阅读说明：本技术 磁控溅射阴极系统 (Magnetron sputtering cathode system ) 是由 王三军 刘圣烈 黄维邦 余晓军 于 2017-12-26 设计创作，主要内容包括：一种磁控溅射阴极系统(10),磁控溅射阴极系统(10)包括靶材(12)和设置在靶材(12)一侧的多个电磁系统单元(14)。每个电磁系统单元(14)独立工作并能够产生不同的磁力效应,电磁系统单元(14)的磁场线穿过靶材(12)的溅射面(122)。(A magnetron sputtering cathode system (10), the magnetron sputtering cathode system (10) comprising a target (12) and a plurality of electromagnetic system units (14) arranged at one side of the target (12). Each electromagnetic system unit (14) operates independently and is capable of generating different magnetic effects, and magnetic field lines of the electromagnetic system unit (14) pass through a sputtering surface (122) of the target (12).)

A magnetron sputtering cathode system, comprising:

a target material; and

the electromagnetic system units are arranged on one side of the target, each electromagnetic system unit works independently and can generate different magnetic force effects, and magnetic field lines of the electromagnetic system units penetrate through the sputtering surface of the target.

The magnetron sputtering cathode system of claim 1 wherein each of the electromagnetic system units comprises a magnetic component and a coil surrounding at least a portion of the magnetic component.

The magnetron sputtering cathode system of claim 2 further comprising a power source connected to the coil and a controller connected to the power source for controlling the current flowing from the power source through the coil.

The magnetron sputtering cathode system of claim 2, wherein the magnetic component comprises an E-shaped magnetic element or a U-shaped magnetic element.

The magnetron sputtering cathode system according to claim 1, further comprising a support plate opposing the target, wherein the plurality of electromagnetic system units are disposed on the support plate at intervals in a first direction, and wherein the plurality of electromagnetic system units are located between the target and the support plate.

The magnetron sputtering cathode system of claim 5 further comprising a drive member coupled to the support plate, the drive member configured to drive the support plate in a second direction perpendicular to the sputtering surface.

The magnetron sputtering cathode system according to claim 5, further comprising a plurality of retractable connecting members respectively corresponding to the plurality of electromagnetic system units, wherein one end of each connecting member is disposed on the supporting plate, and the other end thereof is connected to the electromagnetic system unit.

The magnetron sputtering cathode system according to claim 7, wherein the connecting member comprises a push rod and a cylinder, one end of the push rod is arranged in the cylinder, and the other end of the push rod is connected with the electromagnetic system unit; or

The connecting piece is a driving motor and comprises a stator and a telescopic rotor, one end of the rotor is arranged in the stator, and the other end of the rotor is connected with the electromagnetic system unit.

The magnetron sputtering cathode system according to claim 5, further comprising a plurality of connecting members respectively corresponding to the plurality of electromagnetic system units, wherein the support plate includes a plurality of sliding rails arranged at intervals in the first direction, each of the sliding rails extends in a third direction, the plurality of sliding rails correspond to the plurality of electromagnetic system units, and one end of each of the connecting members is slidably arranged on the sliding rail while the other end thereof is connected to the electromagnetic system unit.

The magnetron sputtering cathode system of claim 9, wherein the first direction is perpendicular to the third direction.