阅读说明：本技术 一种超厚型金属基材印制板v型槽的加工方法 (Processing method of V-shaped groove of super-thick metal substrate printed board ) 是由 聂兴培 李波 吴世亮 林鹭华 乔元 于 2019-09-24 设计创作，主要内容包括：本发明提供一种超厚型金属基材印制板V型槽的加工方法,包括以下步骤：S1、V-CUT机与V-CUT刀的选择；S2、V-CUT加工资料设计；S3、V-CUT加工参数设置；S4、超厚金属基材产品V型槽加工尺寸的检测。本发明从设备的工艺能力和工具的材料技术能力入手,通过V-CUT机设备的工艺能力、和对V-CUT刀材料、角度的更深层次的技术开发,设计专用的超厚金属基印制电路板V-CUT加工流程,确保超厚高硬度的金属基材微波产品能批量、快速安全地生产、提升产品质量,常规V-CUT机及V-CUT刀无法生产超厚金属类基板的技术难题。(The invention provides a processing method of a V-shaped groove of an ultra-thick metal substrate printed board, which comprises the following steps: s1, selecting a V-CUT machine and a V-CUT knife; s2, designing V-CUT processing data; s3, setting V-CUT processing parameters; and S4, detecting the machining size of the V-shaped groove of the super-thick metal base material product. The invention starts from the process capability of equipment and the material technical capability of tools, designs the V-CUT processing flow of the special ultra-thick metal base printed circuit board through the process capability of the V-CUT machine equipment and the deeper technical development of the V-CUT cutter material and angle, ensures that ultra-thick and high-hardness metal base material microwave products can be produced in batches, quickly and safely and improves the product quality, and has the technical problem that the conventional V-CUT machine and the V-CUT cutter can not produce ultra-thick metal base plates.)

1. A processing method of a V-shaped groove of an ultra-thick metal substrate printed board is characterized by comprising the following steps:

s1, selecting a V-CUT machine and a V-CUT knife: selecting a PIN hanging nail V-CUT machine with a depth control V-cutting function, and selecting V-CUT cutters with the same degree according to the V-CUT angle requirement to be processed;

s2, designing V-CUT processing data: setting hanging holes according to the equipment parameters of the V-CUT machine and the hole center distance of 80-120mm, calculating the center line through which the V-CUT passes according to the outer frame data and the degree data which are processed as required, and making data;

s3, setting V-CUT processing parameters: the processing times are as follows: designing the number of V-CUT times according to the thickness of the PCB and the residual thickness to be processed, wherein the number of V-CUT times (taking an integer) = ((board thickness-residual thickness) ÷ processing depth/knife) ÷ 2 surfaces, and the residual thickness is set conventionally; processing speed: the V-CUT conventional processing speed is between 30 and 60m/min, and when the ultra-thick metal material product is produced, the processing times of the same position are more, and the processing speed of the V-CUT cutter needs to be reduced in sequence;

and S4, detecting the machining size of the V-shaped groove of the super-thick metal base material product.

2. The method for processing the V-groove of the ultra-thick metal substrate printed board as claimed in claim 1, wherein in the step S3, if the conventional material is processed, each blade is processed with a depth of 0.7-1.3mm, and the metal material is processed with a depth of 0.3-0.7 mm.

3. The method for processing the V-shaped groove of the ultra-thick metal substrate printed board as claimed in claim 1, wherein in the step S3, when the ultra-thick metal material product is produced, the processing speed is set to 40-70% of the processing speed of the conventional product.

4. The method for processing the V-shaped groove of the ultra-thick metal substrate printed board as claimed in claim 1, wherein in the step S4, the finished ultra-thick V-shaped groove metal substrate product needs to use a V-CUT residual thickness measuring instrument to measure the residual thickness of the V-shaped groove, so as to ensure that the size meets the design requirement.

5. The method for processing the V-shaped groove of the ultra-thick metal substrate printed board as claimed in claim 1, wherein the PCB is processed to have a thickness of 2-5mm in step S3.

Technical Field

The invention belongs to the technical field of PCB processing, and particularly relates to a processing method of a V-shaped groove of an ultra-thick metal substrate printed board.

Background

The metal-based printed board replaces FR4 and brittle ceramic base materials in the field of high-frequency microwave communication consisting of long-distance communication, navigation, medical treatment, transportation, storage power supply modules, intelligent photoelectric systems and digital systems, has good heat dissipation performance and more stable size, so that the problem of expansion with heat and contraction with cold of different substances of components on the printed board is relieved, and the durability and reliability of the whole machine and electronic equipment are improved. However, the thickness of the metal base is 1.0-3.2mm, the thickness of part of the PCB is 3.2-5.0mm, and the product with the technical edge needs to be subjected to shape processing in a V-cut mode so as to be convenient for the product to be well separated after being pasted.

A conventional device for processing a V-shaped groove in the PCB industry is a V-CUT machine, and the used tools are V-CUT knives (also called micro-nicking knives, V-cutting knives and the like in the industry). The prior art and the equipment can only produce conventional products with the plate thickness of less than 3.2mm, but cannot produce products with the plate thickness of more than the thickness or metal base materials. The patent adopts a method of raising the speed of a 150V-CUT knife, but the 150V-CUT knife is a tungsten steel product, the tooth density material is soft, and only the conventional FR4 PCB product with the plate thickness of less than 3.2mm can be produced, and the service life is short. A150 tungsten steel V-CUT cutter is adopted for producing PCB products with high hardness or metal materials, the cutter can jump and the service life can be shortened by more than 90 percent, and the V-CUT machine can not process ultra-thick metal base products with the plate thickness of 3.2-5.0 mm.

Disclosure of Invention

In view of the above, the invention provides a processing method of a V-shaped groove of an ultra-thick metal substrate printed circuit board, which starts from the process capability of equipment and the material technical capability of tools, designs a special V-CUT processing flow of the ultra-thick metal substrate printed circuit board through the process capability of V-CUT machine equipment and the deeper technical development of V-CUT cutter materials and angles, and ensures that ultra-thick and high-hardness metal substrate microwave products can be produced in batches, quickly and safely and the product quality is improved, and the conventional V-CUT machine and V-CUT cutter can not produce ultra-thick metal substrates.

The technical scheme of the invention is as follows:

a processing method of a V-shaped groove of an ultra-thick metal substrate printed board is characterized by comprising the following steps:

s1, selecting a V-CUT machine and a V-CUT knife: selecting a PIN hanging nail V-CUT machine with a depth control V-cutting function, and selecting V-CUT cutters with the same degree according to the V-CUT angle requirement to be processed;

s2, designing V-CUT processing data: setting hanging holes according to the equipment parameters of the V-CUT machine and the hole center distance of 80-120mm, calculating the center line through which the V-CUT passes according to the outer frame data and the degree data which are processed as required, and making data;

s3, setting V-CUT processing parameters: the processing times are as follows: designing the number of V-CUT times according to the thickness of the PCB and the residual thickness to be processed, wherein the number of V-CUT times (taking an integer) = ((board thickness-residual thickness) ÷ processing depth/knife) ÷ 2 surfaces, and the residual thickness is set conventionally; processing speed: the V-CUT conventional processing speed is between 30 and 60m/min, when the ultra-thick metal material product is produced, the more times of processing at the same position, the greater the resistance applied to the V-CUT knife, and the processing speed of the V-CUT knife needs to be reduced in sequence;

and S4, detecting the machining size of the V-shaped groove of the super-thick metal base material product.

Further, in the step S3, if the conventional material is processed, each blade is processed with a depth of 0.7-1.3mm, and each blade is processed with a depth of 0.3-0.7 mm.

Further, in the step S3, when the ultra-thick metal material product is produced, the processing speed is set to 40-70% of the processing speed of the conventional product.

Further, in step S4, the extra thickness of the V-groove needs to be measured by the V-CUT residual thickness measuring instrument to ensure that the dimension meets the design requirement.

Further, in the step S3, the thickness of the processed PCB is 2-5 mm.

Further, in step S1, the V-CUT knife is a tungsten steel dense-teeth knife or 25-90 dense-teeth knife⁰Of gold steelStone V-CUT knife.

The innovation points of the invention are as follows:

the invention provides a manufacturing method for processing the external dimension of an ultra-thick metal substrate PCB by adopting a V-CUT machine with a controllable depth V groove and a V-CUT cutter made of special materials and special angles. The new technology designs a program and a method for controlling the depth V for multiple times to finally meet the size requirement of a product according to the technical characteristics of super-thick and super-hard metal materials.

The invention combines the technical characteristics that the V-CUT machine has controllable processing depth, the special V-CUT knife can process metal materials, the angle of the V-CUT knife is increased, the processing service life can be prolonged, and the cost is reduced, ensures that metal base materials with the thickness of 3.2-5.0mm can be processed, and meets the requirement of large-scale automatic production of enterprises. Meanwhile, the new technology designs a product processing scheme according to the overall dimension of the ultra-thick metal material product, ensures that the overall dimension precision of the ultra-thick metal material product and the conventional product is within the range required by customers, and meets the quality requirements of the customers.

The technical scheme of the invention can achieve the following effects:

1. the V-CUT machine can only process and process products with the super-thickness of 2.0-5.0mm, and the invention discloses a V-CUT processing technology for rapidly and automatically processing printed boards of metal base materials with the super-thickness of 2.0-5.0mm by using the V-CUT machine, so that the microwave products with the super-thickness metal base materials can be rapidly and safely produced in batches.

2. The V-CUT knife used in the conventional FR4 product is a tungsten steel dense-tooth knife, and when a high-hardness metal base material microwave product is CUT, a technical scheme of V-CUT knife processing of special materials such as large-tooth diamond and the like needs to be adopted, so that the service life of the V-CUT knife is prolonged, and the high-hardness metal base material microwave product can be rapidly and safely produced in batches.

3. Development of 25-90⁰The diamond V-CUT cutter can be used for processing conventional products, the service life of the cutter can be prolonged from 10000m to more than 2000m, the processing capacity of the products is improved, and the processing cost is reduced.

4. Super-thick and metal substrate high-hardness special materials belong to 5G and subsequent market high-added-value processing projects, the processing profit of conventional products is very low, the new technology is adopted to realize autonomous production and preempt market first-time, and high processing profit can be obtained for the foreign generation processing.

5. The novel process is a technical innovation of the existing process, has strong operability, can meet the requirements of batch production and safe production of conventional products and special products of printed boards simultaneously, and can become a new profit increasing point of enterprises. On the premise that the technology is not limited by people, enterprises must use the high, fine and sharp technology as the latest profit increasing point to obtain more product orders and higher profit return.

The technical scheme of the application is essentially to improve the composition and connection relation of hardware parts, and does not relate to the improvement of a software program or a circuit structure per se.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.