阅读说明：本技术 一种多层刚挠结合板制作方法和装置 (Method and device for manufacturing multilayer rigid-flex printed circuit board ) 是由 孙启双 孙文兵 于 2019-09-18 设计创作，主要内容包括：本发明公开了一种多层刚挠结合板制作方法和装置,适用于PCB加工技术领域,方法包括：制作单侧刚性板；进行双面挠性板表面加工；压合单侧刚性板和双面挠性板；在双面挠性板指定的露出位置进行单侧刚性板开窗。装置用于执行对应方法。本发明实施例通过制作单侧刚性板；进行双面挠性板表面加工；压合单侧刚性板和双面挠性板；在双面挠性板指定的露出位置进行单侧刚性板开窗,能够通过合理的处理步骤,提高多层刚挠结合板的生产良率。(The invention discloses a method and a device for manufacturing a multilayer rigid-flex printed circuit board, which are suitable for the technical field of PCB processing, and the method comprises the following steps: manufacturing a single-side rigid plate; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the single-sided rigid plate is windowed at the designated exposure position of the double-sided flexible plate. The apparatus is for performing a corresponding method. In the embodiment of the invention, a single-side rigid plate is manufactured; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the window opening of the rigid plate on one side is carried out at the appointed exposure position of the double-sided flexible plate, and the production yield of the multilayer rigid-flex printed circuit board can be improved through reasonable processing steps.)

1. A method for manufacturing a multilayer rigid-flex printed circuit board is characterized by comprising the following steps:

manufacturing a single-side rigid plate;

Processing the surface of a double-sided flexible plate;

Pressing the single-sided rigid plate and the double-sided flexible plate;

And performing single-side rigid plate windowing at the appointed exposure position of the double-sided flexible plate.

2. The method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the manufacturing of the single-sided rigid board comprises the following steps: sequentially pressing a copper-free side of the single-side copper-clad plate, a non-gummosis PP plate, a double-side copper-clad plate and a non-gummosis PP plate;

Alternatively, the fabricating the one-sided rigid plate includes: and pressing the copper-free side of the single-side copper-clad plate and the no-flow glue PP plate.

3. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the processing of the surface of the double-sided flexible board comprises the following steps: and cutting the covering film by laser, and attaching the cut covering film to the surface of the double-sided flexible board.

4. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 1, wherein the processing of the surface of the double-sided flexible board comprises the following steps: and adhering glue to the welding points on the surface of the double-sided flexible plate and the areas around the welding points.

5. The method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 2, wherein the manufacturing of the single-sided rigid board comprises the following steps: and arranging positioning holes at the edge of the copper-clad plate, wherein the positioning holes are used for determining the pressing position between the single-side rigid plates positioned at different sides of the double-sided flexible plate.

6. the method for manufacturing a multi-layer rigid-flex printed circuit board according to claim 2, wherein the manufacturing of the single-sided rigid board further comprises: and windowing is carried out on the PP plate which is in contact with the double-sided flexible plate, and the windowing position corresponds to the appointed exposure position of the double-sided flexible plate.

7. the method for manufacturing a multilayer rigid-flex printed circuit board according to claim 2, wherein the single-sided copper-clad plate and the double-sided copper-clad plate comprise an FR4 plate and a copper layer.

8. the method for manufacturing a multilayer rigid-flex printed circuit board according to claim 2, wherein the single-sided rigid board is windowed by a gong machine.

9. The utility model provides a multilayer rigid-flex printed circuit board making devices which characterized in that includes:

the outer layer unit is used for manufacturing a single-side rigid plate;

The middle layer unit is used for processing the surface of the double-sided flexible board;

the pressing unit is used for pressing the single-side rigid plate and the double-sided flexible plate;

And an opening unit for performing one-side rigid plate windowing at the specified exposure position of the double-sided flexible plate.

Technical Field

the invention relates to the technical field of PCB processing, in particular to a method and a device for manufacturing a multilayer rigid-flex printed circuit board.

background

Rigid-flex boards are circuit boards formed by selectively laminating rigid and flexible substrates together. The layers are conductively connected using metallized holes. Each panel has one or more exposed soft zones. The rigid-flexible printed board is convenient to install, can be installed in a bendable and three-dimensional mode, and effectively utilizes installation space. The rigid-flex combination mode can also replace an insert, and high reliability under vibration impact, humid and severe environments is guaranteed.

Meanwhile, due to the difference of the rigid and flexible properties, the yield is not high in the processing, and the production cost is too high.

Disclosure of Invention

Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, the invention aims to provide a method and a device for manufacturing a multilayer rigid-flex printed circuit board.

The technical scheme adopted by the invention is as follows:

In a first aspect, an embodiment of the present invention provides a method for manufacturing a multilayer rigid-flex printed circuit board, including: manufacturing a single-side rigid plate; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the single-sided rigid plate is windowed at the designated exposure position of the double-sided flexible plate.

Preferably, the making of the single-sided rigid plate comprises: sequentially pressing a copper-free side of the single-side copper-clad plate, a non-gummosis PP plate, a double-side copper-clad plate and a non-gummosis PP plate; alternatively, fabricating the one-sided rigid plate includes: and pressing the copper-free side of the single-side copper-clad plate and the no-flow glue PP plate.

Preferably, the double-sided flexible sheet surface processing comprises: and cutting the covering film by laser, and attaching the cut covering film to the surface of the double-sided flexible board.

preferably, the double-sided flexible board surface processing comprises: and adhering glue to the welding points on the surface of the double-sided flexible board and the areas around the welding points.

Preferably, the making of the single-sided rigid plate comprises: and positioning holes are formed in the edge of the copper-clad plate and used for determining the pressing position between the single-side rigid plates on different sides of the double-sided flexible plate.

Preferably, the manufacturing of the one-sided rigid plate further comprises: and windowing is carried out on the PP plate which is in contact with the double-sided flexible plate, and the windowing position corresponds to the appointed exposure position of the double-sided flexible plate.

Preferably, the single-sided copper clad laminate and the double-sided copper clad laminate include FR4 board and copper layer.

preferably, the one-sided rigid panel windowing is performed by a gong machine.

in a second aspect, an embodiment of the present invention provides a device for manufacturing a multilayer rigid-flex printed circuit board, including: the outer layer unit is used for manufacturing a single-side rigid plate; the middle layer unit is used for processing the surface of the double-sided flexible board; the pressing unit is used for pressing the single-side rigid plate and the double-sided flexible plate; and an opening unit for performing one-side rigid plate windowing at the specified exposure position of the double-sided flexible plate.

The embodiment of the invention has the beneficial effects that:

In the embodiment of the invention, a single-side rigid plate is manufactured; processing the surface of a double-sided flexible plate; pressing the single-side rigid plate and the double-sided flexible plate; the window opening of the rigid plate on one side is carried out at the appointed exposure position of the double-sided flexible plate, and the production yield of the multilayer rigid-flex printed circuit board can be improved through reasonable processing steps.

Drawings

FIG. 1 is a flow chart of one embodiment of a method of making a multi-layer rigid-flex printed circuit board;

FIG. 2 is a block diagram of an embodiment of an original block diagram of a multi-layer rigid-flex printed circuit board;

FIG. 3 is a block diagram of an embodiment of a final block diagram of a multi-layer rigid-flex board;

FIG. 4 is a drawing showing the attachment of an embodiment of a device for producing a multi-layer rigid-flex printed circuit board.

Detailed Description

it should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.