阅读说明：本技术 一种led灯带电路板的制造工艺 (Manufacturing process of LED lamp strip circuit board ) 是由 赖思强 于 2021-08-16 设计创作，主要内容包括：一种LED灯带电路板的制造工艺,首先,制作绝缘基板；然后,在基板一侧粘附导电层,在基板另一侧形成多条具有间隔的导电条；然后,在所述导电层上按电路图形印刷抗腐蚀油墨；然后,用腐蚀药水蚀刻导电层上未被防腐油墨覆盖部分,导电层上未被腐蚀的部分即构成连接电路；然后,在所述连接电路上印刷阻焊油墨层,同时在需要焊接LED灯珠和其他电子元气件的位置预留暴露所述连接电路的第一焊盘,在需要将连接电路和导电条导通的位置预留第二焊盘；然后,在所述第二焊盘中开设连通孔；最后,在所述连通孔中插入金属棒,并在基材上下两侧采用冲压或挤压的方式将所述金属棒两端镦粗,使金属棒两端分别夹持在连接电路和导电条上。(A manufacturing process of an LED lamp belt circuit board comprises the following steps of firstly, manufacturing an insulating substrate; then, adhering a conductive layer on one side of the substrate, and forming a plurality of conductive strips with intervals on the other side of the substrate; then, printing corrosion-resistant ink on the conductive layer according to a circuit pattern; etching the part, which is not covered by the anti-corrosion ink, on the conductive layer by using an etching solution, wherein the part, which is not etched, on the conductive layer forms a connecting circuit; then, printing a solder mask ink layer on the connecting circuit, reserving a first pad exposing the connecting circuit at a position where the LED lamp beads and other electronic elements need to be welded, and reserving a second pad at a position where the connecting circuit and the conductive strips need to be conducted; then, a communication hole is opened in the second pad; and finally, inserting a metal rod into the communicating hole, upsetting two ends of the metal rod on the upper side and the lower side of the base material in a stamping or extruding mode, and clamping two ends of the metal rod on the connecting circuit and the conductive bar respectively.)

1. The manufacturing process of the LED lamp strip circuit board is characterized in that: firstly, manufacturing a substrate by adopting an insulating material; then, forming a conducting layer fully distributed on one side of the substrate, and forming a plurality of conducting strips with intervals on the other side of the substrate; then, printing corrosion-resistant ink on the conducting layer according to the designed circuit pattern, and simultaneously baking and curing; etching the part, which is not covered by the anticorrosion ink, on the conductive layer by using an etching solution, and removing the anticorrosion ink, wherein the part, which is not etched, on the conductive layer forms a connecting circuit; then, printing a solder mask ink layer on the connecting circuit, reserving a first pad exposing the connecting circuit at a position where the LED lamp beads and other electronic elements need to be welded, and reserving a second pad at a position where the connecting circuit and the conductive strips need to be conducted; then, a communication hole is opened in the second pad; and finally, inserting a metal rod into the communicating hole, upsetting two ends of the metal rod on the upper side and the lower side of the base material in a stamping or extruding mode, and clamping two ends of the metal rod on the connecting circuit and the conductive bar respectively.

2. A process for manufacturing a LED strip circuit board according to claim 1, wherein: the conductive layer and the conductive strips are formed by depositing or electroplating a metal material or adhering a metal foil.

3. A process for manufacturing a LED strip circuit board according to claim 2, wherein: the conductive layer and the conductive strips are made of copper or copper alloy or aluminum or silver or gold.

4. A process for manufacturing a LED strip circuit board according to claim 1, wherein: the substrate is made of polyimide or polyethylene terephthalate.

5. A process for manufacturing a LED strip circuit board according to claim 1, wherein: a second isolation area is arranged between the conductive strips at the edge of the base material and the edge of the base plate, every 2-4 conductive strips on the base plate form a circuit group, a third isolation area is arranged between every two circuit groups, and the width of the third isolation area is twice of that of the second isolation area.

6. A manufacturing process of a LED strip circuit board according to claim 5, wherein: and a separation line is formed in the third isolation region by adopting a slotting or partially hollowed-out mode.

Technical Field

The invention relates to a circuit board manufacturing process, and particularly discloses a circuit board manufacturing process of an LED lamp strip.

Background

The manufacturing process of the existing wire-free LED lamp strip comprises the following steps: firstly, selecting a circuit board substrate with copper foils attached to two sides, then manufacturing a connecting circuit connected with the LED lamp beads on one copper foil in a wet etching mode, and manufacturing a power supply circuit for conducting power supply on the other copper foil in a second wet etching mode; then, communication holes are started where the connection circuit and the power supply circuit need to be electrically connected; then, carrying out the operation; electroplating a palladium metal layer on the inner wall of the communicating hole to serve as a transition layer, and electroplating a copper metal layer connected with the connecting circuit and the power circuit on the palladium metal layer; then, covering a solder resist ink layer on the connecting circuit and reserving a bonding pad for welding the electronic component; then, welding LED lamp beads, resistors and a wiring terminal protruding out of the solder resist ink layer in a surfacing mode on the bonding pad; and finally, wrapping the circuit board with an outer skin. In the prior art, in the manufacture of a circuit board, because wet corrosion needs to be carried out on a circuit substrate twice, the process is complex, the manufacturing cost is high and the environmental pollution is great; in the mode of conducting the connecting circuit and the power circuit, because the electroplating needs to be carried out twice in the communicating hole, the process is complex and the electric connection is unreliable; when the external power supply is connected, the connecting terminal needs to be welded on the connecting circuit in an overlaying mode, the process is complex, and the electric connection is unreliable.

Disclosure of Invention

Therefore, a manufacturing process of the LED strip circuit board with simple process, low production cost and small environmental pollution is needed to solve the problems in the prior art.

In order to solve the problems of the prior art, the invention discloses a manufacturing process of an LED lamp belt circuit board, which comprises the following steps of firstly, manufacturing a substrate by adopting an insulating material; then, forming a conducting layer fully distributed on one side of the substrate, and forming a plurality of conducting strips with intervals on the other side of the substrate; then, printing corrosion-resistant ink on the conducting layer according to the designed circuit pattern, and simultaneously baking and curing; etching the part, which is not covered by the anticorrosion ink, on the conductive layer by using an etching solution, and removing the anticorrosion ink, wherein the part, which is not etched, on the conductive layer forms a connecting circuit; then, printing a solder mask ink layer on the connecting circuit, reserving a first pad exposing the connecting circuit at a position where the LED lamp beads and other electronic elements need to be welded, and reserving a second pad at a position where the connecting circuit and the conductive strips need to be conducted; then, a communication hole is opened in the second pad; and finally, inserting a metal rod into the communicating hole, upsetting two ends of the metal rod on the upper side and the lower side of the base material in a stamping or extruding mode, and clamping two ends of the metal rod on the connecting circuit and the conductive bar respectively.

The invention has the beneficial effects that: the invention does not need to manufacture a power circuit, reduces the primary circuit corrosion process, and has the advantages of simple process, low production cost and little environmental pollution; meanwhile, in the conduction mode of the connecting circuit and the conducting bar, the method adopts the communication hole arranged on the circuit board, and the metal bar electrically connecting the connecting circuit and the conducting bar is inserted into the communication hole, so that the method has the advantages of reliable electric connection, simple process and small environmental pollution.

Drawings

Fig. 1 is a schematic structural view of a side of a circuit board substrate to which a conductive strip is attached.

Fig. 2 is a schematic structural view of a section a-a in fig. 1.

Fig. 3 is a schematic diagram of a circuit connected to a circuit board bus.

FIG. 4 is a schematic diagram of a structure of a circuit board motherboard covering a solder resist ink layer.

Fig. 5 is a schematic view showing a structure in which a conductor is inserted into a communication hole of a motherboard of a circuit board.

Fig. 6 is a schematic structural diagram of a circuit board mother board after welding LED lamp beads and resistors.

Fig. 7 is a schematic structural diagram of a motherboard of a circuit board being separated into individual circuit boards. .

Fig. 8 is a view showing one of the structures of the section B-B in fig. 7.

FIG. 9 is a second schematic structural view of the section B-B in FIG. 7.

Fig. 10 is a schematic structural diagram of the LED strip.

Detailed Description

For further understanding of the features and technical means, as well as the specific objects and functions of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 and 2. A double-sided circuit board base material for an LED lamp strip comprises an insulating base plate 1, wherein a conducting layer 2 which is fully distributed on the base plate 1 is adhered to one side of the base plate 1, and a plurality of conducting strips 3 which are used as a circuit board power circuit are adhered to the other side of the base plate 1. A first isolation region S1 is disposed between the conductive strips 3, and a second isolation region S2 is disposed between the edge of the substrate 1 and the conductive strip 3 closest to the edge of the substrate 1. The second isolation region S2 is provided to prevent the conductive strip 3 from short-circuiting or creeping with the conductive layer 2 on the other side of the substrate 1 due to the relatively thin thickness of the substrate 1. For mass production, a plurality of individual circuit boards for LED strips are generally fabricated simultaneously side by side on a mother board. Specifically, 2 to 4 conductive strips 3 are formed into circuit groups 30 on the substrate 1, a third isolation region S3 is disposed between the circuit groups 30, the width of the third isolation region S3 is twice that of the second isolation region S2, and a separation line C is disposed in the third isolation region S3. In the subsequent process of manufacturing the LED lamp strip, the motherboard is divided along the separation line C to obtain a plurality of independent circuit boards for the LED lamp strip.

The manufacturing method of the base material comprises the following steps: first, a substrate 1 is manufactured using Polyimide (PI) or polyethylene terephthalate (PET); then, a method of depositing or electroplating metal materials or adhering metal foils is adopted, a conductive layer 2 fully distributed on one side of the substrate 1 is formed, and a plurality of conductive strips 3 with intervals are formed on the other side of the substrate 1; finally, a separation line C is formed on the substrate 1 at intervals of 2 to 4 conductive strips 3 by slotting or partially hollowing. The material of the conductive layer 2 and the conductive strips 3 may be copper, copper alloy, aluminum, silver, gold, or the like.

For a substrate manufacturer, the double-sided circuit board substrate for the LED lamp strip manufactured by the method does not need to be fully distributed with a metal material on the other side of the substrate, so that materials can be saved and the production cost can be reduced; for a circuit board manufacturer, the circuit board for the LED lamp strip can be formed by only once manufacturing the connecting circuit by corroding the conducting layer and then conducting the connecting circuit with the conducting bar, and the power circuit does not need to be corroded for the second time, so that the production process can be simplified, the production cost can be reduced, and the environmental pollution can be reduced.

Refer to fig. 3 to 7. A manufacturing process of an LED lamp belt circuit board. Firstly, selecting a double-sided circuit board substrate 1 manufactured by the method, wherein the substrate 1 comprises a substrate 1, a conducting layer 2 is adhered to one side of the substrate 1, and a plurality of conducting strips 3 serving as a circuit board power circuit are adhered to the other side of the substrate 1; then, printing corrosion-resistant ink on the conducting layer 2 according to the designed circuit pattern, and simultaneously baking and curing; then, etching the part, which is not covered by the anticorrosion printing ink, on the conductive layer 2 by using an etching solution, and then removing the anticorrosion printing ink, wherein the part, which is not etched, on the conductive layer 2 forms a connecting circuit 21; then, a solder resist ink layer 5 is printed on the connecting circuit 21, and meanwhile, a first pad 51 for exposing the connecting circuit 21 is reserved at a position where an LED lamp bead and other electronic components need to be welded, and a second pad 52 is reserved at a position where the connecting circuit 21 and the conductive strip 3 need to be conducted. Then, in the second pad 52, a communicating hole 22 is formed by drilling or punching; then, the conductor 4 electrically connecting the connection circuit 21 and the bus bar 3 is inserted into the communication hole 22. Referring to fig. 8, the electric conductor 4 may be a metal rivet 41, and the rivet 41 is driven into the through hole 22, and both ends of the rivet 41 are clamped to the connection circuit 21 and the bus bar 3, respectively. Referring to fig. 9, the conductor 4 may also be made of a soft metal rod 42 such as copper or aluminum, by first inserting the metal rod 42 into the through hole 22, and then upsetting the two ends of the metal rod 42 by punching or pressing on the upper and lower sides of the substrate, so that the two ends of the metal rod 42 are clamped on the connecting circuit 21 and the conductive bar 3, respectively. The conductor 4 may also be solder paste that is poured into the via hole 22 and electrically connects the connection circuit 21 and the bus bar 3.

Refer to fig. 7 to 9. The circuit board structure for the LED lamp strip obtained by the method comprises a base material 1, wherein one side of the base material 1 is provided with a connecting circuit 21, and the other side of the base material 1 is provided with a conductive strip 3 serving as a circuit board power circuit. The connecting circuit 21 is covered with a solder resist ink layer 5, a first bonding pad 51 exposing the connecting circuit 21 is arranged at a position on the solder resist ink layer 5 where an LED lamp bead and other electronic elements need to be welded, and a second bonding pad 52 is arranged at a position where the connecting circuit 21 and the conductive strip 3 need to be electrically connected. The second pad 52 has a communication hole 22 penetrating the connection circuit 21 and the bus bar 3. And the conductive body 4 electrically connected with the connecting circuit 21 and the conductive bar 2 is inserted in the communicating hole 22, and the conductive body 4 protrudes out of the solder resist ink layer 5. The conductor 4 may be a rivet 41 having both ends clamped to the connection circuit 21 and the bus bar 3, respectively, or a metal bar 42 having both ends thickened and clamped to the connection circuit 21 and the bus bar 3.

The double-sided circuit board for the LED lamp strip manufactured by the method does not need to manufacture a power circuit, reduces a primary circuit corrosion process, and has the advantages of simple process, low production cost and small environmental pollution; meanwhile, in the conduction mode of the connecting circuit and the conducting bar, the method adopts the mode that the communicating hole is arranged on the circuit board, and the metal conductor is inserted into the communicating hole to electrically connect the connecting circuit and the conducting bar, so that the method has the advantages of reliable electric connection, simple process and small environmental pollution.

Refer to fig. 6 to 10. A method for manufacturing a wire-free LED lamp strip. Firstly, selecting a double-sided circuit board manufactured by the method; then, welding an LED lamp bead 6 and a resistor 7 on the first bonding pad 51; then, separating the circuit board motherboard into a plurality of independent circuit boards 10 from the separation line C; and finally, wrapping transparent plastic outside the independent circuit board through a plastic extrusion process to be used as an outer skin 8 of the LED lamp strip.

When the LED lamp strip is a monochromatic lamp strip, only one LED lamp bead with one light emitting color is welded on the independent circuit board 10, at this time, each independent circuit board 10 only includes two conductive strips 3, and the two conductive strips 3 are respectively used as positive and negative power circuits of the independent circuit board 10. When the LED lamp strip is a double-color lamp strip, the LED lamp beads 6 with two light-emitting colors are welded on the independent circuit boards 10, at this time, each independent circuit board 10 needs to include three conductive strips 3, two of the three conductive strips are respectively an anode power circuit or a cathode power circuit of the LED lamp beads 6 with two light-emitting colors, and the other one is a cathode power circuit or an anode power circuit shared by the two independent circuit boards. When the LED lamp strip is a colored lamp strip, the independent circuit boards 10 are welded with LED lamp beads 6 with three colors of red, green and blue, or the LED lamp beads 6 are internally packaged with light emitting chips with three colors, at this time, each independent circuit board 10 needs to include four electrical conductors 3, three of which are positive or negative power circuits of the LED lamp beads 6 with three colors of light emission or the chips, and the other is a negative or positive power circuit shared by the three.

Refer to fig. 7 to 10. Taking a monochromatic LED lamp strip as an example, the leadless LED lamp strip structure manufactured by the method comprises a sheath 8, and an independent circuit board 10 is wrapped in the sheath 8. The independent circuit board 10 is provided with a connecting circuit 21 on one side and a conductive strip 3 as a power circuit of the independent circuit board 10 on the other side, wherein the conductive strip 3 comprises a positive conductive strip 3a and a negative conductive strip 3 b. The connecting circuit 21 is welded with a plurality of LED lamp beads 6 and resistors 7. The LED lamp beads 6 and the resistors 7 are connected in series to form a series unit 60, and the positive and negative ends of the series unit 60 are provided with electric conductors 4 which penetrate through the independent circuit board 10 and are electrically connected with the connecting circuit 21 and the conductive strips 3. The electric conductors 4 comprise a positive electric conductor 4a and a negative electric conductor 4b, at the positive end of the series unit 60, the positive electric conductor 4a is electrically connected with the positive end of the series unit 60 and the positive conductive strip 3a on the back of the independent circuit board 10, and the negative electric conductor 4b is electrically connected with the negative conductive strip 3b on the back of the circuit board 10; at the negative end of the series unit 60, the positive conductor 4a is electrically connected to only the positive conductive strip 3a on the back of the separate circuit board 10, and the negative conductor 4b is electrically connected to the negative end of the series unit 60 and the negative conductive strip 3b on the back of the separate circuit board 10. Fig. 10 shows only the circuit structure of a single series unit 60, and in actual production, a plurality of series units 60 may be arranged along the length direction of the independent circuit board 10, and the series units 60 are in parallel relation. Thus, the LED strip comprising one or more series units 60 is cut, and the positive and negative conductors 4a, 4b on either end of the individual circuit board 10 are connected to external positive and negative power supplies, respectively, and the LED strip is ready for operation. The conductor 4 may be a rivet 41 having two ends respectively clamped to the connection circuit 21 and the bus bar 3, or a metal bar 42 having two ends thicker and then clamped to the connection circuit 21 and the bus bar 3.

The LED lamp strip manufactured by the method has the advantages of simple process, low production cost, small environmental pollution, reliable electric connection between the connecting circuit and the conductive strips and the like; meanwhile, the electric conductor protrudes out of the solder resist ink layer and can be directly used for connecting an external power supply, so that the process of surfacing welding a wiring terminal on the connecting circuit 21 in the prior art can be omitted.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.