阅读说明：本技术 一种透明led电路板及透明led显示屏的制备方法 (Transparent LED circuit board and preparation method of transparent LED display screen ) 是由 林富 于 2020-05-07 设计创作，主要内容包括：为克服现有技术中的透明LED电路板制备方法存在的方案相对较复杂,可靠性较差,铜箔形成的电路图案与透明基板的粘合度差,容易从透明基板上脱落的问题,本发明提供了一种透明LED电路板及透明LED显示屏的制备方法。本发明一方面提供一种透明LED电路板制备方法,包括如下步骤：在清洁及干燥后的所述透明基板上通过UV胶粘接铜箔；将所述铜箔进行曝光显影蚀刻,形成电路图案；将附着形成电路图案的透明基板浸泡在软化液中软化；然后去除蚀刻掉所述铜箔的区域上软化以后的残留粘结剂。本发明提供的透明LED电路板制备方法,因此可满足透明LED显示屏的使用需求。本方法形成的电路图案,铜箔和透明基板粘合稳固,不变形不脱落。(In order to solve the problems that a scheme of a transparent LED circuit board preparation method in the prior art is relatively complex, reliability is poor, adhesion degree of a circuit pattern formed by copper foil and a transparent substrate is poor, and the circuit pattern is easy to fall off from the transparent substrate, the invention provides a transparent LED circuit board and a preparation method of a transparent LED display screen. The invention provides a preparation method of a transparent LED circuit board on one hand, which comprises the following steps: bonding a copper foil on the cleaned and dried transparent substrate through UV (ultraviolet) glue; exposing, developing and etching the copper foil to form a circuit pattern; soaking the transparent substrate with the circuit pattern in softening liquid for softening; and then removing the residual adhesive after the copper foil is etched and softened on the area of the copper foil. The preparation method of the transparent LED circuit board provided by the invention can meet the use requirement of the transparent LED display screen. The circuit pattern formed by the method has the advantages that the copper foil and the transparent substrate are firmly bonded, and the circuit pattern is not deformed and falls off.)

1. A preparation method of a transparent LED circuit board is characterized by comprising the following steps:

cleaning and drying the transparent substrate;

coating an adhesive on the front surface of the cleaned and dried transparent substrate, wherein the adhesive is UV (ultraviolet) glue; placing the copper foil above the UV glue, applying pressure on the copper foil, and pre-pressing the copper foil on the transparent substrate; irradiating UV glue from the back of a transparent substrate by using ultraviolet rays, curing the UV glue, and curing and bonding the copper foil and the transparent substrate;

exposing, developing and etching the copper foil to form a circuit pattern;

and removing the redundant adhesive on the circuit pattern.

2. The method for preparing the transparent LED circuit board according to claim 1, wherein the step of removing the excess adhesive on the circuit pattern specifically comprises the steps of:

soaking the transparent substrate attached with the formed circuit pattern in softening liquid, gradually dissolving and softening the residual binder on the area etched away from the copper foil and enabling the transparent substrate to be separated; and then removing the residual adhesive after the copper foil is etched and softened on the area of the copper foil.

3. The method for preparing the transparent LED circuit board according to claim 1, wherein the step of cleaning and drying the transparent substrate comprises the following steps:

cleaning the transparent substrate by one or more of acid washing, alkali washing and water washing, and drying the cleaned transparent substrate in a dust-free state.

4. The method for preparing the transparent LED circuit board according to claim 1, wherein the step of placing the copper foil above the UV glue, applying pressure on the copper foil, and pre-pressing the copper foil on the transparent substrate specifically comprises the following steps:

and placing the copper foil above the UV glue, applying pressure above the copper foil for pressing, and pre-pressing the copper foil on the transparent substrate.

5. The method for preparing the transparent LED circuit board according to claim 1, wherein the step of exposing, developing and etching the copper foil to form a circuit pattern specifically comprises the steps of:

covering a photosensitive film on the copper foil, covering a film with a circuit pattern on the photosensitive film, exposing, and etching away the unnecessary part of the copper foil through a solution to leave the required circuit pattern.

6. The method for preparing the transparent LED circuit board according to claim 2, wherein the step of removing the softened residual adhesive on the area where the copper foil is etched away comprises the following steps:

removing the softened residual adhesive on the copper foil area by adopting a scraping mode; or washing off the softened residual adhesive on the copper foil area by using a washing device.

7. The method for preparing a transparent LED circuit board according to claim 1, wherein the copper foil has a thickness of 6-105 μm.

8. The method for manufacturing the transparent LED circuit board according to claim 1, wherein the transparent substrate is tempered glass or a transparent plastic substrate, and the thickness of the transparent substrate is 2-10 mm.

9. The method for preparing the transparent LED circuit board according to claim 1, wherein the circuit pattern comprises a power supply pad, a signal pad and bead lands for mounting LED beads arranged in an array;

each lamp bead welding area is provided with a pin welding disc corresponding to a pin of the LED lamp; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads;

signal wires for signal transmission are arranged between the signal bonding pads and the signal pin bonding pads in the lamp bead welding areas and between the signal pin bonding pads in the adjacent lamp bead welding areas in the same row or the same column; control signals for controlling the on and off of the LED lamp beads can be input from the signal bonding pad and then transmitted in sequence through the LED lamp beads;

and electrically connecting the electrode pin pad on the lamp bead welding area with the power supply pad with the same polarity through a power line.

10. A preparation method of a transparent LED display screen comprises the following steps: preparing a transparent LED circuit board; installing an LED lamp on the transparent LED circuit board, and then packaging;

the method for preparing the transparent LED circuit board is the method for preparing the transparent LED circuit board as claimed in any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of a printed circuit board of a transparent substrate as an LED transparent display screen.

Background

The printed circuit of the transparent substrate is generally applied to the field of LCD display screens, a metal conducting layer, usually a copper plating layer, is formed on the transparent substrate such as glass in a magnetron sputtering mode, then a circuit pattern is formed on the transparent substrate in an etching mode, the thickness of the conducting layer is generally in a nanometer level, and the conducting current is very small. In addition, there is a proposal of forming a transparent circuit pattern on a glass substrate by using a conductive material such as ITO, nano silver, metal mesh, etc., but the square resistance of the circuit pattern is large, and the conductive current is also small, which is difficult to use in products with large current demand.

For example, a transparent LED circuit board using transparent glass as a substrate is taken as an example, the LED lamps mounted on the glass substrate have a large demand for current, one LED lamp needs about 3-15 mA (milliampere) of driving current, and a square meter of LED display screen is mounted with 1000-20000 unequal LED lamps, which has a very large demand for current.

As an improvement, a new glass substrate copper-clad process is proposed, and a copper-clad layer with the thickness of 10-70 microns is formed on the glass substrate, so as to meet the application requirements of the transparent LED circuit board. The new process substantially comprises the following steps: and adhering copper foil on the glass substrate by glue, etching the copper foil to form a circuit pattern, and removing the redundant glue at the position where the copper foil is etched by a laser carbonization mode. This method is difficult to effectively bond the copper foil and the glass plate because the circuit on the final circuit pattern is very narrow (0.1-0.5mm line width), and the glue is difficult to ensure the effective bonding of the copper foil and the glass because the high temperature of about 260 ℃ is required during the SMT (surface mount technology) process. Meanwhile, the time and conditions for the effective adhesion of the glue to the glass substrate are difficult to grasp.

Disclosure of Invention

The invention provides a transparent LED circuit board and a preparation method of a transparent LED display screen, aiming at solving the problems that the adhesion degree of a circuit pattern formed by a copper foil and a transparent substrate is poor, the circuit pattern is easy to fall off from the transparent substrate, and the effective adhesion time and conditions of glue and a glass substrate are difficult to control in the preparation method of the transparent LED circuit board in the prior art.

The invention provides a preparation method of a transparent LED circuit board on one hand, which comprises the following steps:

cleaning and drying the transparent substrate;

coating an adhesive on the front surface of the cleaned and dried transparent substrate, wherein the adhesive is UV (ultraviolet) glue; placing the copper foil above the UV glue, applying pressure on the copper foil, and pre-pressing the copper foil on the transparent substrate; irradiating UV glue from the back of a transparent substrate by using ultraviolet rays, curing the UV glue, and curing and bonding the copper foil and the transparent substrate;

exposing, developing and etching the copper foil to form a circuit pattern;

and removing the redundant adhesive on the circuit pattern.

According to the preparation method of the transparent LED circuit board, the circuit pattern with copper as the conductive material can be formed on the transparent substrate, the conductive requirement of a high-power electronic component can be met, and the high transparency of a finished product can be ensured, so that the use requirement of a transparent LED display screen can be met. The circuit pattern formed by the method not only enables the copper foil and the transparent substrate to be firmly bonded, but also can resist the reflow soldering temperature in the SMT processing process of electronic components, and the bonding force between the circuit pattern and the transparent substrate is still very stable after high-temperature reflow soldering, and the circuit pattern is not deformed and does not fall off. The transparent substrate and the copper foil are bonded by using UV adhesive, and the manufacturing process can be carried out at normal temperature. The process can be effectively simplified when the process is carried out at normal temperature, the requirement on the processing environment is not high, the energy consumption is reduced, and the cost is reduced. Meanwhile, the UV adhesive can be quickly adhered under the irradiation condition of ultraviolet rays, so that the adhesion reliability is easy to judge, and the processing efficiency is very high.

Further, the step of removing the excess adhesive on the circuit pattern specifically includes the following steps:

soaking the transparent substrate attached with the formed circuit pattern in softening liquid, gradually dissolving and softening the residual binder on the area etched away from the copper foil and enabling the transparent substrate to be separated; and then removing the residual adhesive after the copper foil is etched and softened on the area of the copper foil. Adopt the softening liquid to dissolve the softening and can break away from transparent substrate to unnecessary UV glue, then get rid of unnecessary UV glue again, it is cleaner to handle UV glue, and efficiency is higher.

Further, the step of "cleaning and drying the transparent substrate" includes the steps of:

cleaning the transparent substrate by one or more of acid washing, alkali washing and water washing, and drying the cleaned transparent substrate in a dust-free state.

Further, the step of placing the copper foil above the UV glue, applying pressure on the copper foil, and pre-pressing the copper foil on the transparent substrate specifically comprises the steps of:

and placing the copper foil above the UV glue, pressing the copper foil above the UV glue by using a flat weight, and pre-pressing the copper foil on the transparent substrate.

Further, the step of exposing, developing and etching the copper foil to form a circuit pattern includes the following steps:

covering a photosensitive film on the copper foil, covering a film with a circuit pattern on the photosensitive film, exposing, etching, and removing the unnecessary part of the copper foil through solution etching to leave the required circuit pattern.

Further, the step of removing the residual adhesive after the copper foil is etched and softened on the area of the copper foil comprises the following steps:

removing the softened residual adhesive on the copper foil area by adopting a scraping mode; or washing off the softened residual adhesive on the copper foil area by using a washing device.

Further, the copper foil is 6-105 microns thick.

Further, the transparent substrate is toughened glass or a transparent plastic substrate, and the thickness of the transparent substrate is 2-10 mm.

Furthermore, the circuit pattern comprises a power supply bonding pad, a signal bonding pad and a lamp bead welding area which is arranged in an array and is provided with LED lamp beads;

each lamp bead welding area is provided with a pin welding disc corresponding to a pin of the LED lamp; the pin bonding pads comprise signal pin bonding pads and electrode pin bonding pads;

signal wires for signal transmission are arranged between the signal bonding pads and the signal pin bonding pads in the lamp bead welding areas and between the signal pin bonding pads in the adjacent lamp bead welding areas in the same row or the same column; control signals for controlling the on and off of the LED lamp beads can be input from the signal bonding pad and then transmitted in sequence through the LED lamp beads;

and electrically connecting the electrode pin pad on the lamp bead welding area with the power supply pad with the same polarity through a power line.

The invention provides a preparation method of a transparent LED display screen, which comprises the following steps: preparing a transparent LED circuit board; installing an LED lamp on the transparent LED circuit board, and then packaging;

the method for preparing the transparent LED circuit board is the method for preparing the transparent LED circuit board.

According to the preparation method of the transparent LED display screen, when the transparent LED circuit board is prepared, the circuit pattern with copper as the conductive material can be formed on the transparent substrate, so that the conductive requirement of electronic components with higher power can be met, and the finished product can have higher transparency, so that the use requirement of the transparent LED display screen can be met. The circuit pattern formed by the method not only enables the copper foil and the transparent substrate to be firmly bonded, but also can resist the reflow soldering temperature in the SMT processing process of electronic components, and the bonding force between the circuit pattern and the transparent substrate is still very stable after high-temperature reflow soldering, and the circuit pattern is not deformed and does not fall off. The transparent substrate and the copper foil are bonded by using UV adhesive, and the manufacturing process can be carried out at normal temperature. The process can be effectively simplified when the process is carried out at normal temperature, the requirement on the processing environment is not high, the energy consumption is reduced, and the cost is reduced. Meanwhile, the UV adhesive can be quickly adhered under the irradiation condition of ultraviolet rays, so that the adhesion reliability is easy to judge, and the processing efficiency is very high.

Drawings

FIG. 1 is a flow chart of a transparent LED circuit board fabrication process provided in an embodiment of the present invention;

FIG. 2 is a flowchart of the optimization of step S2 in FIG. 1;

FIG. 3 is a schematic view of an adhesive applied to a transparent substrate provided in an embodiment of the present invention;

fig. 4 is a schematic view of a copper foil laminated on a transparent substrate by a roller and cured by ultraviolet light according to an embodiment of the present invention;

FIG. 5 is a schematic illustration of the removal of residual adhesive provided in an embodiment of the present invention;

FIG. 6 is a schematic top view of a primary transparent circuit board provided in an embodiment of the present invention after softening residual adhesive;

FIG. 7 is a schematic top view of a transparent LED circuit board provided in an embodiment of the present invention after removal of softened residual adhesive;

fig. 8 is an enlarged schematic view of a portion a of fig. 7.

Wherein, 1, a transparent substrate; 2. a binder; 3. copper foil; 4. a flat plate; 5. an ultraviolet light irradiation device; 6. a softening box; 7. a flushing device;

20. residual binder; 30. a circuit pattern; 60. softening liquid;

100. gluing a substrate; 200. a copper-clad substrate; 300. a primary transparent circuit board; 400. a transparent LED circuit board;

30a, a pin pad; 30b, a power supply pad; 30c, signal pads; 30d, a power line; 30e, a first signal line; 30f, and a second signal line.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

The present embodiment will specifically explain the preparation method of the transparent LED circuit board provided by the present invention, as shown in fig. 1, including the following steps:

step S1, a transparent substrate cleaning step: cleaning and drying the transparent substrate 1;

step S2, copper foil pressing and bonding: coating an adhesive 2 on the cleaned and dried transparent substrate 1; then pressing and bonding the copper foil 3 on the transparent substrate 1; the copper foil 3 preferably has a thickness of 6 to 105 μm.

Step S3, circuit pattern forming step: exposing, developing and etching the copper foil 3 to form a circuit pattern 30;

step S4, excess adhesive removing step: the excess adhesive 2 on the circuit pattern 30 is removed.

The following is a detailed explanation of each step.

In step S1, the transparent substrate 1 needs to be cleaned, and usually the transparent substrate 1 can be purchased to customize the transparent substrate 1 with a specific specification, or after a large number of transparent substrates 1 are purchased, the transparent substrate 1 with a specific specification is prepared by cutting, edging and other processes; in the cleaning and drying, the transparent substrate 1 may be cleaned by one or more of acid washing, alkali washing, and water washing, and then the cleaned transparent substrate 1 may be dried in a dust-free state. During cleaning, for example, after acid washing and alkali washing, purified water is used for water washing, and as a preferred mode, during drying, on one hand, a fan or high-pressure gas can be used for blowing, and low-temperature heating and drying can be performed.

In step S2, the copper foil 3 and the transparent substrate 1 need to be bonded by using the bonding agent 2, the bonding agent is a UV adhesive, which is also called shadowless adhesive, photosensitive adhesive, ultraviolet light curing adhesive, and the like, and is an adhesive that can be cured only by irradiation of ultraviolet light, and it can be used as a bonding agent, and can also be used as a glue material for paint, coating, ink, and the like. UV is an abbreviation for Ultraviolet Rays, the term UV light. The principle of shadowless glue curing is that a photoinitiator (or photosensitizer) in a UV curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and the polymerization and crosslinking chemical reaction of monomers are initiated, so that the adhesive is converted from a liquid state to a solid state within a few seconds. In this example, the UV paste is used as an example to describe how the copper foil 3 and the transparent substrate 1 are bonded and how the excess adhesive 2 is removed in the subsequent steps.

As shown in fig. 2, the method specifically includes the following steps:

step S21, coating UV glue on the front surface: as shown in fig. 3, the adhesive 2 is a UV adhesive, and the UV adhesive is coated on the front surface of the transparent substrate 1 after cleaning and drying; in this example, "front surface" and "back surface" are relative concepts, and when the copper foil 3 is bonded by applying UV paste to the front surface, it is necessary to irradiate the copper foil from the back surface thereof when ultraviolet light is irradiated. As shown in the figure, the transparent substrate 1 to which the UV paste is attached is referred to as a paste substrate 100;

step S22, copper foil prepressing: placing the copper foil 3 above the UV glue, applying pressure on the copper foil 3, and pre-pressing the copper foil 3 on the transparent substrate 1;

step S23, ultraviolet curing step: UV glue is irradiated from the back surface of the transparent substrate 1 by using ultraviolet rays, and the UV glue is cured, so that the copper foil 3 and the transparent substrate 1 are cured and bonded.

The transparent substrate 1 and the copper foil 3 are bonded by using UV adhesive, and the manufacturing process can be carried out at normal temperature. The process can be effectively simplified when the process is carried out at normal temperature, the requirement on the processing environment is not high, the energy consumption is reduced, and the cost is reduced.

In this example, as shown in fig. 4, the step S22 is performed by placing the copper foil 3 above the UV paste, and pre-pressing the copper foil 3 on the transparent substrate 1 by applying pressure on the copper foil 3 in the direction indicated by the arrow in the figure using a flat plate 4. An intermediate comprising copper foil 3, UV glue and transparent substrate 1 as marked in the figure is obtained, which for the sake of distinction is named copper clad substrate 200; in this example, as a preferable mode, while the pressing is performed, the UV light is emitted from the ultraviolet light irradiation device 5 to irradiate the UV paste from the back surface of the transparent substrate 1 until the UV paste is cured, and the copper foil 3 and the transparent substrate 1 are cured and bonded. That is, step S23 is performed simultaneously with step S22, but step S22 and step S23 may be performed sequentially. In order to avoid the generation of bubbles between the copper foil 3 and the transparent substrate 1 after lamination, the lamination process is carried out in a vacuum environment, so that the effect is better.

The step S3 relates to a method for forming the circuit pattern 30, which is a common method for forming a printed circuit board, and is well known and need not be described specifically, and generally includes the following steps: a photosensitive film is coated on the copper foil 3 of the copper-clad substrate 200, a film having a circuit pattern is coated on the photosensitive film, exposure is performed, and then the unnecessary portion of the copper foil is etched away by a solution, leaving a desired circuit pattern 30. For the sake of distinction, the transparent substrate 1 (i.e., including the transparent substrate 1, the adhesive 2, the circuit pattern 30) after the circuit pattern 30 is formed is named as a primary transparent circuit board 300.

As shown in fig. 5, the method for removing the excess adhesive 2 in step S4 includes, first, preparing a softening liquid 60 in a softening tank 6, wherein the softening liquid may be a weak acid solution (but not limited to a weak acid solution), soaking the transparent substrate 1 (i.e., the primary transparent circuit board 300) attached with the circuit pattern 30 in the softening liquid 60 for 35 to 50 minutes, gradually dissolving and softening the residual adhesive 20 on the area etched away from the copper foil 3 and removing the transparent substrate 1 (this state can be referred to fig. 6); and then, washing off the softened residual adhesive 20 on the area of the copper foil 3 by using a washing device 7 to obtain the transparent LED circuit board 400. Alternatively, it is also conceivable to remove the residual adhesive 20 after softening the region of the copper foil 3 by scraping and etching.

The applicant has also tried to remove the excess binder 2 directly by laser high-temperature carbonization, but it was found that this method has more problems: 1. full area laser scanning is required and the efficiency is low. 2. The irradiation range of the laser equipment is limited, and large-area scanning is difficult; 3. the laser can easily solidify the glue on the glass while carbonizing the glue, and the glue is difficult to remove. This is therefore not preferred. After the softening by the softening liquid mentioned in the present application is performed, the skin is easily peeled off from the transparent substrate 1 as in the state shown in fig. 6, and at this time, when the excess residual adhesive 20 is removed again by scraping or washing, the excess residual adhesive is easily removed. The UV glue processing method is cleaner in UV glue processing and higher in efficiency. The method is suitable for the operation of a large number of circuit panels with large area, improves the production efficiency, requires lower equipment cost, and simultaneously ensures that the manufactured transparent panel which can be formed at one time has larger size and is not limited by the stroke of a machine table.

In this example, the transparent substrate 1 is tempered glass, and the thickness thereof is 2-10 mm.

In this example, the circuit pattern 30 may be implemented in a manner known to those skilled in the art, for example, as shown in fig. 6-8, the circuit pattern 30 includes a power pad 30b, a signal pad 30c, and bead lands for mounting LED beads arranged in an array;

each lamp bead welding area is provided with a pin bonding pad 30a corresponding to a pin of the LED lamp; the pin pad 30a includes a signal pin pad and an electrode pin pad;

signal wires for signal transmission are arranged between the signal bonding pad 30c and the signal pin bonding pad in the lamp bead welding area and between the signal pin bonding pads in the adjacent lamp bead welding areas in the same row or the same column; for the sake of distinction, a signal line between the signal pad 30c and the signal pin pad in the bead soldering zone is marked as a first signal line 30 e; a signal wire used for signal transmission between signal pin bonding pads in adjacent lamp bead welding areas in the same row or the same column is marked as a second signal wire 30 f; control signals for controlling the on and off of the LED lamp beads can be input from the signal bonding pad 30c and then transmitted in sequence through the LED lamp beads;

and electrically connecting the electrode pin pad on the lamp bead welding area with the power supply pad 30b with the same polarity through a power supply line 30 d.

According to the preparation method of the transparent LED circuit board, the circuit pattern 30 which takes copper as a conductive material can be formed on the transparent substrate 1, the conductive requirement of electronic components with high power can be met, and meanwhile, the finished product can have high transparency, so that the use requirement of a transparent LED display screen can be met. The circuit pattern 30 formed by the method not only enables the copper foil 3 and the transparent substrate 1 to be firmly bonded, but also can resist the reflow soldering temperature in the SMT processing process of electronic components, and the bonding force of the circuit pattern 30 and the transparent substrate 1 is still very stable after high-temperature reflow soldering, and the circuit pattern is not deformed and does not fall off. The transparent substrate 1 and the copper foil 3 are bonded by using UV adhesive, and the manufacturing process can be carried out at normal temperature. The process can be effectively simplified when the process is carried out at normal temperature, the requirement on the processing environment is not high, the energy consumption is reduced, and the cost is reduced. Meanwhile, the UV adhesive can be quickly adhered under the irradiation condition of ultraviolet rays, so that the adhesion reliability is easy to judge, and the processing efficiency is very high.

Example 2

The present example will specifically explain the preparation method of the transparent LED display screen provided by the present invention, which includes the following steps: preparing a transparent LED circuit board 400; mounting an LED lamp on the transparent LED circuit board 400, and then packaging;

the method for preparing the transparent LED circuit board 400 is the method for preparing the transparent LED circuit board provided in embodiment 1.

The LED lamp is installed on the lamp bead welding area by adopting a Surface Mounting Technology (SMT) method and limiting the reflow soldering temperature in the SMT processing process to be about 260 ℃. And then, a waterproof protective layer is formed on the transparent LED circuit board 400 after the LEDs are installed through glue pouring and packaging, and then a protective cover plate is adopted for protection.

In this example, the key point lies in the method for manufacturing the transparent LED circuit board 400, and other subsequent packaging processes are publicly known, and the method for manufacturing the transparent LED circuit board 400 is explained in example 1. Therefore, the description is omitted.

According to the preparation method of the transparent LED display screen, when the transparent LED circuit board 400 is prepared, the circuit pattern 30 which takes copper as a conductive material can be formed on the transparent substrate 1, so that the conductive requirement of electronic components with high power can be met, and the finished product can have high transparency, so that the use requirement of the transparent LED display screen can be met. The circuit pattern 30 formed by the method not only enables the copper foil 3 and the transparent substrate 1 to be firmly bonded, but also can resist the reflow soldering temperature in the SMT processing process of electronic components, and the bonding force of the circuit pattern 30 and the transparent substrate 1 is still very stable after high-temperature reflow soldering, and the circuit pattern is not deformed and does not fall off. The manufacturing process of the method can be carried out at normal temperature. The transparent substrate 1 and the copper foil 3 are bonded by using UV adhesive, and the manufacturing process can be carried out at normal temperature. The process can be effectively simplified when the process is carried out at normal temperature, the requirement on the processing environment is not high, the energy consumption is reduced, and the cost is reduced. Meanwhile, the UV adhesive can be quickly adhered under the irradiation condition of ultraviolet rays, so that the adhesion reliability is easy to judge, and the processing efficiency is very high.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.