阅读说明：本技术 一种南瓜糕点及其加工工艺 (Pumpkin cake and processing technology thereof ) 是由 李芳华 于 2019-11-23 设计创作，主要内容包括：本发明公开了一种南瓜糕点及其加工工艺,本发明涉及糕点技术领域,具体为一种南瓜糕点及其加工工艺,本发明,糯米粉采用热水搅拌,形成烫面,在食用的时候比较劲道,提高了口感；本发明,将南瓜泥混入糯米粉中,使得糕点具有更高的营养价值；本发明,在南瓜糕点中添加葡萄干、芝麻和腰果,有效的提高了食用口感,受到广大食客的热爱；本发明,采用一次烘烤和二次烘烤对南瓜糕点进行烤制,使得南瓜糕点外酥里嫩,咀嚼时更加醇香。(The invention discloses a pumpkin cake and a processing technology thereof, relates to the technical field of cakes, and particularly relates to a pumpkin cake and a processing technology thereof.A glutinous rice flour is stirred by hot water to form a hot noodle, so that the pumpkin cake is chewy when being eaten, and the taste is improved; according to the invention, the pumpkin paste is mixed into the glutinous rice flour, so that the cake has higher nutritional value; according to the invention, the raisin, the sesame and the cashew are added into the pumpkin cake, so that the edible taste is effectively improved, and the pumpkin cake is popular with eaters; according to the invention, the pumpkin cake is baked by primary baking and secondary baking, so that the pumpkin cake is crisp outside and tender inside and is more mellow and fragrant when being chewed.)

1. A pumpkin cake is characterized in that: the cake comprises 5kg of old pumpkin, 5kg of glutinous rice flour, 1kg of salad oil, 5g of essence, 0.2mg of pigment, 1.5kg of hot water, 200g of raisin, 50g of cashew nut, 40g of sesame and 20g of white granulated sugar.

2. A pumpkin cake processing technology is characterized in that: the processing technology of the cake comprises the following steps:

step 1: preparing pumpkin paste, peeling old pumpkin, cutting into 5 × 10 strips, steaming in a pot for 30-40 min, and grinding to obtain pumpkin paste;

step 2: kneading dough, namely putting the glutinous rice flour into a basin, stirring and kneading dough by using hot water to ensure that the glutinous rice flour is fully and uniformly kneaded, adding 0.5kg of salad oil, uniformly stirring, and standing for 15 minutes;

and step 3: making pumpkin paste dough, namely fully mixing the pumpkin paste prepared in the step 1 with the glutinous rice flour prepared in the step 2, adding 20g of white granulated sugar, uniformly stirring, and then padding with flour to make the surface of the pumpkin paste smooth;

and 4, step 4: the pumpkin paste dough prepared in the step 3 is leveled by a rolling pin, the pumpkin paste dough is rolled to a dough sheet with the thickness of 3mm, then 0.5kg of salad oil is smeared on the dough sheet, 200g of raisins and 50g of cashews are scattered, and then the dough sheet is rolled up from one side to form a cylinder;

and 5: making a cake, namely uniformly dividing the cylinder in the step 4 into a plurality of small pills with the weight of 3-4g, folding the two ends of the small pills inwards, wrapping the small pills into a steamed stuffed bun shape, rolling the small pills into a round cake with the thickness of 1cm by using a rolling pin, and uniformly scattering sesame on the round cake;

step 6: baking;

and 7: and (3) inner packaging and outer packaging, namely wrapping a layer of oil absorbing paper on the outer part of the pumpkin cake cooled to 30 ℃, then putting the pumpkin cake into an outer packaging bag, adding a moisture-proof agent, and spraying the production date by using an ink-jet printer.

3. The pumpkin cake processing technology of claim 2, which is characterized in that: the step 2: the hot water for kneading dough has a temperature of 80-90 deg.C.

4. The pumpkin cake processing technology of claim 2, which is characterized in that: the step 6: the baking comprises primary baking and secondary baking.

5. The pumpkin cake processing technology of claim 4, wherein the pumpkin cake processing technology comprises the following steps: the primary baking is to bake the pumpkin cake in a baking room at the baking temperature of 200 ℃ for 10-15 minutes, and take out.

6. The pumpkin cake processing technology of claim 4, wherein the pumpkin cake processing technology comprises the following steps: and 5, the first baking is to bake the round cake prepared in the step 5 in a baking room, the lower baking temperature is 150 ℃, the upper baking temperature is 170 ℃, the round cake is baked for 40 minutes and then taken out, the second baking is to cool the round cake to 40 ℃, the round cake is placed again in the baking room, the temperature in the baking room is the same as the set temperature of the first baking, and the round cake is baked for 60 minutes and then taken out.

Technical Field

The invention relates to the technical field of cakes, in particular to a pumpkin cake and a processing technology thereof.

Background

Pastry (CakesandPastries) is a food product. It is made up by using flour or rice flour, sugar, oil and fat, egg and milk product as main raw material, adding various auxiliary materials, filling material and flavouring material, primary-making and forming, then steaming, roasting, frying and stir-frying. The cake is a finished product of food which is prepared by taking rice, flour, beans and the like as main raw materials, adding various auxiliary materials, stuffing and seasonings, processing into a certain shape and then baking, roasting, steaming, frying and the like. The pastry has the meaning of a snack in daily life of people, so the pastry is different from pastry snacks in the catering industry. The cake can be used as breakfast, tea snack, or snack in a mat.

However, the existing cakes have the problems of poor mouthfeel, no crisp taste when being eaten, no mellow flavor when being chewed and low nutritional value.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a pumpkin cake and a processing technology thereof, and solves the problems of poor taste, no crisp taste when being eaten, no mellow flavor when being chewed and low nutritive value of the existing cake.

(II) technical scheme

In order to achieve the purpose, the invention provides the following technical scheme: a pumpkin cake comprises 5kg of old pumpkin, 5kg of glutinous rice flour, 1kg of salad oil, 5g of essence, 0.2mg of pigment, 1.5kg of hot water, 200g of raisin, 50g of cashew nut, 40g of sesame and 20g of white granulated sugar.

The pumpkin cake processing technology comprises the following steps:

step 1: preparing pumpkin paste, peeling old pumpkin, cutting into 5 × 10 strips, steaming in a pot for 30-40 min, and grinding to obtain pumpkin paste;

step 2: kneading dough, namely putting the glutinous rice flour into a basin, stirring and kneading dough by using hot water to ensure that the glutinous rice flour is fully and uniformly kneaded, adding 0.5kg of salad oil, uniformly stirring, and standing for 15 minutes;

and step 3: making pumpkin paste dough, namely fully mixing the pumpkin paste prepared in the step 1 with the glutinous rice flour prepared in the step 2, adding 20g of white granulated sugar, uniformly stirring, and then padding with flour to make the surface of the pumpkin paste smooth;

and 4, step 4: the pumpkin paste dough prepared in the step 3 is leveled by a rolling pin, the pumpkin paste dough is rolled to a dough sheet with the thickness of 3mm, then 0.5kg of salad oil is smeared on the dough sheet, 200g of raisins and 50g of cashews are scattered, and then the dough sheet is rolled up from one side to form a cylinder;

and 5: making a cake, namely uniformly dividing the cylinder in the step 4 into a plurality of small pills with the weight of 3-4g, folding the two ends of the small pills inwards, wrapping the small pills into a steamed stuffed bun shape, rolling the small pills into a round cake with the thickness of 1cm by using a rolling pin, and uniformly scattering sesame on the round cake;

step 6: baking;

and 7: and (3) inner packaging and outer packaging, namely wrapping a layer of oil absorbing paper on the outer part of the pumpkin cake cooled to 30 ℃, then putting the pumpkin cake into an outer packaging bag, adding a moisture-proof agent, and spraying the production date by using an ink-jet printer.

The step 2: the hot water for kneading dough has a temperature of 80-90 deg.C.

The step 6: the baking comprises primary baking and secondary baking.

The primary baking is to bake the pumpkin cake in a baking room at the baking temperature of 200 ℃ for 10-15 minutes, and take out.

And 5, the first baking is to bake the round cake prepared in the step 5 in a baking room, the lower baking temperature is 150 ℃, the upper baking temperature is 170 ℃, the round cake is baked for 40 minutes and then taken out, the second baking is to cool the round cake to 40 ℃, the round cake is placed again in the baking room, the temperature in the baking room is the same as the set temperature of the first baking, and the round cake is baked for 60 minutes and then taken out.

(III) advantageous effects

The invention provides a pumpkin cake and a processing technology thereof. The method has the following beneficial effects:

according to the invention, the glutinous rice flour is stirred by hot water to form the hot noodles, so that the glutinous rice noodles are chewier and have improved taste;

according to the invention, the pumpkin paste is mixed into the glutinous rice flour, so that the cake has higher nutritional value;

according to the invention, the raisin, the sesame and the cashew are added into the pumpkin cake, so that the edible taste is effectively improved, and the pumpkin cake is popular with eaters;

according to the invention, the pumpkin cake is baked by primary baking and secondary baking, so that the pumpkin cake is crisp outside and tender inside and is more mellow and fragrant when being chewed.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides a technical scheme that: a pumpkin cake comprises 5kg of old pumpkin, 5kg of glutinous rice flour, 1kg of salad oil, 5g of essence, 0.2mg of pigment, 1.5kg of hot water, 200g of raisin, 50g of cashew nut, 40g of sesame and 20g of white granulated sugar.

The pumpkin cake processing technology comprises the following steps:

step 1: preparing pumpkin paste, peeling old pumpkin, cutting into 5 × 10 strips, steaming in a pot for 30-40 min, and grinding to obtain pumpkin paste;

step 2: kneading dough, namely putting the glutinous rice flour into a basin, stirring and kneading dough by using hot water to ensure that the glutinous rice flour is fully and uniformly kneaded, adding 0.5kg of salad oil, uniformly stirring, and standing for 15 minutes;

and step 3: making pumpkin paste dough, namely fully mixing the pumpkin paste prepared in the step 1 with the glutinous rice flour prepared in the step 2, adding 20g of white granulated sugar, uniformly stirring, and then padding with flour to make the surface of the pumpkin paste smooth;

and 4, step 4: the pumpkin paste dough prepared in the step 3 is leveled by a rolling pin, the pumpkin paste dough is rolled to a dough sheet with the thickness of 3mm, then 0.5kg of salad oil is smeared on the dough sheet, 200g of raisins and 50g of cashews are scattered, and then the dough sheet is rolled up from one side to form a cylinder;

and 5: making a cake, namely uniformly dividing the cylinder in the step 4 into a plurality of small pills with the weight of 3-4g, folding the two ends of the small pills inwards, wrapping the small pills into a steamed stuffed bun shape, rolling the small pills into a round cake with the thickness of 1cm by using a rolling pin, and uniformly scattering sesame on the round cake;

step 6: baking;

and 7: and (3) inner packaging and outer packaging, namely wrapping a layer of oil absorbing paper on the outer part of the pumpkin cake cooled to 30 ℃, then putting the pumpkin cake into an outer packaging bag, adding a moisture-proof agent, and spraying the production date by using an ink-jet printer.

The step 2: the hot water for kneading dough has a temperature of 80-90 deg.C.

The step 6: the baking comprises primary baking and secondary baking.

The primary baking is to bake the pumpkin cake in a baking room at the baking temperature of 200 ℃ for 10-15 minutes, and take out.

And 5, the first baking is to bake the round cake prepared in the step 5 in a baking room, the lower baking temperature is 150 ℃, the upper baking temperature is 170 ℃, the round cake is baked for 40 minutes and then taken out, the second baking is to cool the round cake to 40 ℃, the round cake is placed again in the baking room, the temperature in the baking room is the same as the set temperature of the first baking, and the round cake is baked for 60 minutes and then taken out.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.