阅读说明：本技术 一种保证led灯板背钻精度的设计方法 (Design method for ensuring back drilling precision of LED lamp panel ) 是由 洪俊杰 姚国庆 肖小红 彭华伟 倪跃辉 姜辉望 于 2021-08-03 设计创作，主要内容包括：本发明公开一种保证LED灯板背钻精度的设计方法,依次包括有以下工序：开料、烘板、内层线路、压合、一次钻孔、化学沉铜、整板电镀、外层线路、图形电镀、钻出备用定位孔、背钻、碱性蚀刻、防焊、字符、成型、电测试以及成品检验；其中,在内层线路制作时,通过光绘制作出对应线路于菲林上,另添加一套备用靶孔,菲林在温度为20℃-24℃、湿度为50%-55%环境内静止4H,菲林整体涨缩控制在2mil以内,菲林层偏控制在2mil以内。通过在背钻前钻出备用定位孔,以供背钻时定位使用,无需采用一钻定位孔进行定位,可完全规避掉因一钻定位孔内镀上铜导致孔位精度偏差问题,从而有效提升背钻精度,对成品品质更有保障。(The invention discloses a design method for ensuring the back drilling precision of an LED lamp panel, which sequentially comprises the following steps of: cutting, drying a board, carrying out inner-layer circuit pressing, carrying out primary drilling, carrying out chemical copper deposition, carrying out whole-board electroplating, carrying out outer-layer circuit, carrying out pattern electroplating, drilling out a standby positioning hole, carrying out back drilling, carrying out alkaline etching, preventing welding, carrying out character forming, carrying out electrical testing and carrying out finished product inspection; when the inner layer circuit is manufactured, a corresponding circuit is manufactured on a film through optical drawing, a set of standby target holes are additionally added, the film is static for 4H in an environment with the temperature of 20-24 ℃ and the humidity of 50-55%, the overall expansion and contraction of the film are controlled within 2mil, and the deviation of the film layer is controlled within 2 mil. Through drilling out reserve locating hole before the back drilling to fix a position the use when supplying the back drilling, need not to adopt a brill locating hole to fix a position, can avoid completely falling because of the copper results in the hole site precision deviation problem of plating in a brill locating hole, thereby effectively promote the back drilling precision, more secure to the finished product quality.)

1. A design method for guaranteeing the back drilling precision of an LED lamp panel is characterized by comprising the following steps: the method sequentially comprises the following steps: cutting, drying a board, carrying out inner-layer circuit pressing, carrying out primary drilling, carrying out chemical copper deposition, carrying out whole-board electroplating, carrying out outer-layer circuit, carrying out pattern electroplating, drilling out a standby positioning hole, carrying out back drilling, carrying out alkaline etching, preventing welding, carrying out character forming, carrying out electrical testing and carrying out finished product inspection; when an inner layer circuit is manufactured, a corresponding circuit is manufactured on a film through photo-drawing, a set of standby target holes are additionally added, the film is static for 4H in an environment with the temperature of 20-24 ℃ and the humidity of 50-55%, the overall expansion and contraction of the film are controlled within 2mil, and the deviation of the film layer is controlled within 2 mil; when back drilling, a special drill bit with a corresponding diameter and angle is selected according to the requirements of customers, and during positioning, a standby positioning hole is used for positioning, and the positioning precision of the pin is within 1 mil.

2. The design method for ensuring the accuracy of the back drilling of the LED lamp panel according to claim 1 is characterized in that: and a drilling positioning hole formed by one-time drilling is drilled by an x-ray target machine after pressing.

3. The design method for ensuring the accuracy of the back drilling of the LED lamp panel according to claim 1 is characterized in that: and the standby positioning hole is drilled by an x-ray shooting machine.

Technical Field

The invention relates to the technical field of LED lamp panels, in particular to a design method for ensuring the back drilling precision of an LED lamp panel.

Background

The LED panel lamp is a high-grade indoor lighting lamp, the outer frame of the LED panel lamp is formed by anodizing aluminum alloy, and the light source is an LED.

The LED lamp plate is the essential element of LED panel light, and this kind of LED lamp plate is a back-drilling product, and present back-drilling product all adopts traditional technology design, though the back-drilling is according to the locating information that the locating hole provided, carries out the back-drilling to the via hole one by one, nevertheless, because of the plate is through electroplating the back, has plated the copper layer that the thickness differs on the locating hole pore wall in the board, leads to the locating hole precision certain deviation to appear, and the hole site precision is relatively poor during the back-drilling. Therefore, there is a need to develop a solution to the above problems.

Disclosure of Invention

In view of the above, the present invention is directed to the defects in the prior art, and the main object of the present invention is to provide a design method for ensuring the accuracy of a back drill of an LED lamp panel, which can effectively solve the problem of poor accuracy of a back drill hole position when the existing LED lamp panel is manufactured.

In order to achieve the purpose, the invention adopts the following technical scheme:

a design method for ensuring the back drilling precision of an LED lamp panel sequentially comprises the following steps: cutting, drying a board, carrying out inner-layer circuit pressing, carrying out primary drilling, carrying out chemical copper deposition, carrying out whole-board electroplating, carrying out outer-layer circuit, carrying out pattern electroplating, drilling out a standby positioning hole, carrying out back drilling, carrying out alkaline etching, preventing welding, carrying out character forming, carrying out electrical testing and carrying out finished product inspection; when an inner layer circuit is manufactured, a corresponding circuit is manufactured on a film through photo-drawing, a set of standby target holes are additionally added, the film is static for 4H in an environment with the temperature of 20-24 ℃ and the humidity of 50-55%, the overall expansion and contraction of the film are controlled within 2mil, and the deviation of the film layer is controlled within 2 mil; when back drilling, a special drill bit with a corresponding diameter and angle is selected according to the requirements of customers, and during positioning, a standby positioning hole is used for positioning, and the positioning precision of the pin is within 1 mil.

Preferably, one drilling positioning hole formed by one drilling is drilled by an x-ray target machine after pressing.

Preferably, the spare pilot hole is drilled by an x-ray machine.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:

through drilling out reserve locating hole before the back drilling to fix a position the use when supplying the back drilling, need not to adopt a brill locating hole to fix a position, can avoid completely falling because of the copper results in the hole site precision deviation problem of plating in a brill locating hole, thereby effectively promote the back drilling precision, more secure to the finished product quality.

Drawings

FIG. 1 is a schematic process flow diagram of a preferred embodiment of the present invention;

FIG. 2 is a cross-sectional view of the LED lamp panel in the preferred embodiment of the invention.

The attached drawings indicate the following:

10. plate 11 and radiating aluminum sheet

101. A drill location hole 102 and a spare location hole.

Detailed Description

The invention discloses a design method for ensuring the back drilling precision of an LED lamp panel, which sequentially comprises the following steps of: cutting, drying the board, carrying out inner layer circuit treatment, pressing, carrying out primary drilling, carrying out chemical copper deposition, carrying out whole board electroplating, carrying out outer layer circuit treatment, carrying out pattern electroplating, drilling out standby positioning holes, carrying out back drilling, carrying out alkaline etching, preventing welding, carrying out character formation, carrying out electrical test and carrying out finished product inspection.

When an inner layer circuit is manufactured, a corresponding circuit is manufactured on a film through photo-drawing, a set of standby target holes are additionally added, the film is static for 4H in an environment with the temperature of 20-24 ℃ and the humidity of 50-55%, the overall expansion and contraction of the film are controlled within 2mil, and the deviation of the film layer is controlled within 2 mil; when back drilling, a special drill bit with a corresponding diameter and angle is selected according to the requirements of customers, and during positioning, the spare positioning hole 102 is used for positioning, and the positioning precision of the pin is within 1 mil. In this embodiment, one drilled pilot hole 101 is drilled by the x-ray machine after pressing, and the spare pilot hole 102 is drilled by the x-ray machine. As shown in fig. 2, a plurality of one-drilled locating holes 101 and a plurality of spare locating holes 102 are formed on the heat dissipating aluminum sheet 11 of the plate 10, the one-drilled locating holes 101 and the spare locating holes 102 are all located at the edge of the plate 10, and one-drilled locating hole 101 is used for normal drilling and locating; after the plate 10 is subjected to the electroplating process, a copper layer with different thickness is plated in a drilled positioning hole 101, and the position precision of the plate cannot be guaranteed during back drilling, so that the plate 10 needs to drill a spare positioning hole 102 through an x-ray target shooter before back drilling for positioning during back drilling.

The design of the invention is characterized in that: through drilling out reserve locating hole before the back drilling to fix a position the use when supplying the back drilling, need not to adopt a brill locating hole to fix a position, can avoid completely falling because of the copper results in the hole site precision deviation problem of plating in a brill locating hole, thereby effectively promote the back drilling precision, more secure to the finished product quality.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.