, Ra is preferably 20nm to 500 nm. Ra is more preferably 50nm to 300nm, and still more preferably 50nm to 200 nm. Ra is an arithmetic mean roughness of the surface of the copper wiring, and when the copper wiring is covered with the resin layer, it means a surface roughness of a surface in contact with the resin layer. It is preferable that the Ra is 20nm to 500nm, since the adhesion to the resin layer can be improved.

The copper wiring may further contain nitrogen. The element concentration ratio of nitrogen/copper is preferably 0.04 to 0.6, more preferably 0.1 to 0.55, and further preferably 0.2 to 0.5. The corrosion resistance of the copper wiring can be improved by setting the nitrogen/copper element concentration ratio to 0.04 or more, and the resistance value of the wiring can be reduced by setting the nitrogen/copper element concentration ratio to 0.6 or less, which is preferable. The nitrogen source is derived from residues generated when hydrazine or hydrazine hydrate in the coating layer reduces copper oxide.

The copper wiring preferably contains reduced copper in which copper oxide is reduced, phosphorus, and carbon, and the concentration ratio of each element, that is, phosphorus: carbon: the copper is preferably 0.02: 1: 1 to 0.3: 6: 1, in the above range. The concentration ratio is more preferably 0.05: 1.5: 1 to 0.28: 5.5: 1, more preferably 0.1: 2: 1 to 0.25: 5: 1, in the above range. The above range is a ratio defined by setting the elemental concentration of copper to 1. By including reduced copper, phosphorus, and carbon in this range, the resistance value of the wiring can be reduced, and the inhibition of copper oxidation and the flexibility of copper can be shared to the maximum extent.

The copper wiring preferably contains reduced copper in which copper oxide is reduced, phosphorus, carbon, and nitrogen, and the concentration ratio of each element, that is, phosphorus: carbon: nitrogen: the copper is preferably 0.02: 1: 0.04: 1 to 0.3: 6: 0.6: 1, in the above range. The concentration ratio is more preferably 0.05: 1.5: 0.1: 1 to 0.28: 5.5: 0.55: 1, more preferably 0.1: 2: 0.2: 1 to 0.25: 5: 0.5: 1, in the above range. The above range is a ratio defined by setting the elemental concentration of copper to 1. By including reduced copper, phosphorus, carbon, and nitrogen in this range, the resistance value of the wiring can be reduced, and the inhibition of oxidation of copper, the bendability of copper, and the corrosion resistance can be shared to the maximum.

Next, a method for manufacturing the 1 st structural body 10 shown in fig. 2 will be described. The method for manufacturing the 1 st structure 10 mainly includes the following steps.

(A) A step of disposing a coating layer containing copper oxide and an organic substance containing phosphorus on the surface constituted by the support,

(B) and a step of selectively irradiating the coating layer with light to reduce the copper oxide to copper, thereby obtaining a support and a layer in which an insulating region containing the copper oxide and the organic substance containing phosphorus and a conductive pattern region containing copper are arranged adjacent to each other on a surface constituted by the support.

In the above (a), a coating layer containing copper oxide and hydrazine or hydrazine hydrate may be disposed on the surface constituted by the support. Alternatively, a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate may be disposed on the surface of the support. By containing hydrazine or hydrazine hydrate, reduction by light can be further performed, and a copper film with low resistance can be obtained.

As shown in (a), first, a coating layer containing copper oxide and phosphorus is disposed on a surface constituted by the support. Examples of the method include: (a) a method of coating a dispersion containing copper oxide and a phosphorus-containing organic substance; (b) a method of scattering copper oxide fine particles and then coating a phosphorus-containing organic material; (c) a method of coating a phosphorus-containing organic substance and then dispersing copper oxide fine particles; and so on. The following description will be given by taking the method (a) as an example, but the method is not limited thereto.

(method for producing Dispersion)

Next, the method for preparing the dispersion will be described. First, copper oxide fine particles are dispersed in a dispersion medium together with a phosphorus-containing organic substance to prepare a copper oxide dispersion.

For example, the copper oxide fine particles synthesized by the method (3) are soft aggregates, and are not suitable for direct coating, and therefore need to be dispersed in a dispersion medium.

After the synthesis in the method (3) is terminated, the synthesis solution is separated from the copper oxide fine particles by a known method such as centrifugal separation. The obtained copper oxide fine particles are added with a dispersion medium and a phosphorus-containing organic substance, and stirred by a known method such as a homogenizer to disperse the copper oxide fine particles in the dispersion medium.

The phosphorus-containing organic substance according to the present embodiment functions as a dispersant. However, other dispersants may be added as long as they do not affect the electrical insulation of the insulating region (the insulating region 12 shown in fig. 2).

The copper oxide fine particles are not easily dispersed in the dispersion medium, and may be insufficiently dispersed. In such a case, for example, copper oxide is dispersed using an alcohol (e.g., butanol) which is easily dispersed, and then replaced with a desired dispersion medium and concentrated to a desired concentration. As an example, there are a method of concentrating by a UF membrane and a method of repeatedly diluting and concentrating by a desired dispersion medium.

(coating)

A thin film composed of the dispersion according to the present embodiment is formed on the surface of the support. More specifically, for example, the dispersion is applied to a support, and the dispersion medium is removed by drying as necessary to form a coating layer. The method for forming the coating layer is not particularly limited, and coating methods such as die coating, spin coating, slit coating, bar coating, blade coating, spray coating, and dip coating can be used. These methods are preferably used to apply the dispersion to a support in a uniform thickness.

The oxygen barrier layer is preferably disposed so as to cover the coating layer disposed on the support. However, as a method of manufacturing the structure 10 shown in fig. 2, the arrangement of the oxygen barrier layer is not essential.

(firing treatment)

As shown in (B), in the present embodiment, the conductive pattern region is formed by performing the heat treatment under the condition that the copper oxide in the coating layer is reduced to generate the copper particles and the generated copper particles are fused to each other to be integrated.

In the present embodiment, a selective light irradiation method is used as the method of firing treatment. In the present embodiment, as the photo-firing method, for example, a flash method or a laser method using a discharge tube such as xenon as a light source can be applied. These methods can be carried out by exposing light having a high intensity to light in a short time, and raising the temperature of the coating layer formed on the support to a high temperature in a short time. Since the firing time is short, the damage to the support is small, and the resin film substrate having low heat resistance can be suitably used.

The flash method is a method of instantaneously discharging the charge accumulated in the capacitor using a xenon lamp (discharge tube), for example. According to this embodiment, pulsed light (xenon lamp light) of a large light amount is generated, and the coating layer formed on the support is irradiated with the pulsed light, whereby the coating layer is instantaneously heated to a high temperature. The exposure amount can be adjusted by the light intensity, the light emission time, the light irradiation interval, and the number of times.

In order to form the conductive pattern region, the coating layer may be selectively irradiated with light from a light source through a mask.

Although the light emitting sources are different, the same effect can be obtained even with the laser light source. In the case of a laser light source, there is a degree of freedom in selecting a wavelength in addition to the adjustment items of the flash system, and the wavelength may be selected in consideration of the light absorption wavelength of the coating layer or the absorption wavelength of the support.

In addition, according to the laser system, exposure can be performed by beam scanning, the exposure range can be easily adjusted, and the coating layer can be selectively irradiated with light (drawn) without using a mask.

Examples of the laser source include YAG (yttrium-aluminum garnet), YVO (yttrium vanadate), Yb (ytterbium), semiconductor laser (GaAs, GaAlAs, GaInAs), and carbon dioxide. As the laser light, not only the fundamental wave but also harmonics can be picked up as necessary for use.

In the present embodiment, the light beam is preferably a laser beam having a central wavelength of 355nm to 532 nm. By making the wavelength longer than the wavelength absorbed by the coating layer containing cuprous oxide, reduction of cuprous oxide occurs uniformly, and a region with low resistance (conductive pattern region) can be obtained.

In the present embodiment, since the support is made light-transmissive, light can be transmitted through the support, and thus part of the coating layer can be appropriately fired.

In addition, in the case of a configuration in which the coating layer has an oxygen barrier layer on the surface thereof, by making one of the support and the coating layer light-transmissive, and by making light-transmissive through the support or through the coating layer via the oxygen barrier layer, it is possible to appropriately fire a part of the coating layer.

In the structure in which the oxygen barrier layer is disposed on the surface of the coating layer, the structure 10 shown in fig. 2 can be obtained by removing the oxygen barrier layer after the conductive pattern region is formed.

A method for manufacturing the support having the conductive pattern region according to embodiment 1 will be described in more detail with reference to fig. 7. Fig. 7 is an explanatory view showing steps of the method for manufacturing the support with the conductive pattern region according to embodiment 1. In fig. 7 (a), copper acetate is dissolved in a mixed solvent of water and Propylene Glycol (PG), and hydrazine or hydrazine hydrate is added thereto and stirred.

Next, in fig. 7 (b) and (c), the mixture was separated into a supernatant and a precipitate by centrifugation. Next, in fig. 7 (d), a dispersant and an alcohol are added to the obtained precipitate to perform dispersion.

Next, in (e) and (f) of fig. 7, the concentration and dilution were repeated by the UF membrane module to replace the solvent, thereby obtaining a dispersion I containing copper oxide microparticles.

In fig. 7 (g) and (h), dispersion I was applied by spray coating to a support made of PET (described as "PET" in fig. 7(h)) to form a coating layer containing copper oxide and a phosphorus-containing organic substance (described as "Cu" in fig. 7(h))₂O”)。

Next, in fig. 7(i), the coating layer is irradiated with laser light, and a part of the coating layer is selectively fired to reduce copper oxide to copper (shown as "Cu" in fig. 7 (i)). As a result, in fig. 7(j), a structure having a conductive pattern region was obtained in which a layer in which an insulating region containing copper oxide and phosphorus (indicated by "a" in fig. 7 (j)) and a conductive pattern region containing copper (indicated by "B" in fig. 7 (j)) were disposed adjacent to each other was formed on a support.

In this embodiment mode, the insulating region can be further removed by cleaning. A pattern in which copper wiring (indicated by "C" in fig. 7 (K)) is patterned on the support can be obtained. The copper wiring C is the same layer as the conductive pattern region B. Further, the support body from the upper portion of the copper wiring C to the position between the copper wirings C may be sealed with a second resin layer (shown as "D" in fig. 7 (l)). The second resin layer D may be formed so as to cover at least the copper wiring C as the conductive pattern region B. The second resin layer corresponds to the "other resin layer" mentioned above.

When the insulating region is removed, water, alcohols such as ethanol, propanol, butanol, isopropanol, methanol, ethylene glycol, and glycerol, or organic solvents such as ketones, esters, and ethers may be used. Water, ethanol, propanol, butanol, and isopropanol are particularly preferable from the viewpoint of cleaning performance of the insulating region. In addition, a phosphorus-based dispersant may be added to the solvent. The cleaning performance can be further improved by adding a phosphorus dispersant.

When the structure 10 shown in fig. 2 is manufactured, the laminate 40 shown in fig. 5 is not used, and if the atmosphere is, for example, a vacuum atmosphere, the structure 10 can be manufactured even if an oxygen barrier layer (fig. 7(h)) as an example of the resin layer is not present. However, naturally, by using the laminate including the oxygen barrier layer, there is no need for a facility for realizing a vacuum atmosphere or an inert gas atmosphere, and there is an advantage that the manufacturing cost of the structure having the conductive pattern region can be reduced.

Next, in the method for manufacturing the 2 nd structure 20, 30, 50 shown in fig. 3,4, 6 described above, the laminate 40 shown in fig. 5 is preferably used.

That is, the method 2 for manufacturing a structure having a conductive pattern region includes the following steps.

(C) A step of disposing a coating layer containing copper oxide and an organic substance containing phosphorus on the surface constituted by the support,

(D) a step of disposing a resin layer (first resin layer) so as to cover the coating layer,

(E) and a step of reducing copper oxide to copper by selectively irradiating the coating layer with light through either the resin layer or the support to obtain a structure having a conductive pattern region, the structure including a support, a layer in which an insulating region including copper oxide and a phosphorus-containing organic substance and the conductive pattern region including copper are arranged adjacent to each other on a surface constituted by the support, and a resin layer formed so as to cover the layer.

In the above (C), a coating layer containing copper oxide and hydrazine or hydrazine hydrate may be disposed on the surface constituted by the support. Alternatively, a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate may be disposed on the surface constituted by the support. By containing hydrazine or hydrazine hydrate, reduction by light can be further performed, and a copper film with low resistance can be obtained.

The step (C) is the same as the step (a) described above. (D) In the step (2), a resin layer is formed on the surface of the coating layer. By the steps of obtaining (C) and (D), a laminate 40 as an intermediate shown in fig. 5 can be produced.

That is, the method for producing the laminate 40 includes the steps of: disposing a coating layer containing copper oxide and a phosphorus-containing organic substance on a surface constituted by a support; and a step of disposing a resin layer (oxygen barrier layer 45) so as to cover the coating layer. Alternatively, the method for producing the laminate 40 includes the steps of: disposing a coating layer containing copper oxide and hydrazine or hydrazine hydrate on a surface constituted by a support; and a step of disposing a resin layer (oxygen barrier layer 45) so as to cover the coating layer. Alternatively, the method for producing the laminate 40 includes the steps of: disposing a coating layer containing copper oxide, a phosphorus-containing organic substance, and hydrazine or hydrazine hydrate on a surface constituted by a support; and a step of disposing a resin layer (oxygen barrier layer 45) so as to cover the coating layer.

In the laminate 40 shown in FIG. 5, an oxygen barrier layer 45 is bonded to a coating layer 44 via an adhesive layer 46. Wherein the adhesive layer 46 is not required. For example, in the case where the oxygen barrier layer 45 is formed of a cured resin or is formed by heating and pressing a thermoplastic resin, the adhesive layer 46 is not necessarily required. For example, the material constituting the oxygen barrier layer may be heated to be softened, and pressed against the coating layer while applying pressure to form a laminate.

The oxygen barrier layer 45 is exemplified as an example of the resin layer, and preferably, the resin layer is an oxygen barrier layer and is a resin film having an adhesive layer. Thus, the resin film is stuck to the surface of the coating layer 44, whereby the laminate 40 shown in fig. 5 can be easily and appropriately produced.

The adhesive is not particularly limited, and an acrylate resin, an epoxy resin, a silicone resin, and the like can be exemplified.

The adhesive force of the adhesive layer is preferably 5mN/10mm or more and 10N/10mm or less. Thus, the oxygen barrier layer can be appropriately fixed to the coating layer by the adhesive layer, and the oxygen barrier layer can be easily peeled off in a subsequent step. Further, by setting the adhesive force to 1N/10mm or more and 10N/10mm or less, the oxygen barrier layer can be firmly fixed to the coating layer by the adhesive layer.

The above-described firing treatment is performed on the laminate formed through the steps (C) and (D), thereby forming a conductive pattern region.

In the present embodiment, either the oxygen barrier layer or the support is made light-transmissive. In this way, in the light irradiation method, light can pass through the oxygen barrier layer or the support and fire a part of the coating layer.

As described above, the structure 20 shown in fig. 3 and the structure 50 having the conductive pattern region shown in fig. 6 can be manufactured.

(arrangement of other resin layer)

Next, the oxygen barrier layer may be replaced with another resin layer as necessary. The oxygen barrier layer is first removed by dissolution with a solvent. In this case, when the adhesive layer is formed using the adhesive layer, only the adhesive layer may be dissolved and removed by a solvent. Further, by peeling the oxygen barrier layer from the layer having the conductive pattern region in advance using an adhesive having a weak adhesive force, the oxygen barrier layer can be peeled off without using a solvent.

Then, a sealing material layer, which is an example of another resin layer, is disposed so as to cover the exposed layer having the conductive pattern region. The sealing material layer may be formed by bonding a resin sheet made of the material constituting the sealing material layer to the coating layer with a separately prepared adhesive.

The sealing material layer may be formed by heating and softening the material constituting the sealing material layer, and pressing the material to the coating layer while applying pressure to the material to perform a lamination process. Further, a curable material that is photo-cured or thermally cured may be selected, and a coating layer made of the curable material may be formed on the exposed layer having the conductive pattern region, and then cured by light or heat.

A method for manufacturing the support with the conductive pattern region according to embodiment 2 will be described in more detail with reference to fig. 8. Fig. 8 is an explanatory view showing each step of the method for manufacturing the support with the conductive pattern region according to the present embodiment. In fig. 8 (a), copper acetate is dissolved in a mixed solvent of water and Propylene Glycol (PG), and hydrazine or hydrazine hydrate is added thereto and stirred.

Subsequently, in fig. 8 (b) and (c), the mixture was separated into a supernatant and a precipitate by centrifugation. Next, in fig. 8 (d), a dispersant and an alcohol are added to the obtained precipitate to perform dispersion.

Next, in (e) and (f) of fig. 8, concentration and dilution by the UF membrane module are repeated to replace the solvent, thereby obtaining a dispersion I containing copper oxide microparticles.

In fig. 8 (g) and (h), dispersion I was applied to a support made of PET (referred to as "PET" in fig. 8 (h)) by a spray coating method to form a coating layer containing copper oxide and a phosphorus-containing organic substance (fig. 8 (h))) Is described as "Cu₂O”)。

Next, in fig. 8(i), an oxygen barrier layer is disposed on the coating layer (in fig. 8(i), this is referred to as "barrier").

Next, in fig. 8(j), the coating layer is irradiated with laser light through the oxygen barrier layer, and a part of the coating layer is selectively fired to reduce copper oxide to copper (shown as "Cu" in fig. 8 (j)). As a result, in fig. 8(k), a layer was obtained in which an insulating region (indicated by "a" in fig. 8 (k)) containing copper oxide and a phosphorus-containing organic substance and a conductive pattern region (indicated by "B" in fig. 8 (k)) containing copper were disposed adjacent to each other on the support.

Next, in fig. 8 (l) and (m), the oxygen barrier layer is removed by a solvent to expose a layer in which the conductive pattern region and the insulating region are adjacent to each other. Then, in fig. 8(n), the surface of the layer in which the conductive pattern region and the insulating region are adjacent to each other is covered with a sealing material layer (referred to as "sealing" in fig. 8 (n)), whereby the structure having the conductive pattern region shown in fig. 4 can be obtained.

In this embodiment mode, the insulating region can be further removed by cleaning. A pattern in which copper wiring (indicated as "C" in fig. 8 (o)) is patterned on the support can be obtained. The copper wiring C is the same layer as the conductive pattern region B. Further, the support body from the upper side of the copper wiring C to the position between the copper wirings C may be sealed with a second resin layer (shown as "D" in fig. 8 (p)). The second resin layer D may be formed so as to cover at least the copper wiring C as the conductive pattern region B. The second resin layer corresponds to the "other resin layer" mentioned above.

When the insulating region is removed, water, alcohols such as ethanol, propanol, butanol, isopropanol, methanol, ethylene glycol, and glycerol, or organic solvents such as ketones, esters, and ethers may be used. Water, ethanol, propanol, butanol, and isopropanol are particularly preferable from the viewpoint of cleaning performance of the insulating region. In addition, a phosphorus-based dispersant may be added to the solvent. The cleaning performance can be further improved by adding a phosphorus dispersant.

The oxygen barrier layer may function as a sealing material layer without being removed. At this time, the structure having the conductive pattern region shown in fig. 3 and 6 can be manufactured. Therefore, in the method for manufacturing a structure having a conductive pattern region according to the present embodiment, the steps after the removal of the oxygen barrier layer are not essential.

In the method of manufacturing a structure according to the present embodiment, after the layer having the conductive pattern region and the insulating region is obtained by light irradiation, the insulating region may be removed from the layer in which the conductive pattern region and the insulating region are in close contact with each other, as shown in fig. 7(k) and 8 (o). For example, the insulating region can be selectively cleaned and removed by using an etching solution or the like in which the conductive pattern region does not dissolve but the insulating region dissolves. In the present embodiment, the boundary between the conductive pattern region and the insulating region can be clearly distinguished, and only the insulating region can be selectively removed as appropriate.

In the present embodiment, after the insulating region is removed from the layer as described above, the second resin layer may be disposed so as to cover the surface of the conductive pattern region as shown in fig. 7(l) and 8 (p). This ensures insulation between the conductive pattern region and the conductive pattern region. In addition, it is also effective as a barrier film in terms of durability of copper wiring. The second resin layer may be applied to the "other resin layer" mentioned above.

In this embodiment, for example, the insulating region may be removed as described above, and the copper wiring may be left on the support. The conductive pattern region including reduced copper, phosphorus, and carbon, which is obtained by reducing copper oxide remaining on the support, can be manufactured as the copper wiring of the present embodiment. Alternatively, the conductive pattern region and the conductive pattern region in the insulating region may be regarded as copper wirings even if the insulating region is not removed. In this case, in the copper wiring in the present embodiment, the concentration ratio of phosphorus/copper element may be set to 0.02 to 0.30, and the concentration ratio of carbon/copper element may be set to 1.0 to 6.0, and Ra may be set to 20nm to 500 nm. In order to make the elemental concentration ratio of phosphorus/copper to be 0.02 to 0.30, for example, a coating layer containing copper oxide and a phosphorus-containing organic substance may be provided, and reduced copper may be obtained from the copper oxide by irradiation with light. The elemental concentration ratio of phosphorus/copper can be adjusted by adjusting the ratio of copper oxide to phosphorus-containing organic substance. In order to make the carbon/copper ratio 1.0 to 6.0, for example, a coating layer containing copper oxide and an organic substance may be provided, and reduced copper may be obtained from the copper oxide by irradiation with light. The elemental concentration ratio of carbon/copper can be adjusted by adjusting the ratio of copper oxide to organic matter. In order to set Ra of the surface of the copper wiring to 20nm to 500nm, desired Ra can be obtained by adjusting the irradiation intensity, irradiation speed, and irradiation interval of light when the light is irradiated, for example.

In the method for producing a structure or a laminate having a conductive pattern region according to the present embodiment, the resin layer or the support preferably has a light transmittance at a wavelength of 445nm of 30% or more, more preferably 40% or more, and still more preferably 50% or more. The upper limit of the light transmittance may be 98% or less. The wavelength may be selected from near ultraviolet to near infrared wavelengths such as 355nm, 405nm, 450nm, 532nm, and 1064nm, in addition to 445 nm. By increasing the light transmittance at such a wavelength, the coating layer can be fired by irradiating light from the support side to form the conductive pattern region.

In the method for producing a structure or a laminate having a conductive pattern region according to the present embodiment, the copper oxide contained in the coating layer is preferably cuprous oxide. Thus, reduced copper can be obtained by firing treatment, and a layer in which the conductive pattern region and the insulating region are present in a mixed state can be formed with high accuracy.

In the structure having a conductive pattern region or the method for producing a laminate according to the present embodiment, the phosphorus-containing organic material contained in the coating layer preferably has a skeleton represented by the following chemical formula (1) (in the chemical formula (1), R is an ester salt).

[ solution 5]

Chemical formula (1)

In the formula (1), R is an ester salt.

The structure of the above chemical formula (1) can adsorb copper oxide and is excellent in adhesion to the support. This can ensure insulation and effectively prevent peeling between the support and the coating layer.

In the structure having a conductive pattern region or the method for manufacturing a multilayer body according to the present embodiment, a case where the support is a three-dimensional object can be exemplified. That is, in the present embodiment, the flat support is not the subject, but a curved surface, a broken slope, or the like may be used, and for example, the structure having the conductive pattern region in the present embodiment may be formed by using the surface of the housing, the chassis, or the like as the support surface.

< application example >

The structure having the conductive pattern region according to the present embodiment can be suitably applied to, for example, a wiring material (a printed circuit board, an RFID, a replacement for a wire harness in an automobile, or the like) of an electronic circuit board or the like, an antenna formed in a case of a portable information device (a smartphone or the like), a mesh electrode (an electrode film for a capacitive touch panel), an electromagnetic wave shielding material, and a heat dissipating material.

As described above, according to the structure having the conductive pattern regions according to the present embodiment, the conductive pattern regions containing copper can be insulated from each other by the insulating regions containing copper oxide and phosphorus. Therefore, it is not necessary to remove the unfired portion of the layer disposed on the support for the production, and therefore, the production process can be reduced, and the production cost can be reduced because a solvent or the like is not required. In addition, by insulating the conductive pattern region with the insulating region, cracks are less likely to occur in the insulating region, and reliability can be improved.

In addition, according to the method for producing a structure having a conductive pattern region according to the present embodiment, a part of the coating layer including copper oxide and the phosphorus-containing organic substance is fired by a laser to form the conductive pattern region, and the unfired portion can be used for insulation of the conductive pattern region. Thus, it is not necessary to remove the unfired portion of the coating layer. Therefore, the manufacturing process can be reduced, and the manufacturing cost can be reduced because a solvent or the like is not required. Further, since it is not necessary to provide a solder resist or the like for insulation of the conductive pattern region, the number of manufacturing steps can be reduced accordingly.

Further, according to the laminate of the present embodiment, the coating layer is covered with the resin layer, whereby the coating layer can be prevented from contacting oxygen during the photo-firing, and the reduction of copper oxide can be promoted. This eliminates the need for a facility for making the periphery of the coating layer an oxygen-free or low-oxygen atmosphere during light irradiation, and can reduce the production cost. Further, since the coating layer is covered with the resin layer, the coating layer can be protected from external stress, and the handling property can be improved.

In addition, according to the method for producing a laminated body according to the present embodiment, a laminated body can be easily and appropriately produced by using a step of forming a coating layer including copper oxide and a phosphorus-containing organic substance on a surface of a support and a step of forming a resin layer on a surface of the coating layer.